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市場調查報告書
商品編碼
2149719
人工智慧資料中心冷卻市場預測至2034年-全球分析(按冷卻技術、冷卻組件、資料中心類型、機架密度、應用、最終用戶和地區分類)AI Data Center Cooling Market Forecasts to 2034 - Global Analysis By Cooling Technology, Cooling Component, Data Center Type, Rack Density, Application, End User, and By Geography |
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根據 Stratistics MRC 的數據,預計到 2026 年,全球人工智慧資料中心冷卻市場規模將達到 219 億美元,並在預測期內以 9.5% 的複合年成長率成長,到 2034 年將達到 453 億美元。
人工智慧資料中心冷卻是指用於管理高密度人工智慧運算基礎設施產生的熱量的技術、組件和系統。該市場涵蓋多種冷卻技術,例如空氣冷卻、晶片級液冷、單相浸沒式冷卻、兩相浸沒式冷卻、後門式熱交換器和混合冷卻系統。冷卻組件包括冷卻分配單元、冷板、浸沒式水箱、熱交換器、泵浦和歧管、冷水機組和冷卻塔水塔、冷卻器分配和管道系統以及洩漏檢測和監控系統。這些解決方案部署於雲端服務供應商、超大規模營運商、企業、政府機構和金融服務業的超大規模資料中心、託管資料中心、企業級資料中心和邊緣資料中心。人工智慧的日益普及、機架密度的不斷提高以及日益成長的溫度控管需求是推動市場擴張的主要因素。
AI工作負載對機架密度和溫度控管的要求日益提高
人工智慧運算密度的快速成長以及由此帶來的對溫度控管要求的日益複雜,是推動人工智慧資料中心冷卻市場發展的主要動力。人工智慧加速器(包括GPU)產生的熱量遠高於傳統CPU,機架密度已達到50-100千瓦甚至更高。傳統的風冷方式無法有效應對如此巨大的熱負荷,因此需要更先進的冷卻解決方案。液冷技術具有卓越的傳熱效率。隨著人工智慧基礎設施部署的加速和機架密度的不斷提高,對先進冷卻解決方案的需求也在持續成長,從而支撐著市場的持續發展。
實施成本高且複雜
先進冷卻系統的高昂成本和複雜的實施流程是限制人工智慧資料中心冷卻市場發展的主要阻礙因素。液冷系統需要前期投入大量資金用於冷卻分配單元、冷板和設施維修。維修現有資料中心以適應液冷系統也面臨技術挑戰。此外,液冷系統的實施也會增加營運的複雜性。這些成本和複雜性方面的障礙可能會限制市場成長,尤其對於小規模的資料中心營運商而言。
開發永續和高效的冷凍技術
永續高效冷卻技術的持續創新為人工智慧資料中心冷卻市場的拓展帶來了巨大機會。兩相浸沒式冷卻技術以更低的泵浦功率實現了卓越的傳熱性能。熱水冷卻技術則可將餘熱用於區域加熱。此外,具有更優異熱性能的冷卻劑配方也在不斷研發中。隨著人們對永續發展的永續性關注和對能源效率要求的不斷提高,創新冷卻解決方案正逐步佔據市場佔有率。
技術轉型和基礎設施相容性
冷卻技術的快速發展以及與現有基礎設施相容性方面的挑戰,對人工智慧資料中心冷卻市場的成長構成重大威脅。最佳冷卻方法可能因應用而異。維修現有設施以適應新的冷卻技術也面臨許多挑戰。技術上的不確定性可能會延遲投資決策。這些技術轉型和相容性問題可能會影響市場成長。
新冠疫情加速了人工智慧資料中心冷卻市場的成長,推動了資料中心的建置和人工智慧技術的應用。疫情凸顯了數位基礎設施的重要性,並加速了對人工智慧能力的投資。供應鏈中斷影響了零件的供應。疫情後,人工智慧的持續進步和資料中心的擴張維持了對冷卻解決方案的強勁需求。
在預測期內,「晶片直接冷卻 (DTC)」細分市場預計將佔據最大的市場佔有率。
預計在預測期內,直接晶片液冷 (DTC) 技術將佔據最大的市場佔有率,這主要得益於其在冷卻高功率AI 加速器方面的卓越性能、與現有伺服器外形尺寸的兼容性,以及超大規模資料中心和託管營運商日益成長的採用率。直接晶片液冷透過冷板將冷卻液直接輸送到發熱組件,從而提供卓越的溫度控管。該技術正受惠於 AI 資料中心的快速普及。隨著 AI 機架密度的增加,直接晶片液冷在冷卻技術領域仍將維持最大的市場佔有率。
預計在預測期內,兩相浸沒式冷卻細分市場將呈現最高的複合年成長率。
在預測期內,兩相浸沒式冷卻技術預計將呈現最高的成長率,這主要得益於其卓越的傳熱效率、應對極高機架密度的能力以及在要求嚴苛的人工智慧工作負載中日益成長的應用。兩相浸沒式冷卻利用相變流體透過沸騰吸收熱量,從而實現卓越的散熱性能。該技術受益於介電流體成本的下降和部署經驗的累積。隨著人工智慧密度的提升,其冷卻能力已無法滿足需求,因此兩相浸沒式冷卻技術在冷卻技術領域正經歷最快的成長。
在整個預測期內,北美地區預計將保持最大的市場佔有率,這主要得益於該地區超大規模資料中心、人工智慧技術公司和先進冷卻技術供應商的集中佈局。美國正透過建造需要先進冷卻解決方案的大規模人工智慧資料中心,推動該地區的成長。技術創新的集中應用正在加速技術普及,而成熟的資料中心生態系統則為市場成長提供了支撐。技術領先地位和強勁的投資確保了北美地區繼續保持其市場主導地位。
在預測期內,亞太地區預計將呈現最高的複合年成長率,這主要得益於中國、日本、韓國以及整個東南亞地區人工智慧的快速普及、資料中心基礎設施的擴張以及對先進冷卻技術投資的增加。該地區龐大且持續成長的數位經濟正在催生對人工智慧冷卻解決方案的巨大需求。政府促進人工智慧發展的措施也推動了市場成長。隨著人工智慧的普及和資料中心容量的擴張,亞太地區將成為全球人工智慧資料中心冷卻市場成長最快的地區。
According to Stratistics MRC, the Global AI Data Center Cooling Market is accounted for $21.9 billion in 2026 and is expected to reach $45.3 billion by 2034 growing at a CAGR of 9.5% during the forecast period. AI data center cooling encompasses the technologies, components, and systems designed to manage heat generated by high-density AI computing infrastructure. The market includes cooling technologies such as air cooling, direct-to-chip liquid cooling, single-phase immersion cooling, two-phase immersion cooling, rear-door heat exchangers, and hybrid cooling systems. Cooling components include cooling distribution units, cold plates, immersion tanks, heat exchangers, pumps and manifolds, chillers and cooling towers, coolant distribution and piping systems, and leak detection and monitoring systems. These solutions are deployed in hyperscale, colocation, enterprise, and edge data centers across cloud service providers, hyperscale operators, enterprises, government institutions, and financial services. Growing AI adoption, increasing rack densities, and thermal management requirements are key drivers of market expansion.
Increasing rack densities and thermal management requirements for AI workloads
The rapid increase in AI computing density and associated thermal management requirements is a primary driver for the AI data center cooling market. AI accelerators including GPUs generate significantly more heat than traditional CPUs, with rack densities reaching 50-100 kW or higher. Traditional air cooling cannot efficiently manage these thermal loads, necessitating advanced cooling solutions. Liquid cooling technologies offer superior heat transfer efficiency. As AI infrastructure deployments accelerate and rack densities increase, demand for advanced cooling solutions expands, supporting sustained market growth.
High implementation costs and complexity
The significant costs associated with advanced cooling systems and implementation complexity represent a major restraint for the AI data center cooling market. Liquid cooling systems require substantial upfront investment in cooling distribution units, cold plates, and facility modifications. Retrofitting existing data centers for liquid cooling presents technical challenges. Operational complexity increases with liquid cooling systems. These cost and complexity barriers may constrain market growth, particularly for smaller data center operators.
Development of sustainable and efficient cooling technologies
Continuous innovation in sustainable and efficient cooling technologies presents significant opportunities for AI data center cooling market expansion. Two-phase immersion cooling offers superior heat transfer with lower pumping power. Warm water cooling enables heat reuse for district heating. Coolant formulations with improved thermal properties are being developed. As sustainability concerns grow and efficiency requirements increase, innovative cooling solutions capture growing market share.
Technology transitions and infrastructure compatibility
The rapid evolution of cooling technologies and compatibility challenges with existing infrastructure pose significant threats to AI data center cooling market growth. Different cooling approaches may be optimal for different applications. Retrofitting existing facilities for new cooling technologies presents challenges. Technology uncertainty may delay investment decisions. These transitions and compatibility issues may affect market growth.
The COVID-19 pandemic accelerated AI data center cooling market growth as data center construction and AI adoption increased. The pandemic highlighted the importance of digital infrastructure and accelerated investment in AI capabilities. Supply chain disruptions affected component availability. Post-pandemic, continued AI advancement and data center expansion have sustained strong demand for cooling solutions.
The Direct-to-Chip Liquid Cooling segment is expected to be the largest during the forecast period
The Direct-to-Chip Liquid Cooling segment is expected to account for the largest market share during the forecast period, driven by its effectiveness in cooling high-power AI accelerators, compatibility with existing server form factors, and growing adoption by hyperscale and colocation providers. Direct-to-chip liquid cooling delivers coolant directly to heat-generating components through cold plates, offering superior thermal management. The segment benefits from rapid adoption in AI data centers. As AI rack densities increase, direct-to-chip liquid cooling maintains the largest cooling technology segment share.
The Two-Phase Immersion Cooling segment is expected to have the highest CAGR during the forecast period
Over the forecast period, the Two-Phase Immersion Cooling segment is predicted to witness the highest growth rate, fueled by its superior heat transfer efficiency, ability to handle extreme rack densities, and growing adoption for the most demanding AI workloads. Two-phase immersion cooling uses phase-change fluids to absorb heat through boiling, offering exceptional thermal performance. The segment benefits from declining dielectric fluid costs and growing deployment experience. As AI densities increase beyond liquid cooling capabilities, two-phase immersion delivers the fastest cooling technology segment growth.
During the forecast period, the North America region is expected to hold the largest market share, supported by the concentration of hyperscale data centers, AI technology companies, and advanced cooling technology providers. The United States leads regional growth with substantial AI data center construction requiring advanced cooling solutions. High concentration of technology innovation drives adoption. Well-established data center ecosystem supports market growth. With technology leadership and strong investment, North America maintains its dominant market position.
Over the forecast period, the Asia-Pacific region is anticipated to exhibit the highest CAGR, driven by rapid AI adoption, expanding data center infrastructure, and increasing investment in advanced cooling technologies across China, Japan, South Korea, and Southeast Asia. The region's large and growing digital economy creates substantial demand for AI cooling solutions. Government initiatives promoting AI development support market growth. As AI adoption and data center capacity expand, Asia Pacific delivers the fastest AI data center cooling market growth globally.
Key players in the market
Some of the key players in AI Data Center Cooling Market include Vertiv Holdings Co., Schneider Electric SE, Johnson Controls International plc, STULZ GmbH, Rittal GmbH & Co. KG, CoolIT Systems Inc., LiquidStack Inc., Submer Technologies, Iceotope Technologies Limited, Asetek A/S, Motivair Corporation, Delta Electronics, Inc., Munters Group AB, Trane Technologies plc, and Carrier Global Corporation.
In June 2026, CoolIT Systems demonstrated a 15 kW high-density cold plate engineered for next-generation, high-wattage accelerated processors and dense AI accelerator blades.
In January 2026, Vertiv introduced updated configurations of its MegaMod HDX prefabricated power and liquid cooling modular infrastructure to support rapid multi-megawatt AI cluster deployments.
In November 2025, Schneider Electric signed a $1.9 billion supply agreement with Switch Data Centers to supply advanced thermal and power systems-including Uniflair chillers-for large-scale AI campuses across North America.
In June 2025, LiquidStack launched the GigaModular Coolant Distribution Unit platform, capable of scaling up to 10 MW per CDU module and hundreds of megawatts in aggregated high-density AI campuses.
Note: Tables for North America, Europe, APAC, South America, and Rest of the World (RoW) Regions are also represented in the same manner as above.