嵌入式晶片封裝市場－2025-2030年預測

預計到 2025 年，嵌入式晶片封裝市場規模將達到 677,131,000 美元，到 2030 年將達到 1,690,993,000 美元，複合年成長率為 20.09%。

電子產業對技術進步的不懈追求正在推動嵌入式晶片封裝市場的成長。這種封裝技術滿足了現代電子設備的幾項關鍵需求，包括更小的晶片尺寸、更高的電氣性能和更優異的互連密度。該技術的主要優勢在於其對小型化的貢獻。基板本身允許多層組件的整合，從而實現更靈活、更複雜的基板佈局。這種方法為製造商和設計人員帶來了許多益處，包括更高的封裝強度和可靠性，以及快速適應客製化設計的能力。

全球嵌入式晶片封裝市場的擴張主要受兩大相互關聯的趨勢驅動：一是先進消費性電子產品的日益普及，二是5G網路技術的全球部署。智慧型手機、筆記型電腦、平板電腦和穿戴式裝置等現代消費性電子產品整合了大量嵌入式處理器，以實現更好的使用者介面和更高的整體效能。這些處理器是電源管理電路（例如DC-DC轉換器）、相機模組以及其他各種子系統的關鍵元件。同時，5G連接的整合也催生了對嵌入式晶片封裝的需求，尤其是在需要高速資料處理和低延遲的應用領域，例如汽車高級駕駛輔助系統（ADAS）和智慧影像監控系統。整個產業對微電子元件電路小型化的迫切需求，使得嵌入式晶片封裝成為越來越有吸引力的解決方案。

嵌入式晶片封裝技術相較於其他積體電路（IC）封裝方法，其固有的優勢，例如比系統級封裝（SiP）技術佔用空間更小，是其價值提案和市場成長的核心所在。然而，市場成長並非一帆風順。嵌入式晶片封裝技術的高昂初始成本構成了其普及應用的一大障礙，並可能阻礙市場擴張的步伐。儘管面臨這項挑戰，物聯網（IoT）解決方案的普及仍蘊藏著未來巨大的成長機會。物聯網設備對緊湊、可靠和高效能電子元件的獨特需求，預計將在預測期內為嵌入式晶片封裝技術帶來盈利的市場前景。

主要市場促進因素

嵌入式晶片封裝市場的主要促進因素是全球消費性電子產品消費量的成長以及5G基礎設施的部署。消費性電子產品是全球最受歡迎的產品類型之一。家庭領域電子設備的日益普及正在推動該行業的顯著成長。在競爭激烈的市場環境中，製造商正大力投資將先進的數位技術整合到產品中，並高度重視提供高品質的使用者體驗。這種對性能和創新的關注，加上主要市場參與者不斷增加的研發投入，正在催生出一系列具有尖端功能的新產品，而這些產品都依賴先進的封裝解決方案，例如嵌入式晶粒技術。

另一個關鍵促進因素是對軟式電路板內晶粒整合日益成長的需求。可拉伸電子領域持續發展，呈現多種形式並開拓新的應用領域。這項技術通常採用標準印刷電路基板，尤其重視軟式電路板。先進的製造程序，例如採用液態射出成型嵌入彈性體的可拉伸電子電路，正被用於打造耐用可靠的產品。這些軟性嵌入式解決方案的潛在應用非常廣泛。例如，在軍事和國防領域，輕巧軟性衝擊感測器的研發正在取得進展，這些感測器可以直接嵌入製服和防彈背心。這些創新能夠提供有關戰鬥傷亡的關鍵數據，並代表著一系列日益成長的高價值應用，這些應用正在推動嵌入式晶片封裝向軟性形式演進。

區域市場展望

預計亞太地區將佔據全球嵌入式晶片封裝市場的主要佔有率，並有望在整個預測期內保持主導地位。這一主導地位歸功於該地區主要電子產品製造商和半導體行業關鍵參與者的強大實力。亞太地區預計也將實現最高的成長率。這一成長主要得益於各大公司和政府機構在開發下一代半導體解決方案方面的大量投資。這些努力尤其著重於利用嵌入式晶片封裝技術來提高電氣和熱性能、機械穩定性以及整體可靠性。半導體產業對技術進步的這種共同推動預計將成為亞太地區嵌入式晶片封裝市場擴張的主要驅動力。

本報告的主要優勢：

• 深入分析：提供對主要和新興地區的深入市場洞察，重點關注客戶群、政府政策和社會經濟因素、消費者偏好、行業垂直領域和其他細分市場。
• 競爭格局：了解全球主要參與者的策略舉措，並了解透過正確的策略實現市場滲透的潛力。
• 市場促進因素與未來趨勢：探討影響市場的動態因素和關鍵趨勢及其對未來市場發展的影響。
• 可操作的建議：利用這些見解，在快速變化的環境中製定策略決策，發展新的商業機會和收入來源。
• 受眾廣泛：適用於Start-Ups、研究機構、顧問公司、中小企業和大型企業，且經濟實惠。

公司如何使用我們的報告範例

產業與市場分析、機會評估、產品需求預測、打入市場策略、地理擴張、資本投資決策、法規結構及影響、新產品開發、競爭情報

報告範圍：

• 2022年至2024年的歷史數據和2025年至2030年的預測數據
• 成長機會、挑戰、供應鏈前景、法規結構與趨勢分析
• 競爭定位、策略和市場佔有率分析
• 按業務板塊和地區分類的收入成長和預測評估，包括國家/地區
• 公司概況（策略、產品、財務資訊、關鍵發展等）

目錄

第1章執行摘要

第2章 市場概覽

• 市場概覽
• 市場定義
• 調查範圍
• 市場區隔

第3章 商業情境

• 市場促進因素
• 市場限制
• 市場機遇
• 波特五力分析
• 產業價值鏈分析
• 政策與法規
• 策略建議

第4章 技術展望

第5章嵌入式晶片封裝市場（依平台分類）

• 介紹
• IC構裝基板
• 剛性基板
• 軟式電路板

第6章 依應用分類的嵌入式晶片封裝市場

• 介紹
• 醫學領域
• 消費性電子產品
• 軍隊
• 產業

第7章嵌入式晶片封裝市場（按地區分類）

• 介紹
• 北美洲
  • 美國
  • 加拿大
  • 墨西哥
• 南美洲
  • 巴西
  • 阿根廷
  • 其他
• 歐洲
  • 德國
  • 法國
  • 英國
  • 西班牙
  • 其他
• 中東和非洲
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 其他
• 亞太地區
  • 中國
  • 印度
  • 日本
  • 韓國
  • 印尼
  • 泰國
  • 其他

第8章 競爭格局與分析

• 主要企業和策略分析
• 市佔率分析
• 合併、收購、協議和合作
• 競爭對手儀錶板

第9章：公司簡介

• ASE Group
• Microsemi Corporation
• Fujikura Ltd
• Infineon Technologies AG
• AT&S Company
• Schweizer Electronic AG
• Intel Corporation
• TSMC
• Shinko Electric Industries Co Ltd
• Amkor Technology

第10章附錄

• 貨幣
• 先決條件
• 基準年和預測年時間表
• 相關人員的主要收益
• 調查方法
• 簡稱

The Embedded Die Packaging Market, with a 20.09% CAGR, is expected to grow to USD 1,690.993 million in 2030 from USD 677.131 million in 2025.

The embedded die packaging market is being propelled by the relentless pursuit of technological advancement in the electronics industry. This packaging technique addresses several critical requirements for modern electronics, including the demand for a reduced chip footprint, enhanced electrical performance, and superior interconnect density. A key advantage of this technology is its contribution to miniaturization; by allowing components to be stacked within multiple layers of the substrate itself, it enables more flexible and complex board layouts. This approach offers significant benefits to manufacturers and designers, including improved package robustness and reliability, as well as the capacity for rapid turnaround times for customized designs.

The expansion of the global embedded die packaging market is primarily driven by two interconnected mega-trends: the rising consumption of sophisticated consumer electronics and the global rollout of 5G network technologies. Modern consumer devices, such as smartphones, laptops, tablets, and wearables, integrate numerous embedded processors to deliver a superior user interface and enhanced overall performance. These processors are critical components within power management circuits (like DC-DC converters), camera modules, and various other subsystems. Concurrently, the integration of 5G connectivity is creating demand for embedded die packaging in applications requiring high-speed data processing and low latency, such as the advanced driver-assistance systems (ADAS) and smart video surveillance in automobiles. The urgent industry-wide need for further circuit miniaturization in microelectronic devices makes embedded die packaging an increasingly attractive solution.

The technology's intrinsic benefits over alternative integrated circuit (IC) packaging methods, such as its ability to occupy significantly less space than System-in-Package (SiP) technology, are central to its value proposition and market growth. However, the market's trajectory is not without constraints. The high initial costs associated with establishing embedded die packaging capabilities present a significant barrier to adoption and may hinder the pace of market expansion. Despite this challenge, a substantial opportunity for future growth lies in the proliferation of Internet of Things (IoT) solutions. The unique demands of IoT devices for compact, reliable, and high-performance electronics are expected to create lucrative prospects for embedded die packaging technology over the forecast period.

Primary Market Drivers

A dominant driver for the embedded die packaging market is the increased global consumption of consumer electronics and the deployment of 5G infrastructure. Consumer electronics represent one of the most ubiquitous product categories worldwide. The household sector's adoption of an increasingly diverse array of electronic devices has led to substantial growth for the industry. In this highly competitive landscape, manufacturers are making significant investments to integrate advanced digital technologies into their products, with a strong emphasis on delivering a high-quality user experience. This focus on performance and innovation, supported by rising research and development expenditures from leading market players, is resulting in a continuous stream of new products with cutting-edge features, all of which rely on advanced packaging solutions like embedded die technology.

Another significant driver is the growing demand for die integration within flexible boards. The field of stretchable electronics is evolving, taking on various forms and finding new applications. This technology often utilizes standard printed circuit boards, with a notable emphasis on flexible substrates. Advanced manufacturing processes, such as liquid injection molding of elastomer-embedded stretchable electronic circuits, are being employed to create durable and reliable products. The application potential for these flexible, embedded solutions is vast. For example, in the military and defense sector, there is development of lightweight, flexible impact sensors that can be embedded directly into uniforms and body armor. Such innovations could provide critical data on injuries sustained in combat, demonstrating the high-value applications that are pushing the boundaries of embedded die packaging into flexible formats.

Geographical Market Outlook

The Asia Pacific region is projected to be the prominent market shareholder in the global embedded die packaging market and is anticipated to maintain this leadership position throughout the forecast period. This dominance is attributed to the strong presence of major electronics manufacturers and semiconductor industry players within the region. Asia Pacific is also expected to register the fastest growth rate. A key contributor to this growth is the significant investment from both leading corporations and government entities in the development of next-generation semiconductor solutions. These initiatives specifically focus on leveraging embedded die packaging technology to achieve enhancements in electrical and thermal performance, mechanical stability, and overall reliability. This concerted push for technological advancement in the semiconductor sector is anticipated to be the primary fuel for the expansion of the embedded die packaging market within the Asia Pacific region.

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others.

Segmentation:

• EMBEDDED DIE PACKAGING MARKET BY PLATFORM
• IC package substrate
• Rigid Board
• Flexible Board
• EMBEDDED DIE PACKAGING MARKET BY APPLICATION
• Medical
• Consumer Electronics
• Military
• Industrial
• EMBEDDED DIE PACKAGING MARKET BY GEOGRAPHY
• North America
• USA
• Canada
• Mexico
• South America
• Brazil
• Argentina
• Others
• Europe
• Germany
• France
• United Kingdom
• Spain
• Others
• Middle East and Africa
• Saudi Arabia
• UAE
• Others
• Asia Pacific
• China
• India
• Japan
• South Korea
• Indonesia
• Thailand
• Others

TABLE OF CONTENTS

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

• 2.1. Market Overview
• 2.2. Market Definition
• 2.3. Scope of the Study

2.4. Market Segmentation

3. BUSINESS LANDSCAPE

• 3.1. Market Drivers
• 3.2. Market Restraints
• 3.3. Market Opportunities
• 3.4. Porter's Five Forces Analysis
• 3.5. Industry Value Chain Analysis
• 3.6. Policies and Regulations
• 3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. EMBEDDED DIE PACKAGING MARKET BY PLATFORM

• 5.1. Introduction
• 5.2. IC package substrate
• 5.3. Rigid Board
• 5.4. Flexible Board

6. EMBEDDED DIE PACKAGING MARKET BY APPLICATION

• 6.1. Introduction
• 6.2. Medical
• 6.3. Consumer Electronics
• 6.4. Military
• 6.5. Industrial

7. EMBEDDED DIE PACKAGING MARKET BY GEOGRAPHY

• 7.1. Introduction
• 7.2. North America
  • 7.2.1. USA
  • 7.2.2. Canada
  • 7.2.3. Mexico
• 7.3. South America
  • 7.3.1. Brazil
  • 7.3.2. Argentina
  • 7.3.3. Others
• 7.4. Europe
  • 7.4.1. Germany
  • 7.4.2. France
  • 7.4.3. United Kingdom
  • 7.4.4. Spain
  • 7.4.5. Others
• 7.5. Middle East and Africa
  • 7.5.1. Saudi Arabia
  • 7.5.2. UAE
  • 7.5.3. Others
• 7.6. Asia Pacific
  • 7.6.1. China
  • 7.6.2. India
  • 7.6.3. Japan
  • 7.6.4. South Korea
  • 7.6.5. Indonesia
  • 7.6.6. Thailand
  • 7.6.7. Others

8. COMPETITIVE ENVIRONMENT AND ANALYSIS

• 8.1. Major Players and Strategy Analysis
• 8.2. Market Share Analysis
• 8.3. Mergers, Acquisitions, Agreements, and Collaborations
• 8.4. Competitive Dashboard

9. COMPANY PROFILES

• 9.1. ASE Group
• 9.2. Microsemi Corporation
• 9.3. Fujikura Ltd
• 9.4. Infineon Technologies AG
• 9.5. AT&S Company
• 9.6. Schweizer Electronic AG
• 9.7. Intel Corporation
• 9.8. TSMC
• 9.9. Shinko Electric Industries Co Ltd
• 9.10. Amkor Technology

10. APPENDIX

• 10.1. Currency
• 10.2. Assumptions
• 10.3. Base and Forecast Years Timeline
• 10.4. Key Benefits for the Stakeholders
• 10.5. Research Methodology
• 10.6. Abbreviations