玻璃基板的突破:CoWoS和CPO革新的推動因素

由於玻璃通孔（TGV）技術的最新突破，玻璃基板已成為先進半導體封裝領域極具前景的解決方案。玻璃基板有望推動CoWoS、CPO和FOPLP技術的創新。憑藉卓越的高頻性能、低熱膨脹係數（CTE）和優異的尺寸穩定性，玻璃基板顯著提升了I/O密度和訊號完整性。這使得它們特別適用於大型中介層、多層堆疊和高頻射頻應用。隨著英特爾、三星和台積電等領先公司積極投資玻璃基板的開發和應用，TGV技術的廣泛應用將顯著加速尖端封裝技術的進步。

信息圖形

主要的焦點

• 受TGV技術突破的推動，玻璃基板已成為先進半導體封裝的關鍵新興材料。
• 它們具有卓越的高頻性能、低熱膨脹和優異的尺寸穩定性，從而提高了I/O密度和訊號完整性。
• 它們是大型中介層、多層堆疊和高頻射頻應用的理想選擇。
• 產業領導者正在投資玻璃基板開發，加速TGV技術和尖端封裝創新的普及。

目錄

第一章：全球封裝趨勢及基板材料市場概覽

第二章：玻璃基板推動下一波 3D 整合浪潮，在成本和效能上課題 TSV

第三章：玻璃基板輔助 CoWoS、CPO 與 FOPLP，釋出全新市場潛力

第四章：TRI 的觀點

Glass substrates are emerging as a highly promising solution in advanced semiconductor packaging with recent breakthroughs in Through-Glass Via (TGV) technology. They are poised to drive innovation in CoWoS, CPO, and FOPLP technologies. Leveraging superior high-frequency performance, low coefficient of thermal expansion (CTE), and excellent dimensional stability, glass substrates significantly enhance I/O density and signal integrity. This makes them particularly well-suited for large interposers, multi-layer stacking, and high-frequency RF applications. As major players such as Intel, Samsung and TSMC actively invest in the development and adoption of glass substrates, the widespread application of TGV technology is set to profoundly accelerate the advancement of cutting-edge packaging technologies.

INFOGRAPHICS

Key Highlights:

• Glass substrates, driven by breakthroughs in TGV technology, are key emerging materials for advanced semiconductor packaging.
• They offer superior high-frequency performance, low thermal expansion, and excellent dimensional stability, boosting I/O density and signal integrity.
• Ideally suited for large interposers, multilayer stacking, and high-frequency RF scenarios.
• Major industry players are investing in glass substrate development, accelerating TGV technology adoption and cutting-edge packaging innovation.

Table of Contents

1. Global Packaging Trends and Substrate Material Market Overview

• Table 1: Materials, Technologies, and Key Specifications of FC-BGA and FC-CSP
• Figure 1: Five Key Performance Differences in IC Packaging Substrate Materials
• Figure 2: Packaging Architectures Using Silicon, Organic, and Glass Materials
• Table 2: Progress of Substrate and Materials Suppliers in Glass Substrate Development (as of 1H25)

2. Glass Substrates Drive the Next Wave of 3D Integration, Challenging TSV in Cost and Performance

• Table 3: Cost-Effectiveness Comparison of TGV Fabrication Techniques
• Figure 3: Glass Substrates Can Be Applied at Scale in 2.5D/3D Packaging Types

3. Glass Substrates Empower CoWoS, CPO, and FOPLP, Unlocking New Market Potential

4. TRI's View