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市場調查報告書
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1946000

全球下一代邏輯擴展技術市場：預測（至2034年）－按材料、節點尺寸、技術、應用、最終用戶和地區分類的分析

Next-Gen Logic Scaling Technologies Market Forecasts to 2034 - Global Analysis By Material, Node Size, Technology, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的研究，全球下一代邏輯縮放技術市場預計將在 2026 年達到 1,894 億美元，並在預測期內以 6.4% 的複合年成長率成長，到 2034 年達到 3,126 億美元。

下一代邏輯微縮技術是指突破傳統電晶體小型化極限的先進半導體設計和製造方法，它能夠提升運算效能、效率和整合密度。此技術融合了GAA（環柵）電晶體、奈米片結構、先進微影術和3D堆疊等創新技術，從而實現更小、更快、更節能的邏輯電路。透過克服小型化挑戰，它為高效能運算、人工智慧和資料密集型應用提供了有力支援。下一代微縮技術確保了莫耳定律的持續發展，並推動了晶片功能、能源效率最佳化和系統整合的突破。

對更高性能的持續需求

對更高性能的持續需求是推動下一代邏輯微縮技術市場發展的主要動力。半導體製造商正努力滿足日益成長的計算和處理需求。人工智慧、雲端運算和高效能資料中心等應用需要速度更快、效率更高的邏輯裝置。這一趨勢正在推動先進微縮技術、創新光刻技術和新材料的應用，以提高電晶體密度和性能。對節能、高速運算的持續需求正在促進全球最先進半導體製造工廠的市場成長。

半導體製造成本飆升

在下一代邏輯微縮技術市場中，半導體製造成本飆升是限制其發展的主要因素。這主要是由於先進製程節點的複雜性日益增加。 5奈米以下和3奈米以下的製造程序需要昂貴的微影術設備、精密材料和嚴格的製程控制。不斷上漲的資本和營運成本會限制小規模半導體晶圓廠採用這些技術，並減緩大規模部署的速度。儘管尖端應用對高效能邏輯微縮解決方案的需求強勁，但這些財務障礙正在抑制短期市場成長。

採用3奈米以下技術

隨著製造商們努力突破電晶體小型化的極限，採用3奈米以下製程技術為下一代邏輯微縮技術市場帶來了巨大的機會。這些技術能夠實現更高的電晶體密度、低耗電量和更優異的運算性能。人們對晶片整合、異質架構和節能設計的興趣日益濃厚，正在推動這項技術的應用。隨著半導體公司加大對3奈米以下製程節點的研發、製程開發和試生產投入，對配套工具、材料和先進微縮解決方案的需求預計將迅速成長。

矽物理小型化的極限

隨著電晶體尺寸逼近原子級極限，矽的物理尺寸縮放極限對下一代邏輯微縮技術市場構成了重大威脅。短溝道效應、漏電流和溫度控管限制等挑戰阻礙了進一步的微型化。克服這些限制需要對替代材料、裝置架構或創新微影術技術進行大量投資。如果無法解決這些物理尺寸縮放障礙，可能會阻礙效能提升和應用普及，進而影響下一代邏輯微縮技術的長期發展。

新冠疫情的影響：

新冠感染疾病透過暫時中斷半導體製造、供應鏈延遲和計劃進度延誤，對下一代邏輯微縮技術市場造成了衝擊。設備交付和晶圓生產面臨物流挑戰，減緩了技術普及。然而，在疫情後的復甦階段，對高效能運算、雲端基礎設施和人工智慧應用的需求加速成長，再次凸顯了先進邏輯微縮技術的必要性。這一新的成長動能正在推動市場發展，並凸顯下一代微縮解決方案在半導體創新中的戰略重要性。

在預測期內，先進矽材料細分市場預計將佔據最大的市場佔有率。

由於先進矽材料在實現高性能邏輯裝置發揮至關重要的作用，預計在預測期內，該細分市場將佔據最大的市場佔有率。這些材料具有卓越的電學性能、熱穩定性和與先進微影術刻製程的兼容性。在最先進的製程節點上採用這些材料可確保電晶體密度和裝置可靠性的提升。對矽材料創新和製造支援的持續投入將推動其廣泛應用，從而在預測期內佔據邏輯微縮技術領域最大的市場佔有率。

預計在預測期內，5nm以上的製程將呈現最高的複合年成長率。

在預測期內，5奈米及以上製程製程預計將呈現最高的成長率，這反映了先進製程節點的快速普及。這些製程節點能夠實現更高的電晶體密度、更低的功耗和更強的運算效能。人工智慧處理器、行動裝置和高效能運算系統等領域的廣泛應用將加速市場需求。對微影術技術、材料創新和製程最佳化的持續投入將支撐這一成長，使5奈米以上製程製程成為下一代邏輯微縮技術中成長最快的技術類別。

市佔率最大的地區：

在整個預測期內，亞太地區預計將保持最大的市場佔有率，這得益於其強大的半導體製造生態系統。台灣、韓國、中國大陸和日本等國家和地區位置大型晶圓製造工廠和晶圓代工廠，能夠大規模生產最先進的邏輯晶片。政府支持、策略性投資和持續的技術升級正在加速下一代微縮解決方案的普及應用。基礎設施、政策支援和製造能力的結合將鞏固該地區的市場主導地位，並確保在整個預測期內實現持續的收入成長。

複合年成長率最高的地區：

在預測期內，北美預計將呈現最高的複合年成長率，這主要得益於半導體研發和先進計算基礎設施的大量投資。領先的晶片設計公司、無廠半導體公司以及高效能運算舉措的存在，正在加速下一代擴展解決方案的採用。政府支援、光刻和材料領域的持續創新，以及對人工智慧、雲端運算和邊緣處理應用日益成長的需求，將進一步推動市場成長，使北美在整個預測期內成為成長最快的區域市場。

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訂閱本報告的用戶可享有以下免費自訂選項之一：

  • 公司簡介
    • 對其他公司（最多 3 家公司）進行全面分析
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  • 區域分類
    • 根據客戶興趣量身定做的主要國家/地區的市場估算、預測和複合年成長率（註：基於可行性檢查）
  • 競爭性標竿分析
    • 根據產品系列、地理覆蓋範圍和策略聯盟對主要企業進行基準分析。

目錄

第1章執行摘要

  • 市場概覽及主要亮點
  • 成長要素、挑戰與機遇
  • 競爭格局概述
  • 戰略考慮和建議

第2章：分析框架

  • 分析的目標和範圍
  • 相關人員分析
  • 分析的前提條件與限制
  • 分析方法

第3章 市場動態與趨勢分析

  • 市場定義與結構
  • 主要市場促進因素
  • 市場限制與挑戰
  • 投資成長機會和重點領域
  • 產業威脅與風險評估
  • 科技與創新趨勢
  • 新興市場和高成長市場
  • 監管和政策環境
  • 感染疾病的影響及恢復前景

第4章：競爭環境與策略評估

  • 波特五力分析
    • 供應商議價能力
    • 買方的議價能力
    • 替代產品的威脅
    • 新進入者的威脅
    • 競爭公司之間的競爭
  • 主要企業市佔率分析
  • 產品基準評效和效能比較

第5章：全球下一代邏輯擴展技術市場：按材料分類

  • 高品質矽材料
  • 高介電常數材料
  • 金屬門材料
  • 2D半導體材料
  • 化合物半導體材料

第6章 下一代邏輯擴展技術的全球市場：按節點尺寸分類

  • 5奈米或以上
  • 3nm節點
  • 2nm節點
  • 2nm 下列節點
  • 實驗邏輯節點

第7章 全球新一代邏輯擴展技術市場：依技術分類

  • GAA（全環柵極）電晶體技術
  • 先進的FinFET微縮技術
  • 3D邏輯整合
  • 基於晶片組的擴展
  • 後CMOS邏輯技術

第8章 全球下一代邏輯擴展技術市場：按應用領域分類

  • 高效能運算
  • 人工智慧處理
  • 資料中心處理器
  • 高級家用電子電器
  • 自主系統

第9章：全球下一代邏輯擴展技術市場：按最終用戶分類

  • 半導體晶圓代工廠
  • 整合設備製造商
  • 無晶圓廠晶片公司
  • 研究機構
  • 政府附屬研發機構
  • 其他最終用戶

第10章：全球下一代邏輯擴展技術市場：按地區分類

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 英國
    • 德國
    • 法國
    • 義大利
    • 西班牙
    • 荷蘭
    • 比利時
    • 瑞典
    • 瑞士
    • 波蘭
    • 其他歐洲國家
  • 亞太地區
    • 中國
    • 日本
    • 印度
    • 韓國
    • 澳洲
    • 印尼
    • 泰國
    • 馬來西亞
    • 新加坡
    • 越南
    • 其他亞太地區
  • 南美洲
    • 巴西
    • 阿根廷
    • 哥倫比亞
    • 智利
    • 秘魯
    • 南美洲其他地區
  • 世界其他地區（RoW）
    • 中東
      • 沙烏地阿拉伯
      • 阿拉伯聯合大公國
      • 卡達
      • 以色列
      • 其他中東國家
    • 非洲
      • 南非
      • 埃及
      • 摩洛哥
      • 其他非洲國家

第11章 策略市場資訊

  • 產業加值網路與供應鏈評估
  • 空白區域和機會地圖
  • 產品演進與市場生命週期分析
  • 通路、經銷商和打入市場策略的評估

第12章 產業趨勢與策略舉措

  • 企業合併（M&A）
  • 夥伴關係、聯盟和合資企業
  • 新產品發布和認證
  • 擴大生產能力和投資
  • 其他策略舉措

第13章：公司簡介

  • TSMC
  • Intel
  • Samsung Electronics
  • GlobalFoundries
  • Micron Technology
  • SK Hynix
  • Broadcom
  • Qualcomm
  • NVIDIA
  • AMD
  • ASML
  • Applied Materials
  • Lam Research
  • KLA Corporation
  • Tokyo Electron
  • Cadence Design Systems
  • Synopsys
Product Code: SMRC33771

According to Stratistics MRC, the Global Next-Gen Logic Scaling Technologies Market is accounted for $189.4 billion in 2026 and is expected to reach $312.6 billion by 2034 growing at a CAGR of 6.4% during the forecast period. Next-Gen Logic Scaling Technologies refer to advanced semiconductor design and manufacturing approaches that push beyond traditional transistor scaling limits to enhance computing performance, efficiency, and density. These technologies integrate innovations such as gate-all-around (GAA) transistors, nanosheet architectures, advanced lithography, and 3D stacking to enable smaller, faster, and more power-efficient logic circuits. By overcoming challenges of miniaturization, they support high-performance computing, artificial intelligence, and data-intensive applications. Next-gen scaling ensures continued progress in Moore's Law, driving breakthroughs in chip functionality, energy optimization, and system integration.

Market Dynamics:

Driver:

Continued demand for higher performance

Continued demand for higher performance is a key driver for the Next-Gen Logic Scaling Technologies Market as semiconductor manufacturers strive to meet growing computing and processing requirements. Applications such as AI, cloud computing, and high-performance data centers demand faster, more efficient logic devices. This trend encourages adoption of advanced scaling techniques, innovative lithography, and novel materials to enhance transistor density and performance. Sustained demand for energy-efficient, high-speed computing reinforces market growth across leading-edge semiconductor fabrication facilities worldwide.

Restraint:

Escalating semiconductor fabrication costs

Escalating semiconductor fabrication costs act as a major restraint in the Next-Gen Logic Scaling Technologies Market due to increasing complexity in advanced process nodes. Sub-5 nm and sub-3 nm fabrication requires expensive lithography equipment, precision materials, and stringent process control. Rising capital expenditure and operational costs can limit adoption for smaller semiconductor fabs and slow large-scale deployment. These financial barriers constrain short-term market growth despite strong demand for high-performance logic scaling solutions in leading-edge applications.

Opportunity:

Adoption of sub-3nm technologies

Adoption of sub-3 nm technologies presents a significant opportunity within the Next-Gen Logic Scaling Technologies Market as manufacturers push transistor miniaturization limits. These technologies enable higher transistor density, lower power consumption, and enhanced computing performance. Growing interest in chiplet integration, heterogeneous architectures, and energy-efficient designs supports adoption. As semiconductor companies invest in research, process development, and pilot production for sub-3 nm nodes, demand for supporting tools, materials, and advanced scaling solutions is expected to expand rapidly.

Threat:

Physical scaling limitations of silicon

Physical scaling limitations of silicon pose a notable threat to the Next-Gen Logic Scaling Technologies Market as transistor dimensions approach atomic-scale limits. Challenges such as short-channel effects, leakage currents, and thermal management constraints restrict further miniaturization. Overcoming these limitations requires significant investment in alternative materials, device architectures, or innovative lithography techniques. Failure to address physical scaling barriers may hinder performance improvements and adoption rates, impacting the long-term growth of next-generation logic scaling technologies.

Covid-19 Impact:

The COVID-19 pandemic affected the Next-Gen Logic Scaling Technologies Market through temporary disruptions in semiconductor fabrication, supply chain delays, and project timelines. Equipment deliveries and wafer production faced logistical challenges, slowing technology adoption. However, the post-pandemic recovery witnessed accelerated demand for high-performance computing, cloud infrastructure, and AI applications, reinforcing the need for advanced logic scaling. This renewed momentum has strengthened market growth, highlighting the strategic importance of next-generation scaling solutions in semiconductor innovation.

The advanced silicon materials segment is expected to be the largest during the forecast period

The advanced silicon materials segment is expected to account for the largest market share during the forecast period due to its critical role in enabling high-performance logic devices. These materials provide superior electrical characteristics, thermal stability, and compatibility with advanced lithography processes. Adoption in leading-edge nodes ensures improved transistor density and device reliability. Continuous investment in silicon material innovations and fabrication support drives widespread deployment, resulting in the largest market share across logic scaling technologies during the forecast period.

The 5 nm and above segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the 5 nm and above segment is predicted to witness the highest growth rate reflecting rapid adoption of leading-edge process nodes. These nodes deliver higher transistor density, lower power consumption, and enhanced computing performance. Increasing deployment in AI processors, mobile devices, and high-performance computing systems accelerates demand. Continued investment in lithography, material innovation, and process optimization supports growth, positioning the 5 nm and above segment as the fastest-growing technology category in next-generation logic scaling.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share supported by its robust semiconductor manufacturing ecosystem. Countries such as Taiwan, South Korea, China, and Japan host leading wafer fabrication facilities and foundries, enabling high-volume production of advanced logic chips. Government support, strategic investments, and continuous technology upgrades drive widespread adoption of next-generation scaling solutions. This combination of infrastructure, policy backing, and manufacturing capability reinforces regional market dominance and ensures sustained revenue growth throughout the forecast period.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR driven by substantial investments in semiconductor R&D and advanced computing infrastructure. The presence of leading chip designers, fabless companies, and high-performance computing initiatives accelerates adoption of next-generation scaling solutions. Supportive government incentives, ongoing innovation in lithography and materials, and increasing demand for AI, cloud computing, and edge processing applications further fuel market growth, positioning North America as the fastest-growing regional market throughout the forecast period.

Key players in the market

Some of the key players in Next-Gen Logic Scaling Technologies Market include TSMC, Intel, Samsung Electronics, GlobalFoundries, Micron Technology, SK Hynix, Broadcom, Qualcomm, NVIDIA, AMD, ASML, Applied Materials, Lam Research, KLA Corporation, Tokyo Electron, Cadence Design Systems and Synopsys.

Key Developments:

In January 2026, TSMC advanced its next-generation logic scaling roadmap by expanding production of sub-3nm process technologies, supporting improved transistor density, power efficiency, and performance for high-performance computing and AI-driven applications.

In December 2025, Intel strengthened its logic scaling capabilities by introducing advanced transistor architectures and backside power delivery technologies, aiming to enhance power efficiency and yield performance in future-node semiconductor manufacturing.

In November 2025, Samsung Electronics expanded its next-gen logic scaling portfolio with gate-all-around transistor advancements, enabling improved performance-per-watt and supporting high-density logic chips for mobile and data center applications.

Materials Covered:

  • Advanced Silicon Materials
  • High-k Dielectric Materials
  • Metal Gate Materials
  • 2D Semiconductor Materials
  • Compound Semiconductor Materials

Node Sizes Covered:

  • 5 nm and Above
  • 3 nm Node
  • 2 nm Node
  • Sub-2 nm Nodes
  • Experimental Logic Nodes

Technologies Covered:

  • Gate-All-Around Transistor Technologies
  • Advanced FinFET Scaling
  • 3D Logic Integration
  • Chiplet-Based Scaling
  • Post-CMOS Logic Technologies

Applications Covered:

  • High-Performance Computing
  • Artificial Intelligence Processing
  • Data Center Processors
  • Advanced Consumer Electronics
  • Autonomous Systems

End Users Covered:

  • Semiconductor Foundries
  • Integrated Device Manufacturers
  • Fabless Chip Companies
  • Research Institutions
  • Government R&D Organizations
  • Other End Users

Regions Covered:

  • North America
    • United States
    • Canada
    • Mexico
  • Europe
    • United Kingdom
    • Germany
    • France
    • Italy
    • Spain
    • Netherlands
    • Belgium
    • Sweden
    • Switzerland
    • Poland
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Thailand
    • Malaysia
    • Singapore
    • Vietnam
    • Rest of Asia Pacific
  • South America
    • Brazil
    • Argentina
    • Colombia
    • Chile
    • Peru
    • Rest of South America
  • Rest of the World (RoW)
    • Middle East
    • Saudi Arabia
    • United Arab Emirates
    • Qatar
    • Israel
    • Rest of Middle East
    • Africa
    • South Africa
    • Egypt
    • Morocco
    • Rest of Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2023, 2024, 2025, 2026, 2027, 2028, 2030, 3032 and 2034
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

  • 1.1 Market Snapshot and Key Highlights
  • 1.2 Growth Drivers, Challenges, and Opportunities
  • 1.3 Competitive Landscape Overview
  • 1.4 Strategic Insights and Recommendations

2 Research Framework

  • 2.1 Study Objectives and Scope
  • 2.2 Stakeholder Analysis
  • 2.3 Research Assumptions and Limitations
  • 2.4 Research Methodology
    • 2.4.1 Data Collection (Primary and Secondary)
    • 2.4.2 Data Modeling and Estimation Techniques
    • 2.4.3 Data Validation and Triangulation
    • 2.4.4 Analytical and Forecasting Approach

3 Market Dynamics and Trend Analysis

  • 3.1 Market Definition and Structure
  • 3.2 Key Market Drivers
  • 3.3 Market Restraints and Challenges
  • 3.4 Growth Opportunities and Investment Hotspots
  • 3.5 Industry Threats and Risk Assessment
  • 3.6 Technology and Innovation Landscape
  • 3.7 Emerging and High-Growth Markets
  • 3.8 Regulatory and Policy Environment
  • 3.9 Impact of COVID-19 and Recovery Outlook

4 Competitive and Strategic Assessment

  • 4.1 Porter's Five Forces Analysis
    • 4.1.1 Supplier Bargaining Power
    • 4.1.2 Buyer Bargaining Power
    • 4.1.3 Threat of Substitutes
    • 4.1.4 Threat of New Entrants
    • 4.1.5 Competitive Rivalry
  • 4.2 Market Share Analysis of Key Players
  • 4.3 Product Benchmarking and Performance Comparison

5 Global Next-Gen Logic Scaling Technologies Market, By Material

  • 5.1 Advanced Silicon Materials
  • 5.2 High-k Dielectric Materials
  • 5.3 Metal Gate Materials
  • 5.4 2D Semiconductor Materials
  • 5.5 Compound Semiconductor Materials

6 Global Next-Gen Logic Scaling Technologies Market, By Node Size

  • 6.1 5 nm and Above
  • 6.2 3 nm Node
  • 6.3 2 nm Node
  • 6.4 Sub-2 nm Nodes
  • 6.5 Experimental Logic Nodes

7 Global Next-Gen Logic Scaling Technologies Market, By Technology

  • 7.1 Gate-All-Around Transistor Technologies
  • 7.2 Advanced FinFET Scaling
  • 7.3 3D Logic Integration
  • 7.4 Chiplet-Based Scaling
  • 7.5 Post-CMOS Logic Technologies

8 Global Next-Gen Logic Scaling Technologies Market, By Application

  • 8.1 High-Performance Computing
  • 8.2 Artificial Intelligence Processing
  • 8.3 Data Center Processors
  • 8.4 Advanced Consumer Electronics
  • 8.5 Autonomous Systems

9 Global Next-Gen Logic Scaling Technologies Market, By End User

  • 9.1 Semiconductor Foundries
  • 9.2 Integrated Device Manufacturers
  • 9.3 Fabless Chip Companies
  • 9.4 Research Institutions
  • 9.5 Government R&D Organizations
  • 9.6 Other End Users

10 Global Next-Gen Logic Scaling Technologies Market, By Geography

  • 10.1 North America
    • 10.1.1 United States
    • 10.1.2 Canada
    • 10.1.3 Mexico
  • 10.2 Europe
    • 10.2.1 United Kingdom
    • 10.2.2 Germany
    • 10.2.3 France
    • 10.2.4 Italy
    • 10.2.5 Spain
    • 10.2.6 Netherlands
    • 10.2.7 Belgium
    • 10.2.8 Sweden
    • 10.2.9 Switzerland
    • 10.2.10 Poland
    • 10.2.11 Rest of Europe
  • 10.3 Asia Pacific
    • 10.3.1 China
    • 10.3.2 Japan
    • 10.3.3 India
    • 10.3.4 South Korea
    • 10.3.5 Australia
    • 10.3.6 Indonesia
    • 10.3.7 Thailand
    • 10.3.8 Malaysia
    • 10.3.9 Singapore
    • 10.3.10 Vietnam
    • 10.3.11 Rest of Asia Pacific
  • 10.4 South America
    • 10.4.1 Brazil
    • 10.4.2 Argentina
    • 10.4.3 Colombia
    • 10.4.4 Chile
    • 10.4.5 Peru
    • 10.4.6 Rest of South America
  • 10.5 Rest of the World (RoW)
    • 10.5.1 Middle East
      • 10.5.1.1 Saudi Arabia
      • 10.5.1.2 United Arab Emirates
      • 10.5.1.3 Qatar
      • 10.5.1.4 Israel
      • 10.5.1.5 Rest of Middle East
    • 10.5.2 Africa
      • 10.5.2.1 South Africa
      • 10.5.2.2 Egypt
      • 10.5.2.3 Morocco
      • 10.5.2.4 Rest of Africa

11 Strategic Market Intelligence

  • 11.1 Industry Value Network and Supply Chain Assessment
  • 11.2 White-Space and Opportunity Mapping
  • 11.3 Product Evolution and Market Life Cycle Analysis
  • 11.4 Channel, Distributor, and Go-to-Market Assessment

12 Industry Developments and Strategic Initiatives

  • 12.1 Mergers and Acquisitions
  • 12.2 Partnerships, Alliances, and Joint Ventures
  • 12.3 New Product Launches and Certifications
  • 12.4 Capacity Expansion and Investments
  • 12.5 Other Strategic Initiatives

13 Company Profiles

  • 13.1 TSMC
  • 13.2 Intel
  • 13.3 Samsung Electronics
  • 13.4 GlobalFoundries
  • 13.5 Micron Technology
  • 13.6 SK Hynix
  • 13.7 Broadcom
  • 13.8 Qualcomm
  • 13.9 NVIDIA
  • 13.10 AMD
  • 13.11 ASML
  • 13.12 Applied Materials
  • 13.13 Lam Research
  • 13.14 KLA Corporation
  • 13.15 Tokyo Electron
  • 13.16 Cadence Design Systems
  • 13.17 Synopsys

List of Tables

  • Table 1 Global Next-Gen Logic Scaling Technologies Market Outlook, By Region (2023-2034) ($MN)
  • Table 2 Global Next-Gen Logic Scaling Technologies Market Outlook, By Material (2023-2034) ($MN)
  • Table 3 Global Next-Gen Logic Scaling Technologies Market Outlook, By Advanced Silicon Materials (2023-2034) ($MN)
  • Table 4 Global Next-Gen Logic Scaling Technologies Market Outlook, By High-k Dielectric Materials (2023-2034) ($MN)
  • Table 5 Global Next-Gen Logic Scaling Technologies Market Outlook, By Metal Gate Materials (2023-2034) ($MN)
  • Table 6 Global Next-Gen Logic Scaling Technologies Market Outlook, By 2D Semiconductor Materials (2023-2034) ($MN)
  • Table 7 Global Next-Gen Logic Scaling Technologies Market Outlook, By Compound Semiconductor Materials (2023-2034) ($MN)
  • Table 8 Global Next-Gen Logic Scaling Technologies Market Outlook, By Node Size (2023-2034) ($MN)
  • Table 9 Global Next-Gen Logic Scaling Technologies Market Outlook, By 5 nm and Above (2023-2034) ($MN)
  • Table 10 Global Next-Gen Logic Scaling Technologies Market Outlook, By 3 nm Node (2023-2034) ($MN)
  • Table 11 Global Next-Gen Logic Scaling Technologies Market Outlook, By 2 nm Node (2023-2034) ($MN)
  • Table 12 Global Next-Gen Logic Scaling Technologies Market Outlook, By Sub-2 nm Nodes (2023-2034) ($MN)
  • Table 13 Global Next-Gen Logic Scaling Technologies Market Outlook, By Experimental Logic Nodes (2023-2034) ($MN)
  • Table 14 Global Next-Gen Logic Scaling Technologies Market Outlook, By Technology (2023-2034) ($MN)
  • Table 15 Global Next-Gen Logic Scaling Technologies Market Outlook, By Gate-All-Around Transistor Technologies (2023-2034) ($MN)
  • Table 16 Global Next-Gen Logic Scaling Technologies Market Outlook, By Advanced FinFET Scaling (2023-2034) ($MN)
  • Table 17 Global Next-Gen Logic Scaling Technologies Market Outlook, By 3D Logic Integration (2023-2034) ($MN)
  • Table 18 Global Next-Gen Logic Scaling Technologies Market Outlook, By Chiplet-Based Scaling (2023-2034) ($MN)
  • Table 19 Global Next-Gen Logic Scaling Technologies Market Outlook, By Post-CMOS Logic Technologies (2023-2034) ($MN)
  • Table 20 Global Next-Gen Logic Scaling Technologies Market Outlook, By Application (2023-2034) ($MN)
  • Table 21 Global Next-Gen Logic Scaling Technologies Market Outlook, By High-Performance Computing (2023-2034) ($MN)
  • Table 22 Global Next-Gen Logic Scaling Technologies Market Outlook, By Artificial Intelligence Processing (2023-2034) ($MN)
  • Table 23 Global Next-Gen Logic Scaling Technologies Market Outlook, By Data Center Processors (2023-2034) ($MN)
  • Table 24 Global Next-Gen Logic Scaling Technologies Market Outlook, By Advanced Consumer Electronics (2023-2034) ($MN)
  • Table 25 Global Next-Gen Logic Scaling Technologies Market Outlook, By Autonomous Systems (2023-2034) ($MN)
  • Table 26 Global Next-Gen Logic Scaling Technologies Market Outlook, By End User (2023-2034) ($MN)
  • Table 27 Global Next-Gen Logic Scaling Technologies Market Outlook, By Semiconductor Foundries (2023-2034) ($MN)
  • Table 28 Global Next-Gen Logic Scaling Technologies Market Outlook, By Integrated Device Manufacturers (2023-2034) ($MN)
  • Table 29 Global Next-Gen Logic Scaling Technologies Market Outlook, By Fabless Chip Companies (2023-2034) ($MN)
  • Table 30 Global Next-Gen Logic Scaling Technologies Market Outlook, By Research Institutions (2023-2034) ($MN)
  • Table 31 Global Next-Gen Logic Scaling Technologies Market Outlook, By Government R&D Organizations (2023-2034) ($MN)
  • Table 32 Global Next-Gen Logic Scaling Technologies Market Outlook, By Other End Users (2023-2034) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Rest of the World (RoW) Regions are also represented in the same manner as above. Global Next-Gen Logic Scaling Technologies Market, By End User