SiC/GaN功率半導體突破了「AI電力牆」，重塑了資料中心電源

到2026年，功率半導體將從傳統元件發展成為重塑全球能源格局的戰略基礎技術。隨著人工智慧資料中心面臨「電力牆」瓶頸，電動車加速採用800V高壓架構，碳化矽（SiC）和氮化鎵（GaN）技術正進入全球基礎設施大規模部署階段。

主要亮點

• 功率半導體已從傳統元件轉變為重塑全球能源格局的戰略基礎。
• SiC 和 GaN 技術正進入全球基礎設施大規模部署階段。
• 人工智慧資料中心正面臨一個被稱為「電力牆」的瓶頸，這推動了對先進電力解決方案的需求。
• 電動車（EV）加速高壓架構的採用，進一步推動了對功率半導體的需求。
• 人工智慧基礎設施的需求與電動車技術的進步相結合，對下一代功率半導體技術產生前所未有的需求。

目錄

第1章 SiC/GaN從新興技術發展成為綠色能源和人工智慧生態系統的標準基礎設施

第2章 VIS 擴展其 GaN-on-Si產品系列，在功率半導體領域開闢新視野。

第3章 Innoscience進軍一級市場，重塑人工智慧能源供應鏈格局

第4章 STMicroelectronics採用「SiC基板+GaN擴展」策略加速市場滲透

第5章 TI利用其整合的GaN 架構建構了人工智慧時代電源管理的核心。

第6章 ROHM 透過自主研發的氮化鎵產品和「印度製造」合作，建構全球電力電子防禦體系。

第7章 Infineon以「SiC核心，GaN擴展」策略引領高效率動力革命

第8章 TRI的觀點

In 2026, power semiconductors have evolved from conventional components into strategic enablers reshaping the global energy landscape. SiC and GaN technologies are entering a phase of large-scale deployment across global infrastructure as AI data centers confront the “power wall” bottleneck and EVs accelerate the adoption of 800V high-voltage architectures.

Key Highlights

• Power semiconductors have transformed from conventional components into strategic enablers reshaping the global energy landscape.
• SiC and GaN technologies are entering large-scale deployment phase across global infrastructure.
• AI data centers are confronting the "power wall" bottleneck, driving demand for advanced power solutions.
• Electric vehicles are accelerating adoption of high-voltage architectures, further boosting power semiconductor requirements.
• The convergence of AI infrastructure needs and EV technological advancement is creating unprecedented demand for next-generation power semiconductor technologies.

Table of Contents

1. SiC/GaN Evolves from Emerging Technology to Standard Infrastructure for Green Energy and AI Ecosystems

• Figure 1: Four transformation pathways and the core competitiveness of SiC/GaN
• Figure 2: Clear division of roles for third-gen semiconductors in AIDC: SiC anchors infrastructure, while GaN targets end-point power conversion
• Figure 3: SiC as a key enabler in reducing data center OpEx and energy loss
• Figure 4: Energy efficiency and conversion performance of GaN in power supply units (PSU)
• Figure 5: Global automaker adoption roadmap for SiC technologies

2. VIS expands GaN-on-Si product portfolio, opening a new front in power semiconductors

3. Innoscience enters Tier 1, reshaping the AI power supply chain landscape

4. STMicroelectronics accelerates market penetration with a “SiC foundation + GaN expansion” strategy

5. TI builds the core of AI-era power management with an integrated GaN architecture

6. ROHM builds a global power electronics defense line through in-house GaN production and “Make in India” collaboration

7. Infineon drives the high-efficiency power revolution with a “SiC core, GaN expansion” strategy

8. TRI’s View