3D IC展望（2026）：SOIC量產擴張，STCO崛起

2026 3D IC Outlook: SoIC Ramp-Up, Rise of STCO

出版日期: 2026年09月04日 | 出版商:

TrendForce | 英文 25 Pages | 商品交期: 最快1-2個工作天內

價格

簡介目錄

在2026年8月舉行的OCP亞太高峰會上，包括台積電、日月光和AMAT在內的供應商探討了3D IC的未來發展趨勢。同年9月，在SEMICON展會上，由台積電和日月光主導成立的3D IC先進製造聯盟（3DICAMA）舉辦了「3D IC全球高峰會」。此次高峰會聚焦於人工智慧時代下大規模生產體系的建構、系統整合以及生態系統間的合作，顯示3D IC正邁入大規模生產和系統級最佳化的新階段。

本報告詳細分析了以下主題：(1) 3D IC 的定義和類型；(2) 混合接合製程；(3) 混合鍵結供應商概覽；(4) 台積電 SOIC 產能擴張計畫及市場動態；(5) 3D IC 面臨的系統性技術挑戰及未來發展趨勢。本報告旨在說明混合鍵結的技術原理，檢驗主要鍵結供應商及市場狀況，並展望 3D IC 的未來發展方向。

主要亮點

在最近舉行的 OCP 亞太高峰會上，台積電、日月光、應用材料（AMAT）等供應商共同強調了 3D IC 的未來發展趨勢。
隨後，在 SEMICON 期間，台積電和日月光發起了 3DICAMA，舉辦了“3DIC 全球高峰會”，重點關注人工智慧時代的大規模生產系統、系統整合和生態系統合作。
這反映出 3D IC 正在進入大規模量產和系統級最佳化的新階段。
本報告詳細分析了 3D IC，包括其定義和類型、混合接合製程、主要供應商概述、台積電 SOIC 產能擴張計劃和市場動態，以及未來系統性的技術挑戰和趨勢。
本報告旨在說明混合鍵結的技術原理，檢驗鍵合設備的供應商和市場狀況，並展望 3D IC 發展的未來方向。

In the OCP APAC Summit held in August 2026, suppliers including TSMC, ASE, and AMAT all highlighted the future trends of 3D IC. In September, during SEMICON, the 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by TSMC and ASE, further organized the 3DIC Global Summit. The event shifted its focus toward mass production readiness, system integration, and ecosystem collaboration in the AI era, reflecting that 3D IC is entering a new phase of large-scale manufacturing and system-level optimization.

This report provides an in-depth analysis of: (1) the definition and technology types of 3D IC; (2) the Hybrid Bonding process; (3) a summary of Hybrid Bonding suppliers; (4) TSMC’s SoIC capacity expansion timeline and market dynamics; and (5) the systemic technical challenges and future trends of 3D IC. The goal is to explain the technical principles of Hybrid Bonding, review the major bonder suppliers and market landscape, and outline the future development direction of 3D IC.

Key Highlights

Recently, at the OCP APAC Summit, suppliers including TSMC, ASE, and Applied Materials (AMAT) jointly highlighted future development trends in 3D IC.
Subsequently, during SEMICON, the 3DICAMA - initiated by TSMC and ASE - held the 3DIC Global Summit, focusing on mass-production readiness, system integration, and ecosystem collaboration in the AI era.
This reflects that 3D IC is entering a new phase of large-scale mass production and system-level optimization.
The report provides an in-depth analysis of 3D IC definitions and technology types, the Hybrid Bonding process, a summary of major suppliers, TSMC's SoIC capacity expansion timeline and market dynamics, and future systemic technical challenges and trends.
The goal is to explain the technical principles of Hybrid Bonding, review the bonding equipment suppliers and market landscape, and outline the future direction of 3D IC development.

1. Definition and Technology Types of 3D IC

Figure 1: TSMC’s 3DFabric Integrated Platform
Figure 2: Schematics of 2.5D, 3D, and 3.5D Packaging
Table 1: 2.5D and 3D Packaging Platforms of Major Players
Table 2: TCB vs. Hybrid Bonding
Figure 3: Hybrid Bonding Evolution Process
Figure 4: Roadmap to TSMC’s SoIC
Figure 5: Architecture of 3D DRAM
Figure 6: CPO Further Complicates Packaging
Figure 7: ASE’s SiPh Optical Engine

2. Hybrid Bonding Process

Figure 8: TCB, Fluxless, and Hybrid Bonding Processes
Table 3: W2W vs. D2W
Figure 9: Hybrid Bonding Process

3. Summary of Hybrid Bonding Suppliers

Figure 10: Besi’s Hybrid Bonder Roadmap
Figure 11: AMAT’s Kinex Integrated D2W Hybrid Bonding System
Figure 12: ASMPT’s LITHOBOLT G2
Figure 13: XBC300 Gen 2 D2W/W2W from SUSS
Figure 14: Shibaura’s TFC-6700 and TFC-6800
Figure 15: Operating Principle of EVG’s SmartView Technology
Figure 16: EVG’s GEMINI FB
Figure 17: TEL’s Synapse Si
Table 4: Specifications and Target Applications of Major Equipment Providers’ Bonders