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半導體生產設備半導體製造設備

市場調查報告書

商品編碼

2037300

晶圓製造設備市場：預測（至2034年）－按設備類型、晶圓尺寸、製程技術節點、應用和地區分類的全球分析

Wafer Fab Equipment Market Forecasts to 2034 - Global Analysis By Equipment Type, Wafer Size, Process Technology Node, Application and By Geography

出版日期: 2026年05月11日 | 出版商:

Stratistics Market Research Consulting | 英文 | 商品交期: 2-3個工作天內

價格

簡介目錄圖表

根據 Stratistics MRC 的數據，預計到 2026 年，全球晶圓製造設備市場規模將達到 1,008 億美元，並在預測期內以 8.0% 的複合年成長率成長，到 2034 年將達到 1,865 億美元。

晶圓製造設備是指半導體製造中用於在矽晶圓上形成積體電路的先進系統。這包括微影術、蝕刻、薄膜沉積、離子布植和晶圓清洗等工藝，能夠精確地形成複雜的電子結構。這些設備對於製造用於電腦、汽車和通訊技術的高性能晶片至關重要。製造技術的不斷進步提高了效率、良率和精度，同時減少了缺陷。這增強了半導體供應鏈，並在全球工業進步和創新浪潮的推動下，加速了整個全球電子製造業的創新。

根據 SEMI（國際半導體設備與材料協會）的數據，全球超過 1400 家前端工廠的晶圓製造活動受到追蹤，並提供有關晶圓製造廠投資、建設、產能、產品類型、技術節點和晶圓尺寸轉變的詳細數據。

對先進半導體元件的需求不斷成長

對先進半導體元件的強勁需求是晶圓製造設備市場的主要驅動力。智慧型手機、電腦、消費性電子設備和資料中心的快速發展，推動了對高效能小型晶片的需求成長。人工智慧、物聯網 (IoT)、5G 網路和雲端服務等新興技術進一步促進了晶片消費。這迫使半導體製造商投資先進的製造設備，以提高精度和小型化程度。隨著晶片設計日益複雜，晶圓製造設備對於實現更高的性能、多層架構和能源效率至關重要，最終將支撐全球半導體製造及相關產業技術生態系統的持續發展。

需要極高的資金投入。

晶圓製造設備市場的主要阻礙因素是半導體製造工廠建造成本極高。微影術、蝕刻和沈積系統等先進設備需要大量的資本投入，每台設備的成本通常高達數百萬美元。此外，工廠建設還涉及昂貴的潔淨室環境、基礎設施建設以及持續的技術升級。這些資金壁壘使得中小企業難以進入該行業。漫長的投資回收期和巨額的初始成本抑制了新的投資，導致儘管現代工業的電子、汽車和電信行業對半導體的全球需求快速成長，但晶圓製造設備市場成長緩慢。

半導體製造技術的進步

半導體製造技術的不斷進步為晶圓製造設備市場創造了巨大的機會。諸如極紫外光刻、3D晶片堆疊和奈米級製造等創新技術，使得生產更小、更快、更有效率的晶片成為可能。這些先進製程需要高度精密的製造設備，從而推動了對新設備的持續投資。半導體製造商正在升級其生產設施，以提高精度、良率和性能。這一趨勢為設備供應商提供了絕佳的機會，使其能夠開發尖端解決方案，並支援全球半導體生產系統的演進。

地緣政治高度緊張與貿易限制

政治緊張局勢和國際貿易壁壘對晶圓製造設備市場構成重大威脅。半導體生產依賴涉及多個國家的全球互聯供應鏈。國家間衝突、出口限制和貿易壁壘會阻礙關鍵材料和先進製造設備的供應。主要經濟體之間技術共用的限制進一步阻礙了市場擴張。這些問題會導致生產延誤、成本增加和營運不確定性。在全球政治持續動盪的背景下，供應鏈的可靠性以及整個半導體產業生態系統仍然面臨風險。

新型冠狀病毒（COVID-19）的影響：

新冠疫情為晶圓製造設備市場帶來了挑戰與機會。疫情初期，全球封鎖、製造業停工和供應鏈中斷導致半導體生產和設備出貨延遲。旅行限制也影響了安裝服務和技術支援，造成正在進行的專案延期。另一方面，疫情加速了數位化進程，增加了對電子產品、雲端運算和資料中心基礎設施的需求。這反過來又促進了半導體消費，並鼓勵對製造設施進行長期投資。世界各國政府優先發展國內晶片生產，並增加了對半導體晶圓廠的資金投入。

在預測期內，微影術系統細分市場預計將佔據最大的市場佔有率。

預計在預測期內，微影術系統領域將佔據最大的市場佔有率，因為它在矽晶圓上的電路形成過程中發揮著至關重要的作用。這些系統能夠將複雜的晶片設計精確地投射到半導體表面，從而實現高清晰度、高整合度整合電路的製造。隨著半導體小型化的發展，對先進微影術技術的需求持續激增。光刻製程是晶圓製造中最先進、成本最高的環節，也是高性能晶片生產的關鍵。光刻技術的不斷進步進一步提升了其重要性，鞏固了主導地位，並強化了其在全球設備市場的主導地位。

在預測期內，記憶體產業預計將呈現最高的複合年成長率。

在預測期內，受先進資料儲存技術需求不斷成長的推動，記憶體領域預計將呈現最高的成長率。雲端平台、人工智慧 (AI) 應用、智慧型手機和大型資料中心的擴張，顯著提升了 DRAM 和NAND快閃記憶體晶片的產量。這些組件需要先進的製造流程和定期的技術升級，從而提高了設備的利用率。此外，連網設備和數位生態系統產生的全球資料量激增，也進一步加劇了儲存需求。

市佔率最大的地區：

在預測期內，亞太地區預計將佔據最大的市場佔有率，這主要得益於其高度發展的半導體製造基地。中國、台灣、韓國和日本等主要國家和地區擁有先進的製造工廠和大型記憶體製造商，在全球晶片生產中發揮至關重要的作用。強力的政府主導舉措、對半導體基礎設施的大量投資以及完善的供應鏈，都鞏固了該地區的領先地位。大量運作中中的晶圓廠確保了對晶圓製造設備的穩定需求。此外，半導體在電子、汽車系統和電信技術領域的日益普及也推動了消費成長。

複合年成長率最高的地區：

在預測期內，北美預計將呈現最高的複合年成長率，這主要得益於當地半導體生產投資的增加。美國正積極透過政府主導的各項措施來增強其晶片製造能力，旨在減少對海外供應商的依賴。人工智慧、高效能運算 (HPC) 和汽車電子等先進技術的日益普及，進一步推動了設備需求。此外，政府為促進半導體自給自足而訂定的利多政策和獎勵，正在刺激該地區製造基礎設施的快速發展，並推動市場擴張。

免費客製化服務：

訂閱本報告的用戶可享有以下免費自訂選項之一：

公司簡介
- 對其他公司（最多 3 家公司）進行全面分析
- 對主要公司進行SWOT分析（最多3家公司）
區域分類
- 根據客戶興趣量身定做的主要國家/地區的市場估算、預測和複合年成長率（註：基於可行性檢查）
競爭性標竿分析
- 根據產品系列、地理覆蓋範圍和策略聯盟對領先公司進行基準分析。

北美洲
- 美國
- 加拿大
- 墨西哥
歐洲
- 英國
- 德國
- 法國
- 義大利
- 西班牙
- 荷蘭
- 比利時
- 瑞典
- 瑞士
- 波蘭
- 其他歐洲國家
亞太地區
- 中國
- 日本
- 印度
- 韓國
- 澳洲
- 印尼
- 泰國
- 馬來西亞
- 新加坡
- 越南
- 其他亞太國家
南美洲
- 巴西
- 阿根廷
- 哥倫比亞
- 智利
- 秘魯
- 其他南美國家
其他地區（RoW）
- 中東
  - 沙烏地阿拉伯
  - 阿拉伯聯合大公國
  - 卡達
  - 以色列
  - 其他中東國家
- 非洲
  - 南非
  - 埃及
  - 摩洛哥
  - 其他非洲國家

第10章戰略市場資訊

產業加值網路與供應鏈評估
空白區域和機會地圖
產品演進與市場生命週期分析
通路、經銷商和打入市場策略的評估

第11章產業趨勢與策略舉措

企業合併（M&A）
夥伴關係、聯盟和合資企業
新產品發布和認證
擴大生產能力和投資
其他策略舉措

第12章：公司簡介

Applied Materials Inc.
ASML Holding NV
Lam Research Corporation
Tokyo Electron Ltd.
KLA Corporation
SCREEN Holdings Co. Ltd.
Hitachi Ltd.
Advantest Corporation
Nikon Corporation
Ebara Corporation
ASM International NV
Teradyne Inc.
ULVAC Inc.
SUSS MicroTec SE
EV Group
Veeco Instruments Inc.
Canon Inc.
Advanced Micro-Fabrication Equipment Inc.

簡介目錄圖表

Product Code: SMRC35712

According to Stratistics MRC, the Global Wafer Fab Equipment Market is accounted for $100.8 billion in 2026 and is expected to reach $186.5 billion by 2034 growing at a CAGR of 8.0% during the forecast period. Wafer Fab Equipment describes sophisticated systems utilized in semiconductor production to build integrated circuits on silicon wafers. It covers processes such as lithography, etching, thin-film deposition, ion implantation, and wafer cleaning, enabling accurate creation of microscopic electronic structures. These machines are critical for manufacturing high-performance chips used in computing, automotive, and communication technologies. Ongoing advancements in fabrication technology improve efficiency, yield, and precision while reducing defects, strengthening the semiconductor supply chain and accelerating innovation across global electronics manufacturing industries driven by worldwide industrial progress and innovation surge.

According to SEMI (Semiconductor Equipment and Materials International), global wafer fab activity is tracked across more than 1,400 front-end facilities, with detailed data on fab spending, construction, production capacity, product type, technology node, and wafer size transitions.

Market Dynamics:

Driver:

Rising demand for advanced semiconductor devices

Strong growth in demand for sophisticated semiconductor components is significantly driving the Wafer Fab Equipment market. Expansion of smartphones, computers, consumer devices, and data centers is increasing the requirement for powerful and compact chips. Emerging technologies like artificial intelligence, Internet of Things, 5G networks, and cloud services are further elevating chip consumption. This compels semiconductor producers to adopt advanced fabrication machinery for enhanced precision and scaling. As chip designs become more complex, wafer fabrication tools are critical for enabling improved performance, layered architectures, and energy efficiency, ultimately supporting continuous growth in global semiconductor manufacturing and related industrial technology ecosystems worldwide.

Restraint:

Extremely high capital investment requirements

A key limitation of the Wafer Fab Equipment market is the very high cost associated with establishing semiconductor manufacturing facilities. Advanced tools like lithography, etching, and deposition systems require substantial financial investment, often running into millions per machine. Moreover, constructing fabrication plants involves expensive cleanroom environments, infrastructure development, and continuous technological upgrades. These financial barriers make it difficult for smaller firms to enter the industry. The long payback period and heavy upfront expenditure discourage new investments, thereby slowing market growth even though semiconductor demand is increasing rapidly across electronics, automotive, and communication sectors worldwide in modern industries.

Opportunity:

Technological advancements in semiconductor fabrication

Ongoing advancements in semiconductor fabrication technology create significant opportunities for the Wafer Fab Equipment market. Innovations such as EUV lithography, 3D chip stacking, and nanoscale manufacturing techniques are enabling production of smaller, faster, and more efficient chips. These advanced processes require highly sophisticated fabrication equipment, driving continuous investment in new tools. Semiconductor manufacturers are upgrading production facilities to enhance accuracy, yield, and performance. This trend provides strong opportunities for equipment suppliers to develop cutting-edge solutions and support the evolution of global semiconductor production systems.

Threat:

High geopolitical tensions and trade restrictions

Political tensions and international trade barriers are a major threat to the Wafer Fab Equipment market. Semiconductor production depends on a globally connected supply chain involving multiple countries. Conflicts between nations, export regulations, and trade restrictions can interrupt the availability of critical materials and advanced manufacturing tools. Limitations on technology sharing between leading economies further restrict market expansion. These issues lead to production delays, increased costs, and uncertainty in operations. As global political instability persists, it continues to pose risks to supply chain reliability and the overall semiconductor industry ecosystem.

Covid-19 Impact:

The COVID-19 outbreak created both challenges and opportunities for the Wafer Fab Equipment market. During the early stages, global lockdowns, manufacturing halts, and disrupted supply chains caused delays in semiconductor production and equipment shipments. Restrictions on movement also impacted installation services and technical support, slowing down ongoing projects. On the positive side, the pandemic accelerated digital adoption, increasing demand for electronics, cloud computing, and data center infrastructure. This led to higher semiconductor consumption and long-term investments in fabrication facilities. Governments emphasized local chip production, boosting funding for semiconductor fabs.

The lithography systems segment is expected to be the largest during the forecast period

The lithography systems segment is expected to account for the largest market share during the forecast period because they play a crucial role in patterning circuits on silicon wafers. These systems accurately project complex chip designs onto semiconductor surfaces, enabling the creation of highly detailed and compact integrated circuits. With ongoing semiconductor miniaturization, the need for advanced lithography technology continues to rise sharply. This process is the most sophisticated and cost-intensive stage in wafer fabrication, making it vital for producing high-performance chips. Continuous technological improvements in lithography methods further enhance its importance, ensuring its leading position across semiconductor manufacturing and reinforcing its dominance in the global equipment market.

The memory segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the memory segment is predicted to witness the highest growth rate, driven by rising demand for advanced data storage technologies. Expansion of cloud platforms, artificial intelligence applications, smart phones, and large-scale data centers is significantly increasing the production of DRAM and NAND flash memory chips. These components require highly advanced manufacturing processes and regular technological upgrades, boosting equipment usage. In addition, the rapid increase in global data creation from connected devices and digital ecosystems is strengthening storage needs.

Region with largest share:

During the forecast period, the Asia-Pacific region is expected to hold the largest market share due to its highly developed semiconductor manufacturing base. Key countries like China, Taiwan, South Korea, and Japan play a major role in global chip production, hosting advanced fabrication plants and leading memory producers. Strong government initiatives, significant investments in semiconductor infrastructure, and well-established supply chains support regional dominance. The high number of operational fabs ensures steady demand for wafer fabrication tools. Moreover, increasing use of electronics, automotive systems, and communication technologies boosts semiconductor consumption.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR driven by increasing investment in local semiconductor production. The United States is actively enhancing its chip manufacturing capacity through government-backed initiatives designed to reduce reliance on foreign suppliers. Rising adoption of advanced technologies such as artificial intelligence, high-performance computing, and automotive electronics is further boosting equipment demand. In addition, favorable government policies and incentives promoting semiconductor independence are encouraging rapid growth in fabrication infrastructure and strengthening the region's market expansion.

Key players in the market

Some of the key players in Wafer Fab Equipment Market include Applied Materials Inc., ASML Holding N.V., Lam Research Corporation, Tokyo Electron Ltd., KLA Corporation, SCREEN Holdings Co. Ltd., Hitachi Ltd., Advantest Corporation, Nikon Corporation, Ebara Corporation, ASM International N.V., Teradyne Inc., ULVAC Inc., SUSS MicroTec SE, EV Group, Veeco Instruments Inc., Canon Inc. and Advanced Micro-Fabrication Equipment Inc.

Key Developments:

In April 2026, Canon Inc. and Ross Video announced a partnership to deliver broadcast-grade PTZ camera solutions for modern live production environments. Through this collaboration, Canon's professional PTZ cameras-the Canon CR-N700 and CR-N500-can be deployed alongside Ross Video's production workflows, robotics, and automation platforms, enabling broadcasters and live production teams to incorporate high-quality PTZ cameras into their workflows.

In November 2024, Nikon Corporation (Nikon) and the European Molecular Biology Laboratory have announced the formation of a new technological development partnership. This partnership will accelerate the development of next-generation microscopy technologies that provide solutions to the complex challenges faced by the global research community.

Equipment Types Covered:

Lithography Systems
Etching Equipment
Deposition Equipment
Chemical Mechanical Planarization (CMP) Tools
Wafer Cleaning Equipment
Metrology & Inspection Systems

Wafer Sizes Covered:

200mm Wafers
300mm Wafers
>300mm Wafers

Process Technology Nodes Covered:

Legacy Nodes (>28nm)
Mid Nodes (10-28nm)
Advanced Nodes (<10nm)

Applications Covered:

Logic ICs
Memory
Foundry Services
Analog & Mixed Signal Devices
Power Devices

Regions Covered:

North America
- United States
- Canada
- Mexico
Europe
- United Kingdom
- Germany
- France
- Italy
- Spain
- Netherlands
- Belgium
- Sweden
- Switzerland
- Poland
- Rest of Europe
Asia Pacific
- China
- Japan
- India
- South Korea
- Australia
- Indonesia
- Thailand
- Malaysia
- Singapore
- Vietnam
- Rest of Asia Pacific
South America
- Brazil
- Argentina
- Colombia
- Chile
- Peru
- Rest of South America
Rest of the World (RoW)
- Middle East
Saudi Arabia
United Arab Emirates
Qatar
Israel
Rest of Middle East
- Africa
South Africa
Egypt
Morocco
Rest of Africa

What our report offers:

Market share assessments for the regional and country-level segments
Strategic recommendations for the new entrants
Covers Market data for the years 2023, 2024, 2025, 2026, 2027, 2028, 2030, 2032 and 2034
Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
Strategic recommendations in key business segments based on the market estimations
Competitive landscaping mapping the key common trends
Company profiling with detailed strategies, financials, and recent developments
Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

Company Profiling
- Comprehensive profiling of additional market players (up to 3)
- SWOT Analysis of key players (up to 3)
Regional Segmentation
- Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
Competitive Benchmarking
- Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

1 Executive Summary

1.1 Market Snapshot and Key Highlights
1.2 Growth Drivers, Challenges, and Opportunities
1.3 Competitive Landscape Overview
1.4 Strategic Insights and Recommendations

2 Research Framework

2.1 Study Objectives and Scope
2.2 Stakeholder Analysis
2.3 Research Assumptions and Limitations
2.4 Research Methodology
- 2.4.1 Data Collection (Primary and Secondary)
- 2.4.2 Data Modeling and Estimation Techniques
- 2.4.3 Data Validation and Triangulation
- 2.4.4 Analytical and Forecasting Approach

3 Market Dynamics and Trend Analysis

3.1 Market Definition and Structure
3.2 Key Market Drivers
3.3 Market Restraints and Challenges
3.4 Growth Opportunities and Investment Hotspots
3.5 Industry Threats and Risk Assessment
3.6 Technology and Innovation Landscape
3.7 Emerging and High-Growth Markets
3.8 Regulatory and Policy Environment
3.9 Impact of COVID-19 and Recovery Outlook

4 Competitive and Strategic Assessment

4.1 Porter's Five Forces Analysis
- 4.1.1 Supplier Bargaining Power
- 4.1.2 Buyer Bargaining Power
- 4.1.3 Threat of Substitutes
- 4.1.4 Threat of New Entrants
- 4.1.5 Competitive Rivalry
4.2 Market Share Analysis of Key Players
4.3 Product Benchmarking and Performance Comparison

5 Global Wafer Fab Equipment Market, By Equipment Type

5.1 Lithography Systems
5.2 Etching Equipment
5.3 Deposition Equipment
5.4 Chemical Mechanical Planarization (CMP) Tools
5.5 Wafer Cleaning Equipment
5.6 Metrology & Inspection Systems

6 Global Wafer Fab Equipment Market, By Wafer Size

6.1 200mm Wafers
6.2 300mm Wafers
6.3 >300mm Wafers

7 Global Wafer Fab Equipment Market, By Process Technology Node

7.1 Legacy Nodes (>28nm)
7.2 Mid Nodes (10-28nm)
7.3 Advanced Nodes (<10nm)

8 Global Wafer Fab Equipment Market, By Application

8.1 Logic ICs
8.2 Memory
8.3 Foundry Services
8.4 Analog & Mixed Signal Devices
8.5 Power Devices

9 Global Wafer Fab Equipment Market, By Geography

9.1 North America
- 9.1.1 United States
- 9.1.2 Canada
- 9.1.3 Mexico
9.2 Europe
- 9.2.1 United Kingdom
- 9.2.2 Germany
- 9.2.3 France
- 9.2.4 Italy
- 9.2.5 Spain
- 9.2.6 Netherlands
- 9.2.7 Belgium
- 9.2.8 Sweden
- 9.2.9 Switzerland
- 9.2.10 Poland
- 9.2.11 Rest of Europe
9.3 Asia Pacific
- 9.3.1 China
- 9.3.2 Japan
- 9.3.3 India
- 9.3.4 South Korea
- 9.3.5 Australia
- 9.3.6 Indonesia
- 9.3.7 Thailand
- 9.3.8 Malaysia
- 9.3.9 Singapore
- 9.3.10 Vietnam
- 9.3.11 Rest of Asia Pacific
9.4 South America
- 9.4.1 Brazil
- 9.4.2 Argentina
- 9.4.3 Colombia
- 9.4.4 Chile
- 9.4.5 Peru
- 9.4.6 Rest of South America
9.5 Rest of the World (RoW)
- 9.5.1 Middle East
  - 9.5.1.1 Saudi Arabia
  - 9.5.1.2 United Arab Emirates
  - 9.5.1.3 Qatar
  - 9.5.1.4 Israel
  - 9.5.1.5 Rest of Middle East
- 9.5.2 Africa
  - 9.5.2.1 South Africa
  - 9.5.2.2 Egypt
  - 9.5.2.3 Morocco
  - 9.5.2.4 Rest of Africa

10 Strategic Market Intelligence

10.1 Industry Value Network and Supply Chain Assessment
10.2 White-Space and Opportunity Mapping
10.3 Product Evolution and Market Life Cycle Analysis
10.4 Channel, Distributor, and Go-to-Market Assessment

11 Industry Developments and Strategic Initiatives

11.1 Mergers and Acquisitions
11.2 Partnerships, Alliances, and Joint Ventures
11.3 New Product Launches and Certifications
11.4 Capacity Expansion and Investments
11.5 Other Strategic Initiatives

12 Company Profiles

12.1 Applied Materials Inc.
12.2 ASML Holding N.V.
12.3 Lam Research Corporation
12.4 Tokyo Electron Ltd.
12.5 KLA Corporation
12.6 SCREEN Holdings Co. Ltd.
12.7 Hitachi Ltd.
12.8 Advantest Corporation
12.9 Nikon Corporation
12.10 Ebara Corporation
12.11 ASM International N.V.
12.12 Teradyne Inc.
12.13 ULVAC Inc.
12.14 SUSS MicroTec SE
12.15 EV Group
12.16 Veeco Instruments Inc.
12.17 Canon Inc.
12.18 Advanced Micro-Fabrication Equipment Inc.

簡介目錄圖表

List of Tables

Table 1 Global Wafer Fab Equipment Market Outlook, By Region (2023-2034) ($MN)
Table 2 Global Wafer Fab Equipment Market Outlook, By Equipment Type (2023-2034) ($MN)
Table 3 Global Wafer Fab Equipment Market Outlook, By Lithography Systems (2023-2034) ($MN)
Table 4 Global Wafer Fab Equipment Market Outlook, By Etching Equipment (2023-2034) ($MN)
Table 5 Global Wafer Fab Equipment Market Outlook, By Deposition Equipment (2023-2034) ($MN)
Table 6 Global Wafer Fab Equipment Market Outlook, By Chemical Mechanical Planarization (CMP) Tools (2023-2034) ($MN)
Table 7 Global Wafer Fab Equipment Market Outlook, By Wafer Cleaning Equipment (2023-2034) ($MN)
Table 8 Global Wafer Fab Equipment Market Outlook, By Metrology & Inspection Systems (2023-2034) ($MN)
Table 9 Global Wafer Fab Equipment Market Outlook, By Wafer Size (2023-2034) ($MN)
Table 10 Global Wafer Fab Equipment Market Outlook, By 200mm Wafers (2023-2034) ($MN)
Table 11 Global Wafer Fab Equipment Market Outlook, By 300mm Wafers (2023-2034) ($MN)
Table 12 Global Wafer Fab Equipment Market Outlook, By >300mm Wafers (2023-2034) ($MN)
Table 13 Global Wafer Fab Equipment Market Outlook, By Process Technology Node (2023-2034) ($MN)
Table 14 Global Wafer Fab Equipment Market Outlook, By Legacy Nodes (>28nm) (2023-2034) ($MN)
Table 15 Global Wafer Fab Equipment Market Outlook, By Mid Nodes (10-28nm) (2023-2034) ($MN)
Table 16 Global Wafer Fab Equipment Market Outlook, By Advanced Nodes (<10nm) (2023-2034) ($MN)
Table 17 Global Wafer Fab Equipment Market Outlook, By Application (2023-2034) ($MN)
Table 18 Global Wafer Fab Equipment Market Outlook, By Logic ICs (2023-2034) ($MN)
Table 19 Global Wafer Fab Equipment Market Outlook, By Memory (2023-2034) ($MN)
Table 20 Global Wafer Fab Equipment Market Outlook, By Foundry Services (2023-2034) ($MN)
Table 21 Global Wafer Fab Equipment Market Outlook, By Analog & Mixed Signal Devices (2023-2034) ($MN)
Table 22 Global Wafer Fab Equipment Market Outlook, By Power Devices (2023-2034) ($MN)