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市場調查報告書
商品編碼
2007838
光子整合運算市場預測至2034年-全球分析(按整合類型、組件、材料平台、運算架構、波長範圍、應用、最終用戶和地區分類)Photonic Integrated Computing Market Forecasts to 2034 - Global Analysis By Integration Type, Component, Material Platform, Computing Architecture, Wavelength Range, Application, End User, and By Geography |
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根據 Stratistics MRC 的數據,預計到 2026 年,全球光子整合計算市場規模將達到 13 億美元,並在預測期內以 21.5% 的複合年成長率成長,到 2034 年將達到 63 億美元。
光子整合運算利用光而非電子進行資料處理和傳輸,與傳統電子設備相比,可實現超高頻寬、低延遲和顯著的節能效果。這些系統將雷射、調製器和檢測器等光學元件整合到單一晶片上,實現高速資料通訊、高級感測和人工智慧加速器等應用。隨著資料中心需求、自主系統和下一代運算架構對光學解決方案的依賴性日益增強,預計該市場將快速擴張。
人工智慧和資料中心對頻寬的需求激增
人工智慧 (AI) 工作負載和超大規模資料中心的爆炸性成長,迫切需要速度更快、能源效率更高的互連技術,而傳統的銅基解決方案已無法滿足這一需求。光子積體電路能夠以極低的功耗實現Terabit特級的資料傳輸,直接解決了運算密集型環境中的瓶頸問題。隨著 AI 模型規模每隔幾個月就加倍,光 I/O 的經濟和技術優勢顯而易見,正加速其在全球雲端服務供應商、半導體製造商和高效能運算設施中的應用。
製造流程的複雜性和高成本
光子積體電路的製造需要專門的代工廠、化合物半導體材料和精密封裝技術,這些高成本標準CMOS電子元件。缺乏標準化的設計工具和製程設計套件(PDK)進一步增加了開發成本,延長了新產品的上市時間。雷射和矽光電混合整合帶來的產量比率挑戰也增加了成本,這限制了資金雄厚的成熟企業的准入,同時也延緩了小規模創新者本可以加速市場多元化。
與CMOS電子元件在共封裝光學元件中的整合
將光電與傳統CMOS電子技術融合到共封裝光學元件中,為克服成本和複雜性障礙提供了突破性的機會。透過在同一基板上直接整合光引擎和開關矽,製造商可以利用現有的半導體基礎設施,簡化封裝、提高能源效率並實現規模經濟。領先的晶片製造商正在大力投資於此,從而為開發具有成本競爭力的光子運算解決方案鋪平了道路,這些解決方案可部署在主流伺服器架構、通訊設備和邊緣運算節點中。
與先進電子互連技術的競爭
低壓差分訊號傳輸和銅基主動主動電纜等電訊號傳輸技術的持續創新,可能會縮小目前光子解決方案所擁有的性能優勢。近封裝光學元件和先進均衡技術等新興技術,使得以往使用電鏈路的光技術能夠實現更遠的傳輸距離和更高的資料傳輸速度。如果這些電子替代方案能夠在保持成本和整合優勢的同時,提供足夠的效能提升,那麼光子整合運算的普及速度可能會放緩,尤其是在對成本較為敏感的市場領域。
疫情加速了數位轉型,增加了對雲端服務、串流媒體和遠端協作的需求。這進一步加劇了資料中心頻寬和電力預算的壓力。儘管供應鏈中斷暫時阻礙了光元件的供應,但整體影響是正面的。企業和超大規模資料中心業者加快了基礎設施升級,優先考慮光連接模組。此次危機也凸顯了彈性低延遲網路的重要性,並促使企業做出長期投資承諾,這將持續支撐光整合運算市場的發展動能。
預計在預測期內,混合整合細分市場將成為最大的細分市場。
預計在預測期內,混合整合領域將成為最大的細分市場。混合整合利用成熟的製造程序,結合不同材料平台(例如用於發光的III-V族半導體和用於被動電路的矽)的優異特性,從而實現高性能。這種方法允許在組裝前對雷射、調製器和檢測器進行單獨最佳化,與單晶片整合方法相比,可獲得更高的光學效率和可靠性。其柔軟性支援快速原型製作和異質系統設計,使得混合整合成為通訊、資料中心和新興運算應用中複雜光子積體電路的理想選擇。
在預測期內,光連接模組產業預計將呈現最高的複合年成長率。
預計在預測期內,光連接模組領域將呈現最高的成長率。光連接模組以高速光子連接取代晶片、基板和系統之間傳統的電連接,從而顯著提高頻寬密度和能源效率。隨著運算節點日益分散化和記憶體池不斷擴展,對超低延遲、可擴展互連解決方案的需求呈指數級成長。光子互連支援晶片級處理器和機架級運算等架構,這些架構對於人工智慧叢集和高效能運算至關重要。光互連在下一代系統設計中發揮的關鍵作用,正推動其顯著的成長動能。
在整個預測期內,北美預計將保持最大的市場佔有率,這主要得益於大型科技公司和領先的半導體代工廠的存在,以及政府對研發的大力投入。美國擁有密集的微光子積體電路Start-Ups生態系統、成熟的無晶圓廠設計公司以及超大規模資料中心營運商,這些企業都是光連接模組解決方案的早期採用者。在國家光電計畫等項目的支持下,舉措合作將加速商業化進程,並在整個預測期內保持該地區的技術領先地位。
在預測期內,亞太地區預計將呈現最高的複合年成長率,這主要得益於半導體製造基礎設施的大規模投資以及中國、日本和韓國資料中心的快速擴張。政府主導的旨在實現先進封裝和光電自給自足的舉措,加上該地區在家用電子電器和通訊設備領域的領先地位,正在為技術應用創造有利環境。隨著國內雲端服務供應商不斷提升其人工智慧能力,對光子整合運算解決方案的需求將加速成長,成長速度將超過其他地區。
According to Stratistics MRC, the Global Photonic Integrated Computing Market is accounted for $1.3 billion in 2026 and is expected to reach $6.3 billion by 2034 growing at a CAGR of 21.5% during the forecast period. Photonic integrated computing leverages light rather than electrons to process and transmit data, delivering ultra-high bandwidth, low latency, and dramatically reduced energy consumption compared to conventional electronics. These systems integrate optical components such as lasers, modulators, and detectors onto a single chip, enabling high-speed data communication, advanced sensing, and AI accelerator applications. The market is poised for rapid expansion as data-center demands, autonomous systems, and next-generation computing architectures increasingly rely on photonic solutions.
Soaring bandwidth demands from AI and data centers
The explosive growth of artificial intelligence workloads and hyperscale data centers is creating an urgent need for faster, more energy-efficient interconnects that traditional copper-based solutions cannot satisfy. Photonic integrated circuits enable terabit-scale data movement with a fraction of the power, directly addressing the bottleneck in compute-intensive environments. As AI model sizes double every few months, the economic and technical advantages of optical I/O become impossible to ignore, driving widespread adoption across cloud providers, semiconductor manufacturers, and high-performance computing facilities globally.
High manufacturing complexity and cost
Fabricating photonic integrated circuits requires specialized foundries, compound semiconductor materials, and precision packaging techniques that remain significantly more expensive than standard CMOS electronics. The lack of standardized design tools and process design kits (PDKs) further raises development costs and extends time-to-market for new products. Yield challenges associated with hybrid integration of lasers with silicon photonics add another layer of expense, limiting accessibility to well-funded incumbents and slowing the entry of smaller innovators who could otherwise accelerate market diversification.
Integration with CMOS electronics for co-packaged optics
The convergence of photonics with traditional CMOS electronics in co-packaged optics presents a transformative opportunity to overcome cost and complexity barriers. By combining optical engines directly with switching silicon on the same substrate, manufacturers can simplify packaging, improve power efficiency, and achieve economies of scale using established semiconductor infrastructure. Major chipmakers are investing heavily in this approach, creating a clear pathway toward cost-competitive photonic computing solutions that can be deployed across mainstream server architectures, telecommunications equipment, and edge computing nodes.
Competition from advanced electronic interconnects
Continuous innovation in electrical signaling, including low-voltage differential signaling and copper-based active cables, threatens to narrow the performance gap that currently favors photonic solutions. Emerging technologies such as near-package optics and advanced equalization techniques allow electrical links to reach distances and data rates previously thought impossible without optics. If these electronic alternatives deliver sufficient performance improvements while maintaining cost and integration advantages, they could delay the widespread adoption of photonic integrated computing, particularly in cost-sensitive market segments.
The pandemic accelerated digital transformation, intensifying demand for cloud services, streaming, and remote collaboration, which in turn increased pressure on data-center bandwidth and power budgets. Supply chain disruptions temporarily hampered photonic component availability, but the overall effect was a net positive: enterprises and hyperscalers fast-tracked infrastructure upgrades that favor optical interconnects. The crisis also underscored the importance of resilient, low-latency networks, prompting long-term investment commitments that continue to support photonic integrated computing market momentum.
The Hybrid Integration segment is expected to be the largest during the forecast period
The hybrid integration segment is anticpated to be the largest during the forecast period. Hybrid integration combines the best attributes of different material platforms such as III-V semiconductors for light generation and silicon for passive circuitry enabling high performance while leveraging established manufacturing processes. This approach allows lasers, modulators, and detectors to be optimized independently before assembly, yielding superior optical efficiency and reliability compared to monolithic alternatives. Its flexibility supports rapid prototyping and heterogeneous system design, making hybrid integration the preferred choice for complex photonic integrated circuits across telecommunications, data centers, and emerging computing applications.
The Optical Interconnects segment is expected to have the highest CAGR during the forecast period
The optical interconnects segment is estimated to have the highest growth rate during the forecast period. Optical interconnects replace traditional electrical links with high-speed photonic connections between chips, boards, and systems, delivering dramatic improvements in bandwidth density and energy efficiency. As compute nodes become more disaggregated and memory pools expand, the need for ultra-low-latency, scalable interconnect solutions grows exponentially. Photonic interconnects enable architectures such as chiplet-based processors and rack-scale computing, which are critical for AI clusters and high-performance computing. This foundational role in next-generation system design underpins its exceptional growth trajectory.
During the forecast period, the North America region is expected to hold the largest market share, driven by the presence of major technology companies, leading semiconductor foundries, and robust government research funding. The United States hosts a dense ecosystem of photonic integrated circuit startups, established fabless design houses, and hyperscale data-center operators who are early adopters of optical interconnect solutions. Collaborative initiatives between industry and academia, supported by programs like the National Photonics Initiative, accelerate commercialization and maintain the region's technological lead throughout the forecast period.
Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR, fueled by massive investments in semiconductor manufacturing infrastructure and the rapid expansion of data centers across China, Japan, and South Korea. Government-backed initiatives to achieve self-sufficiency in advanced packaging and photonics, combined with the region's dominance in consumer electronics and telecommunications equipment, create a fertile environment for adoption. As domestic cloud service providers scale their AI capabilities, demand for photonic integrated computing solutions will grow at an accelerated pace, outpacing other regions.
Key players in the market
Some of the key players in Photonic Integrated Computing Market include Intel Corporation, IBM Corporation, Cisco Systems, Broadcom Inc., NVIDIA Corporation, GlobalFoundries, STMicroelectronics, Infinera Corporation, Lumentum Holdings, Coherent Corporation, Ayar Labs, Lightmatter, Lightelligence, Rockley Photonics, and Marvell Technology.
In March 2026, IBM unveiled a new blueprint for quantum-centric supercomputing, highlighting a reference architecture that integrates quantum processors (QPUs) with traditional GPUs and CPUs. This architecture relies on advanced interconnects and photonic-ready logic scaling to tackle complex scientific simulations.
In March 2026, Cisco expanded its Secure AI Factory collaboration with NVIDIA, focusing on integrated packages that simplify the deployment of photonic-based networking for large-scale enterprise AI infrastructure.
In November 2025, Intel announced a massive expansion of its patent portfolio focused on co-packaged optics (CPO) and glass substrates. The company revealed prototypes of its Optical Compute Interconnect (OCI), which utilizes a Photonic Integrated Circuit (PIC) hybrid-bonded to a glass substrate to achieve higher bandwidth and lower power consumption for future AI CPUs and GPUs.
Note: Tables for North America, Europe, APAC, South America, and Rest of the World (RoW) Regions are also represented in the same manner as above.