闡明PLP翹曲現象：低溫PSPI、平衡膜和供應商分析

台積電計畫於2026年透過其子公司VisEra建立一條CoPoS原型生產線，並計畫於2027年開始原型生產。因此，今年對於相關設備和材料供應商將是檢驗和交付產品的關鍵時期。為了解決大面積面板級封裝（PLP）固有的翹曲問題，AMC、WaferChem和億光化學等特種化學品供應商在「Touch Taiwan 2026」上展示了他們的解決方案，吸引了市場的廣泛關注。

因此，本報告將詳細分析以下內容：（1）PLP材料技術的背景和市場前景；（2）翹曲的原因及潛在解決方案；（3）翹曲抑製材料及主要供應商。其目的是闡明PLP的需求、板材翹曲的機制、有效的應對措施以及為台灣企業帶來的新商機。

主要亮點

• 台積電計畫透過其子公司 VisEra 建立一條 CoPoS 測試線，這使得今年對於相關設備和材料供應商來說至關重要，決定著產品檢驗和交付的成敗。
• 為了解決大面積面板級封裝中的翹曲問題，AMC、WaferChem 和 Everlight Chemical 等特種化學品製造商在「Touch Taiwan」展會上展示了解決方案，引起了市場的強烈興趣。
• 本報告分析了PLP（板式線性面板）的背景和未來前景，重點關注材料，說明了面板翹曲的原因和緩解措施，並介紹了抑制翹曲的材料和主要供應商。
• 本報告旨在闡明對PLP的需求、變形機制和應對措施，並重點介紹台灣企業的新商機。

目錄

第1章 PLP：背景與市場展望

第2章：翹曲的原因與解決方法

第3章 抗翹曲材料及相關供應商

第4章：TRI的觀點

For the current year of 2026, TSMC plans to establish a trial production line CoPoS through its subsidiary, VisEra, with trial production scheduled for 2027. Consequently, this year will be a critical window for product validation and deliveries for related equipment and material providers. To address the warpage issues inherent in large-area panel-level packaging (PLP), specialty chemical suppliers such as AMC, WaferChem, and Everlight Chemical showcased corresponding solutions at Touch Taiwan 2026, drawing significant market attention.

Accordingly, this report provides an in-depth analysis of: (1) the background of the material technology PLP and its market outlook; (2) the causes of warpage and potential solutions; and (3) warpage-suppressing materials and key suppliers. The objective is to clarify the demand drivers for PLP, the mechanisms behind panel warpage, viable countermeasures, and the emerging business opportunities for Taiwan-based companies.

Key Highlights

• TSMC, via subsidiary VisEra, plans a CoPoS trial line, making this year pivotal for product validation and deliveries for related equipment and material suppliers.
• To tackle warpage in large-area panel-level packaging, specialty chemical providers such as AMC, WaferChem, and Everlight Chemical presented solutions at Touch Taiwan, attracting strong market interest.
• The report analyzes the background and outlook of material-focused PLP, explains panel warpage causes and mitigation approaches, and profiles warpage-suppressing materials and key suppliers.
• The goal is to clarify PLP demand drivers, warpage mechanisms and countermeasures, and highlight emerging business opportunities for Taiwan-based companies.

Table of Contents

1. PLP: Background and Market Outlook

• Figure 1: TSMC’s and Intel’s Respective Package Size Roadmaps
• Figure 2: Number of Packages Across Different Wafer/Panel Sizes
• Table 1: Overview of PLP Suppliers

2. Causes of Warpage and Solutions

• Figure 3: Definition of Warpage
• Figure 4: Different Types of Warpage
• Figure 5: Steps of the Chip-First and Chip-Last Processes

3. Materials and Related Suppliers of Warpage Suppression

• Figure 6: Major Specifications of PSPI at Various Cure Temperatures for Fujifilm
• Table 2: Deployment in Low-Temperature-Cure PSPI among Vendors
• Figure 7: Structure of Balance Film
• Figure 8: Steps of Chip-Last Process for Balance Film
• Figure 9: TSMC’s Ratio and Target of Localized Purchases (2022-2030)

4. TRI’s View