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1871906

全球玻璃中介層市場：預測至2032年－按類型、基板厚度、製造流程、應用、最終用戶和地區進行分析

Glass Interposers Market Forecasts to 2032 - Global Analysis By Type, Substrate Thickness, Fabrication Process, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，預計到 2025 年全球玻璃中介層市場規模將達到 1.377 億美元，到 2032 年將達到 3.5967 億美元，預測期內複合年成長率為 14.7%。

玻璃中介層是超薄玻璃層，可作為半導體晶片和基板之間的橋樑，提供高密度互連、增強的電絕緣性和優異的散熱性能。其優異的平整度和穩定性使其能夠在2.5D和3D整合電路中實現細間距佈線和多組件整合，從而顯著提高現代電子設備的性能、效率和緊湊性。

據美國商務部經濟分析局稱，受人工智慧和雲端基礎設施需求的推動，到 2024 年，美國資料中心投資將成長 14%，達到創紀錄的 1,080 億美元。

對高效能運算 (HPC) 和人工智慧的需求

玻璃中介層因其優異的電絕緣性和尺寸精度而備受關注，能夠支援高速資料傳輸。隨著人工智慧工作負載的擴展和邊緣運算的廣泛應用，對緊湊、熱穩定的互連的需求呈爆炸式成長。晶片架構和神經形態處理器等新興技術正在突破封裝的極限，而玻璃基板在這些領域展現出明顯的優勢。 2.5D 和 3D 整合技術的創新正在為資料中心和人工智慧叢集打造更密集、更快速的系統。這一趨勢正在推動半導體、汽車電子和通訊等產業的應用。

技術製造挑戰

實現高長寬比的可靠玻璃通孔 (TGV) 需要精密的工裝和先進的製程控制。異質組件的整合增加了溫度控管和機械穩定性的複雜性。產量比率最佳化仍然具有挑戰性，尤其是在大基板和多層設計的情況下。中小製造商由於巨額資本投入和專有製造技術的獲取管道有限而面臨諸多障礙。這些技術限制延緩了商業化進程，並限制了大規模生產的擴充性。

面板級封裝（PLP）技術進步

面板級封裝 (PLP) 正逐漸成為一種經濟高效且可擴展的玻璃中介層製造解決方案。 PLP 支援更大尺寸的基板，從而提高了多晶粒組件的生產效率並減少了材料浪費。扇出型架構和模組化晶片設計的興起與 PLP 的優勢完美契合。隨著人工智慧、5G 和汽車應用領域對緊湊型高性能模組的需求不斷成長，PLP 為實現成本和產量目標提供了一條切實可行的途徑。 OSAT 廠商和基板供應商之間的策略聯盟正在加速 PLP 在整個生態系統中的應用。

延遲的認證週期

在部署之前，原始設備製造商 (OEM) 要求對產品進行全面的熱循環、機械應力和訊號完整性測試。由於缺乏玻璃基板的標準化通訊協定，檢驗工作變得更加複雜。在汽車和航太等領域，嚴格的環境和安全標準導致產品上市時間延長。這些週期的延長阻礙了人工智慧和邊緣運算等快速發展領域的創新和應用。如果沒有簡化的認證框架，商業化流程將持續受到限制。

新冠疫情的感染疾病：

疫情擾亂了全球供應鏈，導致玻璃中介層組件的生產和交付延遲。封鎖和勞動力短缺影響了潔淨室的運作和設備的可用性，造成計劃延期。然而，這場危機加速了數位轉型，推動了對高效能運算基礎設施和人工智慧系統的需求。遠距辦公、遠端醫療和虛擬教育促進了半導體消費，間接推動了中介層的應用。後疫情時代的策略強調敏捷製造和數位雙胞胎，以減輕未來可能出現的干擾。

預計在預測期內，玻璃通孔（TGV）中介層細分市場將佔據最大的市場佔有率。

由於其能夠支援高密度垂直互連並最大限度地減少訊號損耗，預計在預測期內，玻璃通孔 (TGV) 中介層將佔據最大的市場佔有率。這些基板具有優異的電絕緣性和尺寸穩定性，使其成為高速和高頻應用的理想選擇。它們與 MEMS、射頻模組和光電裝置的兼容性增強了其在多個領域的通用性。雷射加工和金屬化技術的進步正在提高通孔品質並降低缺陷率。 TGV 中介層具有無與倫比的擴充性，能夠滿足人工智慧和 5G 領域對緊湊型高效能封裝日益成長的需求。

預計在預測期內，汽車產業將實現最高的複合年成長率。

在預測期內，汽車產業預計將保持最高的成長率，這主要得益於車輛的電氣化數位化。玻璃中介層支援ADAS、資訊娛樂系統和電動車動力模組所需的高速資料傳輸和熱穩定性。自動駕駛和V2X通訊等新興趨勢需要訊號劣化較小的可靠互連。原始設備製造商（OEM）正在整合人工智慧晶片和感測器陣列，充分利用玻璃基板的優勢。安全和排放氣體的監管要求正在加速先進電子產品的應用，從而推動對中介層的需求。

佔比最大的地區：

亞太地區預計將在預測期內保持最大的市場佔有率，這得益於其強大的半導體製造生態系統。中國、韓國和台灣等國家和地區正大力投資先進封裝和基板技術。區域內的企業正利用其接近性工廠、OSAT（外包半導體封裝測試）和材料供應商的地理優勢，實現快速原型製作和大量生產。政府為促進晶片自主研發和在地化生產而採取的舉措，正在推動中介層技術的應用。此外，該地區人工智慧、5G和電動車的快速發展也對高性能封裝提出了更高的要求。

預計年複合成長率最高的地區：

在預測期內，北美預計將實現最高的複合年成長率，這主要得益於主導地位。美國擁有眾多主要的半導體製造商和研究機構，它們正引領下一代中介層架構的研發。聯邦政府對國內半導體製造和封裝研發的資助正在加速其商業化進程。各公司正在探索將玻璃中介層應用於量子運算、國防電子和先進醫療設備等領域。數位雙胞胎、預測分析和智慧工廠的融合正在提升製造的靈活性。

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  • 公司簡介
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  • 區域分類
    • 根據客戶興趣對主要國家進行市場估算、預測和複合年成長率分析（註：基於可行性檢查）
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    • 基於產品系列、地域覆蓋和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 引言

  • 概述
  • 相關利益者
  • 分析範圍
  • 分析方法
  • 分析材料

第3章 市場趨勢分析

  • 促進要素
  • 抑制因素
  • 機會
  • 威脅
  • 應用分析
  • 終端用戶分析
  • 新興市場
  • 新冠疫情的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代產品的威脅
  • 新進入者的威脅
  • 競爭對手之間的競爭

第5章 全球玻璃中介層市場（依類型分類）

  • 玻璃通孔 (TGV) 中介層
  • 玻璃基板中介層
  • 嵌入式玻璃中介層
  • 其他類型

6. 全球玻璃中介層市場（依基板厚度分類）

  • 100微米或更小
  • 100～200µm
  • 200微米或以上

7. 全球玻璃中介層市場依製造流程分類

  • 形成
  • 淬火和電鍍
  • 黏合與組裝
  • 表面處理

8. 全球玻璃中介層市場（依應用領域分類）

  • 2.5D/3D IC封裝
  • MEMS和感測器整合
  • LED構裝
  • 光電和光電子學
  • 射頻/無線組件
  • 其他用途

9. 全球玻璃中介層市場（依最終用戶分類）

  • 家用電器
  • 汽車電子
  • 通訊
  • 航太/國防
  • 工業自動化
  • 醫療設備
  • 其他最終用戶

第10章 全球玻璃中介層市場（依地區分類）

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 亞太其他地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第11章：主要趨勢

  • 合約、商業夥伴關係和合資企業
  • 企業合併（M&A）
  • 新產品上市
  • 業務拓展
  • 其他關鍵策略

第12章：公司簡介

  • Corning Incorporated
  • Toppan Printing Co., Ltd.
  • AGC Inc.
  • Ushio Inc.
  • SCHOTT AG
  • Taiwan Glass Industry Corporation
  • Nippon Electric Glass Co., Ltd.
  • Triton Microtechnologies, Inc.
  • HOYA Corporation
  • Kiso Koma Micro Technology Co., Ltd.
  • Plan Optik AG
  • Ibiden Co., Ltd.
  • 3D Glass Solutions, Inc.
  • Dai Nippon Printing Co., Ltd.
  • Samtec Inc.
Product Code: SMRC32276

According to Stratistics MRC, the Global Glass Interposers Market is accounted for $137.70 million in 2025 and is expected to reach $359.67 million by 2032 growing at a CAGR of 14.7% during the forecast period. Glass interposers are ultra-thin glass layers serving as bridges between semiconductor chips and substrates. They provide dense interconnections, enhanced electrical insulation, and superior heat dissipation. Due to their excellent flatness and stability, glass interposers enable fine-pitch wiring and integration of multiple components in 2.5D and 3D integrated circuits, significantly boosting performance, efficiency, and compactness in modern electronic devices.

According to the U.S. Department of Commerce Bureau of Economic Analysis, data center investments in the U.S. grew by 14% in 2024, reaching a record USD 108 billion, driven by demand for AI and cloud infrastructure.

Market Dynamics:

Driver:

Demand for high-performance computing (HPC) & AI

Glass interposers are gaining traction due to their excellent electrical insulation and dimensional precision, which support high-speed data transfer. As AI workloads scale and edge computing expands, the demand for compact, thermally stable interconnects is surging. Emerging technologies like chiplet architectures and neuromorphic processors are pushing packaging boundaries, where glass substrates offer distinct advantages. Innovations in 2.5D and 3D integration are enabling denser, faster systems for data centers and AI clusters. This trend is driving adoption across sectors such as semiconductors, automotive electronics, and telecommunications.

Restraint:

Technical manufacturing challenges

Achieving reliable through-glass vias (TGVs) with high aspect ratios demands precision tooling and advanced process control. The integration of heterogeneous components adds complexity to thermal management and mechanical stability. Yield optimization remains difficult, especially for large-format substrates and multilayer designs. Smaller manufacturers face barriers due to high capital investment and limited access to proprietary fabrication technologies. These technical constraints slow down commercialization and limit scalability for volume production.

Opportunity:

Advancements in panel-level packaging (PLP)

Panel-level packaging is emerging as a cost-effective and scalable solution for glass interposer production. By enabling larger substrate formats, PLP improves throughput and reduces material waste across multiple die assemblies. The rise of fan-out architectures and modular chiplet designs aligns well with PLP's capabilities. As demand grows for compact, high-performance modules in AI, 5G, and automotive applications, PLP offers a viable path to meet cost and volume targets. Strategic partnerships between OSATs and substrate suppliers are accelerating PLP deployment across the ecosystem.

Threat:

Slow qualification cycles

OEMs require comprehensive testing for thermal cycling, mechanical stress, and signal integrity before deployment. The absence of standardized protocols for glass substrates adds complexity to validation efforts. Sectors like automotive and aerospace impose rigorous environmental and safety benchmarks that delay time-to-market. These prolonged cycles hinder rapid innovation and slow adoption in fast-moving domains like AI and edge computing. Without streamlined qualification frameworks, the pace of commercialization remains constrained.

Covid-19 Impact:

The pandemic disrupted global supply chains, delaying production and delivery of glass interposer components. Lockdowns and labor shortages affected cleanroom operations and equipment availability, leading to project delays. However, the crisis accelerated digital transformation, boosting demand for HPC infrastructure and AI-enabled systems. Remote work, telehealth, and virtual education drove semiconductor consumption, indirectly supporting interposer adoption. Post-pandemic strategies now emphasize agile manufacturing and digital twins to mitigate future disruptions.

The through-glass via (TGV) interposers segment is expected to be the largest during the forecast period

The through-glass via (TGV) interposers segment is expected to account for the largest market share during the forecast period, due to their ability to support high-density vertical interconnects with minimal signal loss. These substrates offer superior electrical isolation and dimensional stability, making them ideal for high-speed and high-frequency applications. Their compatibility with MEMS, RF modules, and optoelectronics enhances their versatility across multiple domains. Technological advancements in laser drilling and metallization are improving via quality and reducing defect rates. As demand rises for compact, high-performance packages in AI and 5G, TGV interposers offer unmatched scalability.

The automotive segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the automotive segment is predicted to witness the highest growth rate, driven by the electrification and digitalization of vehicles. Glass interposers support high-speed data transmission and thermal stability required for ADAS, infotainment, and EV power modules. Emerging trends like autonomous driving and V2X communication demand robust interconnects with low signal degradation. OEMs are integrating AI chips and sensor arrays that benefit from glass-based substrates. Regulatory mandates for safety and emissions are accelerating the deployment of advanced electronics, boosting interposer demand.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, supported by its robust semiconductor manufacturing ecosystem. Countries like China, South Korea, and Taiwan are investing heavily in advanced packaging and substrate technologies. Regional players benefit from proximity to foundries, OSATs, and material suppliers, enabling faster prototyping and scale-up. Government initiatives promoting chip sovereignty and local production are driving interposer adoption. The region is also witnessing rapid uptake of AI, 5G, and electric vehicles, all of which require high-performance packaging.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by its leadership in AI, HPC, and semiconductor innovation. The U.S. is home to major chipmakers and research institutions pioneering next-gen interposer architectures. Federal funding for domestic chip production and packaging R&D is accelerating commercialization. Companies are exploring glass interposers for quantum computing, defense electronics, and advanced medical devices. Integration of digital twins, predictive analytics, and smart factories is enhancing manufacturing agility.

Key players in the market

Some of the key players in Glass Interposers Market include Corning Inc., Toppan Pr, AGC Inc., Ushio Inc., SCHOTT A, Taiwan Gl, Nippon El, Triton Mic, HOYA Corp, Kiso Koma, Plan Optik, Ibiden Co., 3D Glass S, Dai Nippo, and Samtec In.

Key Developments:

In June 2025, TOPPAN Security announced that it has entered into a definitive agreement to acquire dzcard Group, a prominent provider of smart card solutions and personalization services across Asia and Africa. This strategic acquisition immediately positions the TOPPAN Group as the clear leader in the Asian payment card market.

In June 2024, Corning Incorporated announced the launch of Corning(R) Gorilla(R) Glass 7i, a new cover glass engineered to deliver improved durability for intermediate and value-segment mobile devices. Gorilla Glass 7i broadens Corning's renowned tough cover glass portfolio, offering better drop and scratch performance compared to competitive lithium aluminosilicate glasses from other manufacturers.

Types Covered:

  • Through-Glass Via (TGV) Interposers
  • Glass Substrate Interposers
  • Embedded Glass Interposers
  • Other Types

Substrate Thicknesses Covered:

  • Below 100 µm
  • 100-200 µm
  • Above 200 µm

Fabrication Processes Covered:

  • Via Formation
  • Metallization and Plating
  • Bonding and Assembly
  • Surface Finishing

Applications Covered:

  • 2.5D and 3D IC Packaging
  • MEMS and Sensor Integration
  • LED Packaging
  • Photonics and Optoelectronics
  • RF and Wireless Components
  • Other Applications

End Users Covered:

  • Consumer Electronics
  • Automotive Electronics
  • Telecommunications
  • Aerospace & Defense
  • Industrial Automation
  • Medical Devices
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Glass Interposers Market, By Type

  • 5.1 Introduction
  • 5.2 Through-Glass Via (TGV) Interposers
  • 5.3 Glass Substrate Interposers
  • 5.4 Embedded Glass Interposers
  • 5.5 Other Types

6 Global Glass Interposers Market, By Substrate Thickness

  • 6.1 Introduction
  • 6.2 Below 100 µm
  • 6.3 100-200 µm
  • 6.4 Above 200 µm

7 Global Glass Interposers Market, By Fabrication Process

  • 7.1 Introduction
  • 7.2 Via Formation
  • 7.3 Metallization and Plating
  • 7.4 Bonding and Assembly
  • 7.5 Surface Finishing

8 Global Glass Interposers Market, By Application

  • 8.1 Introduction
  • 8.2 2.5D and 3D IC Packaging
  • 8.3 MEMS and Sensor Integration
  • 8.4 LED Packaging
  • 8.5 Photonics and Optoelectronics
  • 8.6 RF and Wireless Components
  • 8.7 Other Applications

9 Global Glass Interposers Market, By End User

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Automotive Electronics
  • 9.4 Telecommunications
  • 9.5 Aerospace & Defense
  • 9.6 Industrial Automation
  • 9.7 Medical Devices
  • 9.8 Other End Users

10 Global Glass Interposers Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Corning Incorporated
  • 12.2 Toppan Printing Co., Ltd.
  • 12.3 AGC Inc.
  • 12.4 Ushio Inc.
  • 12.5 SCHOTT AG
  • 12.6 Taiwan Glass Industry Corporation
  • 12.7 Nippon Electric Glass Co., Ltd.
  • 12.8 Triton Microtechnologies, Inc.
  • 12.9 HOYA Corporation
  • 12.10 Kiso Koma Micro Technology Co., Ltd.
  • 12.11 Plan Optik AG
  • 12.12 Ibiden Co., Ltd.
  • 12.13 3D Glass Solutions, Inc.
  • 12.14 Dai Nippon Printing Co., Ltd.
  • 12.15 Samtec Inc.

List of Tables

  • Table 1 Global Glass Interposers Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Glass Interposers Market Outlook, By Type (2024-2032) ($MN)
  • Table 3 Global Glass Interposers Market Outlook, By Through-Glass Via (TGV) Interposers (2024-2032) ($MN)
  • Table 4 Global Glass Interposers Market Outlook, By Glass Substrate Interposers (2024-2032) ($MN)
  • Table 5 Global Glass Interposers Market Outlook, By Embedded Glass Interposers (2024-2032) ($MN)
  • Table 6 Global Glass Interposers Market Outlook, By Other Types (2024-2032) ($MN)
  • Table 7 Global Glass Interposers Market Outlook, By Substrate Thickness (2024-2032) ($MN)
  • Table 8 Global Glass Interposers Market Outlook, By Below 100 µm (2024-2032) ($MN)
  • Table 9 Global Glass Interposers Market Outlook, By 100-200 µm (2024-2032) ($MN)
  • Table 10 Global Glass Interposers Market Outlook, By Above 200 µm (2024-2032) ($MN)
  • Table 11 Global Glass Interposers Market Outlook, By Fabrication Process (2024-2032) ($MN)
  • Table 12 Global Glass Interposers Market Outlook, By Via Formation (2024-2032) ($MN)
  • Table 13 Global Glass Interposers Market Outlook, By Metallization and Plating (2024-2032) ($MN)
  • Table 14 Global Glass Interposers Market Outlook, By Bonding and Assembly (2024-2032) ($MN)
  • Table 15 Global Glass Interposers Market Outlook, By Surface Finishing (2024-2032) ($MN)
  • Table 16 Global Glass Interposers Market Outlook, By Application (2024-2032) ($MN)
  • Table 17 Global Glass Interposers Market Outlook, By 2.5D and 3D IC Packaging (2024-2032) ($MN)
  • Table 18 Global Glass Interposers Market Outlook, By MEMS and Sensor Integration (2024-2032) ($MN)
  • Table 19 Global Glass Interposers Market Outlook, By LED Packaging (2024-2032) ($MN)
  • Table 20 Global Glass Interposers Market Outlook, By Photonics and Optoelectronics (2024-2032) ($MN)
  • Table 21 Global Glass Interposers Market Outlook, By RF and Wireless Components (2024-2032) ($MN)
  • Table 22 Global Glass Interposers Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 23 Global Glass Interposers Market Outlook, By End User (2024-2032) ($MN)
  • Table 24 Global Glass Interposers Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 25 Global Glass Interposers Market Outlook, By Automotive Electronics (2024-2032) ($MN)
  • Table 26 Global Glass Interposers Market Outlook, By Telecommunications (2024-2032) ($MN)
  • Table 27 Global Glass Interposers Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 28 Global Glass Interposers Market Outlook, By Industrial Automation (2024-2032) ($MN)
  • Table 29 Global Glass Interposers Market Outlook, By Medical Devices (2024-2032) ($MN)
  • Table 30 Global Glass Interposers Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.