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市場調查報告書
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2100785

提高人工智慧伺服器的電源完整性：矽電容器和MLCC的演進作用。

Power Integrity Upgrades in AI Servers: Evolving Roles of Silicon Capacitors and MLCCs
出版日期: | 出版商: TrendForce | 英文 13 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

AI伺服器對電源完整性的需求正從基板級直接延伸至封裝級。這種轉變正在推動電容器技術的變革，使其從單純依賴傳統的多層陶瓷電容器（MLCC）轉向結合矽電容器和MLCC的分層互補方法。雖然MLCC仍然是PCB、VRM、電源架和電源模組等系統級去耦、濾波和電壓調節的主要組件，但矽電容器在局部應用中展現出明顯的優勢。其低剖面、低等效串聯電感（ESL）、優異的高頻特性以及在直流偏壓和溫度波動下穩定的電容值，使其成為GPU、ASIC、HBM以及先進封裝中近晶片連接去耦的理想選擇。隨著晶片組、HBM堆疊和高功率封裝在AI加速器中日益普及，矽電容器可望成為確保AI和HPC應用中封裝級電源完整性的重要補充。

主要亮點

  • AI 伺服器的電源完整性要求正從基板擴展到封裝。
  • 電容器策略正從僅依賴MLCC轉向結合矽電容器和MLCC的互補配置。
  • MLCC 在整個配電系統中繼續發揮系統級解耦、濾波和電壓調節的主導作用。
  • 具有低靜電放電和穩定高頻特性的薄矽電容器適用於先進封裝中晶片附近的去耦。
  • 隨著晶片架構、多層 HBM 和高功率封裝在人工智慧和高效能運算領域變得越來越普及，矽電容器正成為確保封裝級功率匹配的重要補充。

目錄

  • 1. 矽電容器的優點：低靜電放電，在高壓高溫環境下穩定性佳。
  • 2. 矽電容器克服了封裝內 MLCC 的局限性，並為電源完整性建立了分工。
  • 3. 隨著電源瓶頸從印刷電路基板轉移到封裝內部，矽電容器成為解決方案。
  • 4. 台灣、日本和韓國主要的矽電容器製造商和供應鏈
  • 5. 未來發展：矽電容器將逐漸成為先進人工智慧封裝中的標準元件。
  • 6. TRI的觀點
簡介目錄
Product Code: Tri-195

The need for power integrity in AI servers is extending from the board level directly into the package. This shift is driving a transition in capacitor technology, moving beyond a sole reliance on traditional multi-layer ceramic capacitors (MLCCs) toward a layered, complementary approach utilizing both silicon capacitors and MLCCs. While MLCCs remain the primary components for system-level decoupling, filtering, and voltage regulation across PCBs, VRMs, power shelves, and power modules, silicon capacitors offer distinct localized advantages. Their thin profile, low equivalent series inductance (ESL), excellent high-frequency characteristics, and stable capacitance under DC bias and temperature fluctuations make them ideal for near-die decoupling around GPUs, ASICs, HBMs, and within advanced packages. As AI accelerators increasingly adopt chiplets, HBM stacking, and high-power packaging, silicon capacitors are poised to become vital complementary components for package-level power integrity in AI and HPC applications.

Key Highlights

  • Power integrity demands in AI servers are extending from boards into packages.
  • Capacitor strategy is shifting from only MLCCs to a complementary mix of silicon capacitors and MLCCs.
  • MLCCs stay dominant for system-level decoupling, filtering, and voltage regulation across power distribution.
  • Silicon capacitors, with thin form, low ESL and stable high‑frequency behavior, are suited for near‑die decoupling in advanced packages.
  • As chiplet architectures, stacked HBM and high‑power packaging proliferate in AI and HPC, silicon capacitors are emerging as essential complements for package‑level power integrity.

Table of Contents

  • 1. Advantages of Silicon Capacitors: Low ESL and Stability in High-Voltage, High-Temperature Environments
    • Figure 1: Schematic Diagram of a Silicon Capacitor
    • Figure 2: Capacitance Variations Between Silicon Capacitors and MLCCs Under Voltage and Temperature Changes
  • 2. Silicon Capacitors Address MLCCs’ Limitations Within Packages, Thus Establishing a Division of Labor for Power Integrity
    • Table 1: Comparison Between MLCCs and Silicon Capacitors
  • 3. As Power Supply Bottlenecks Shift from the PCB to Inside the Package, Silicon Capacitors Emerge as a Solution
    • Figure 3: Primary Placement Locations for Silicon Capacitors
  • 4. Major Silicon Capacitor Manufacturers and Supply Chains in Taiwan, Japan, and South Korea
    • Table 2: Corresponding Dynamics of Silicon Capacitor Technology Among Taiwanese, Japanese, and South Korean Suppliers
  • 5. Future Development: Silicon Capacitors to Slowly Become Standard Configuration for Advanced Packaging of AI
    • Figure 4: Future Technical Orientations and Existing Challenges of Silicon Capacitors
  • 6. TRI’s View