封面
市場調查報告書
商品編碼
1881596

晶圓製造市場-全球產業規模、佔有率、趨勢、機會和預測,按規模、製造流程、最終用戶、地區和競爭格局分類,2020-2030年預測

Wafer Fabrication Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Size, By Fabrication Process, By End-User, By Region, By Competition, 2020-2030F

出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3個工作天內

價格

We offer 8 hour analyst time for an additional research. Please contact us for the details.

簡介目錄

2024年全球晶圓製造市場規模為748.3億美元,預計2030年將以6.2%的複合年成長率成長至1,073.6億美元。晶圓製造是指在半導體晶圓上製造整合電路的複雜多步驟工藝,這些整合電路是電子設備的基礎組件。市場成長的主要驅動力是人工智慧、5G連接和自動駕駛汽車等新興應用領域對先進半導體元件日益成長的需求。

市場概覽
預測期 2026-2030
2024年市場規模 748.3億美元
2030年市場規模 1073.6億美元
2025-2030年複合年成長率 6.2%
成長最快的細分市場 65奈米
最大的市場 亞太地區

主要市場促進因素

主要市場挑戰

主要市場趨勢

目錄

第1章:產品概述

第2章:研究方法

第3章:執行概要

第4章:客戶之聲

第5章:全球晶圓製造市場展望

  • 市場規模及預測
    • 按價值
  • 市佔率及預測
    • 依尺寸(65 nm、45 nm、32 nm、22 nm、14 nm、10 nm、7 nm)
    • 依製造程序(後端加工、前端加工)
    • 按最終用戶(整合設備製造商、代工廠、記憶體)分類
    • 按地區
    • 按公司(2024 年)
  • 市場地圖

第6章:北美晶圓製造市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲:國家分析
    • 美國
    • 加拿大
    • 墨西哥

第7章:歐洲晶圓製造市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲:國家分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

第8章:亞太地區晶圓製造市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區:國家分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

第9章:中東和非洲晶圓製造市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東和非洲:國家分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

第10章:南美洲晶圓製造市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲:國家分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章:市場動態

  • 促進要素
  • 挑戰

第12章:市場趨勢與發展

  • 併購(如有)
  • 產品發布(如有)
  • 最新進展

第13章:全球晶圓製造市場:SWOT分析

第14章:波特五力分析

  • 產業競爭
  • 新進入者的潛力
  • 供應商議價能力
  • 顧客的力量
  • 替代產品的威脅

第15章:競爭格局

  • Taiwan Semiconductor Manufacturing Company Limited
  • Samsung Electronics Co., Ltd.
  • Intel Corporation
  • GlobalFoundries Inc.
  • United Microelectronics Corporation
  • SK Hynix Inc.
  • Micron Technology, Inc.
  • Semiconductor Manufacturing International Corporation
  • STMicroelectronics International NV
  • NXP Semiconductors NV

第16章:策略建議

第17章調查會社について,免責事項

簡介目錄
Product Code: 22164

The Global Wafer Fabrication Market, valued at USD 74.83 Billion in 2024, is projected to experience a CAGR of 6.2% to reach USD 107.36 Billion by 2030. Wafer fabrication involves the complex multi-step process of manufacturing integrated circuits on semiconductor wafers, forming the foundational components of electronic devices. The market's growth is primarily driven by the expanding demand for advanced semiconductor devices across emerging applications such as artificial intelligence, 5G connectivity, and autonomous vehicles.

Market Overview
Forecast Period2026-2030
Market Size 2024USD 74.83 Billion
Market Size 2030USD 107.36 Billion
CAGR 2025-20306.2%
Fastest Growing Segment65 nm
Largest MarketAsia Pacific

Key Market Drivers

The burgeoning landscape of emerging advanced technologies and the relentless pursuit of semiconductor manufacturing process advancements stand as pivotal drivers propelling the global wafer fabrication market. The escalating demand for specialized chips catering to artificial intelligence, 5G connectivity, and autonomous vehicles significantly influences wafer fabrication volumes and complexity. For instance, according to SEMI, September 2024, Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports, 300mm fab equipment spending is projected to grow by 24% to US$123.2 billion in 2025, driven by the increasing demand for artificial intelligence chips used in data centers and edge devices.

Key Market Challenges

A substantial challenge impeding the growth of the global wafer fabrication market is the significant capital expenditure required for establishing and upgrading advanced manufacturing facilities. Developing and maintaining state-of-the-art fabs necessitates immense financial outlays, encompassing the cost of land, construction, and specialized equipment. This high barrier to entry and expansion restricts the number of new market entrants and limits the pace at which existing manufacturers can increase capacity or transition to smaller process nodes, which are crucial for producing advanced semiconductor devices.

Key Market Trends

Heterogeneous Integration and 3D Packaging Expansion addresses the limitations of traditional 2D scaling by combining diverse functional blocks, such as logic, memory, and sensors, into a single, more compact, and higher-performing package. This approach enables enhanced functionality and performance-per-watt in advanced semiconductor devices crucial for high-performance computing, artificial intelligence, and mobile applications.

Key Market Players

  • Taiwan Semiconductor Manufacturing Company Limited
  • Samsung Electronics Co., Ltd.
  • Intel Corporation
  • GlobalFoundries Inc.
  • United Microelectronics Corporation
  • SK Hynix Inc.
  • Micron Technology, Inc.
  • Semiconductor Manufacturing International Corporation
  • STMicroelectronics International N.V.
  • NXP Semiconductors N.V.

Report Scope:

In this report, the Global Wafer Fabrication Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Wafer Fabrication Market, By Size:

  • 65 nm
  • 45 nm
  • 32nm
  • 22 nm
  • 14 nm
  • 10 nm
  • 7nm

Wafer Fabrication Market, By Fabrication Process:

  • The Back End of Line Processing
  • The Front End of Line Processing

Wafer Fabrication Market, By End-User:

  • Integrated Device Manufacturer
  • Foundry
  • Memory

Wafer Fabrication Market, By Region:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Wafer Fabrication Market.

Available Customizations:

Global Wafer Fabrication Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Wafer Fabrication Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Size (65 nm, 45 nm, 32nm, 22 nm, 14 nm, 10 nm, 7nm)
    • 5.2.2. By Fabrication Process (The Back End of Line Processing, The Front End of Line Processing)
    • 5.2.3. By End-User (Integrated Device Manufacturer, Foundry, Memory)
    • 5.2.4. By Region
    • 5.2.5. By Company (2024)
  • 5.3. Market Map

6. North America Wafer Fabrication Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Size
    • 6.2.2. By Fabrication Process
    • 6.2.3. By End-User
    • 6.2.4. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Wafer Fabrication Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Size
        • 6.3.1.2.2. By Fabrication Process
        • 6.3.1.2.3. By End-User
    • 6.3.2. Canada Wafer Fabrication Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Size
        • 6.3.2.2.2. By Fabrication Process
        • 6.3.2.2.3. By End-User
    • 6.3.3. Mexico Wafer Fabrication Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Size
        • 6.3.3.2.2. By Fabrication Process
        • 6.3.3.2.3. By End-User

7. Europe Wafer Fabrication Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Size
    • 7.2.2. By Fabrication Process
    • 7.2.3. By End-User
    • 7.2.4. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Wafer Fabrication Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Size
        • 7.3.1.2.2. By Fabrication Process
        • 7.3.1.2.3. By End-User
    • 7.3.2. France Wafer Fabrication Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Size
        • 7.3.2.2.2. By Fabrication Process
        • 7.3.2.2.3. By End-User
    • 7.3.3. United Kingdom Wafer Fabrication Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Size
        • 7.3.3.2.2. By Fabrication Process
        • 7.3.3.2.3. By End-User
    • 7.3.4. Italy Wafer Fabrication Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Size
        • 7.3.4.2.2. By Fabrication Process
        • 7.3.4.2.3. By End-User
    • 7.3.5. Spain Wafer Fabrication Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Size
        • 7.3.5.2.2. By Fabrication Process
        • 7.3.5.2.3. By End-User

8. Asia Pacific Wafer Fabrication Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Size
    • 8.2.2. By Fabrication Process
    • 8.2.3. By End-User
    • 8.2.4. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Wafer Fabrication Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Size
        • 8.3.1.2.2. By Fabrication Process
        • 8.3.1.2.3. By End-User
    • 8.3.2. India Wafer Fabrication Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Size
        • 8.3.2.2.2. By Fabrication Process
        • 8.3.2.2.3. By End-User
    • 8.3.3. Japan Wafer Fabrication Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Size
        • 8.3.3.2.2. By Fabrication Process
        • 8.3.3.2.3. By End-User
    • 8.3.4. South Korea Wafer Fabrication Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Size
        • 8.3.4.2.2. By Fabrication Process
        • 8.3.4.2.3. By End-User
    • 8.3.5. Australia Wafer Fabrication Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Size
        • 8.3.5.2.2. By Fabrication Process
        • 8.3.5.2.3. By End-User

9. Middle East & Africa Wafer Fabrication Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Size
    • 9.2.2. By Fabrication Process
    • 9.2.3. By End-User
    • 9.2.4. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Wafer Fabrication Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Size
        • 9.3.1.2.2. By Fabrication Process
        • 9.3.1.2.3. By End-User
    • 9.3.2. UAE Wafer Fabrication Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Size
        • 9.3.2.2.2. By Fabrication Process
        • 9.3.2.2.3. By End-User
    • 9.3.3. South Africa Wafer Fabrication Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Size
        • 9.3.3.2.2. By Fabrication Process
        • 9.3.3.2.3. By End-User

10. South America Wafer Fabrication Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Size
    • 10.2.2. By Fabrication Process
    • 10.2.3. By End-User
    • 10.2.4. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Wafer Fabrication Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Size
        • 10.3.1.2.2. By Fabrication Process
        • 10.3.1.2.3. By End-User
    • 10.3.2. Colombia Wafer Fabrication Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Size
        • 10.3.2.2.2. By Fabrication Process
        • 10.3.2.2.3. By End-User
    • 10.3.3. Argentina Wafer Fabrication Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Size
        • 10.3.3.2.2. By Fabrication Process
        • 10.3.3.2.3. By End-User

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Wafer Fabrication Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Taiwan Semiconductor Manufacturing Company Limited
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Samsung Electronics Co., Ltd.
  • 15.3. Intel Corporation
  • 15.4. GlobalFoundries Inc.
  • 15.5. United Microelectronics Corporation
  • 15.6. SK Hynix Inc.
  • 15.7. Micron Technology, Inc.
  • 15.8. Semiconductor Manufacturing International Corporation
  • 15.9. STMicroelectronics International N.V.
  • 15.10. NXP Semiconductors N.V.

16. Strategic Recommendations

17. About Us & Disclaimer