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1943656

整合式被動元件市場 - 全球產業規模、佔有率、趨勢、機會及預測（按應用、最終用途、地區和競爭格局分類，2021-2031年）

Integrated Passive Devices Market - Global Industry Size, Share, Trends, Opportunity, and Forecast, Segmented By Application, By End-use, By Region & Competition, 2021-2031F
出版日期: | 出版商: TechSci Research | 英文 180 Pages | 商品交期: 2-3個工作天內

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簡介目錄

全球整合式被動元件市場預計將從 2025 年的 22.6 億美元成長到 2031 年的 37.9 億美元，複合年成長率為 9.01%。

整合式被動元件 (IPD) 是一種高性能元件，它將電阻器、電容器和電感器等被動元件直接嵌入玻璃或半導體基板中，而不是像傳統封裝方式那樣將它們封裝成單獨的單元。這種整合方式顯著縮小了裝置的面積並提高了電氣性能，從而滿足了高頻環境下對訊號完整性和小型化的關鍵產業需求。市場的主要驅動力是家用電子電器日益成長的需求，以及先進汽車系統和 5G 通訊對性能的嚴格要求，這些要求比傳統表面黏著技術更低的寄生電感。

市場概覽
預測期 2027-2031
市場規模：2025年 22.6億美元
市場規模：2031年 37.9億美元
複合年成長率：2026-2031年 9.01%
成長最快的細分市場 衛生保健
最大的市場 亞太地區

市場發展與整個半導體產業的趨勢密切相關，半導體產業是這些整合解決方案的基礎平台。根據半導體產業協會 (SIA) 預測，2024 年第三季全球半導體銷售額預計將達到 1,660 億美元，年成長 23.2%。半導體產業的強勁成長表明，支援數據密集應用的先進組件技術（例如整合元件）正得到越來越廣泛的應用。然而，市場擴張的主要障礙在於整合裝置相關的高昂非重複性工程成本和複雜的製造程序，這使得它們在大批量、低利潤應用中的成本效益低於標準分立組件。

市場促進因素

5G通訊基礎設施的快速部署正成為整合式被動元件（IPD）應用的重要催化劑。隨著通訊業者向更高頻段過渡，對能夠最大限度降低寄生電容並保持訊號完整性的組件的需求日益成長。 IPD能夠將高效能濾波器、耦合器和平衡-不平衡轉換器直接整合到基板上，這對於大規模MIMO部署中現代射頻前端模組的有效運作至關重要。根據愛立信於2024年6月發布的《行動報告》，2024年第一季全球5G用戶數將增加1.6億人。這種持續的網路擴張推動了小型基地台和廣域基地台的硬體需求，進而導致對射頻效能超越傳統分立組件的整合式被動解決方案的需求不斷成長。

同時，小型化家用電子電器和穿戴式裝置的激增，對設備設計提出了更嚴格的空間限制，加速了市場需求的成長。製造商正擴大採用系統級封裝（SiP）技術，將被動元件整合到基板，以便為更大的處理器和電池騰出空間。蘋果在2024會計年度第三季財報中公佈，其穿戴式家居配件部門的淨銷售額達到81億美元，顯示該領域對元件的需求規模龐大。製造業生態系統的復甦也進一步支持了這些小型電子產品的需求。根據SEMI的報告，2024年第二季全球矽晶圓出貨量較上季成長7.1%，確保了基板供應能滿足消費性電子市場的高需求。

市場挑戰

複雜的製造要求和高昂的非重複性工程成本是限制全球整合被動元件市場成長的重要障礙。與依賴標準低成本生產方法的離散元件不同，整合式被動元件需要利用光刻和薄膜沉積等先進的半導體製造技術。這種依賴關係需要在開發階段投入大量領先資本，導致最終單位成本遠高於傳統方案。因此，這些高成本削弱了整合解決方案在價格敏感型和低利潤應用中的經濟可行性，從而有效地限制了其在高效能領域的應用。

維持必要的生產基礎設施所需的高昂營運成本進一步加劇了這項財務挑戰。這種生產環境的資本密集特性直接影響這些元件的定價結構。近期行業數據顯示，製造業支出也印證了這高昂的營運成本。根據SEMI統計，2024年第二季全球半導體製造設備銷售額達268億美元。如此龐大的生產設施支出凸顯了製造商面臨的沉重財務負擔，也使得整合式被動元件進入通用市場領域面臨較高的進入門檻。

市場趨勢

玻璃基板在高頻射頻和高效能運算應用中的日益普及，正在從根本上改變市場格局。與傳統的有機基板相比，玻璃具有更優異的尺寸穩定性和顯著更低的電損耗，這些特性對於下一代人工智慧加速器和採用玻璃通孔（TGV）技術的5G/6G模組所需的高密度互連至關重要。這種材料轉型正在推動大規模的產業投資，以建立先進整合解決方案所需的製造基礎設施。例如，2024年5月，美國商務部宣布，Absolics公司已獲得《晶片技術創新法案》（CHIPS Act）高達7,500萬美元的津貼，用於支持其在喬治亞建造一座專門用於半導體產業玻璃基板研發的商業設施。

同時，高可靠性整合式被動元件 (IPD) 在電動車系統和汽車高級駕駛輔助系統 (ADAS) 的應用日益廣泛，成為一個重要的新興成長領域。隨著車輛架構越來越依賴複雜的感測器陣列來實現自動駕駛和高壓動力傳動系統，製造商正在轉向整合被動元件，因為與分離式表面黏著技術元件相比，這些元件能夠更好地承受機械振動和嚴苛的熱循環。全球汽車的快速電氣化直接推動了這一轉變，因為汽車安全關鍵硬體需要堅固耐用且節省空間的組件。為了佐證這項需求，國際能源總署 (IEA) 發布的《2024 年全球電動車展望》預測，到 2024 年，全球電動車銷量將達到約 1,700 萬輛，凸顯了對汽車級電子元件的巨大需求。

目錄

第1章概述

第2章調查方法

第3章執行摘要

第4章：客戶評價

第5章 全球整合式被動元件市場展望

  • 市場規模及預測
    • 按金額
  • 市佔率及預測
    • 依應用領域（EMS/EMI 保護 IPD、RF IPD、LED 照明、數位/混合訊號 IPD）
    • 按最終用戶（汽車、家用電子電器、醫療、其他）
    • 按地區
    • 按公司（2025 年）
  • 市場地圖

6. 北美整合式被動元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 北美洲：國家分析
    • 美國
    • 加拿大
    • 墨西哥

7. 歐洲整合被動元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 歐洲：國家分析
    • 德國
    • 法國
    • 英國
    • 義大利
    • 西班牙

8. 亞太地區整合式被動元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 亞太地區：國家分析
    • 中國
    • 印度
    • 日本
    • 韓國
    • 澳洲

9. 中東和非洲整合式被動元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 中東和非洲：國家分析
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 南非

10. 南美洲整合式被動元件市場展望

  • 市場規模及預測
  • 市佔率及預測
  • 南美洲：國家分析
    • 巴西
    • 哥倫比亞
    • 阿根廷

第11章 市場動態

  • 促進要素
  • 任務

第12章 市場趨勢與發展

  • 併購
  • 產品發布
  • 最新進展

第13章 全球整合式被動元件市場：SWOT分析

第14章：波特五力分析

  • 產業競爭
  • 新進入者的可能性
  • 供應商電力
  • 顧客權力
  • 替代品的威脅

第15章 競爭格局

  • Murata Manufacturing Co., Ltd.
  • Infineon Technologies AG
  • STMicroelectronics NV
  • ON Semiconductor Corporation
  • Broadcom Inc.
  • NXP Semiconductors NV
  • Texas Instruments Incorporated
  • Qorvo, Inc.
  • MACOM Technology Solutions Holdings Inc.
  • CTS Corporation

第16章 策略建議

第17章：關於研究公司及免責聲明

簡介目錄
Product Code: 19466

The Global Integrated Passive Devices Market is projected to expand from USD 2.26 Billion in 2025 to USD 3.79 Billion by 2031, registering a CAGR of 9.01%. Integrated Passive Devices (IPDs) are high-performance components in which passive elements like resistors, capacitors, and inductors are embedded directly into glass or semiconductor substrates instead of being packaged as individual units. This integration facilitates significantly reduced device footprints and improved electrical performance, satisfying critical industry needs for signal integrity and miniaturization in high-frequency environments. The market is primarily driven by the growing demand for compact consumer electronics and the stringent performance requirements of advanced automotive systems and 5G telecommunications, which demand lower parasitic inductance than traditional surface-mount technologies.

Market Overview
Forecast Period2027-2031
Market Size 2025USD 2.26 Billion
Market Size 2031USD 3.79 Billion
CAGR 2026-20319.01%
Fastest Growing SegmentHealthcare
Largest MarketAsia Pacific

The market's progression is tightly connected to the broader semiconductor industry, which serves as the foundational platform for these integrated solutions. As reported by the Semiconductor Industry Association, global semiconductor sales hit $166.0 billion in the third quarter of 2024, marking a 23.2% increase over the same period in 2023. This strong growth in the underlying semiconductor sector highlights the increasing adoption of advanced component technologies, such as IPDs, to sustain data-intensive applications. However, a major obstacle to widespread market growth is the high non-recurring engineering costs and manufacturing complexity associated with IPDs, which can render them less cost-effective than standard discrete components for high-volume, low-margin applications.

Market Driver

The swift rollout of 5G telecommunications infrastructure acts as a major catalyst for the adoption of Integrated Passive Devices (IPDs). As telecommunications providers move toward higher frequency bands, the need for components that preserve signal integrity while minimizing parasitic capacitance becomes increasingly critical. IPDs enable the direct integration of high-performance filters, couplers, and baluns onto substrates, which is vital for the effective operation of modern radio frequency front-end modules in massive MIMO implementations. According to Ericsson's June 2024 'Ericsson Mobility Report', global 5G subscriptions increased by 160 million in the first quarter of 2024. This ongoing network expansion drives hardware requirements for both small cells and macro base stations, thereby boosting the volume of integrated passive solutions that outperform traditional discrete components in radio frequency performance.

Simultaneously, the proliferation of miniaturized consumer electronics and connected wearables is accelerating market demand by placing strict space limitations on device architecture. Manufacturers are increasingly adopting System-in-Package technologies where passive components are embedded to save board space for larger processors and batteries. Apple Inc. reported in its fiscal 2024 third-quarter results that the Wearables, Home, and Accessories segment achieved net sales of $8.1 billion, demonstrating the vast scale of component usage in this sector. This demand for compact electronics is bolstered by a rebounding manufacturing ecosystem; SEMI reported that global silicon wafer shipments rose by 7.1% quarter-over-quarter in the second quarter of 2024, ensuring that substrate availability can meet the high volume needs of the consumer electronics market.

Market Challenge

Complex manufacturing requirements and high non-recurring engineering expenses pose a significant barrier to the growth of the Global Integrated Passive Devices Market. Unlike discrete components that rely on standard, low-cost production methods, integrated passive devices utilize advanced semiconductor fabrication techniques such as photolithography and thin-film deposition. This reliance necessitates substantial upfront capital investment during the development phase, resulting in a final unit cost that is considerably higher than traditional alternatives. Consequently, these elevated costs make integrated solutions less financially feasible for price-sensitive or low-margin applications, effectively limiting their adoption to high-performance sectors.

The financial challenge is further exacerbated by the significant operational costs required to maintain the necessary manufacturing infrastructure. The capital-intensive nature of sustaining such production environments directly influences the pricing structure of these components. This high cost of operation is evidenced by recent industry data regarding manufacturing expenditures; according to SEMI, worldwide semiconductor equipment billings reached $26.8 billion in the second quarter of 2024. Such massive spending on production tooling highlights the heavy financial overhead that manufacturers face, which sustains high entry barriers for integrated passive devices in mass-market segments.

Market Trends

The increasing adoption of glass-based substrates for high-frequency RF and high-performance computing applications is fundamentally altering the technological landscape of the market. Glass provides superior dimensional stability and significantly lower electrical loss compared to traditional organic cores, properties that are vital for the dense interconnects required by next-generation AI accelerators and 5G/6G modules using Through-Glass Via (TGV) technologies. This material shift is driving substantial industrial investment to build the necessary manufacturing infrastructure for these advanced integrated solutions. For instance, the U.S. Department of Commerce announced in May 2024 that Absolics was awarded up to $75 million under CHIPS Act incentives to support the construction of a commercial facility in Georgia dedicated to developing glass substrates for the semiconductor industry.

Concurrently, the expanding use of high-reliability IPDs in electric vehicle systems and automotive ADAS represents a critical new growth area. As vehicle architectures increasingly depend on complex sensor arrays for autonomous driving and high-voltage powertrains, manufacturers are transitioning to integrated passive devices that can withstand mechanical vibrations and extreme thermal cycles better than discrete surface-mount components. This shift is directly supported by the rapid electrification of the global fleet, which necessitates robust, space-efficient components for safety-critical hardware. Underscoring this demand, the International Energy Agency's 'Global EV Outlook 2024' projected that global electric car sales would reach approximately 17 million units in 2024, highlighting the massive scale of demand for automotive-grade electronic components.

Key Market Players

  • Murata Manufacturing Co., Ltd.
  • Infineon Technologies AG
  • STMicroelectronics N.V.
  • ON Semiconductor Corporation
  • Broadcom Inc.
  • NXP Semiconductors N.V.
  • Texas Instruments Incorporated
  • Qorvo, Inc.
  • MACOM Technology Solutions Holdings Inc.
  • CTS Corporation

Report Scope

In this report, the Global Integrated Passive Devices Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Integrated Passive Devices Market, By Application

  • EMS & EMI Protection IPD
  • RF IPD
  • LED Lighting
  • Digital & Mixed Signal IPD

Integrated Passive Devices Market, By End-use

  • Automobile
  • Consumer electronics
  • Healthcare
  • Others

Integrated Passive Devices Market, By Region

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • France
    • United Kingdom
    • Italy
    • Germany
    • Spain
  • Asia Pacific
    • China
    • India
    • Japan
    • Australia
    • South Korea
  • South America
    • Brazil
    • Argentina
    • Colombia
  • Middle East & Africa
    • South Africa
    • Saudi Arabia
    • UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Integrated Passive Devices Market.

Available Customizations:

Global Integrated Passive Devices Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

  • Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

  • 1.1. Market Definition
  • 1.2. Scope of the Market
    • 1.2.1. Markets Covered
    • 1.2.2. Years Considered for Study
    • 1.2.3. Key Market Segmentations

2. Research Methodology

  • 2.1. Objective of the Study
  • 2.2. Baseline Methodology
  • 2.3. Key Industry Partners
  • 2.4. Major Association and Secondary Sources
  • 2.5. Forecasting Methodology
  • 2.6. Data Triangulation & Validation
  • 2.7. Assumptions and Limitations

3. Executive Summary

  • 3.1. Overview of the Market
  • 3.2. Overview of Key Market Segmentations
  • 3.3. Overview of Key Market Players
  • 3.4. Overview of Key Regions/Countries
  • 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Integrated Passive Devices Market Outlook

  • 5.1. Market Size & Forecast
    • 5.1.1. By Value
  • 5.2. Market Share & Forecast
    • 5.2.1. By Application (EMS & EMI Protection IPD, RF IPD, LED Lighting, Digital & Mixed Signal IPD)
    • 5.2.2. By End-use (Automobile, Consumer electronics, Healthcare, Others)
    • 5.2.3. By Region
    • 5.2.4. By Company (2025)
  • 5.3. Market Map

6. North America Integrated Passive Devices Market Outlook

  • 6.1. Market Size & Forecast
    • 6.1.1. By Value
  • 6.2. Market Share & Forecast
    • 6.2.1. By Application
    • 6.2.2. By End-use
    • 6.2.3. By Country
  • 6.3. North America: Country Analysis
    • 6.3.1. United States Integrated Passive Devices Market Outlook
      • 6.3.1.1. Market Size & Forecast
        • 6.3.1.1.1. By Value
      • 6.3.1.2. Market Share & Forecast
        • 6.3.1.2.1. By Application
        • 6.3.1.2.2. By End-use
    • 6.3.2. Canada Integrated Passive Devices Market Outlook
      • 6.3.2.1. Market Size & Forecast
        • 6.3.2.1.1. By Value
      • 6.3.2.2. Market Share & Forecast
        • 6.3.2.2.1. By Application
        • 6.3.2.2.2. By End-use
    • 6.3.3. Mexico Integrated Passive Devices Market Outlook
      • 6.3.3.1. Market Size & Forecast
        • 6.3.3.1.1. By Value
      • 6.3.3.2. Market Share & Forecast
        • 6.3.3.2.1. By Application
        • 6.3.3.2.2. By End-use

7. Europe Integrated Passive Devices Market Outlook

  • 7.1. Market Size & Forecast
    • 7.1.1. By Value
  • 7.2. Market Share & Forecast
    • 7.2.1. By Application
    • 7.2.2. By End-use
    • 7.2.3. By Country
  • 7.3. Europe: Country Analysis
    • 7.3.1. Germany Integrated Passive Devices Market Outlook
      • 7.3.1.1. Market Size & Forecast
        • 7.3.1.1.1. By Value
      • 7.3.1.2. Market Share & Forecast
        • 7.3.1.2.1. By Application
        • 7.3.1.2.2. By End-use
    • 7.3.2. France Integrated Passive Devices Market Outlook
      • 7.3.2.1. Market Size & Forecast
        • 7.3.2.1.1. By Value
      • 7.3.2.2. Market Share & Forecast
        • 7.3.2.2.1. By Application
        • 7.3.2.2.2. By End-use
    • 7.3.3. United Kingdom Integrated Passive Devices Market Outlook
      • 7.3.3.1. Market Size & Forecast
        • 7.3.3.1.1. By Value
      • 7.3.3.2. Market Share & Forecast
        • 7.3.3.2.1. By Application
        • 7.3.3.2.2. By End-use
    • 7.3.4. Italy Integrated Passive Devices Market Outlook
      • 7.3.4.1. Market Size & Forecast
        • 7.3.4.1.1. By Value
      • 7.3.4.2. Market Share & Forecast
        • 7.3.4.2.1. By Application
        • 7.3.4.2.2. By End-use
    • 7.3.5. Spain Integrated Passive Devices Market Outlook
      • 7.3.5.1. Market Size & Forecast
        • 7.3.5.1.1. By Value
      • 7.3.5.2. Market Share & Forecast
        • 7.3.5.2.1. By Application
        • 7.3.5.2.2. By End-use

8. Asia Pacific Integrated Passive Devices Market Outlook

  • 8.1. Market Size & Forecast
    • 8.1.1. By Value
  • 8.2. Market Share & Forecast
    • 8.2.1. By Application
    • 8.2.2. By End-use
    • 8.2.3. By Country
  • 8.3. Asia Pacific: Country Analysis
    • 8.3.1. China Integrated Passive Devices Market Outlook
      • 8.3.1.1. Market Size & Forecast
        • 8.3.1.1.1. By Value
      • 8.3.1.2. Market Share & Forecast
        • 8.3.1.2.1. By Application
        • 8.3.1.2.2. By End-use
    • 8.3.2. India Integrated Passive Devices Market Outlook
      • 8.3.2.1. Market Size & Forecast
        • 8.3.2.1.1. By Value
      • 8.3.2.2. Market Share & Forecast
        • 8.3.2.2.1. By Application
        • 8.3.2.2.2. By End-use
    • 8.3.3. Japan Integrated Passive Devices Market Outlook
      • 8.3.3.1. Market Size & Forecast
        • 8.3.3.1.1. By Value
      • 8.3.3.2. Market Share & Forecast
        • 8.3.3.2.1. By Application
        • 8.3.3.2.2. By End-use
    • 8.3.4. South Korea Integrated Passive Devices Market Outlook
      • 8.3.4.1. Market Size & Forecast
        • 8.3.4.1.1. By Value
      • 8.3.4.2. Market Share & Forecast
        • 8.3.4.2.1. By Application
        • 8.3.4.2.2. By End-use
    • 8.3.5. Australia Integrated Passive Devices Market Outlook
      • 8.3.5.1. Market Size & Forecast
        • 8.3.5.1.1. By Value
      • 8.3.5.2. Market Share & Forecast
        • 8.3.5.2.1. By Application
        • 8.3.5.2.2. By End-use

9. Middle East & Africa Integrated Passive Devices Market Outlook

  • 9.1. Market Size & Forecast
    • 9.1.1. By Value
  • 9.2. Market Share & Forecast
    • 9.2.1. By Application
    • 9.2.2. By End-use
    • 9.2.3. By Country
  • 9.3. Middle East & Africa: Country Analysis
    • 9.3.1. Saudi Arabia Integrated Passive Devices Market Outlook
      • 9.3.1.1. Market Size & Forecast
        • 9.3.1.1.1. By Value
      • 9.3.1.2. Market Share & Forecast
        • 9.3.1.2.1. By Application
        • 9.3.1.2.2. By End-use
    • 9.3.2. UAE Integrated Passive Devices Market Outlook
      • 9.3.2.1. Market Size & Forecast
        • 9.3.2.1.1. By Value
      • 9.3.2.2. Market Share & Forecast
        • 9.3.2.2.1. By Application
        • 9.3.2.2.2. By End-use
    • 9.3.3. South Africa Integrated Passive Devices Market Outlook
      • 9.3.3.1. Market Size & Forecast
        • 9.3.3.1.1. By Value
      • 9.3.3.2. Market Share & Forecast
        • 9.3.3.2.1. By Application
        • 9.3.3.2.2. By End-use

10. South America Integrated Passive Devices Market Outlook

  • 10.1. Market Size & Forecast
    • 10.1.1. By Value
  • 10.2. Market Share & Forecast
    • 10.2.1. By Application
    • 10.2.2. By End-use
    • 10.2.3. By Country
  • 10.3. South America: Country Analysis
    • 10.3.1. Brazil Integrated Passive Devices Market Outlook
      • 10.3.1.1. Market Size & Forecast
        • 10.3.1.1.1. By Value
      • 10.3.1.2. Market Share & Forecast
        • 10.3.1.2.1. By Application
        • 10.3.1.2.2. By End-use
    • 10.3.2. Colombia Integrated Passive Devices Market Outlook
      • 10.3.2.1. Market Size & Forecast
        • 10.3.2.1.1. By Value
      • 10.3.2.2. Market Share & Forecast
        • 10.3.2.2.1. By Application
        • 10.3.2.2.2. By End-use
    • 10.3.3. Argentina Integrated Passive Devices Market Outlook
      • 10.3.3.1. Market Size & Forecast
        • 10.3.3.1.1. By Value
      • 10.3.3.2. Market Share & Forecast
        • 10.3.3.2.1. By Application
        • 10.3.3.2.2. By End-use

11. Market Dynamics

  • 11.1. Drivers
  • 11.2. Challenges

12. Market Trends & Developments

  • 12.1. Merger & Acquisition (If Any)
  • 12.2. Product Launches (If Any)
  • 12.3. Recent Developments

13. Global Integrated Passive Devices Market: SWOT Analysis

14. Porter's Five Forces Analysis

  • 14.1. Competition in the Industry
  • 14.2. Potential of New Entrants
  • 14.3. Power of Suppliers
  • 14.4. Power of Customers
  • 14.5. Threat of Substitute Products

15. Competitive Landscape

  • 15.1. Murata Manufacturing Co., Ltd.
    • 15.1.1. Business Overview
    • 15.1.2. Products & Services
    • 15.1.3. Recent Developments
    • 15.1.4. Key Personnel
    • 15.1.5. SWOT Analysis
  • 15.2. Infineon Technologies AG
  • 15.3. STMicroelectronics N.V.
  • 15.4. ON Semiconductor Corporation
  • 15.5. Broadcom Inc.
  • 15.6. NXP Semiconductors N.V.
  • 15.7. Texas Instruments Incorporated
  • 15.8. Qorvo, Inc.
  • 15.9. MACOM Technology Solutions Holdings Inc.
  • 15.10. CTS Corporation

16. Strategic Recommendations

17. About Us & Disclaimer