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市場調查報告書
商品編碼
2059048

2034年整合式被動元件市場預測－全球分析（依被動元件類型、封裝類型、技術、頻寬、元件整合、應用、終端用戶產業和地區分類）

Integrated Passive Device Market Forecasts to 2034 - Global Analysis By Passive Component Type, Packaging Type, Technology, Frequency Range, Device Integration, Application, End Use Industry, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，預計到 2026 年，全球整合被動元件市場規模將達到 18 億美元，並在預測期內以 8.8% 的複合年成長率成長，到 2034 年將達到 37 億美元。

整合式被動元件 (IPD) 是一種半導體元件，它將電阻器、電容器、電感器和平衡-不平衡轉換器等多個被動元件整合到單一晶片或基板上。與分離式被動元件相比，這些元件具有顯著優勢，例如更小的安裝面積、更高的電氣性能、更低的寄生效應和更簡化的組裝製程。家用電子電器的微型化、無線通訊系統的普及以及 5G、物聯網 (IoT) 和汽車雷達應用對高頻性能日益成長的需求，是推動這一市場發展的因素。

5G和無線通訊基礎設施的快速擴張

全球5G網路的部署對整合於緊湊外形尺寸的高頻、高效能被動元件提出了前所未有的需求。基地台、智慧型手機和物聯網設備需要在毫米波頻段進行高效的濾波、電阻和訊號調諧，而傳統的離散被動元件在該頻段會產生過多的寄生元件。整合式被動元件（IPD）透過最大限度地減少互連損耗並在單一晶片上實現精確的元件匹配，從而提供卓越的性能。隨著通訊業者在全球範圍內持續部署5G基礎設施，以及行動電話製造商推出日益複雜的設備，對射頻和微波頻段IPD解決方案的需求不斷成長，市場擴張速度也持續顯著加快。

高昂的初始設計和製造成本

整合式被動元件 (IPD) 的開發和製造需要專門的半導體工藝，例如薄膜沉積、微影術和晶圓層次電子構裝，這需要大量的資本投入。客製化 IPD 的設計通常涉及非重複性的工程成本，這可能成為中小企業和小批量生產應用的障礙。此外，能夠製造高品質 IPD 的生產設施數量有限，可能導致供應緊張和價格壓力。這些成本障礙會減緩 IPD 在價格敏感型市場中的普及，尤其是在傳統分立式被動元件儘管面積更大、電氣性能較差，但仍具有經濟吸引力的地區。

對小型化醫療和穿戴式裝置的需求日益成長

醫療和健身產業正日益廣泛地採用微型電子設備，例如植入式監視器、助聽器、智慧型貼片和連續血糖監測儀，這些設備需要整合超小型組件。整合式被動元件 (IPD) 非常適合空間受限的應用，因為它們能夠在保持可靠性和電氣性能的同時，實現顯著的小型化。隨著全球人口老化和遠端患者監護的日益普及，醫療穿戴式裝置市場預計將快速成長。這一趨勢為 IPD 製造商提供了巨大的成長機遇，他們可以開發針對下一代醫療用電子設備獨特頻率和功率需求的特定應用解決方案。

系統晶片(SoC) 和先進封裝技術帶來的激烈競爭。

新興的整合技術，例如將被動功能整合到主動晶片設計中的晶片系統(SoC) 解決方案，以及提供被動整合的先進扇出型晶圓級封裝技術，對獨立整合被動元件 (IPD) 構成了競爭威脅。一些半導體製造商正在開發以創新方式結合被動和主動功能的替代方案，這可能會削弱純 IPD 的獨特價值提案。如果這些競爭技術在成本上達到同等水平或取得性能優勢，它們可能會侵蝕傳統 IPD 產品的市場佔有率，尤其是在成本敏感且設計週期極其緊張的大批量家用電子電器領域。

新型冠狀病毒（COVID-19）的影響：

新冠疫情初期，供應鏈中斷、工廠停工以及消費者電子產品支出下降，對整合式被動元件（IPD）市場造成了衝擊。然而，隨後遠端辦公、線上學習和數位娛樂的興起，卻意外地催生了對筆記型電腦、平板電腦、遊戲機和網路設備的需求——這些設備都整合了用於無線連接的IPD。疫情也加速了醫療保健和工業領域的數位轉型，從而提振了對連網型設備的長期需求。儘管短期物流挑戰依然存在，但整體影響較為積極，因為半導體短缺凸顯了緊湊型高性能組件在維持穩健的電子產品供應鏈中的重要性。

在預測期內，微波頻率段預計將佔據最大的市場佔有率。

預計在預測期內，微波頻段將佔據最大的市場佔有率，這主要得益於微波通訊系統、雷達應用和衛星技術的廣泛應用。 1 GHz 至 30 GHz 的頻段對於 5G 6 GHz 以下頻段、用於高級駕駛輔助系統 (ADAS) 的汽車雷達、點對點無線回程傳輸以及航太雷達應用的日益普及，將使該頻段在整個預測期內保持市場主導地位。

在預測期內，多被動聚合細分市場預計將呈現最高的複合年成長率。

在預測期內，多被動式整合元件市場預計將呈現最高的成長率，這反映了產業向更高功能密度和更簡潔設計的轉變。這種整合方法透過將電阻器、電容器和電感器等多個被動元件整合到單一裝置中，減少了元件數量、基板空間和組裝成本。在智慧型手機、穿戴式裝置和物聯網感測器中，多被動解決方案越來越受到青睞，尤其適用於複雜的濾波、電阻網路和訊號調理電路，因為在這些應用中，分離式被動元件會佔用過多的面積。隨著設計工程師在不犧牲電氣性能的前提下追求更小的外形規格，多被動整合裝置正成為首選解決方案，並且其普及速度遠超簡單的單被動元件。

市佔率最大的地區：

在預測期內，亞太地區預計將佔據最大的市場佔有率，這主要得益於其在家用電子電器製造、半導體封裝和電信基礎設施部署方面的集中優勢。中國、韓國、日本和台灣等國家和地區擁有一些世界領先的智慧型手機製造商、晶圓代工廠和封裝公司，這些都是整合式被動元件（IPD）的主要需求來源。該地區積極推進的5G部署和快速發展的汽車電子產業進一步推動了需求成長。此外，政府對國內半導體生產的支持以及主要IPD供應商在該地區的存在，共同建構了一個良性循環的生態系統。這些因素的綜合作用將鞏固亞太地區在整個預測期內無可爭議的市場領導地位。

複合年成長率最高的地區：

在預測期內，北美預計將呈現最高的複合年成長率，這主要得益於無線基礎設施、國防電子和醫療設備研發領域的強勁創新。美國在先進通訊技術領域保持主導，包括衛星網際網路衛星群、下一代雷達系統和高效能運算，所有這些都需要高度整合的被動元件。基於晶片整合（CHIPS）技術的國內半導體製造領域的大量投資預計將擴大本地產能。此外，連線健診醫療設備和用於自動駕駛的汽車雷達的快速普及也創造了持續的需求。隨著北美企業日益重視供應鏈韌性和先進封裝解決方案，該地區的成長速度正在加速，並超越其他成熟市場。

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目錄

第1章執行摘要

  • 市場概覽及主要亮點
  • 促進因素、挑戰與機遇
  • 競爭格局概述
  • 戰略洞察與建議

第2章：研究框架

  • 研究目標和範圍
  • 相關人員分析
  • 研究假設和限制
  • 調查方法

第3章 市場動態與趨勢分析

  • 市場定義與結構
  • 主要市場促進因素
  • 市場限制與挑戰
  • 投資成長機會和重點領域
  • 產業威脅與風險評估
  • 技術與創新展望
  • 新興市場/高成長市場
  • 監管和政策環境
  • 新冠疫情的影響及復甦前景

第4章：競爭環境與策略評估

  • 波特五力分析
    • 供應商的議價能力
    • 買方的議價能力
    • 替代品的威脅
    • 新進入者的威脅
    • 競爭公司之間的競爭
  • 主要公司市佔率分析
  • 產品基準評效和效能比較

第5章 全球整合式被動元件市場：以被動元件類型分類

  • 整合電阻器
  • 整合式電容
  • 整合電感器
  • 整合濾波器

第6章 全球整合式被動元件市場：依封裝類型分類

  • 晶圓級封裝
  • 晶片級封裝
  • 系統內包裝

第7章 全球整合式被動元件市場：依技術分類

  • 矽基IPD
  • 玻璃基IPD
  • 陶瓷基IPD

第8章 全球整合式被動元件市場：按頻段分類

  • 低頻
  • 射頻
  • 微波頻率

第9章 全球整合式被動元件市場：按元件整合度分類

  • 單被動整合
  • 多被動元件整合

第10章 全球整合式被動元件市場：按應用分類

  • 射頻模組
  • 電源管理
  • 訊號調理
  • 電磁干擾與射頻干擾濾波
  • 天線調整
  • 感測器模組

第11章 全球整合式被動元件市場：依最終用途產業分類

  • 家用電子產品
  • 電訊
  • 汽車電子
  • 醫療用電子設備
  • 航太/國防
  • 工業電子

第12章 全球整合式被動元件市場：按地區分類

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 荷蘭
    • 比利時
    • 瑞典
    • 瑞士
    • 波蘭
    • 其他歐洲國家
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 韓國
    • 澳洲
    • 印尼
    • 泰國
    • 馬來西亞
    • 新加坡
    • 越南
    • 其他亞太國家
  • 南美洲
    • 巴西
    • 阿根廷
    • 哥倫比亞
    • 智利
    • 秘魯
    • 其他南美國家
  • 世界其他地區（RoW）
    • 中東
      • 沙烏地阿拉伯
      • 阿拉伯聯合大公國
      • 卡達
      • 以色列
      • 其他中東國家
    • 非洲
      • 南非
      • 埃及
      • 摩洛哥
      • 其他非洲國家

第13章 戰略市場資訊

  • 工業價值網路和供應鏈評估
  • 空白區域和機會地圖
  • 產品演進與市場生命週期分析
  • 通路、經銷商和打入市場策略的評估

第14章 產業趨勢與策略舉措

  • 併購
  • 夥伴關係、聯盟和合資企業
  • 新產品發布和認證
  • 擴大生產能力和投資
  • 其他策略舉措

第15章：公司簡介

  • STMicroelectronics NV
  • Infineon Technologies AG
  • Murata Manufacturing Co., Ltd.
  • Taiyo Yuden Co., Ltd.
  • Johanson Technology, Inc.
  • 3D Glass Solutions, Inc.
  • ON Semiconductor Corporation
  • Texas Instruments Incorporated
  • NXP Semiconductors NV
  • Amkor Technology, Inc.
  • ASE Technology Holding Co., Ltd.
  • Broadcom Inc.
  • Skyworks Solutions, Inc.
  • Qorvo, Inc.
  • Rohm Co., Ltd.
  • Samsung Electro-Mechanics Co., Ltd.
  • TDK Corporation
  • Yageo Corporation
Product Code: SMRC36736

According to Stratistics MRC, the Global Integrated Passive Device Market is accounted for $1.8 billion in 2026 and is expected to reach $3.7 billion by 2034 growing at a CAGR of 8.8% during the forecast period. Integrated Passive Devices (IPDs) are semiconductor components that integrate multiple passive elements such as resistors, capacitors, inductors, and baluns into a single chip or substrate. These devices offer significant advantages over discrete passive components, including reduced footprint, improved electrical performance, lower parasitic effects, and simplified assembly. The market is driven by the growing miniaturization of consumer electronics, the proliferation of wireless communication systems, and the increasing demand for high-frequency performance in 5G, Internet of Things (IoT), and automotive radar applications.

Market Dynamics:

Driver:

Rapid expansion of 5G and wireless communication infrastructure

The global rollout of 5G networks is creating unprecedented demand for high-frequency, high-performance passive components integrated into compact form factors. Base stations, smartphones, and IoT devices require efficient filtering, impedance matching, and signal conditioning at millimeter-wave frequencies where traditional discrete passives introduce excessive parasitics. Integrated Passive Devices deliver superior performance by minimizing interconnect losses and providing precise component matching on a single die. As telecommunications operators continue deploying 5G infrastructure worldwide and handset manufacturers launch increasingly sophisticated devices, the need for IPD solutions across radio frequency and microwave frequency bands continues to accelerate market expansion significantly.

Restraint:

High initial design and manufacturing costs

The development and production of Integrated Passive Devices require specialized semiconductor processes such as thin-film deposition, photolithography, and wafer-level packaging, which involve substantial capital investment. Custom IPD designs often require non-recurring engineering expenses that can be prohibitive for smaller companies or lower-volume applications. Additionally, the fabrication facilities capable of producing high-quality IPDs are limited, leading to potential supply constraints and pricing pressures. These cost barriers can slow adoption in price-sensitive markets, particularly in regions where traditional discrete passive components remain economically attractive despite their larger footprint and inferior electrical performance characteristics.

Opportunity:

Growing demand for miniaturized medical and wearable devices

The healthcare and fitness industries are increasingly embracing miniaturized electronic devices such as implantable monitors, hearing aids, smart patches, and continuous glucose monitors that require ultra-compact component integration. Integrated Passive Devices enable significant size reduction while maintaining reliability and electrical performance, making them ideal for applications where space is extremely constrained. As the global population ages and remote patient monitoring gains traction, the medical wearable market is poised for rapid growth. This trend creates substantial opportunities for IPD manufacturers to develop application-specific solutions tailored to the unique frequency and power requirements of next-generation medical electronics.

Threat:

Intense competition from system-on-chip and advanced packaging alternatives

Emerging integration technologies, including system-on-chip (SoC) solutions that embed passive functions into active die designs and advanced fan-out wafer-level packaging that offers passive integration capabilities, pose competitive threats to standalone Integrated Passive Devices. Some semiconductor manufacturers are developing alternative approaches that combine passive and active functions in novel ways, potentially reducing the distinct value proposition of pure-play IPDs. If these competing technologies achieve cost parity or performance advantages, they could erode market share for traditional IPD products, particularly in high-volume consumer electronics where cost sensitivity is paramount and design cycles are extremely aggressive.

Covid-19 Impact:

The COVID-19 pandemic initially disrupted the Integrated Passive Device market through supply chain interruptions, factory shutdowns, and reduced consumer spending on electronics. However, the subsequent shift toward remote work, online learning, and digital entertainment drove unexpected demand for laptops, tablets, gaming consoles, and networking equipment, all of which incorporate IPDs for wireless connectivity. The pandemic also accelerated digital transformation across healthcare and industrial sectors, boosting long-term demand for connected devices. While near-term logistics challenges persisted, the overall impact proved moderately positive as semiconductor shortages highlighted the importance of compact, high-performance components in maintaining resilient electronics supply chains.

The Microwave Frequency segment is expected to be the largest during the forecast period

The Microwave Frequency segment is expected to account for the largest market share during the forecast period, driven by the widespread deployment of microwave-based communication systems, radar applications, and satellite technologies. Frequencies ranging from approximately 1 GHz to 30 GHz are critical for 5G sub-6 GHz bands, automotive radar for advanced driver-assistance systems, point-to-point wireless backhaul, and aerospace defense applications. Integrated Passive Devices operating in this range provide essential filtering, coupling, and matching functions with superior stability and low insertion loss. The ongoing expansion of 5G networks in the sub-6 GHz spectrum, combined with increasing radar content in vehicles, ensures this segment maintains dominant market positioning throughout the forecast timeline.

The Multi-Passive Integration segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the Multi-Passive Integration segment is predicted to witness the highest growth rate, reflecting the industry's shift toward higher functional density and design simplification. This integration approach combines several passive components-such as multiple resistors, capacitors, and inductors-into a single device, reducing component count, board space, and assembly costs. Smartphones, wearables, and IoT sensors increasingly favor multi-passive solutions for complex filtering, impedance matching networks, and signal conditioning circuits where discrete passives would consume excessive area. As design engineers push for ever-smaller form factors without compromising electrical performance, multi-passive IPDs are becoming the preferred solution, driving their adoption at a substantially faster rate than simpler single-passive devices.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, driven by the concentration of consumer electronics manufacturing, semiconductor assembly, and telecommunications infrastructure deployment. Countries including China, South Korea, Japan, and Taiwan host the world's leading smartphone manufacturers, foundries, and packaging houses that are primary consumers of Integrated Passive Devices. The region's aggressive 5G rollout and rapidly expanding automotive electronics sector further fuel demand. Additionally, government support for domestic semiconductor production and the presence of major IPD suppliers within the region create a self-reinforcing ecosystem. These factors collectively position Asia Pacific as the undisputed market leader throughout the forecast period.

Region with highest CAGR:

Over the forecast period, North America region is anticipated to exhibit the highest CAGR, supported by strong innovation in wireless infrastructure, defense electronics, and medical device development. The United States maintains leadership in advanced communication technologies, including satellite internet constellations, next-generation radar systems, and high-performance computing, all of which demand sophisticated Integrated Passive Devices. Significant investment in domestic semiconductor manufacturing under the CHIPS Act is expected to expand local production capabilities. Furthermore, the rapid adoption of connected healthcare devices and automotive radar for autonomous driving creates sustained demand. As North American companies increasingly prioritize supply chain resilience and advanced packaging solutions, the region's growth rate accelerates beyond other mature markets.

Key players in the market

Some of the key players in Integrated Passive Device Market include STMicroelectronics N.V., Infineon Technologies AG, Murata Manufacturing Co., Ltd., Taiyo Yuden Co., Ltd., Johanson Technology, Inc., 3D Glass Solutions, Inc., ON Semiconductor Corporation, Texas Instruments Incorporated, NXP Semiconductors N.V., Amkor Technology, Inc., ASE Technology Holding Co., Ltd., Broadcom Inc., Skyworks Solutions, Inc., Qorvo, Inc., Rohm Co., Ltd., Samsung Electro-Mechanics Co., Ltd., TDK Corporation, and Yageo Corporation.

Key Developments:

In March 2026, Murata released its smallest thin-film IPD diplexer to date, specifically designed for 5G mmWave smartphones, occupying 30% less space than previous ceramic-based iterations.

In February 2026, Infineon introduced a new series of silicon-based IPDs optimized for automotive radar systems, focusing on enhancing signal-to-noise ratios in 77GHz autonomous driving sensors.

In January 2026, STMicroelectronics announced the expansion of its IPD-on-Silicon technology to support ultra-wideband (UWB) applications, aiming to integrate complex matching networks and filters into a single die for the next generation of smart-home sensors.

Passive Component Types Covered:

  • Integrated Resistors
  • Integrated Capacitors
  • Integrated Inductors
  • Integrated Filters

Packaging Types Covered:

  • Wafer-Level Packaging
  • Chip-Scale Packaging
  • System-in-Package

Technologies Covered:

  • Silicon-Based IPD
  • Glass-Based IPD
  • Ceramic-Based IPD

Frequency Ranges Covered:

  • Low Frequency
  • Radio Frequency
  • Microwave Frequency

Device Integrations Covered:

  • Single Passive Integration
  • Multi-Passive Integration

Applications Covered:

  • RF Modules
  • Power Management
  • Signal Conditioning
  • EMI and RFI Filtering
  • Antenna Tuning
  • Sensor Modules

End Use Industries Covered:

  • Consumer Electronics
  • Telecommunications
  • Automotive Electronics
  • Healthcare Electronics
  • Aerospace and Defense
  • Industrial Electronics

Regions Covered:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Spain
    • Netherlands
    • Belgium
    • Sweden
    • Switzerland
    • Poland
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Thailand
    • Malaysia
    • Singapore
    • Vietnam
    • Rest of Asia Pacific
  • South America
    • Brazil
    • Argentina
    • Colombia
    • Chile
    • Peru
    • Rest of South America
  • Rest of the World (RoW)
    • Middle East
  • Saudi Arabia
  • United Arab Emirates
  • Qatar
  • Israel
  • Rest of Middle East
    • Africa
  • South Africa
  • Egypt
  • Morocco
  • Rest of Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2023, 2024, 2025, 2026, 2027, 2028, 2030, 2032 and 2034
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

  • 1.1 Market Snapshot and Key Highlights
  • 1.2 Growth Drivers, Challenges, and Opportunities
  • 1.3 Competitive Landscape Overview
  • 1.4 Strategic Insights and Recommendations

2 Research Framework

  • 2.1 Study Objectives and Scope
  • 2.2 Stakeholder Analysis
  • 2.3 Research Assumptions and Limitations
  • 2.4 Research Methodology
    • 2.4.1 Data Collection (Primary and Secondary)
    • 2.4.2 Data Modeling and Estimation Techniques
    • 2.4.3 Data Validation and Triangulation
    • 2.4.4 Analytical and Forecasting Approach

3 Market Dynamics and Trend Analysis

  • 3.1 Market Definition and Structure
  • 3.2 Key Market Drivers
  • 3.3 Market Restraints and Challenges
  • 3.4 Growth Opportunities and Investment Hotspots
  • 3.5 Industry Threats and Risk Assessment
  • 3.6 Technology and Innovation Landscape
  • 3.7 Emerging and High-Growth Markets
  • 3.8 Regulatory and Policy Environment
  • 3.9 Impact of COVID-19 and Recovery Outlook

4 Competitive and Strategic Assessment

  • 4.1 Porter's Five Forces Analysis
    • 4.1.1 Supplier Bargaining Power
    • 4.1.2 Buyer Bargaining Power
    • 4.1.3 Threat of Substitutes
    • 4.1.4 Threat of New Entrants
    • 4.1.5 Competitive Rivalry
  • 4.2 Market Share Analysis of Key Players
  • 4.3 Product Benchmarking and Performance Comparison

5 Global Integrated Passive Device Market, By Passive Component Type

  • 5.1 Integrated Resistors
  • 5.2 Integrated Capacitors
  • 5.3 Integrated Inductors
  • 5.4 Integrated Filters

6 Global Integrated Passive Device Market, By Packaging Type

  • 6.1 Wafer-Level Packaging
  • 6.2 Chip-Scale Packaging
  • 6.3 System-in-Package

7 Global Integrated Passive Device Market, By Technology

  • 7.1 Silicon-Based IPD
  • 7.2 Glass-Based IPD
  • 7.3 Ceramic-Based IPD

8 Global Integrated Passive Device Market, By Frequency Range

  • 8.1 Low Frequency
  • 8.2 Radio Frequency
  • 8.3 Microwave Frequency

9 Global Integrated Passive Device Market, By Device Integration

  • 9.1 Single Passive Integration
  • 9.2 Multi-Passive Integration

10 Global Integrated Passive Device Market, By Application

  • 10.1 RF Modules
  • 10.2 Power Management
  • 10.3 Signal Conditioning
  • 10.4 EMI and RFI Filtering
  • 10.5 Antenna Tuning
  • 10.6 Sensor Modules

11 Global Integrated Passive Device Market, By End Use Industry

  • 11.1 Consumer Electronics
  • 11.2 Telecommunications
  • 11.3 Automotive Electronics
  • 11.4 Healthcare Electronics
  • 11.5 Aerospace and Defense
  • 11.6 Industrial Electronics

12 Global Integrated Passive Device Market, By Geography

  • 12.1 North America
    • 12.1.1 United States
    • 12.1.2 Canada
    • 12.1.3 Mexico
  • 12.2 Europe
    • 12.2.1 United Kingdom
    • 12.2.2 Germany
    • 12.2.3 France
    • 12.2.4 Italy
    • 12.2.5 Spain
    • 12.2.6 Netherlands
    • 12.2.7 Belgium
    • 12.2.8 Sweden
    • 12.2.9 Switzerland
    • 12.2.10 Poland
    • 12.2.11 Rest of Europe
  • 12.3 Asia Pacific
    • 12.3.1 China
    • 12.3.2 Japan
    • 12.3.3 India
    • 12.3.4 South Korea
    • 12.3.5 Australia
    • 12.3.6 Indonesia
    • 12.3.7 Thailand
    • 12.3.8 Malaysia
    • 12.3.9 Singapore
    • 12.3.10 Vietnam
    • 12.3.11 Rest of Asia Pacific
  • 12.4 South America
    • 12.4.1 Brazil
    • 12.4.2 Argentina
    • 12.4.3 Colombia
    • 12.4.4 Chile
    • 12.4.5 Peru
    • 12.4.6 Rest of South America
  • 12.5 Rest of the World (RoW)
    • 12.5.1 Middle East
      • 12.5.1.1 Saudi Arabia
      • 12.5.1.2 United Arab Emirates
      • 12.5.1.3 Qatar
      • 12.5.1.4 Israel
      • 12.5.1.5 Rest of Middle East
    • 12.5.2 Africa
      • 12.5.2.1 South Africa
      • 12.5.2.2 Egypt
      • 12.5.2.3 Morocco
      • 12.5.2.4 Rest of Africa

13 Strategic Market Intelligence

  • 13.1 Industry Value Network and Supply Chain Assessment
  • 13.2 White-Space and Opportunity Mapping
  • 13.3 Product Evolution and Market Life Cycle Analysis
  • 13.4 Channel, Distributor, and Go-to-Market Assessment

14 Industry Developments and Strategic Initiatives

  • 14.1 Mergers and Acquisitions
  • 14.2 Partnerships, Alliances, and Joint Ventures
  • 14.3 New Product Launches and Certifications
  • 14.4 Capacity Expansion and Investments
  • 14.5 Other Strategic Initiatives

15 Company Profiles

  • 15.1 STMicroelectronics N.V.
  • 15.2 Infineon Technologies AG
  • 15.3 Murata Manufacturing Co., Ltd.
  • 15.4 Taiyo Yuden Co., Ltd.
  • 15.5 Johanson Technology, Inc.
  • 15.6 3D Glass Solutions, Inc.
  • 15.7 ON Semiconductor Corporation
  • 15.8 Texas Instruments Incorporated
  • 15.9 NXP Semiconductors N.V.
  • 15.10 Amkor Technology, Inc.
  • 15.11 ASE Technology Holding Co., Ltd.
  • 15.12 Broadcom Inc.
  • 15.13 Skyworks Solutions, Inc.
  • 15.14 Qorvo, Inc.
  • 15.15 Rohm Co., Ltd.
  • 15.16 Samsung Electro-Mechanics Co., Ltd.
  • 15.17 TDK Corporation
  • 15.18 Yageo Corporation

List of Tables

  • Table 1 Global Integrated Passive Device Market Outlook, By Region (2023-2034) ($MN)
  • Table 2 Global Integrated Passive Device Market Outlook, By Passive Component Type (2023-2034) ($MN)
  • Table 3 Global Integrated Passive Device Market Outlook, By Integrated Resistors (2023-2034) ($MN)
  • Table 4 Global Integrated Passive Device Market Outlook, By Integrated Capacitors (2023-2034) ($MN)
  • Table 5 Global Integrated Passive Device Market Outlook, By Integrated Inductors (2023-2034) ($MN)
  • Table 6 Global Integrated Passive Device Market Outlook, By Integrated Filters (2023-2034) ($MN)
  • Table 7 Global Integrated Passive Device Market Outlook, By Packaging Type (2023-2034) ($MN)
  • Table 8 Global Integrated Passive Device Market Outlook, By Wafer-Level Packaging (2023-2034) ($MN)
  • Table 9 Global Integrated Passive Device Market Outlook, By Chip-Scale Packaging (2023-2034) ($MN)
  • Table 10 Global Integrated Passive Device Market Outlook, By System-in-Package (2023-2034) ($MN)
  • Table 11 Global Integrated Passive Device Market Outlook, By Technology (2023-2034) ($MN)
  • Table 12 Global Integrated Passive Device Market Outlook, By Silicon-Based IPD (2023-2034) ($MN)
  • Table 13 Global Integrated Passive Device Market Outlook, By Glass-Based IPD (2023-2034) ($MN)
  • Table 14 Global Integrated Passive Device Market Outlook, By Ceramic-Based IPD (2023-2034) ($MN)
  • Table 15 Global Integrated Passive Device Market Outlook, By Frequency Range (2023-2034) ($MN)
  • Table 16 Global Integrated Passive Device Market Outlook, By Low Frequency (2023-2034) ($MN)
  • Table 17 Global Integrated Passive Device Market Outlook, By Radio Frequency (2023-2034) ($MN)
  • Table 18 Global Integrated Passive Device Market Outlook, By Microwave Frequency (2023-2034) ($MN)
  • Table 19 Global Integrated Passive Device Market Outlook, By Device Integration (2023-2034) ($MN)
  • Table 20 Global Integrated Passive Device Market Outlook, By Single Passive Integration (2023-2034) ($MN)
  • Table 21 Global Integrated Passive Device Market Outlook, By Multi-Passive Integration (2023-2034) ($MN)
  • Table 22 Global Integrated Passive Device Market Outlook, By Application (2023-2034) ($MN)
  • Table 23 Global Integrated Passive Device Market Outlook, By RF Modules (2023-2034) ($MN)
  • Table 24 Global Integrated Passive Device Market Outlook, By Power Management (2023-2034) ($MN)
  • Table 25 Global Integrated Passive Device Market Outlook, By Signal Conditioning (2023-2034) ($MN)
  • Table 26 Global Integrated Passive Device Market Outlook, By EMI and RFI Filtering (2023-2034) ($MN)
  • Table 27 Global Integrated Passive Device Market Outlook, By Antenna Tuning (2023-2034) ($MN)
  • Table 28 Global Integrated Passive Device Market Outlook, By Sensor Modules (2023-2034) ($MN)
  • Table 29 Global Integrated Passive Device Market Outlook, By End Use Industry (2023-2034) ($MN)
  • Table 30 Global Integrated Passive Device Market Outlook, By Consumer Electronics (2023-2034) ($MN)
  • Table 31 Global Integrated Passive Device Market Outlook, By Telecommunications (2023-2034) ($MN)
  • Table 32 Global Integrated Passive Device Market Outlook, By Automotive Electronics (2023-2034) ($MN)
  • Table 33 Global Integrated Passive Device Market Outlook, By Healthcare Electronics (2023-2034) ($MN)
  • Table 34 Global Integrated Passive Device Market Outlook, By Aerospace and Defense (2023-2034) ($MN)
  • Table 35 Global Integrated Passive Device Market Outlook, By Industrial Electronics (2023-2034) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Rest of the World (RoW) Regions are also represented in the same manner as above.