切割膠帶市場－全球產業規模、佔有率、趨勢、機會和預測，按類型、材料、最終用途產業、地區和競爭細分，2020-2030 年預測

2024 年全球切割膠帶市場價值為 13.4 億美元，預計到 2030 年將達到 19.4 億美元，預測期內的複合年成長率為 6.21%。切割膠帶是半導體和電子製造中使用的專用黏合材料，可在高精度切割過程中牢固地固定晶圓、玻璃或陶瓷基板。這些膠帶對於防止機械或雷射切割操作過程中出現碎裂、開裂或錯位至關重要。這些膠帶種類繁多，從紫外線固化和非紫外線到放熱和壓敏型，可滿足各種應用需求。電子、汽車、電信和工業應用中對半導體日益成長的需求推動了市場的擴張。隨著積體電路的複雜性和小型化程度的提高，對可靠、高性能切割膠帶解決方案的需求也在不斷成長，以確保準確、無損的組件分離。

關鍵市場促進因素

半導體產業的擴張

主要市場挑戰

高級切割膠帶成本高昂

主要市場趨勢

非紫外線切割膠帶的採用率不斷提高

目錄

第 1 章：產品概述

第2章：研究方法

第3章：執行摘要

第4章：顧客之聲

第5章：全球切割膠帶市場展望

• 市場規模和預測
  • 按價值
• 市場佔有率和預測
  • 依類型（UV 固化切割膠帶、非 UV 切割膠帶、熱釋放切割膠帶、壓敏切割膠帶）
  • 依材質（聚乙烯、聚氯乙烯、聚對苯二甲酸乙二酯、聚烯烴）
  • 依最終用途產業（半導體、電子、光子學、汽車）
  • 按地區（北美、歐洲、南美、中東和非洲、亞太地區）
• 按公司分類（2024）
• 市場地圖

第6章：北美切割膠帶市場展望

• 市場規模和預測
• 市場佔有率和預測
• 北美：國家分析
  • 美國
  • 加拿大
  • 墨西哥

第7章：歐洲切割膠帶市場展望

• 市場規模和預測
• 市場佔有率和預測
• 歐洲：國家分析
  • 德國
  • 法國
  • 英國
  • 義大利
  • 西班牙

第8章：亞太切割膠帶市場展望

• 市場規模和預測
• 市場佔有率和預測
• 亞太地區：國家分析
  • 中國
  • 印度
  • 日本
  • 韓國
  • 澳洲

第9章：中東和非洲切割膠帶市場展望

• 市場規模和預測
• 市場佔有率和預測
• 中東和非洲：國家分析
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 南非

第10章：南美洲切割膠帶市場展望

• 市場規模和預測
• 市場佔有率和預測
• 南美洲：國家分析
  • 巴西
  • 哥倫比亞
  • 阿根廷

第 11 章：市場動態

• 驅動程式
• 挑戰

第 12 章：市場趨勢與發展

• 合併與收購（如有）
• 產品發布（如有）
• 最新動態

第13章：公司簡介

• Nitto Denko Corporation
• 3M Company
• Tesa SE
• Shinto Paint Co., Ltd
• Momentive Performance Materials Inc
• Dai Nippon Printing Co., Ltd.
• Mitsui Chemicals, Inc.
• Lintec Corporation
• Samsung Fine Chemicals
• Avery Dennison Corporation

第 14 章：策略建議

第15章調查會社について,免責事項

The Global Dicing Tapes Market was valued at USD 1.34 Billion in 2024 and is projected to reach USD 1.94 Billion by 2030, growing at a CAGR of 6.21% during the forecast period. Dicing tapes are specialized adhesive materials used in semiconductor and electronics manufacturing to securely hold wafers, glass, or ceramic substrates during high-precision dicing processes. These tapes are essential for preventing chipping, cracking, or misalignment during mechanical or laser-based cutting operations. With types ranging from UV curable and non-UV to heat-release and pressure-sensitive variants, these tapes are tailored to meet diverse application needs. The market's expansion is being propelled by the growing demand for semiconductors in electronics, automotive, telecom, and industrial applications. As the complexity and miniaturization of integrated circuits increase, so does the need for reliable, high-performance dicing tape solutions that can ensure accurate and damage-free component separation.

Key Market Drivers

Expansion of the Semiconductor Industry

The rapid growth of the global semiconductor sector is a major driver of the Dicing Tapes market. With increasing adoption of electronic devices in areas such as consumer electronics, automotive systems, telecom infrastructure, and medical technology, there is a heightened need for precise semiconductor chip fabrication. Dicing tapes are vital to maintaining wafer integrity during dicing, especially as chip designs become more compact and intricate. Advanced adhesion and thermal resistance properties are essential in this context, prompting manufacturers to innovate and deliver next-generation tape solutions. Continued R&D in materials and adhesives ensures compatibility with evolving semiconductor manufacturing standards and supports the industry's demand for performance and reliability.

Key Market Challenges

High Cost of Advanced Dicing Tapes

One of the primary challenges in the Dicing Tapes market is the elevated cost of producing technologically advanced tapes. These specialized tapes are engineered to perform under stringent conditions-such as maintaining adhesion under thermal stress and enabling clean, precise wafer separation. However, the R&D, raw materials, and manufacturing processes required to produce such high-performance products significantly increase production expenses. For semiconductor manufacturers, particularly small and mid-sized firms, these higher costs can impact overall profitability. The financial burden of incorporating premium dicing tapes into production lines may limit adoption and create entry barriers, especially in cost-sensitive regions or for lower-volume applications.

Key Market Trends

Increased Adoption of Non-UV Dicing Tapes

A notable trend shaping the Dicing Tapes market is the growing shift toward non-UV dicing tapes. These tapes eliminate the need for ultraviolet exposure, offering enhanced protection for delicate wafers and components during the dicing process. With better adhesion and compatibility for high-precision applications, non-UV tapes are increasingly used in advanced semiconductor packaging. Their role is especially prominent in the fabrication of chips for 5G networks, artificial intelligence, and memory devices, where clean cuts and wafer stability are critical. These tapes also support high-temperature processing environments and fine-pitch designs, making them ideal for next-generation chip technologies. As manufacturers seek more robust and efficient solutions, non-UV dicing tapes are gaining favor across the semiconductor value chain.

Key Market Players

• Nitto Denko Corporation
• 3M Company
• Tesa SE
• Lintec Corporation
• Momentive Performance Materials Inc
• Dai Nippon Printing Co., Ltd.
• Mitsui Chemicals, Inc.
• Shinto Paint Co., Ltd
• Samsung Fine Chemicals
• Avery Dennison Corporation

Report Scope:

In this report, the Global Dicing Tapes Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Dicing Tapes Market, By Type:

• UV Curable Dicing Tapes
• Non-UV Dicing Tapes
• Heat Release Dicing Tapes
• Pressure Sensitive Dicing Tapes

Dicing Tapes Market, By Material:

• Polyethylene
• Polyvinyl Chloride
• Polyethylene Terephthalate
• Polyolefin

Dicing Tapes Market, By End-use Industry:

• Semiconductor
• Electronics
• Photonics
• Automotive

Dicing Tapes Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
• South America
  • Brazil
  • Argentina
  • Colombia
• Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • South Africa

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Dicing Tapes Market.

Available Customizations:

Global Dicing Tapes Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, and Trends

4. Voice of Customer

5. Global Dicing Tapes Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Type (UV Curable Dicing Tapes, Non-UV Dicing Tapes, Heat Release Dicing Tapes, Pressure Sensitive Dicing Tapes)
  • 5.2.2. By Material (Polyethylene, Polyvinyl Chloride, Polyethylene Terephthalate, Polyolefin)
  • 5.2.3. By End-use Industry (Semiconductor, Electronics, Photonics, Automotive)
  • 5.2.4. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
• 5.3. By Company (2024)
• 5.4. Market Map

6. North America Dicing Tapes Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Type
  • 6.2.2. By Material
  • 6.2.3. By End-use Industry
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Dicing Tapes Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Type
      • 6.3.1.2.2. By Material
      • 6.3.1.2.3. By End-use Industry
  • 6.3.2. Canada Dicing Tapes Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Type
      • 6.3.2.2.2. By Material
      • 6.3.2.2.3. By End-use Industry
  • 6.3.3. Mexico Dicing Tapes Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Type
      • 6.3.3.2.2. By Material
      • 6.3.3.2.3. By End-use Industry

7. Europe Dicing Tapes Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Type
  • 7.2.2. By Material
  • 7.2.3. By End-use Industry
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Dicing Tapes Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Type
      • 7.3.1.2.2. By Material
      • 7.3.1.2.3. By End-use Industry
  • 7.3.2. France Dicing Tapes Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Type
      • 7.3.2.2.2. By Material
      • 7.3.2.2.3. By End-use Industry
  • 7.3.3. United Kingdom Dicing Tapes Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Type
      • 7.3.3.2.2. By Material
      • 7.3.3.2.3. By End-use Industry
  • 7.3.4. Italy Dicing Tapes Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Type
      • 7.3.4.2.2. By Material
      • 7.3.4.2.3. By End-use Industry
  • 7.3.5. Spain Dicing Tapes Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Type
      • 7.3.5.2.2. By Material
      • 7.3.5.2.3. By End-use Industry

8. Asia Pacific Dicing Tapes Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Type
  • 8.2.2. By Material
  • 8.2.3. By End-use Industry
  • 8.2.4. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Dicing Tapes Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Type
      • 8.3.1.2.2. By Material
      • 8.3.1.2.3. By End-use Industry
  • 8.3.2. India Dicing Tapes Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Type
      • 8.3.2.2.2. By Material
      • 8.3.2.2.3. By End-use Industry
  • 8.3.3. Japan Dicing Tapes Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Type
      • 8.3.3.2.2. By Material
      • 8.3.3.2.3. By End-use Industry
  • 8.3.4. South Korea Dicing Tapes Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Type
      • 8.3.4.2.2. By Material
      • 8.3.4.2.3. By End-use Industry
  • 8.3.5. Australia Dicing Tapes Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Type
      • 8.3.5.2.2. By Material
      • 8.3.5.2.3. By End-use Industry

9. Middle East & Africa Dicing Tapes Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Type
  • 9.2.2. By Material
  • 9.2.3. By End-use Industry
  • 9.2.4. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Dicing Tapes Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Type
      • 9.3.1.2.2. By Material
      • 9.3.1.2.3. By End-use Industry
  • 9.3.2. UAE Dicing Tapes Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Type
      • 9.3.2.2.2. By Material
      • 9.3.2.2.3. By End-use Industry
  • 9.3.3. South Africa Dicing Tapes Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Type
      • 9.3.3.2.2. By Material
      • 9.3.3.2.3. By End-use Industry

10. South America Dicing Tapes Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Type
  • 10.2.2. By Material
  • 10.2.3. By End-use Industry
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Dicing Tapes Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Type
      • 10.3.1.2.2. By Material
      • 10.3.1.2.3. By End-use Industry
  • 10.3.2. Colombia Dicing Tapes Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Type
      • 10.3.2.2.2. By Material
      • 10.3.2.2.3. By End-use Industry
  • 10.3.3. Argentina Dicing Tapes Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Type
      • 10.3.3.2.2. By Material
      • 10.3.3.2.3. By End-use Industry

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends and Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Company Profiles

• 13.1. Nitto Denko Corporation
  • 13.1.1. Business Overview
  • 13.1.2. Key Revenue and Financials
  • 13.1.3. Recent Developments
  • 13.1.4. Key Personnel
  • 13.1.5. Key Product/Services Offered
• 13.2. 3M Company
• 13.3. Tesa SE
• 13.4. Shinto Paint Co., Ltd
• 13.5. Momentive Performance Materials Inc
• 13.6. Dai Nippon Printing Co., Ltd.
• 13.7. Mitsui Chemicals, Inc.
• 13.8. Lintec Corporation
• 13.9. Samsung Fine Chemicals
• 13.10. Avery Dennison Corporation

14. Strategic Recommendations

15. About Us & Disclaimer