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市場調查報告書
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2100791

AI領域中Si-Cap嵌入式封裝的崛起：技術方法與競爭格局

Si-Cap Embedded Packaging Rises for AI: Technical Routes and Competitive Landscape
出版日期: | 出版商: TrendForce | 英文 15 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

隨著人工智慧晶片對穩定電源的需求日益成長，矽電容（Si-Cap）及其嵌入式/整合封裝已成為重要的技術發展領域，各主要公司紛紛宣布了與矽電容相關的計畫。例如，2026年4月14日，SEMCO宣布計畫擴建位於越南的人工智慧封裝生產線，以生產矽電容嵌入式基板。此外，該公司在5月透露，已與一家北美主要客戶簽訂了價值約10億美元的長期合約。同樣在2026年5月19日，Analog Devices宣布將以15億美元現金收購美國矽電容公司Empower，目的是進軍人工智慧供應鏈。

本報告主要詳細分析了以下三個面向：（1）矽電容（Si-Cap）的技術背景；（2）主要矽電容廠商（Murata、SEMCO、AP Memory、Empower、TSMC、Samsung、Intel）之間的技術差異；（3）人工智慧時代對嵌入式/整合矽電容封裝的需求。其目的是說明矽電容的技術原理、其需求成長的原因以及現有廠商之間的競爭格局。

主要亮點

  • 人工智慧晶片的電源需求推動矽電容（Si-Cap）和嵌入式/整合封裝成為主要技術方向。
  • SEMCO 已在越南擴大了其用於 Si-Cap 嵌入式基板的AI 封裝生產線，並已與北美主要客戶簽訂了合約。
  • Analog Devices 收購了美國矽電容公司 Empower，目的是進軍人工智慧供應鏈。
  • 本報告涵蓋了 Si-Cap 的技術背景、供應商（Murata、SEMCO、AP Memory、Empower、TSMC、Samsung、Intel）的比較，以及人工智慧時代嵌入式封裝的要求。

目錄

  • 1.Si-Cap 的技術背景
  • 2.主要矽電容供應商的技術分析
  • 3.人工智慧時代對嵌入式和整合式矽電容封裝的需求
  • 4.TRI的觀點
簡介目錄
Product Code: TRi-201

As AI chips require increasingly stable power delivery, Si‑Cap (silicon capacitors) and their embedded/integrated packaging have become an important technological development direction, and key companies have successively announced silicon‑capacitor‑related plans, including SEMCO, which on April 14th 2026 announced plans to expand AI packaging production lines in Vietnam to produce Si‑Cap embedded substrates, and then in May revealed it had secured a long‑term contract of about US$1 billion from a major North American customer, and Analog Devices, which on May 19th 2026 announced a cash acquisition of the US Si‑Cap company Empower for US$1.5 billion in order to enter the AI supply chain.

This report mainly provides an in‑depth analysis of (1) the technical background of Si‑Cap, (2) the technological differences among major Si‑Cap vendors (Murata, SEMCO, AP Memory, Empower, TSMC, Samsung, Intel), and (3) the embedded/integrated Si‑Cap packaging requirements in the AI era, with the aim of explaining the technical principles of Si‑Cap, the reasons for growing demand, and the competitive landscape among existing vendors.

Key Highlights

  • AI chip power delivery demands are driving Si-Cap (silicon capacitor) and embedded/integrated packaging as a key technology direction.
  • SEMCO expanding Vietnam AI packaging lines for Si-Cap embedded substrates, plus securing a major North American customer contract.
  • Analog Devices acquiring US Si-Cap firm Empower to enter AI supply chain.
  • Report covers Si-Cap technical background, vendor comparison (Murata, SEMCO, AP Memory, Empower, TSMC, Samsung, Intel), and embedded packaging requirements in AI era.

Table of Contents

  • 1. Technical Background of Si-Cap
    • Figure 1: Principle of Charging and Discharging for Capacitors
    • Figure 2: Schematics of Capacitor Structure and Formula of Capacitance
    • Table 1: Comparison of Materials and Features between Various Capacitors
    • Figure 3: Deep Trench Process of Si-Cap
    • Figure 4: Packable Positions of Si-Cap
    • Figure 5: Hierarchy of Capacitors
  • 2. Analysis on Technology of Major Si-Cap Suppliers
    • Table 2: Comparison between Major Si-Cap Suppliers
    • Figure 6: IPDiA Embedded Si-Cap at Interposers
    • Figure 7: Packable Positions of SEMCO’s Si-Cap
    • Figure 8: Technology Roadmap of DRAM Processes
    • Figure 9: Packable Positions of AP Memory’s S-SiCap
    • Figure 10: Packable Positions of Empower’s ECAP
    • Table 3: Comparison of Embedded Si-Cap Technology among Foundries
    • Figure 11: TSMC’s eDTC in CoWoS Interposer
    • Figure 12: Samsung’s 2.xD Cube Platform
    • Figure 13: Intel’s eDTC/eMIM-T in EMIB Substrate
  • 3. Demand for Embedded and Integrated Si-Cap Packaging in the AI Era
    • Table 4: Advanced Packaging Specifications for AI Chips, 2025-2028
  • 4. TRI’s View