覆銅板市場規模、佔有率及成長分析(按應用、材料類型、製造程序、銅塗層及地區)-2025-2032 年產業預測
市場調查報告書
商品編碼
1758593

覆銅板市場規模、佔有率及成長分析(按應用、材料類型、製造程序、銅塗層及地區)-2025-2032 年產業預測

Copper Clad Laminate Market Size, Share, and Growth Analysis, By Application (High-Speed Digital Circuit Boards, Power Circuit Boards), By Material Type (Fr-4, Cem-1), By Manufacturing Process, By Copper Coating, By Region - Industry Forecast 2025-2032

出版日期: | 出版商: SkyQuest | 英文 194 Pages | 商品交期: 3-5個工作天內

價格
簡介目錄

2023 年全球覆銅板市場規模為 175 億美元,預計將從 2024 年的 187.1 億美元成長到 2032 年的 319 億美元,預測期內(2025-2032 年)的複合年成長率為 6.9%。

覆銅板 (CCL) 市場正經歷強勁成長,主要得益於電子和通訊行業需求的不斷成長。推動這項擴張的關鍵因素包括印刷基板(PCB) 製造和半導體生產的進步。預計到 2024 年,亞太地區將以最高的成長率引領市場,這得益於其作為通訊系統、汽車電子、醫療技術和國防應用中心的戰略定位。隨著全球電子格局的發展,尤其是消費性電子產品、汽車技術創新、5G 基礎設施和物聯網設備的興起,對高性能和耐用層壓板的需求持續激增。此外,汽車產業向電動車和 ADAS(高級駕駛輔助系統)的轉變進一步推動了對可靠、耐熱層壓板的需求。

目錄

介紹

  • 調查目的
  • 研究範圍
  • 定義

調查方法

  • 資訊採購
  • 二次資料和一次資料方法
  • 市場規模預測
  • 市場假設與限制

執行摘要

  • 全球市場展望
  • 供需趨勢分析
  • 細分機會分析

市場動態與展望

  • 市場概覽
  • 市場規模
  • 市場動態
    • 促進因素和機會
    • 限制與挑戰
  • 波特的分析

關鍵市場考察

  • 關鍵成功因素
  • 競爭程度
  • 主要投資機會
  • 市場生態系統
  • 市場吸引力指數(2024年)
  • PESTEL分析
  • 總體經濟指標
  • 價值鏈分析
  • 定價分析

覆銅板市場規模(依應用)

  • 市場概覽
  • 高速數位電路基板
  • 電源電路基板
  • 汽車電路基板
  • 家用電子電器電路基板
  • 醫療電路基板
  • 工業電路基板

覆銅板市場規模(依材料類型分類)

  • 市場概覽
  • Fr-4
  • Cem-1
  • Cem-3
  • Fr-2
  • Fr-5
  • 聚醯亞胺
  • 鉑鐵

按製造流程分類的覆銅板市場規模

  • 市場概覽
  • 層壓樹脂壓機
  • 高壓層壓機
  • 雙面膠帶層壓板
  • 冷裱壓機
  • 高頻層壓機

覆銅板市場規模(依銅塗層分類)

  • 市場概覽
  • 電解
  • 軋延銅
  • 濺鍍銅
  • 包覆銅
  • 蝕刻銅

覆銅板市場規模

  • 北美洲
    • 美國
    • 加拿大
  • 歐洲
    • 德國
    • 西班牙
    • 法國
    • 英國
    • 義大利
    • 其他歐洲國家地區
  • 亞太地區
    • 中國
    • 印度
    • 日本
    • 韓國
    • 其他亞太地區
  • 拉丁美洲
    • 巴西
    • 其他拉丁美洲
  • 中東和非洲
    • 海灣合作理事會國家
    • 南非
    • 其他中東和非洲地區

競爭資訊

  • 前五大公司對比
  • 主要企業市場定位(2024年)
  • 主要市場參與者所採取的策略
  • 近期市場趨勢
  • 公司市場佔有率分析(2024年)
  • 主要企業簡介
    • 公司詳情
    • 產品系列分析
    • 公司分部佔有率分析
    • 收益同比對比(2022-2024 年)

主要企業簡介

  • Kingboard Laminates Holdings Ltd.(China)
  • Shengyi Technology Co., Ltd.(China)
  • Nan Ya Plastics Corporation(Taiwan)
  • Panasonic Holdings Corporation(Japan)
  • Taiwan Union Technology Corporation(Taiwan)
  • Hitachi Chemical Co., Ltd.(Japan)
  • Isola Group(USA)
  • Doosan Corporation Electro-Materials(South Korea)
  • Mitsubishi Gas Chemical Company, Inc.(Japan)
  • Rogers Corporation(USA)
  • Elite Material Co. Ltd.(EMC)(Taiwan)
  • ITEQ Corporation(Taiwan)
  • Resonac Corporation(Japan)
  • AGC Inc.(Japan)
  • Ventec International Group(China/UK)
  • Chang Chun Group(Taiwan)
  • Nanya New Material Technology Co., Ltd.(China)
  • Goldenmax International Group Ltd.(China)
  • Wazam New Materials(China)
  • Sumitomo Bakelite Co., Ltd.(Japan)

結論和建議

簡介目錄
Product Code: SQMIG15K2005

Global Copper Clad Laminate Market size was valued at USD 17.5 billion in 2023 and is poised to grow from USD 18.71 billion in 2024 to USD 31.9 billion by 2032, growing at a CAGR of 6.9% during the forecast period (2025-2032).

The copper clad laminate (CCL) market is witnessing robust growth, primarily fueled by rising demand from the electronics and telecommunications sectors. Key factors driving this expansion include advancements in printed circuit board (PCB) fabrication and semiconductor production. The Asia Pacific region is expected to lead the market, exhibiting the highest growth rate in 2024 due to its strategic position as a hub for communication systems, automotive electronics, healthcare technology, and defense applications. As the global electronics landscape evolves, particularly with the proliferation of consumer electronics, automotive innovations, 5G infrastructure, and IoT devices, the demand for high-performance, durable laminates continues to surge. Additionally, the automotive industry's transition toward electric vehicles and advanced driver-assistance systems further intensifies the need for reliable heat-resistant laminates.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Copper Clad Laminate market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Copper Clad Laminate Market Segments Analysis

Global Copper Clad Laminate Market is segmented by Application, Material Type, Manufacturing Process, Copper Coating and region. Based on Application, the market is segmented into High-Speed Digital Circuit Boards, Power Circuit Boards, Automotive Circuit Boards, Consumer Electronics Circuit Boards, Medical Circuit Boards and Industrial Circuit Boards. Based on Material Type, the market is segmented into Fr-4, Cem-1, Cem-3, Fr-2, Fr-5, Polyimide and PtFe. Based on Manufacturing Process, the market is segmented into Laminating Resin Press, High-Pressure Laminating Press, Double-Sided Tape Lamination, Cold Lamination Press and High-Frequency Lamination Press. Based on Copper Coating, the market is segmented into Electrolytic Copper, Rolled Copper, Sputtered Copper, Clad Copper and Etched Copper. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Copper Clad Laminate Market

The global Copper Clad Laminate (CCL) market is primarily driven by the increasing demand for electronic devices such as smartphones, laptops, electric vehicles (EVs), and various industrial equipment. CCLs play a crucial role in the manufacturing of printed circuit boards (PCBs), which are vital components in these electronic products. The anticipated rollout of 5G infrastructure in 2024 and the rising production of EVs have further fueled the growth of the CCL market. For example, major companies like Apple and Samsung have heightened their procurement of high-frequency CCLs to support new device launches, prompting suppliers such as Kingboard Laminates and Nan Ya Plastics to expand their production capabilities.

Restraints in the Global Copper Clad Laminate Market

The global copper clad laminate market is facing notable constraints primarily linked to the availability and cost of essential raw materials like copper foil, epoxy resin, and fiberglass cloth. In 2024, significant fluctuations in global copper prices became a key challenge, largely due to political turbulence in major copper-producing countries such as Chile and Peru, which hindered mining operations and tightened the worldwide supply of copper. This disruption has led to increased prices, further compounded by a rising demand in sectors like renewable energy and electric vehicles, creating fierce competition for copper resources in the market.

Market Trends of the Global Copper Clad Laminate Market

The Global Copper Clad Laminate (CCL) market is witnessing a significant trend towards the adoption of halogen-free and eco-friendly materials, driven by heightened environmental awareness and stringent regulations. In 2024, leading electronics brands globally are insisting on halogen-free and low-VOC CCLs, influencing manufacturers to innovate sustainable solutions. Notably, companies like Elite Material Co. (EMC) are expanding their product portfolios to include eco-conscious laminate options, appealing to clients focused on meeting ESG objectives and adhering to global sustainability benchmarks. This shift reflects a broader commitment to responsible sourcing and environmental stewardship in the electronics supply chain, shaping the CCL market's future landscape.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2024
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis

Global Copper Clad Laminate Market Size by Application & CAGR (2025-2032)

  • Market Overview
  • High-Speed Digital Circuit Boards
  • Power Circuit Boards
  • Automotive Circuit Boards
  • Consumer Electronics Circuit Boards
  • Medical Circuit Boards
  • Industrial Circuit Boards

Global Copper Clad Laminate Market Size by Material Type & CAGR (2025-2032)

  • Market Overview
  • Fr-4
  • Cem-1
  • Cem-3
  • Fr-2
  • Fr-5
  • Polyimide
  • PtFe

Global Copper Clad Laminate Market Size by Manufacturing Process & CAGR (2025-2032)

  • Market Overview
  • Laminating Resin Press
  • High-Pressure Laminating Press
  • Double-Sided Tape Lamination
  • Cold Lamination Press
  • High-Frequency Lamination Press

Global Copper Clad Laminate Market Size by Copper Coating & CAGR (2025-2032)

  • Market Overview
  • Electrolytic Copper
  • Rolled Copper
  • Sputtered Copper
  • Clad Copper
  • Etched Copper

Global Copper Clad Laminate Market Size & CAGR (2025-2032)

  • North America (Application, Material Type, Manufacturing Process, Copper Coating)
    • US
    • Canada
  • Europe (Application, Material Type, Manufacturing Process, Copper Coating)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Application, Material Type, Manufacturing Process, Copper Coating)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Application, Material Type, Manufacturing Process, Copper Coating)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Application, Material Type, Manufacturing Process, Copper Coating)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2024
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2024
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

  • Kingboard Laminates Holdings Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Shengyi Technology Co., Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nan Ya Plastics Corporation (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Panasonic Holdings Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Taiwan Union Technology Corporation (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Hitachi Chemical Co., Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Isola Group (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Doosan Corporation Electro-Materials (South Korea)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Mitsubishi Gas Chemical Company, Inc. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Rogers Corporation (USA)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Elite Material Co. Ltd. (EMC) (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • ITEQ Corporation (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Resonac Corporation (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • AGC Inc. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Ventec International Group (China/UK)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Chang Chun Group (Taiwan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Nanya New Material Technology Co., Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Goldenmax International Group Ltd. (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Wazam New Materials (China)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Sumitomo Bakelite Co., Ltd. (Japan)
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations