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市場調查報告書
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2046969

專用積體電路市場－全球產業規模、佔有率、趨勢、機會、預測：按產品類型、應用、地區和競爭對手分類，2021-2031年

Application Specific Integrated Circuit Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Product Type, By Application, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 182 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球專用積體電路（ASIC）市場預計將從 2025 年的 185.2 億美元成長到 2031 年的 279.7 億美元，複合年成長率為 7.11%。

與通用元件不同，專用積體電路 (ASIC) 是專為特定應用而設計的半導體元件，作為專用設備的中央處理器，為特定任務提供高效能。推動這一市場成長的關鍵因素包括人工智慧 (AI) 領域對高效能運算日益成長的需求，以及汽車產業電子技術的不斷整合。這兩者都需要最佳化的功耗和獨特的外形尺寸，而這些只有客製設計的電路才能滿足。

市場概覽
預測期 2027-2031
市場規模：2025年 185.2億美元
市場規模：2031年 279.7億美元
複合年成長率：2026-2031年 7.11%
成長最快的細分市場 工業的
最大的市場 亞太地區

行業預測表明，該行業持續展現強勁的成長勢頭。根據世界半導體貿易統計（WSTS）的數據，邏輯積體電路（IC）市場預計在2024年將成長10.7%，凸顯了該產業的韌性以及這些元件在現代技術基礎設施中發揮的關鍵作用。然而，設計複雜性的顯著增加以及工程成本的飆升，是可能阻礙市場擴張的一大挑戰。這限制了小規模企業進入市場，並減緩了整體創新步伐。

市場促進因素

人工智慧 (AI) 和機器學習解決方案的快速普及是專用積體電路 (ASIC) 市場的主要驅動力。資料中心越來越重視採用客製化晶片，以提高特定工作負載的能源效率和運算延遲。這是因為這些特定領域的架構使企業能夠執行比標準圖形處理器 (GPU) 更有經濟且高效的複雜訓練任務。這種向客製化硬體的轉變也體現在專注於客製化運算卸載的領先元件供應商的財報中。例如，博通公司於 2024 年 6 月發布的 2024 年第二季財報顯示，該公司將全年 AI 相關營收預期上調至超過 110 億美元，凸顯了其客製化處理器業務的快速成長。

同時，專用積體電路（ASIC）在電動車（EV）和自動駕駛系統中的整合度不斷提高，正在改變半導體需求格局。汽車製造商依賴這些專屬電路服務來實現電池控制和LiDAR感測器融合等關鍵功能，這些功能需要獨特的外形規格和極高的可靠性標準，因此需要比標準邏輯晶片具有更優異溫度控管性能的組件。根據國際能源總署（IEA）於2024年4月發布的《2024年全球電動車展望》，預計2024年電動車銷量將達到1,700萬輛，這將推動對車規級半導體的需求。同時，半導體產業協會（SIA）報告稱，2024年8月全球半導體銷售額達到531億美元，顯示硬體投資持續復甦。

市場挑戰

設計複雜性的日益增加和工程成本的顯著上升是全球專用積體電路 (ASIC) 市場成長的主要障礙。汽車和人工智慧 (AI) 等行業的專業應用需要更高級的功能，這導致開發這些客製化組件的技術要求非常嚴格，需要昂貴的電子設計自動化工具和高度專業化的工程人員。這造成了巨額的前期投資，往往將中小企業排除在市場之外。反過來，這又減少了參與企業總數，並阻礙了先前推動市場快速發展的競爭多樣性。

這種財務負擔直接阻礙了市場成長，因為它將研發能力集中在少數資金雄厚的公司手中，最終減緩了整體創新步伐。近期的投資趨勢表明，維持競爭力所需的資源規模龐大。根據美國半導體產業協會（SIA）預測，到2024年，美國半導體產業將總收入的17.7%投入研發。這一數字表明，維持研發水準需要投入巨額資源，而這一障礙有效地限制了小規模企業進入市場，並縮小了整個產業的擴張潛力。

市場趨勢

隨著超大規模資料中心營運商不再依賴現成產品，而是自主研發客製化的AI晶片，市場正經歷根本性的轉變。這種垂直整合使企業能夠設計針對特定工作負載（例如建議引擎）量身定做的電路，並提升大規模運算至關重要的「每瓦效能」指標。根據Meta公司2024年4月發布的報告《推出我們的下一代AI基礎設施》，新發布的Meta訓練和推理加速器架構的計算能力和內存頻寬比上一代解決方案提升了一倍以上，這標誌著企業戰略重心從通用硬體轉向針對特定領域的內部研發。

同時，該領域正朝著基於晶片組的設計架構轉變，並藉助先進的2.5D和3D封裝技術。隨著單片製造接近其物理極限，工程師們正在整合異構晶片，以在保持良率的同時提升複雜應用的性能，這需要大幅擴展後端製造能力以支援必要的互連密度。根據2024年2月《台灣新聞》一篇題為「台積電先進封裝能力可望翻番」的報導，這家業界領先的晶圓代工廠預計到2024年第四季度，其每月先進封裝產能將擴大至33,000至35,000片晶圓，這凸顯了下一代

目錄

第1章概述

第2章：調查方法

第3章執行摘要

第4章：客戶心聲

第5章：專用積體電路全球市場展望

  • 市場規模及預測
    • 按金額
  • 市佔率及預測
    • 產品類型（全客製化、半客製化、可編程）
    • 按應用領域（通訊、工業、汽車、家用電子電器、其他）
    • 按地區
    • 按公司（2025 年）
  • 市場地圖

第6章：北美專用積體電路市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國別分析
    • 美國
    • 加拿大
    • 墨西哥

第7章：歐洲專用積體電路市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國別分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

第8章：亞太地區專用積體電路市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國別分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

第9章：中東和非洲專用積體電路市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東與非洲：國別分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

第10章：南美洲專用積體電路市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國別分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章 市場動態

  • 促進因素
  • 任務

第12章 市場趨勢與發展

  • 併購
  • 產品發布
  • 近期趨勢

第13章 全球專用積體電路市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的潛力
  • 供應商的議價能力
  • 顧客權力
  • 替代品的威脅

第15章 競爭格局

  • Intel Corporation
  • NVIDIA Corporation
  • Texas Instruments Incorporated
  • Broadcom Inc.
  • Qualcomm Incorporated
  • Samsung Electronics Co., Ltd.
  • Advanced Micro Devices, Inc.
  • STMicroelectronics NV
  • Analog Devices, Inc.
  • Infineon Technologies AG

第16章 策略建議

第17章：關於研究公司及免責聲明

簡介目錄
Product Code: 20023

The Global Application Specific Integrated Circuit Market is projected to expand from USD 18.52 Billion in 2025 to USD 27.97 Billion by 2031, achieving a CAGR of 7.11%. Unlike components intended for general-purpose execution, Application Specific Integrated Circuits are semiconductor devices tailored for a specific use, serving as the central processing units in specialized equipment to deliver enhanced performance for dedicated tasks. Key drivers fueling this market growth include the escalating demand for high-performance computing in artificial intelligence and the deepening integration of electronics within the automotive sector, both of which necessitate the optimized power consumption and unique form factors that only custom-designed circuits can offer.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 18.52 Billion
Market Size 2031USD 27.97 Billion
CAGR 2026-20317.11%
Fastest Growing SegmentIndustrial
Largest MarketAsia Pacific

Industry forecasts indicate that the sector continues to exhibit robust performance metrics. Data from the World Semiconductor Trade Statistics suggests that the Logic integrated circuit category is anticipated to grow by 10.7 percent in 2024, underscoring the resilience of the sector and the critical role these components play in modern technology infrastructure. However, a major challenge potentially hindering market expansion is the significant rise in design complexity combined with high engineering costs, which restricts market access for smaller entities and decelerates the overall pace of innovation.

Market Driver

The rapid adoption of Artificial Intelligence and Machine Learning solutions serves as a primary catalyst for the Application Specific Integrated Circuit market. Data centers are increasingly prioritizing custom silicon to improve power efficiency and computational latency for specialized workloads, as these domain-specific architectures allow companies to execute complex training tasks more economically than standard graphics processing units. This shift toward bespoke hardware is reflected in the financial results of major component suppliers focusing on custom compute offload; for instance, according to Broadcom Inc.'s 'Second Quarter Fiscal Year 2024 Financial Results' from June 2024, the company increased its projection for AI-linked revenue to over $11 billion for the fiscal year, highlighting the rapid financial expansion of the custom processor segment.

Concurrently, the growing integration of ASICs in Electric Vehicles and autonomous driving systems is reshaping the landscape of semiconductor demand. Automotive manufacturers rely on these specialized circuits for essential functions such as battery regulation and LiDAR sensor fusion, which require distinct form factors and extreme reliability standards, necessitating components with superior thermal management compared to standard logic chips. According to the International Energy Agency's 'Global EV Outlook 2024' released in April 2024, electric car sales are expected to hit 17 million units in 2024, driving demand for automotive-grade silicon, while the Semiconductor Industry Association reported that global semiconductor sales reached $53.1 billion in August 2024, indicating a sustained recovery in hardware investment.

Market Challenge

The significant rise in design complexity and high engineering costs presents a formidable barrier to the growth of the Global Application Specific Integrated Circuit Market. As specialized applications in the automotive sector and artificial intelligence demand greater functionality, the technical requirements to develop these custom components have intensified, necessitating expensive electronic design automation tools and highly specialized engineering talent that result in prohibitive upfront capital requirements. Consequently, small and medium-sized enterprises are often excluded from the market, reducing the overall pool of participants and stifling the competitive diversity that traditionally drives rapid advancement.

This financial burden directly impedes market growth by concentrating development capabilities within a limited number of well-funded corporations, thereby slowing the broader pace of innovation. The magnitude of resources required to remain competitive is evident in recent investment trends; according to the Semiconductor Industry Association, the U.S. semiconductor industry invested 17.7 percent of its total revenue into research and development in 2024. This metric illustrates the immense resource allocation necessary to maintain development standards, a threshold that effectively restricts market access for smaller entities and limits the potential for widespread industry expansion.

Market Trends

The market is observing a fundamental shift where hyperscale data center operators are developing proprietary custom AI silicon instead of relying on merchant offerings. This vertical integration allows companies to architect circuits tailored to unique workloads like recommendation engines, enhancing performance-per-watt metrics that are critical for large-scale computing. According to Meta's 'Introducing Our Next Generation Infrastructure for AI' report from April 2024, the architecture of the newly released Meta Training and Inference Accelerator more than doubles the compute and memory bandwidth compared to the previous generation solution, indicating a strategic deviation from general-purpose hardware toward domain-specific internal development.

Simultaneously, the sector is transitioning toward chiplet-based design architectures supported by 2.5D and 3D advanced packaging technologies. As monolithic manufacturing approaches physical limits, engineers are integrating heterogeneous dies to maintain yield rates while scaling performance for complex applications, necessitating a substantial expansion in backend manufacturing capabilities to support the required interconnect density. According to a 'Taiwan News' article from February 2024 titled 'Taiwan's TSMC reportedly set to double advanced packaging capacity,' the monthly advanced packaging capacity of the industry's leading foundry is expected to grow to between 33,000 and 35,000 wafers by the fourth quarter of 2024, underscoring the critical dependence of next-generation ASICs on multi-die integration.

Key Market Players

  • Intel Corporation
  • NVIDIA Corporation
  • Texas Instruments Incorporated
  • Broadcom Inc.
  • Qualcomm Incorporated
  • Samsung Electronics Co., Ltd.
  • Advanced Micro Devices, Inc.
  • STMicroelectronics N.V.
  • Analog Devices, Inc.
  • Infineon Technologies AG

Report Scope

In this report, the Global Application Specific Integrated Circuit Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Application Specific Integrated Circuit Market, By Product Type

  • Full Custom
  • Semi-custom
  • Programmable

Application Specific Integrated Circuit Market, By Application

  • Telecommunication
  • Industrial
  • Automotive
  • Consumer Electronics
  • Others

Application Specific Integrated Circuit Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Application Specific Integrated Circuit Market.

Available Customizations:

Global Application Specific Integrated Circuit Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Application Specific Integrated Circuit Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Product Type (Full Custom, Semi-custom, Programmable)
    • 5.2.2. By Application (Telecommunication, Industrial, Automotive, Consumer Electronics, Others)
    • 5.2.3. By Region
    • 5.2.4. By Company (2025)
  • 5.3. Market Map

6. North America Application Specific Integrated Circuit Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Product Type
    • 6.2.2. By Application
    • 6.2.3. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Application Specific Integrated Circuit Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Product Type
        • 6.3.1.2.2. By Application
    • 6.3.2. Canada Application Specific Integrated Circuit Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Product Type
        • 6.3.2.2.2. By Application
    • 6.3.3. Mexico Application Specific Integrated Circuit Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Product Type
        • 6.3.3.2.2. By Application

7. Europe Application Specific Integrated Circuit Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Product Type
    • 7.2.2. By Application
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Application Specific Integrated Circuit Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Product Type
        • 7.3.1.2.2. By Application
    • 7.3.2. France Application Specific Integrated Circuit Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Product Type
        • 7.3.2.2.2. By Application
    • 7.3.3. United Kingdom Application Specific Integrated Circuit Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Product Type
        • 7.3.3.2.2. By Application
    • 7.3.4. Italy Application Specific Integrated Circuit Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Product Type
        • 7.3.4.2.2. By Application
    • 7.3.5. Spain Application Specific Integrated Circuit Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Product Type
        • 7.3.5.2.2. By Application

8. Asia Pacific Application Specific Integrated Circuit Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Product Type
    • 8.2.2. By Application
    • 8.2.3. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Application Specific Integrated Circuit Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Product Type
        • 8.3.1.2.2. By Application
    • 8.3.2. India Application Specific Integrated Circuit Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Product Type
        • 8.3.2.2.2. By Application
    • 8.3.3. Japan Application Specific Integrated Circuit Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Product Type
        • 8.3.3.2.2. By Application
    • 8.3.4. South Korea Application Specific Integrated Circuit Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Product Type
        • 8.3.4.2.2. By Application
    • 8.3.5. Australia Application Specific Integrated Circuit Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Product Type
        • 8.3.5.2.2. By Application

9. Middle East & Africa Application Specific Integrated Circuit Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Product Type
    • 9.2.2. By Application
    • 9.2.3. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Application Specific Integrated Circuit Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Product Type
        • 9.3.1.2.2. By Application
    • 9.3.2. UAE Application Specific Integrated Circuit Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Product Type
        • 9.3.2.2.2. By Application
    • 9.3.3. South Africa Application Specific Integrated Circuit Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Product Type
        • 9.3.3.2.2. By Application

10. South America Application Specific Integrated Circuit Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Product Type
    • 10.2.2. By Application
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Application Specific Integrated Circuit Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Product Type
        • 10.3.1.2.2. By Application
    • 10.3.2. Colombia Application Specific Integrated Circuit Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Product Type
        • 10.3.2.2.2. By Application
    • 10.3.3. Argentina Application Specific Integrated Circuit Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Product Type
        • 10.3.3.2.2. By Application

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Application Specific Integrated Circuit Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Intel Corporation
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. NVIDIA Corporation
  • 15.3. Texas Instruments Incorporated
  • 15.4. Broadcom Inc.
  • 15.5. Qualcomm Incorporated
  • 15.6. Samsung Electronics Co., Ltd.
  • 15.7. Advanced Micro Devices, Inc.
  • 15.8. STMicroelectronics N.V.
  • 15.9. Analog Devices, Inc.
  • 15.10. Infineon Technologies AG

16. Strategic Recommendations

17. About Us & Disclaimer