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全球人工智慧資料中心互連趨勢（2025）
市場調查報告書
商品編碼
1873713

全球人工智慧資料中心互連趨勢（2025）

2025 Global AI Data Center Interconnect Trends
出版日期: | 出版商: TrendForce | 英文 8 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

人工智慧驅動的資料中心正從單晶片架構演進異質多GPU架構。高速光互連實現了可擴展性，而矽光子學和共封裝光學技術則在模組化、基於生態系統的競爭中提升了頻寬和能源效率。

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主要亮點：

  • 從單一節點到多層協作互連（縱向擴展、橫向擴展、橫向擴展）。
  • 高速光互連正在設定效能和可擴展性的極限，從而推動對收發器的需求。
  • 矽光子學、共封裝和光I/O正在降低功耗並提高頻寬。
  • 供應商正在尋求生態系統整合或模組化，從而推動系統級和平台級的競爭。

目錄

第一章：引言

  • 2025年光收發器模組出貨量：高規格800G和1.6T模組將成長

第二章：AI資料中心架構從單節點設計轉向包含縱向擴展、橫向擴展和跨域擴展架構的分層協作互連模型

  • 縱向擴展、橫向擴展和跨域擴展互連技術範例
  • 資料中心網路三大擴展架構比較

第三章：對高頻寬、低損耗通訊日益增長的需求將推動光解決方案取代銅線，成為互連的主流機架內部以及資料中心之間。

  • 光通訊模組正從可插拔晶片發展到專用積體電路 (ASIC) 晶片，最終實現光元件和 ASIC 的共封裝。
  • 台灣半導體元件、光通訊元件和計算設備的一體化供應鏈

第四章：未來競爭格局：NVIDIA 和 Broadcom 專注於生態系統整合和模組化，推動資料中心互連市場成長

  • NVIDIA 與 Broadcom：資料中心互連技術與產品對比

第五章：市場競爭從晶片效能延伸至系統和生態系統平台開發，提高資料傳輸效率是未來成功的關鍵

簡介目錄
Product Code: TRi-0096

AI-driven data centers evolve from single-chip to heterogeneous multi-GPU architectures. High-speed optical interconnects enable scalability, while silicon photonics and co-packaged optics boost bandwidth and energy efficiency amid modular, ecosystem-based competition.

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Key Highlights:

  • Shift from single node to multi layer collaborative interconnect (Scale Up, Scale Out, Scale Across).
  • High speed optical interconnects set performance and scalability limits; transceiver demand rises.
  • Silicon photonics, co packaging and optical I/O reduce power and raise bandwidth.
  • Vendors pursue ecosystem integration or modularization, driving system level and platform-based competition.

Table of Contents

1. Introduction

  • Shipments of Optical Transceiver Modules in 2025 Have Shown Growth for High-Spec 800G and 1.6T Modules

2. AI Data Center Architectures Are Transitioning from Single-Node Designs to a Hierarchical Collaborative Interconnection Model, Encompassing Scale-Up, Scale-Out, and Scale-Across Architectures

  • Examples of Scale-Up, Scale-Out, and Scale-Across Interconnect Technologies
  • Comparison of Three Major Expansion Architectures for Data Center Networks

3. Rising Demand for High-Bandwidth, Low-Loss Communication Drives Optical Solutions to Replace Copper Wires as Mainstream Interconnects Within Racks and Between Data Centers

  • Optical Communication Modules Are Evolving from Pluggable Forms to ASIC Chips and Will Ultimately Achieve Co-Packaging of Optical Components and ASICs
  • Supply Chain for Integration of Semiconductor Components, Optical Communication Components, and Computing Equipment in Taiwan

4. Future Competitive Landscape: NVIDIA and Broadcom Will Respectively Focus on Ecosystem Integration and Modularization, Driving Growth in Data Center Interconnect Market

  • NVIDIA vs. Broadcom: Comparison of Data Center Interconnect Technologies and Products

5. Market Competition Will Expand from Chip Performance to Development of Systems and Ecosystem Platforms; Enhanced Data Transmission Efficiency Is the Key to Future Success