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市場調查報告書
商品編碼
1869525

玻璃中介層市場：現況分析與預測（2025-2033）

Glass Interposers Market: Current Analysis and Forecast (2025-2033)
出版日期: | 出版商: UnivDatos Market Insights Pvt Ltd | 英文 138 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計在預測期（2025-2033 年）內，玻璃中介層市場將以約 11.2% 的複合年增長率成長。這一顯著成長主要得益於市場對高性能、高能源效率和小型化半導體裝置日益增長的需求。包括高效能運算 (HPC)、人工智慧 (AI) 和 5G 通訊在內的先進應用需要高互連密度、最小訊號損耗和卓越的散熱管理——而這些特性只有玻璃中介層才能提供，而傳統的有機基板則無法滿足這些需求。此外，處理器、GPU 和 AI 加速器正透過採用 2.5D 和 3D 封裝以及玻璃通孔 (TGV) 技術進一步提升其性能和可靠性。這些因素共同推動了市場成長。

依晶圓尺寸劃分，市場分為 200 毫米、300 毫米和 300 毫米以上三個類別。其中，300mm晶圓市佔率最大，這得益於其更高的晶圓良率、成本效益以及在包括記憶體、邏輯電路和先進處理器在內的各種半導體製造應用中的通用性。然而，隨著產業領導者專注於下一代製造技術以滿足人工智慧、物聯網和5G設備的需求，預計300mm+晶圓市場將實現強勁成長。這有望降低晶片成本並提高生產效率。

依封裝類型，市場可分為2.5D封裝、3D封裝及麵板級封裝。其中，2.5D封裝憑藉其在性能、成本和設計複雜性方面的平衡，佔最大的市場佔有率。目前，它已被廣泛應用於高效能運算、GPU、網路和資料中心系統。然而，受人工智慧、智慧型手機和物聯網領域對緊湊、節能和高效能設備的需求不斷增長的推動，預計3D封裝將實現最快成長。

依終端用戶產業劃分，市場可分為消費性電子、通訊、汽車、國防和航空航太等產業。目前，消費性電子產業佔最大的市場佔有率，這主要得益於智慧型手機、筆記型電腦、穿戴式裝置和其他智慧型裝置的巨大需求。這些設備需要先進的半導體解決方案來處理、儲存和通訊。然而，由於電動車的日益普及、自動駕駛系統的發展以及高級駕駛輔助系統 (ADAS) 的進步，預計汽車產業將成為未來成長最快的產業。由於每輛車半導體使用量的增加以及政府推動電動車普及的壓力，汽車行業的需求預計將顯著增長。

為了更深入了解玻璃中介層的需求，我們基於北美（美國、加拿大和北美其他地區）、歐洲（德國、英國、法國、西班牙、義大利和歐洲其他地區）、亞太地區（中國、日本、印度和亞太其他地區）以及世界其他地區的全球市場應用情況進行了分析。 亞太地區佔最大的市場佔有率。這一優勢得益於中國大陸、台灣、韓國和日本等地擁有主要的半導體製造基地。然而，在高效能運算、人工智慧加速器和 5G 網路廣泛應用的推動下，北美市場預計也將顯著成長。

市面上主要的公司包括 AGC Inc.，Corning Incorporated，Dai Nippon Printing Co.，Ltd.，PLANOPTIK AG，Samtec，Inc.，SCHOTT，3DGS，NSG Group，TOPPAN Inc.，and Nippon Electric Glass Co.，Ltd. 等。

目錄

第一章：市場概況

  • 市場定義
  • 主要目標
  • 利害關係人
  • 局限性

第二章：研究方法或假設

  • 研究過程
  • 研究方法
  • 受訪者公司簡介

第三章：摘要整理

  • 行業概覽
  • 依區隔市場預測
    • 市場成長強度
  • 依地區預測

第四章：市場動態

  • 推動因素
  • 機遇
  • 阻礙因素
  • 趨勢
  • PESTEL 分析
  • 需求面分析
  • 供給面分析
    • 併購
    • 合作與投資情景
    • 產業洞察：重點新創企業及其獨特策略

第五章：定價分析

  • 價格分析區域
  • 影響定價的因素

第六章：2023-2033年全球玻璃中介層市場營收

第七章：以晶圓尺寸劃分的市場洞察

  • 200毫米
  • 300毫米
  • 300毫米以上

第八章：以封裝方式劃分的市場洞察

  • 2.5D封裝
  • 3D封裝
  • 面板級封裝

第九章：依最終用途產業劃分的市場洞察

  • 消費性電子
  • 電信
  • 汽車
  • 國防與航空航太
  • 其他

第十章：依…劃分的市場洞察區域

  • 北美洲
    • 美國
    • 加拿大
    • 北美洲其他地區
  • 歐洲
    • 德國
    • 英國
    • 法國
    • 義大利
    • 西班牙
    • 歐洲其他地區
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 亞太地區其他地區
  • 世界其他地區

第十一章：價值鏈分析

  • 利潤率分析
  • 市場參與者列表

第十二章：競爭格局

  • 競爭概覽
  • 競爭市場定位分析
  • 波特五力分析

第十三章 公司簡介

  • AGC Inc.
    • Company Overview
    • Key Financials
    • SWOT Analysis
    • Product Portfolio
    • Recent Developments
  • Corning Incorporated
  • Dai Nippon Printing Co., Ltd.
  • PLANOPTIK AG
  • Samtec, Inc.
  • SCHOTT
  • 3DGS
  • NSG Group
  • TOPPAN Inc.
  • Nippon Electric Glass Co., Ltd.

第十四章 縮寫與前提條件

第十五章 附件

簡介目錄
Product Code: UMSE213457

A glass interposer is an important component used in the area of microelectronics, serving as a bridging platform between the silicon chip and the substrate or printed circuit board (PCB) to which the chip is mounted. Glass interposer offers several features, such as higher performance due to their superior electrical properties and enhanced thermal management capabilities compared to traditional organic substrates. Additionally, the glass interposer has 3D integration technology, facilitating more complex and higher-functioning devices.

The Glass Interposers market is set to show a growth rate of about 11.2% during the forecast period (2025-2033F). The glass interposers market is experiencing significant growth due to the rising demand for high-performance, energy-efficient, and miniaturized semiconductor devices. High-performance computing (HPC), artificial intelligence (AI), and 5G communications, as well as other advanced applications, require high interconnect density, minimal signal loss, and excellent thermal management capabilities, which only glass interposers can provide compared to traditional organic substrates. Additionally, processors, GPUs, and AI accelerators are further enhanced by the use of 2.5D and 3D packaging, as well as through-glass via (TGV) technology, which improves their performance and reliability. These factors are driving the growth of this market.

Based on the wafer size category, the market is categorised into 200 mm, 300 mm, and above 300 mm. Among these, the 300 mm wafer segment holds the maximum market share since it provides better yield per wafer, cost-effectiveness, and is commonly used in semiconductor fabrication in various applications such as memory, logic, and advanced processors. However, the above 300 mm wafer segment is projected to experience robust growth in the future as the industry leaders focus on next-generation fabrication technology to satisfy the demand of AI, IoT, and 5G-enabled devices, which is likely to decrease the cost per chip and boost productivity.

Based on the packaging category, the market is categorized into 2.5D packaging, 3D packaging, and panel-level packaging. Among these, 2.5D packaging has the largest market share because it balances between performance, cost, and design complexity, and is now commonly used in high-performance computing, GPUs, networking, and data center systems. However, 3D packaging is expected to witness the fastest growth, driven by the increasing demand for compact, energy-efficient, and high-performance devices in AI, smartphones, and IoT.

Based on the end-use industry category, the market is segmented into consumer electronics, telecommunications, automotive, defense & aerospace, and others. Among these, consumer electronics currently hold the maximum market share due to the enormous demand for smartphones, laptops, wearables, and other smart devices that need sophisticated semiconductor solutions to process, store, and communicate. However, the automotive industry is predicted to be the most rapidly expanding field in the future due to the increase in the implementation of electric cars, the development of autonomous driving systems, and high-tech driver-assistance systems (ADAS). The rise in semiconductor per vehicle, and government pressure to adopt EVs, will drive automotive industry demand substantially.

For a better understanding of the demand of Glass Interposers, the market is analyzed based on its worldwide adoption in countries such as North America (U.S., Canada, and the Rest of North America), Europe (Germany, U.K., France, Spain, Italy, Rest of Europe), Asia-Pacific (China, Japan, India, and the Rest of Asia-Pacific), and Rest of World. Among these, the Asia-Pacific region holds the largest market share. This dominance is driven by the presence of major semiconductor manufacturing hubs in China, Taiwan, South Korea, and Japan. However, the North America region is expected to witness significant growth due to the rising adoption of high-performance computing, AI accelerators, and 5G networks.

Some major players running in the market include AGC Inc., Corning Incorporated, Dai Nippon Printing Co., Ltd., PLANOPTIK AG, Samtec, Inc., SCHOTT, 3DGS, NSG Group, TOPPAN Inc., and Nippon Electric Glass Co., Ltd.

TABLE OF CONTENTS

1.Market Introduction

  • 1.1. Market Definitions
  • 1.2. Main Objective
  • 1.3. Stakeholders
  • 1.4. Limitation

2.Research Methodology or Assumption

  • 2.1. Research Process of the Global Glass Interposers Market
  • 2.2. Research Methodology of the Global Glass Interposers Market
  • 2.3. Respondent Profile

3.Executive Summary

  • 3.1. Industry Synopsis
  • 3.2. Segmental Outlook
    • 3.2.1. Market Growth Intensity
  • 3.3. Regional Outlook

4.Market Dynamics

  • 4.1. Drivers
  • 4.2. Opportunity
  • 4.3. Restraints
  • 4.4. Trends
  • 4.5. PESTEL Analysis
  • 4.6. Demand Side Analysis
  • 4.7. Supply Side Analysis
    • 4.7.1. Merger & Acquisition
    • 4.7.2. Collaboration & Investment Scenario
    • 4.7.3. Industry Insights: Leading Startups and Their Unique Strategies

5.Pricing Analysis

  • 5.1. Regional Pricing Analysis
  • 5.2. Price Influencing Factors

6.Global Glass Interposers Market Revenue (USD Mn), 2023-2033F

7.Market Insights By Wafer Size

  • 7.1. 200 mm
  • 7.2. 300 mm
  • 7.3. Above 300 mm

8.Market Insights By Packaging

  • 8.1. 2.5D Packaging
  • 8.2. 3D Packaging
  • 8.3. Panel-Level Packaging

9.Market Insights By End-Use Industry

  • 9.1. Consumer Electronics
  • 9.2. Telecommunications
  • 9.3. Automotive
  • 9.4. Defense & Aerospace
  • 9.5. Others

10.Market Insights By Region

  • 10.1. North America
    • 10.1.1. U.S.
    • 10.1.2. Canada
    • 10.1.3. Rest of North America
  • 10.2. Europe
    • 10.2.1. Germany
    • 10.2.2. U.K.
    • 10.2.3. France
    • 10.2.4. Italy
    • 10.2.5. Spain
    • 10.2.6. Rest of Europe
  • 10.3. Asia-Pacific
    • 10.3.1. China
    • 10.3.2. Japan
    • 10.3.3. India
    • 10.3.4. Rest of Asia-Pacific
  • 10.4. Rest of World

11.Value Chain Analysis

  • 11.1. Marginal Analysis
  • 11.2. List of Market Participants

12.Competitive Landscape

  • 12.1. Competition Dashboard
  • 12.2. Competitor Market Positioning Analysis
  • 12.3. Porter Five Forces Analysis

13.Company Profiles

  • 13.1. AGC Inc.
    • 13.1.1. Company Overview
    • 13.1.2. Key Financials
    • 13.1.3. SWOT Analysis
    • 13.1.4. Product Portfolio
    • 13.1.5. Recent Developments
  • 13.2. Corning Incorporated
  • 13.3. Dai Nippon Printing Co., Ltd.
  • 13.4. PLANOPTIK AG
  • 13.5. Samtec, Inc.
  • 13.6. SCHOTT
  • 13.7. 3DGS
  • 13.8. NSG Group
  • 13.9. TOPPAN Inc.
  • 13.10. Nippon Electric Glass Co., Ltd.

14.Acronyms & Assumption

15.Annexure