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市場調查報告書
商品編碼
1763846

覆銅板市場-全球產業規模、佔有率、趨勢、機會及預測(細分、按應用、按材料類型、按製造程序、按地區、按競爭,2020-2030 年)

Copper Clad Laminates Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented, By Application, By Material Type, By Manufacturing Process, By Region, By Competition, 2020-2030F

出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3個工作天內

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簡介目錄

2024年,全球覆銅板市場規模達159.7億美元,預計2030年將達217.1億美元,複合年成長率為5.09%。覆銅板(CCL)是印刷電路板(PCB)製造的基礎材料,其絕緣芯材(例如玻璃纖維、紙或複合環氧樹脂)單面或雙面覆蓋銅箔。這些覆銅板為各種電子應用中的電路提供必要的導電性、結構支撐和熱穩定性。隨著電子產品不斷發展,對更高效能和更緊湊設計的需求不斷成長,CCL在消費性電子、電信、汽車電子等領域的相關性和應用範圍顯著擴大。

市場概覽
預測期 2026-2030
2024年市場規模 159.7億美元
2030年市場規模 217.1億美元
2025-2030 年複合年成長率 5.09%
成長最快的領域 電源電路板
最大的市場 北美洲

關鍵市場促進因素

消費性電子產品和小型化設備的需求不斷成長

主要市場挑戰

原物料價格波動與供應鏈中斷

主要市場趨勢

高密度互連 (HDI) 技術和電子產品小型化推動需求激增

目錄

第 1 章:產品概述

第2章:研究方法

第3章:執行摘要

第4章:顧客之聲

第5章:全球覆銅板市場展望

  • 市場規模和預測
    • 按價值
  • 市場佔有率和預測
    • 依應用(高速數位電路板、電源電路板、汽車電路板、消費性電子電路板、醫療電路板、工業電路板)
    • 依材料類型(FR-4、CEM-1、CEM-3、FR-2、FR-5、聚醯亞胺、PTFE)
    • 依製造流程分類(層壓樹脂壓機、高壓層壓壓機、雙面膠帶層壓、冷層壓壓機、高頻層壓壓機)
    • 按地區
  • 按公司分類(2024)
  • 市場地圖

第6章:北美覆銅板市場展望

  • 市場規模和預測
  • 市場佔有率和預測
  • 北美:國家分析
    • 美國
    • 加拿大
    • 墨西哥

第7章:歐洲覆銅板市場展望

  • 市場規模和預測
  • 市場佔有率和預測
  • 歐洲:國家分析
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙

第8章:亞太覆銅板市場展望

  • 市場規模和預測
  • 市場佔有率和預測
  • 亞太地區:國家分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

第9章:南美洲覆銅板市場展望

  • 市場規模和預測
  • 市場佔有率和預測
  • 南美洲:國家分析
    • 巴西
    • 阿根廷
    • 哥倫比亞

第10章:中東與非洲覆銅板市場展望

  • 市場規模和預測
  • 市場佔有率和預測
  • 中東和非洲:國家分析
    • 南非
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 科威特
    • 土耳其

第 11 章:市場動態

  • 驅動程式
  • 挑戰

第 12 章:市場趨勢與發展

  • 合併與收購(如有)
  • 產品發布(如有)
  • 最新動態

第13章:公司簡介

  • Kingboard Laminates Holdings Ltd.
  • Nan Ya Plastics Corporation
  • Panasonic Corporation
  • ITEQ Corporation
  • Shengyi Technology Co., Ltd. (SYTECH)
  • Isola Group
  • Doosan Corporation Electro-Materials
  • Nippon Mektron, Ltd.
  • Ventec International Group
  • Rogers Corporation

第 14 章:策略建議

第15章調查會社について,免責事項

簡介目錄
Product Code: 29665

The Global Copper Clad Laminates Market was valued at USD 15.97 billion in 2024 and is projected to reach USD 21.71 billion by 2030, growing at a CAGR of 5.09%. Copper Clad Laminates (CCLs) serve as foundational materials in the manufacturing of printed circuit boards (PCBs), comprising an insulating core-such as glass fiber, paper, or composite epoxy-coated with copper foil on one or both sides. These laminates provide essential electrical conductivity, structural support, and thermal stability for circuit pathways in a wide array of electronic applications. As electronics continue to evolve with demand for higher performance and compact designs, the relevance and adoption of CCLs have significantly expanded across consumer devices, telecommunications, automotive electronics, and more.

Market Overview
Forecast Period2026-2030
Market Size 2024USD 15.97 Billion
Market Size 2030USD 21.71 Billion
CAGR 2025-20305.09%
Fastest Growing SegmentPower Circuit Boards
Largest MarketNorth America

Key Market Drivers

Rising Demand for Consumer Electronics and Miniaturized Devices

The rapid growth of the global consumer electronics sector is significantly propelling the copper clad laminates (CCL) market, with widespread usage in devices such as smartphones, tablets, wearables, laptops, smart home appliances, and gaming consoles. As consumer preferences shift toward faster, slimmer, and multifunctional devices, manufacturers are driven to deliver compact and high-performance products. Copper clad laminates, being a crucial component in printed circuit boards (PCBs), play a pivotal role in achieving these objectives by offering robust electrical conductivity, insulation, and structural integrity needed in compact device architecture.

Key Market Challenges

Volatility in Raw Material Prices and Supply Chain Disruptions

The Copper Clad Laminates (CCL) market faces notable challenges due to fluctuating raw material prices, particularly for copper and epoxy resins, which directly influence production expenses and profitability. Copper's price volatility stems from factors such as global supply-demand imbalances, geopolitical instability, mining limitations, and currency shifts. This unpredictability places cost pressures on manufacturers who may struggle to maintain margins or be forced to pass costs to customers, potentially affecting demand. Additionally, resin and glass fabric costs are impacted by crude oil price movements, adding to the financial uncertainty. The situation is compounded by global supply chain vulnerabilities triggered by events like the COVID-19 pandemic, geopolitical conflicts, and maritime disruptions in regions like the Red Sea and Suez Canal. These issues have led to longer delivery timelines, rising freight costs, and sporadic raw material availability, particularly affecting manufacturers in the Asia Pacific. As a result, securing stable long-term material contracts has become increasingly difficult, making pricing and production planning highly unpredictable.

Key Market Trends

Surge in Demand Driven by High-Density Interconnect (HDI) Technology and Miniaturization in Electronics

The transition toward compact, high-efficiency, and multi-layer printed circuit boards (PCBs) is accelerating demand for copper clad laminates as High-Density Interconnect (HDI) technology becomes standard in modern electronics. With the rise of space-saving consumer products such as smartphones, tablets, and wearables, PCBs must accommodate dense circuitry while ensuring thermal and signal performance. To meet these specifications, CCL manufacturers are developing advanced laminates featuring ultra-thin prepregs, high Tg materials, low-loss substrates, and premium copper foil types like RTF and HTE. These innovations offer superior dielectric characteristics, dimensional reliability, and enhanced adhesion-critical for supporting microvias, blind/buried vias, and fine-line routing. Moreover, the growth of 5G infrastructure, electric vehicle electronics, IoT solutions, and ADAS technologies is fueling further adoption of HDI and multilayer board designs, boosting the overall CCL market.

Key Market Players

  • Kingboard Laminates Holdings Ltd.
  • Nan Ya Plastics Corporation
  • Panasonic Corporation
  • ITEQ Corporation
  • Shengyi Technology Co., Ltd. (SYTECH)
  • Isola Group
  • Doosan Corporation Electro-Materials
  • Nippon Mektron, Ltd.
  • Ventec International Group
  • Rogers Corporation

Report Scope:

In this report, the Global Copper Clad Laminates Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Copper Clad Laminates Market, By Application:

  • High-Speed Digital Circuit Boards
  • Power Circuit Boards
  • Automotive Circuit Boards
  • Consumer Electronics Circuit Boards
  • Medical Circuit Boards
  • Industrial Circuit Boards

Copper Clad Laminates Market, By Material Type:

  • FR-4
  • CEM-1
  • CEM-3
  • FR-2
  • FR-5
  • Polyimide
  • PTFE

Copper Clad Laminates Market, By Manufacturing Process:

  • Laminating Resin Press
  • High-Pressure Laminating Press
  • Double-Sided Tape Lamination
  • Cold Lamination Press
  • High-Frequency Lamination Press

Copper Clad Laminates Market, By Region:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE
    • Kuwait
    • Turkey

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Copper Clad Laminates Market.

Available Customizations:

Global Copper Clad Laminates Market report with the given Market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional Market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
  • 1.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Formulation of the Scope
  • 2.4. Assumptions and Limitations
  • 2.5. Sources of Research
    • 2.5.1. Secondary Research
    • 2.5.2. Primary Research
  • 2.6. Approach for the Market Study
    • 2.6.1. The Bottom-Up Approach
    • 2.6.2. The Top-Down Approach
  • 2.7. Methodology Followed for Calculation of Market Size & Market Shares
  • 2.8. Forecasting Methodology
    • 2.8.1. Data Triangulation & Validation

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, and Trends

4. Voice of Customer

5. Global Copper Clad Laminates Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Application (High-Speed Digital Circuit Boards, Power Circuit Boards, Automotive Circuit Boards, Consumer Electronics Circuit Boards, Medical Circuit Boards, Industrial Circuit Boards)
    • 5.2.2. By Material Type (FR-4, CEM-1, CEM-3, FR-2, FR-5, Polyimide, PTFE)
    • 5.2.3. By Manufacturing Process (Laminating Resin Press, High-Pressure Laminating Press, Double-Sided Tape Lamination, Cold Lamination Press, High-Frequency Lamination Press)
    • 5.2.4. By Region
  • 5.3. By Company (2024)
  • 5.4. Market Map

6. North America Copper Clad Laminates Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Application
    • 6.2.2. By Material Type
    • 6.2.3. By Manufacturing Process
    • 6.2.4. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Copper Clad Laminates Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Application
        • 6.3.1.2.2. By Material Type
        • 6.3.1.2.3. By Manufacturing Process
    • 6.3.2. Canada Copper Clad Laminates Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Application
        • 6.3.2.2.2. By Material Type
        • 6.3.2.2.3. By Manufacturing Process
    • 6.3.3. Mexico Copper Clad Laminates Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Application
        • 6.3.3.2.2. By Material Type
        • 6.3.3.2.3. By Manufacturing Process

7. Europe Copper Clad Laminates Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Application
    • 7.2.2. By Material Type
    • 7.2.3. By Manufacturing Process
    • 7.2.4. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Copper Clad Laminates Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Application
        • 7.3.1.2.2. By Material Type
        • 7.3.1.2.3. By Manufacturing Process
    • 7.3.2. United Kingdom Copper Clad Laminates Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Application
        • 7.3.2.2.2. By Material Type
        • 7.3.2.2.3. By Manufacturing Process
    • 7.3.3. Italy Copper Clad Laminates Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Application
        • 7.3.3.2.2. By Material Type
        • 7.3.3.2.3. By Manufacturing Process
    • 7.3.4. France Copper Clad Laminates Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Application
        • 7.3.4.2.2. By Material Type
        • 7.3.4.2.3. By Manufacturing Process
    • 7.3.5. Spain Copper Clad Laminates Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Application
        • 7.3.5.2.2. By Material Type
        • 7.3.5.2.3. By Manufacturing Process

8. Asia-Pacific Copper Clad Laminates Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Application
    • 8.2.2. By Material Type
    • 8.2.3. By Manufacturing Process
    • 8.2.4. By Country
  • 8.3. Asia-Pacific: Country Analysis
    • 8.3.1. China Copper Clad Laminates Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Application
        • 8.3.1.2.2. By Material Type
        • 8.3.1.2.3. By Manufacturing Process
    • 8.3.2. India Copper Clad Laminates Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Application
        • 8.3.2.2.2. By Material Type
        • 8.3.2.2.3. By Manufacturing Process
    • 8.3.3. Japan Copper Clad Laminates Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Application
        • 8.3.3.2.2. By Material Type
        • 8.3.3.2.3. By Manufacturing Process
    • 8.3.4. South Korea Copper Clad Laminates Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Application
        • 8.3.4.2.2. By Material Type
        • 8.3.4.2.3. By Manufacturing Process
    • 8.3.5. Australia Copper Clad Laminates Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Application
        • 8.3.5.2.2. By Material Type
        • 8.3.5.2.3. By Manufacturing Process

9. South America Copper Clad Laminates Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Application
    • 9.2.2. By Material Type
    • 9.2.3. By Manufacturing Process
    • 9.2.4. By Country
  • 9.3. South America: Country Analysis
    • 9.3.1. Brazil Copper Clad Laminates Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Application
        • 9.3.1.2.2. By Material Type
        • 9.3.1.2.3. By Manufacturing Process
    • 9.3.2. Argentina Copper Clad Laminates Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Application
        • 9.3.2.2.2. By Material Type
        • 9.3.2.2.3. By Manufacturing Process
    • 9.3.3. Colombia Copper Clad Laminates Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Application
        • 9.3.3.2.2. By Material Type
        • 9.3.3.2.3. By Manufacturing Process

10. Middle East and Africa Copper Clad Laminates Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Application
    • 10.2.2. By Material Type
    • 10.2.3. By Manufacturing Process
    • 10.2.4. By Country
  • 10.3. Middle East and Africa: Country Analysis
    • 10.3.1. South Africa Copper Clad Laminates Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Application
        • 10.3.1.2.2. By Material Type
        • 10.3.1.2.3. By Manufacturing Process
    • 10.3.2. Saudi Arabia Copper Clad Laminates Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Application
        • 10.3.2.2.2. By Material Type
        • 10.3.2.2.3. By Manufacturing Process
    • 10.3.3. UAE Copper Clad Laminates Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Application
        • 10.3.3.2.2. By Material Type
        • 10.3.3.2.3. By Manufacturing Process
    • 10.3.4. Kuwait Copper Clad Laminates Market Outlook
      • 10.3.4.1. Market Size & Forecast
        • 10.3.4.1.1. By Value
      • 10.3.4.2. Market Share & Forecast
        • 10.3.4.2.1. By Application
        • 10.3.4.2.2. By Material Type
        • 10.3.4.2.3. By Manufacturing Process
    • 10.3.5. Turkey Copper Clad Laminates Market Outlook
      • 10.3.5.1. Market Size & Forecast
        • 10.3.5.1.1. By Value
      • 10.3.5.2. Market Share & Forecast
        • 10.3.5.2.1. By Application
        • 10.3.5.2.2. By Material Type
        • 10.3.5.2.3. By Manufacturing Process

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Company Profiles

  • 13.1. Kingboard Laminates Holdings Ltd.
    • 13.1.1. Business Overview
    • 13.1.2. Key Revenue and Financials
    • 13.1.3. Recent Developments
    • 13.1.4. Key Personnel/Key Contact Person
    • 13.1.5. Key Product/Services Offered
  • 13.2. Nan Ya Plastics Corporation
  • 13.3. Panasonic Corporation
  • 13.4. ITEQ Corporation
  • 13.5. Shengyi Technology Co., Ltd. (SYTECH)
  • 13.6. Isola Group
  • 13.7. Doosan Corporation Electro-Materials
  • 13.8. Nippon Mektron, Ltd.
  • 13.9. Ventec International Group
  • 13.10. Rogers Corporation

14. Strategic Recommendations

15. About Us & Disclaimer