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市場調查報告書
商品編碼
1757903

全球晶圓廠設備市場

Wafer Fab Equipment
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 233 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計到 2030 年全球晶圓廠設備市場規模將達 744 億美元

全球晶圓廠設備市場規模預計在2024年為646億美元，預計到2030年將達到744億美元，2024年至2030年的複合年成長率為2.4%。本報告分析的細分市場之一—前段製程—預計複合年成長率為1.9%，到分析期結束時規模將達到479億美元。後段製程細分市場在分析期間的複合年成長率預計為3.4%。

美國市場規模估計為 170 億美元，中國市場預計複合年成長率為 2.3%

美國晶圓廠設備市場規模預計2024年達到170億美元。預計到2030年，作為世界第二大經濟體的中國市場規模將達到120億美元，在2024-2030年的分析期內，複合年成長率為2.3%。其他值得關注的區域市場包括日本和加拿大，預計在分析期間內，這兩個市場的複合年成長率分別為2.2%和1.9%。在歐洲，預計德國市場的複合年成長率為2.0%。

全球「晶圓廠設備」市場—主要趨勢與促進因素摘要

為什麼晶圓廠設備是全球半導體繁榮的核心

隨著全球經濟數位化，晶圓製造 (fab) 設備已成為生產幾乎所有電子設備所需的半導體的核心。從智慧型手機和筆記型電腦到電動車和資料中心，對半導體的需求不僅在成長，而且呈現加速趨勢。晶圓製造設備是積體電路 (IC) 製造的基礎，包括用於微影術、沉澱、蝕刻、離子布植和清洗等製程的機器。這些精密工具使製造商能夠以奈米級的間隔操縱矽晶圓，以提高晶片的性能、效率並使其微型化。 5G、人工智慧 (AI)、物聯網 (IoT) 和高效能運算 (HPC) 等技術的爆炸性成長給半導體供應鏈帶來了巨大壓力，促使代工廠和整合設備製造商 (IDM) 迅速擴大產能並採用尖端設備。此外，近期全球危機暴露的地緣政治變化和供應脆弱性，促使各國政府大力投資國內晶片生產，尤其是在美國、歐洲和東亞地區，這進一步推動了對先進晶圓廠設備的需求。因此，該行業不僅在成長，而且正在成為現代技術進步的支柱。

技術節點和製程複雜性如何影響設備創新？

人們不斷追求更小、更快、更有效率的晶片，這推動著晶圓廠設備技術發生驚人的變革。隨著產業向 7 奈米、5 奈米甚至 3 奈米製程節點邁進，半導體製造的複雜性呈指數級成長。尖端製造需要極紫外線 (EUV)微影術系統，該系統能夠以無與倫比的精度對極小的特徵圖形化。 ASML、應用材料、東京電子和泛林集團等公司處於開發下一代沉積、蝕刻和計量工具的前沿，以滿足這些節點的獨特需求。不斷增加的電晶體密度、3D 晶片堆疊和環柵 (GAA) 電晶體架構正在推動設備製造商開發新材料和原子級處理技術。此外，隨著可變性變得越來越重要，即時數據分析和人工智慧主導的控制系統正在整合到晶圓廠工具中，以最佳化產量比率和檢測異常。這催生了「智慧晶圓廠」的興起，設備不再只是硬體，而是一個數位連接、自我修正的生態系統的一部分。隨著晶圓廠規模和複雜程度的不斷成長，能源效率、污染控制和永續性也成為關鍵的設計重點——畢竟，最新晶片的複雜程度直接體現在製造晶片所用工具的創新上。

全球晶圓製造基礎建設投資集中在哪裡？

全球晶圓廠設備投資主要集中在那些在半導體生產領域佔據主導地位且致力於技術自給自足的地區。台灣、韓國、中國大陸和日本在晶圓廠建設和設備進口方面處於領先地位。台灣的台積電、韓國的三星和中國大陸的中芯國際正在先進和傳統節點製造領域投資數十億美元，確保各類晶圓廠設備的需求穩定。為因應地緣政治緊張局勢和供應鏈風險，美國已通過《晶片法案》和《科學法案》等立法，啟動了一項大規模補貼計劃，以振興國內製造業。英特爾和格芯等美國公司正在積極建造新工廠，這進一步刺激了設備需求。歐洲也正在通過《歐洲晶片法案》等舉措，加強其半導體發展力度，目標是到2030年將其在全球晶片產量中的佔有率翻倍。此外，東南亞正在崛起成為後端流程和設備服務的戰略中心，而印度也積極吸引投資，以期成為未來的半導體製造地。這波投資浪潮反映出全球不僅在生產晶片方面的競爭，而且在控制晶圓級生產資料方面的競爭。

有幾個因素正在推動晶圓廠設備市場的成長…

晶圓廠設備市場的成長受到與半導體技術進步、區域產能擴張和不斷變化的最終用戶需求相關的多種因素的驅動。最大的驅動力之一是向先進節點（5nm 及以下）的發展，這需要高度專業化的微影術、沉積和蝕刻設備來處理更精細的幾何形狀和複雜的電晶體結構。人工智慧、5G、邊緣運算和自主系統的普及正在推動對高效能、低功耗晶片的需求，擴大尖端設備的潛在市場。同時，在汽車、工業和物聯網領域需求的推動下，傳統節點的製造依然強勁，這也確保了成熟製程工具的成長。主要在美國、歐盟、韓國和中國的區域投資激勵措施正在刺激工廠建設並推動跨技術節點設備的大量購買。此外，向小型晶片架構和異質整合整合的轉變正在刺激對先進封裝設備和特定製程創新的需求。透過人工智慧、機器學習和巨量資料的整合，晶圓廠營運中的硬體和軟體融合也為設備供應商創造了新的價值鍊和服務機會。晶圓廠設備是半導體生態系的重要支柱，隨著全球矽晶圓需求的持續飆升，其規模也持續擴張。

部分

製造流程（前段製程、後段製程）、節點尺寸（7nm及以下、10nm、14nm、22nm、65nm及以上）、最終用途（代工廠、記憶體、整合設備製造商、其他最終用途）

調查企業範例（共44家企業）

  • Advantest Corporation
  • Applied Materials, Inc.
  • ASM International NV
  • ASML Holding NV
  • Brooks Automation, Inc.
  • Canon Inc.
  • Dainippon Screen Mfg. Co., Ltd.
  • Ebara Corporation
  • EV Group（EVG）
  • Hitachi High-Tech Corporation
  • KLA Corporation
  • Lam Research Corporation
  • Nikon Corporation
  • Plasma-Therm LLC
  • Rudolph Technologies, Inc.
  • SUSS MicroTec SE
  • Teradyne, Inc.
  • Tokyo Electron Limited（TEL）
  • ULVAC, Inc.
  • Veeco Instruments Inc.

人工智慧整合

我們正在利用可操作的專家內容和人工智慧工具來改變市場和競爭情報。

Global 特定產業SLM 的典型規範，而是建立了一個從全球專家收集的內容庫，其中包括視訊錄影、部落格、搜尋引擎研究以及大量的公司、產品/服務和市場數據。

關稅影響係數

全球產業分析師根據公司總部所在國家、製造地、進出口狀況（成品和原始OEM）預測其競爭態勢的變化。這種複雜且多面向的市場動態預計將以多種方式影響競爭對手，包括銷貨成本成本 (COGS) 上升、盈利下降、供應鏈重組以及其他微觀和宏觀市場動態。

目錄

第1章調查方法

第2章執行摘要

  • 市場概覽
  • 主要企業
  • 市場趨勢和促進因素
  • 全球市場展望

第3章市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲國家
  • 亞太地區
  • 其他地區

第4章 比賽

簡介目錄
Product Code: MCP35992

Global Wafer Fab Equipment Market to Reach US$74.4 Billion by 2030

The global market for Wafer Fab Equipment estimated at US$64.6 Billion in the year 2024, is expected to reach US$74.4 Billion by 2030, growing at a CAGR of 2.4% over the analysis period 2024-2030. Front-End-of-Line Processing, one of the segments analyzed in the report, is expected to record a 1.9% CAGR and reach US$47.9 Billion by the end of the analysis period. Growth in the Back-End-of-Line Processing segment is estimated at 3.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$17.0 Billion While China is Forecast to Grow at 2.3% CAGR

The Wafer Fab Equipment market in the U.S. is estimated at US$17.0 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$12.0 Billion by the year 2030 trailing a CAGR of 2.3% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 2.2% and 1.9% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 2.0% CAGR.

Global "Wafer Fab Equipment" Market - Key Trends & Drivers Summarized

Why Is Wafer Fab Equipment at the Core of the Global Semiconductor Boom?

As the global economy becomes increasingly digitized, wafer fabrication (fab) equipment has taken center stage in the production of semiconductors that power virtually every electronic device in existence. From smartphones and laptops to electric vehicles and data centers, the demand for semiconductors is not only rising-it’s accelerating. Wafer fab equipment, which includes machinery used for processes such as photolithography, deposition, etching, ion implantation, and cleaning, is foundational to the manufacture of integrated circuits (ICs). These precision tools enable manufacturers to manipulate silicon wafers at the nanometer scale, ensuring the performance, efficiency, and miniaturization of chips. The explosion of technologies like 5G, artificial intelligence (AI), Internet of Things (IoT), and high-performance computing (HPC) has put enormous pressure on semiconductor supply chains, pushing foundries and integrated device manufacturers (IDMs) to rapidly expand capacity and adopt cutting-edge equipment. Moreover, geopolitical shifts and supply vulnerabilities exposed by recent global crises have led to substantial government investments in domestic chip production-particularly in the U.S., Europe, and East Asia-further boosting demand for advanced fab equipment. As a result, this segment is not just growing-it’s becoming the backbone of modern technological progress.

How Are Technology Nodes and Process Complexity Influencing Equipment Innovation?

The relentless march toward smaller, faster, and more efficient chips is driving an extraordinary evolution in wafer fab equipment technology. As the industry moves below the 7nm, 5nm, and even 3nm process nodes, the complexity of semiconductor manufacturing has grown exponentially. Leading-edge fabrication now requires extreme ultraviolet (EUV) lithography systems capable of patterning minuscule features with unparalleled precision. Companies like ASML, Applied Materials, Tokyo Electron, and Lam Research are at the forefront of developing next-gen tools for deposition, etching, and metrology that can meet the unique demands of these nodes. Increasing transistor density, 3D chip stacking, and gate-all-around (GAA) transistor architecture are pushing equipment makers to develop new materials and atomic-level processing techniques. Additionally, as variability becomes more critical, real-time data analytics and AI-driven control systems are being integrated into fab tools to optimize yield and detect anomalies. This has given rise to “smart fabs” where equipment is no longer just hardware, but part of a digitally connected, self-correcting ecosystem. Energy efficiency, contamination control, and sustainability are also becoming key design priorities as fabs grow in size and complexity. In essence, the sophistication of modern chips is directly mirrored by the innovation in the tools used to produce them.

Where Is the Global Investment in Wafer Fabrication Infrastructure Concentrated?

Global investment in wafer fab equipment is largely concentrated in regions that dominate semiconductor production and are investing in technological self-sufficiency. East Asia remains the powerhouse of the semiconductor world, with Taiwan, South Korea, China, and Japan leading the way in fab construction and equipment imports. Taiwan’s TSMC, South Korea’s Samsung, and China’s SMIC are making multi-billion-dollar investments in both advanced and legacy node manufacturing, ensuring a steady demand pipeline for all categories of fab equipment. The United States, in response to geopolitical tensions and supply chain risks, has initiated substantial subsidies through legislation such as the CHIPS and Science Act to spur domestic manufacturing. Intel, GlobalFoundries, and other U.S.-based players are constructing new facilities with aggressive timelines, further bolstering equipment demand. Europe, too, is ramping up its semiconductor ambitions through initiatives like the European Chips Act, aiming to double its share of global chip production by 2030. Additionally, Southeast Asia is emerging as a strategic hub for backend processes and equipment servicing, while India is actively courting investments to become a future semiconductor manufacturing base. This wave of investment reflects a global race not just to produce chips-but to control the means of production at the wafer level.

The Growth in the Wafer Fab Equipment Market Is Driven by Several Factors…

The growth in the wafer fab equipment market is driven by several factors linked to semiconductor technology advancements, regional capacity expansion, and evolving end-user requirements. One of the foremost drivers is the push toward advanced nodes (5nm and below), which necessitate highly specialized lithography, deposition, and etch equipment to handle smaller geometries and complex transistor structures. The proliferation of AI, 5G, edge computing, and autonomous systems is fueling the need for high-performance, low-power chips-thereby expanding the addressable market for leading-edge equipment. In parallel, legacy node manufacturing remains robust due to demand from automotive, industrial, and IoT sectors, ensuring growth in mature process tools as well. Regional investment incentives, particularly from the U.S., EU, South Korea, and China, are stimulating fab construction and driving bulk purchases of equipment across technology nodes. Additionally, the move toward chiplet architectures and heterogeneous integration is spurring demand for advanced packaging equipment and process-specific innovation. The convergence of hardware and software in fab operations-through the integration of AI, machine learning, and big data-has also created new value chains and service opportunities for equipment vendors. As the global appetite for silicon continues to surge, wafer fab equipment remains an essential and expanding pillar of the semiconductor ecosystem.

SCOPE OF STUDY:

The report analyzes the Wafer Fab Equipment market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Fabrication Process (Front-End-of-Line Processing, Back-End-of-Line Processing); Node Size (7 Nm & Below, 10 Nm, 14 Nm, 22 Nm, 65 Nm & Above); End-Use (Foundry, Memory, Integrated Device Manufacturer, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 44 Featured) -

  • Advantest Corporation
  • Applied Materials, Inc.
  • ASM International N.V.
  • ASML Holding N.V.
  • Brooks Automation, Inc.
  • Canon Inc.
  • Dainippon Screen Mfg. Co., Ltd.
  • Ebara Corporation
  • EV Group (EVG)
  • Hitachi High-Tech Corporation
  • KLA Corporation
  • Lam Research Corporation
  • Nikon Corporation
  • Plasma-Therm LLC
  • Rudolph Technologies, Inc.
  • SUSS MicroTec SE
  • Teradyne, Inc.
  • Tokyo Electron Limited (TEL)
  • ULVAC, Inc.
  • Veeco Instruments Inc.

AI INTEGRATIONS

We're transforming market and competitive intelligence with validated expert content and AI tools.

Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • Wafer Fab Equipment - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Escalating Demand for Advanced Semiconductor Nodes Propels Growth in Wafer Fab Equipment
    • Rise of AI, HPC, and Data Center Markets Expands Demand for Cutting-Edge Fabrication Tools
    • Miniaturization of Devices Strengthens Business Case for EUV Lithography Systems
    • Increasing Chip Complexity and Layer Count Spur Adoption of Advanced Etching and Deposition Equipment
    • Surge in Electric Vehicle Production Generates Demand for Power Semiconductor Manufacturing
    • Technological Innovations in Process Control Tools Sustain Equipment Market Momentum
    • Expansion of 3D Packaging and Heterogeneous Integration Throws Spotlight on Backend Fab Equipment
    • Supply Chain Resilience Efforts Create Opportunities for Localized Equipment Production
    • Rising Importance of Yield Optimization Drives Adoption of AI-Powered Monitoring Systems
    • Continued Foundry Competition Spurs Capex in Cutting-Edge Tooling
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Wafer Fab Equipment Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Wafer Fab Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Wafer Fab Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for Wafer Fab Equipment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Front-End-of-Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Front-End-of-Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for Front-End-of-Line Processing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Back-End-of-Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Back-End-of-Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for Back-End-of-Line Processing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Integrated Device Manufacturer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Integrated Device Manufacturer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for Integrated Device Manufacturer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Foundry by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Foundry by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Foundry by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 22: World 15-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for 7 Nm & Below by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for 7 Nm & Below by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 25: World 15-Year Perspective for 7 Nm & Below by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for 10 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 27: World Historic Review for 10 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 28: World 15-Year Perspective for 10 Nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for 14 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 30: World Historic Review for 14 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 31: World 15-Year Perspective for 14 Nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for 22 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 33: World Historic Review for 22 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 34: World 15-Year Perspective for 22 Nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 35: World Recent Past, Current & Future Analysis for 65 Nm & Above by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 36: World Historic Review for 65 Nm & Above by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 37: World 15-Year Perspective for 65 Nm & Above by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 38: USA Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 40: USA 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 41: USA Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 42: USA Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 43: USA 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 44: USA Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: USA Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 46: USA 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 47: Canada Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 48: Canada Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 49: Canada 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 50: Canada Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Canada Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 52: Canada 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 53: Canada Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Canada Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 55: Canada 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • JAPAN
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 56: Japan Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Japan Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 58: Japan 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 59: Japan Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Japan Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 61: Japan 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 62: Japan Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Japan Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 64: Japan 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • CHINA
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 65: China Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 66: China Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 67: China 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 68: China Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: China Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 70: China 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 71: China Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 72: China Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 73: China 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • EUROPE
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 74: Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 75: Europe Historic Review for Wafer Fab Equipment by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 76: Europe 15-Year Perspective for Wafer Fab Equipment by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 77: Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 78: Europe Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 79: Europe 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 80: Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Europe Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 82: Europe 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 83: Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Europe Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 85: Europe 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • FRANCE
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 86: France Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: France Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 88: France 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 89: France Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 90: France Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 91: France 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 92: France Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: France Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 94: France 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • GERMANY
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 95: Germany Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Germany Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 97: Germany 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 98: Germany Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Germany Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 100: Germany 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 101: Germany Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 102: Germany Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 103: Germany 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 104: Italy Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Italy Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 106: Italy 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 107: Italy Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 108: Italy Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 109: Italy 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 110: Italy Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Italy Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 112: Italy 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 113: UK Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 114: UK Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 115: UK 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 116: UK Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 117: UK Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 118: UK 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 119: UK Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 120: UK Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 121: UK 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 122: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 123: Rest of Europe Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 124: Rest of Europe 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 125: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 126: Rest of Europe Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 127: Rest of Europe 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 128: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Rest of Europe Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 130: Rest of Europe 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 131: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 132: Asia-Pacific Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 133: Asia-Pacific 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 134: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Asia-Pacific Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 136: Asia-Pacific 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 137: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Asia-Pacific Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 139: Asia-Pacific 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • REST OF WORLD
    • TABLE 140: Rest of World Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 141: Rest of World Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 142: Rest of World 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 143: Rest of World Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 144: Rest of World Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 145: Rest of World 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 146: Rest of World Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Rest of World Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 148: Rest of World 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030

IV. COMPETITION