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1871905

全球強化玻璃基板市場：預測（至2032年）－按基板類型、厚度、應用、最終用戶和地區分類的分析

Glass-reinforced Substrate Market Forecasts to 2032 - Global Analysis By Substrate Type, Thickness, Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的一項研究，預計到 2025 年，全球玻璃纖維增強基板市場規模將達到 11.8 億美元，到 2032 年將達到 17.5 億美元，預測期內複合年成長率為 5.8%。

玻璃纖維增強基板是一種複合材料，它將玻璃纖維與樹脂基體結合，以提高強度、耐久性和耐熱性。由於其優異的絕緣性能、穩定性和抗環境因素能力，玻璃纖維增強基材被廣泛應用於電子產品，尤其是印刷電路基板，確保在嚴苛的電子和工業環境中保持可靠性和性能。

優異的電氣性能，適用於高頻應用

基板能夠提升尺寸穩定性和機械強度，從而支援先進印刷電路基板(PCB) 的小型化和多層設計。 5G通訊系統、雷達模組和高頻感測器的日益普及進一步推動了對這些材料的需求。嵌入式被動元件和軟性電路整合等新興趨勢也正在促進其應用。製造商正在開發先進的玻璃纖維組合物和樹脂體系，以提高 GHz 頻率下的性能。對低損耗材料和混合層壓板的持續研發正在拓展其在通訊、航太和汽車電子等眾多領域的應用。

缺乏成熟的產業流程

玻璃纖維編織圖案、樹脂相容性和固化參數的差異會影響產品的一致性和產量比率，為大規模生產帶來挑戰。不同製造商的設備校準和操作流程各不相同，阻礙了互通性以及從多家供應商購買的便利性。對專用蝕刻和層壓製程的需求也增加了操作的複雜性。雷射輔助鑽孔和精密層壓等新興技術正被用於推動製造標準化。然而，缺乏統一的產業框架和明確的資格標準仍限制著大規模商業化應用。

下一代顯示技術的應用

OLED、MicroLED 和量子點顯示器等先進顯示器技術的日益普及，為玻璃增強基板帶來了強勁的成長機會。其優異的熱穩定性、透明度和機械強度使其成為高解析度、軟性及曲面顯示器的理想選擇。超薄玻璃複合材料和混合基板技術的進步，使得透明導電層與軟性電路的整合成為可能。顯示器製造商與材料開發商之間的合作，共同最佳化基板結構，是該領域發展的關鍵。智慧和穿戴式顯示器的發展趨勢預計將在未來幾年進一步擴大市場滲透率。

與替代基板的競爭

陶瓷具有優異的導熱性和機械韌性，而有機層壓材料則為家用電子電器提供了柔韌性和成本優勢。聚合物基材料（例如聚醯亞胺和液晶聚合物 (LCP)）的持續創新，正在挑戰玻璃複合材料在某些高頻應用中的優越地位。為了保持競爭力，製造商正致力於研發兼具介電性能和機械耐久性的混合玻璃材料。隨著各公司朝著更輕、更有效率的基板方向發展，不同材料類別之間的競爭日益激烈。

新冠疫情的影響：

疫情初期，封鎖措施和原料短缺擾亂了玻璃纖維增強基板的生產和供應鏈。然而，由於醫療設備、資料中心和通訊基礎設施對電子元件的需求增加，復甦速度加快。遠距辦公和數位轉型的興起推動了消費性電子和網路設備對高頻印刷電路板的需求。製造商正在實施自動化、預測性維護和數位化品管，以增強業務永續營運。後疫情時代的策略重點是區域分散式製造和永續的材料採購，以減少未來可能出現的干擾。

預計在預測期內，印刷電路基板（PCB）細分市場將佔據最大的市場佔有率。

由於印刷基板(PCB) 在通訊、電腦和汽車電子等領域的廣泛應用，預計在預測期內，PCB 細分市場將佔據最大的市場佔有率。玻璃纖維增強基板因其優異的介電穩定性和降低訊號失真的能力，對於高頻 PCB 至關重要。基板和高密度基板(HDI) 的普及正在推動其進一步應用。雷射鑽孔、嵌入式元件和微孔結構等技術進步正在拓展基板的應用範圍。製造商正在整合玻璃纖維複合材料和先進樹脂，以最佳化訊號性能和散熱效果。

預計在預測期內，航太和國防領域將實現最高的複合年成長率。

由於對輕質、耐用和高性能材料的需求不斷成長，航太和國防領域預計在預測期內將實現最高成長率。玻璃纖維增強基板具有優異的機械穩定性和抗輻射性能，使其成為航空電子設備、雷達和衛星通訊系統的關鍵材料。先進複合材料在電子封裝和控制系統中的應用正在推動該領域的成長。新興趨勢包括使用奈米複合玻璃纖維和混合層壓板來提高惡劣環境下的訊號可靠性。國防現代化計畫和太空探勘計劃進一步促進了材料創新。

佔比最大的地區：

亞太地區預計將在預測期內佔據最大的市場佔有率，這主要得益於其強大的電子製造業生態系統和不斷擴大的半導體生產。中國、日本、韓國和台灣等國家和地區在印刷電路基板(PCB) 製造和高頻元件組裝處於主導地位。政府支持本地基板製造和技術自主的措施正在增強該地區的生產能力。新興趨勢包括開發用於 5G 和物聯網基礎設施的環保樹脂和先進玻璃複合材料。主要企業正在投資自動化、無塵室設施和材料回收，以提高產量比率和永續性。

預計年複合成長率最高的地區：

在預測期內，北美預計將實現最高的複合年成長率，這主要得益於先進電子和國防應用領域的快速技術創新。美國在支援高速資料傳輸和航太技術的下一代基板的研發方面處於領先地位。關鍵進展包括將低損耗玻璃複合材料整合到人工智慧計算模組、衛星通訊和電動汽車系統中。該地區致力於增強供應鏈韌性並將印刷電路板（PCB）生產遷回國內，從而鞏固了當地的製造業基礎。材料科學公司與原始設備製造商（OEM）之間的合作正在推動混合基板技術的突破。

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    • 基於產品系列、地域覆蓋和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 引言

  • 概述
  • 相關利益者
  • 分析範圍
  • 分析方法
  • 分析材料

第3章 市場趨勢分析

  • 介紹
  • 促進要素
  • 抑制因素
  • 機會
  • 威脅
  • 應用分析
  • 終端用戶分析
  • 新興市場
  • 新冠疫情的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代產品的威脅
  • 新進入者的威脅
  • 競爭對手之間的競爭

第5章 全球強化玻璃基板市場（依基板類型分類）

  • 玻璃纖維增強聚醯亞胺
  • 玻璃纖維增強氰酸酯
  • 玻璃纖維增強BT樹脂
  • 玻璃纖維增強聚四氟乙烯
  • 玻璃纖維增強環氧樹脂層壓板
  • 其他基板類型

6. 全球強化玻璃基板市場（依厚度分類）

  • 0.1毫米或更小
  • 0.1mm～0.5mm
  • 0.5mm～1mm
  • 1毫米或以上

7. 全球強化玻璃基板市場（依應用領域分類）

  • 印刷電路基板（PCB）
  • IC構裝基板
  • 射頻和微波組件
  • 汽車電子模組
  • 顯示面板
  • 其他用途

第8章 全球強化玻璃基板市場（依最終用戶分類）

  • 家用電器
  • 通訊
  • 航太/國防
  • 車
  • 其他最終用戶

9. 全球強化玻璃基板市場（依地區分類）

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 亞太其他地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第10章：主要趨勢

  • 合約、商業夥伴關係和合資企業
  • 企業合併（M&A）
  • 新產品上市
  • 業務拓展
  • 其他關鍵策略

第11章 公司簡介

  • AGC Inc.
  • Ibiden Co., Ltd.
  • Corning Incorporated
  • Saint-Gobain
  • Schott AG
  • Taiwan Glass Ind. Corp.
  • Nippon Electric Glass Co., Ltd.
  • Toray Industries, Inc.
  • NEG
  • Toppan Inc.
  • Ohara Inc.
  • LG Chem
  • Plan Optik AG
  • HOYA Corporation
  • Tecnisco Ltd.
Product Code: SMRC32275

According to Stratistics MRC, the Global Glass-reinforced Substrate Market is accounted for $1.18 billion in 2025 and is expected to reach $1.75 billion by 2032 growing at a CAGR of 5.8% during the forecast period. A glass-reinforced substrate is a composite material combining glass fibers with a resin base to improve strength, durability, and heat resistance. It is widely used in electronics, particularly for printed circuit boards, due to its excellent insulation properties, stability, and resistance to environmental factors, ensuring reliability and performance in demanding electronic and industrial environments.

Market Dynamics:

Driver:

Superior electrical properties for high-frequency applications

The substrates offer enhanced dimensional stability and mechanical strength, supporting miniaturization and multilayer designs in advanced printed circuit boards (PCBs). The growing use of 5G communication systems, radar modules, and high-frequency sensors is amplifying demand for these materials. Emerging trends such as embedded passive components and flexible circuit integration are also boosting adoption. Manufacturers are developing advanced glass-fiber compositions and resin systems to improve performance at GHz frequencies. Continuous R&D in low-loss materials and hybrid laminates is expanding their utility across telecom, aerospace, and automotive electronics.

Restraint:

Lack of established industry process

Variations in glass weave patterns, resin compatibility, and curing parameters affect consistency and yield, posing challenges for mass production. Equipment calibration and handling procedures differ across manufacturers, hindering interoperability and cross-supplier sourcing. The need for specialized etching and lamination processes increases operational complexity. Emerging technologies such as laser-assisted drilling and precision lamination are being explored to standardize fabrication. However, without a unified industry framework or clear qualification standards, large-scale commercialization remains constrained.

Opportunity:

Adoption in next-generation display tech

The growing adoption of advanced display technologies, including OLED, MicroLED, and quantum-dot displays, presents a strong growth opportunity for glass-reinforced substrates. Their superior thermal stability, transparency, and mechanical strength make them ideal for high-resolution, flexible, and curved displays. Advancements in ultra-thin glass composites and hybrid substrates are enabling integration with transparent conductors and flexible circuits. Key developments include collaborations between display manufacturers and material innovators to optimize substrate architecture. The trend toward smart and wearable displays is expected to further expand market penetration in the coming years.

Threat:

Competition from alternative substrate materials

Ceramics offer superior thermal conductivity and mechanical robustness, while organic laminates provide flexibility and cost advantages for consumer electronics. Continuous innovation in polymer-based materials, such as polyimide and liquid crystal polymers (LCPs), is challenging the dominance of glass composites in certain high-frequency applications. To maintain competitiveness, manufacturers are focusing on hybrid glass materials that combine dielectric performance with mechanical resilience. The ongoing shift toward lightweight and thermally efficient substrates is intensifying rivalry among material classes.

Covid-19 Impact:

The pandemic initially disrupted production and supply chains of glass-reinforced substrates due to lockdowns and raw material shortages. However, recovery was accelerated by rising demand for electronic components in medical devices, data centers, and communication infrastructure. The surge in remote working and digital transformation boosted consumption of high-frequency PCBs in consumer and networking electronics. Manufacturers adopted automation, predictive maintenance, and digital quality control to enhance operational resilience. Post-pandemic strategies focus on regionalized manufacturing and sustainable material sourcing to reduce future disruptions.

The printed circuit boards (PCBs) segment is expected to be the largest during the forecast period

The printed circuit boards (PCBs) segment is expected to account for the largest market share during the forecast period, owing to its extensive use in communication, computing, and automotive electronics. Glass-reinforced substrates are essential for high-frequency PCBs due to their superior dielectric stability and reduced signal distortion. The shift toward multilayer and high-density interconnect (HDI) boards is further driving adoption. Technological advancements such as laser drilling, embedded components, and microvia structures are enhancing substrate utilization. Manufacturers are integrating glass-fiber composites with advanced resins to optimize signal performance and heat dissipation.

The aerospace & defense segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the aerospace & defense segment is predicted to witness the highest growth rate, due to the increasing demand for lightweight, durable, and high-performance materials. Glass-reinforced substrates offer excellent mechanical stability and radiation resistance, essential for avionics, radar, and satellite communication systems. The adoption of advanced composites in electronic packaging and control systems is boosting segment growth. Emerging trends include the use of nanocomposite glass fibers and hybrid laminates for enhanced signal reliability under extreme conditions. Defense modernization programs and space exploration projects are further accelerating material innovation.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, due to its strong electronics manufacturing ecosystem and expanding semiconductor production. Countries like China, Japan, South Korea, and Taiwan are leading in PCB fabrication and high-frequency component assembly. Government initiatives supporting local substrate manufacturing and technological self-reliance are enhancing regional capacity. Emerging trends include the development of eco-friendly resins and advanced glass composites for 5G and IoT infrastructure. Major players are investing in automation, cleanroom facilities, and material recycling to improve yield and sustainability.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by rapid innovation in advanced electronics and defense applications. The U.S. leads in R&D for next-generation substrates supporting high-speed data transfer and aerospace technologies. Key developments include integration of low-loss glass composites in AI computing modules, satellite communication, and electric vehicle systems. The region's focus on supply chain resilience and onshoring of PCB production is strengthening local manufacturing. Collaborations between material science firms and OEMs are fostering breakthroughs in hybrid substrate technologies.

Key players in the market

Some of the key players in Glass-reinforced Substrate Market include AGC Inc., Ibiden Co., Corning Inc., Saint-Gobain, Schott AG, Taiwan Gl, Nippon Ele, Toray Indu, NEG, Toppan Inc., Ohara Inc., LG Chem, Plan Optik, HOYA Corp., and Tecnisco.

Key Developments:

In October 2025, Saint-Gobain has signed a definitive agreement with the Brazilian group GG10, owner of the G-Haus brand, for the sale of Tumelero, a retail chain specializing in construction materials, with a strong presence in southern Brazil. Tumelero is currently operating 16 stores and 1 logistic center in Rio Grande do Sul, employs around 580 people and generated revenues of around €40 million in 2024.

In June 2024, Corning Incorporated announced the launch of Corning(R) Gorilla(R) Glass 7i, a new cover glass engineered to deliver improved durability for intermediate and value-segment mobile devices. Gorilla Glass 7i broadens Corning's renowned tough cover glass portfolio, offering better drop and scratch performance compared to competitive lithium aluminosilicate glasses from other manufacturers.

Substrate Types Covered:

  • Glass-reinforced Polyimide
  • Glass-reinforced Cyanate Ester
  • Glass-reinforced BT Resin
  • Glass-reinforced PTFE
  • Glass-reinforced Epoxy Laminates
  • Other Substrate Types

Thicknesses Covered:

  • <= 0.1 mm
  • 0.1 mm - 0.5 mm
  • 0.5 mm - 1 mm
  • Above 1 mm

Applications Covered:

  • Printed Circuit Boards (PCBs)
  • IC Packaging Substrates
  • RF & Microwave Components
  • Automotive Electronic Modules
  • Display Panels
  • Other Applications

End Users Covered:

  • Consumer Electronics
  • Telecommunications
  • Aerospace & Defense
  • Automotive
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Glass-reinforced Substrate Market, By Substrate Type

  • 5.1 Introduction
  • 5.2 Glass-reinforced Polyimide
  • 5.3 Glass-reinforced Cyanate Ester
  • 5.4 Glass-reinforced BT Resin
  • 5.5 Glass-reinforced PTFE
  • 5.6 Glass-reinforced Epoxy Laminates
  • 5.7 Other Substrate Types

6 Global Glass-reinforced Substrate Market, By Thickness

  • 6.1 Introduction
  • 6.2 <= 0.1 mm
  • 6.3 0.1 mm - 0.5 mm
  • 6.4 0.5 mm - 1 mm
  • 6.5 Above 1 mm

7 Global Glass-reinforced Substrate Market, By Application

  • 7.1 Introduction
  • 7.2 Printed Circuit Boards (PCBs)
  • 7.3 IC Packaging Substrates
  • 7.4 RF & Microwave Components
  • 7.5 Automotive Electronic Modules
  • 7.6 Display Panels
  • 7.7 Other Applications

8 Global Glass-reinforced Substrate Market, By End User

  • 8.1 Introduction
  • 8.2 Consumer Electronics
  • 8.3 Telecommunications
  • 8.4 Aerospace & Defense
  • 8.5 Automotive
  • 8.6 Other End Users

9 Global Glass-reinforced Substrate Market, By Geography

  • 9.1 Introduction
  • 9.2 North America
    • 9.2.1 US
    • 9.2.2 Canada
    • 9.2.3 Mexico
  • 9.3 Europe
    • 9.3.1 Germany
    • 9.3.2 UK
    • 9.3.3 Italy
    • 9.3.4 France
    • 9.3.5 Spain
    • 9.3.6 Rest of Europe
  • 9.4 Asia Pacific
    • 9.4.1 Japan
    • 9.4.2 China
    • 9.4.3 India
    • 9.4.4 Australia
    • 9.4.5 New Zealand
    • 9.4.6 South Korea
    • 9.4.7 Rest of Asia Pacific
  • 9.5 South America
    • 9.5.1 Argentina
    • 9.5.2 Brazil
    • 9.5.3 Chile
    • 9.5.4 Rest of South America
  • 9.6 Middle East & Africa
    • 9.6.1 Saudi Arabia
    • 9.6.2 UAE
    • 9.6.3 Qatar
    • 9.6.4 South Africa
    • 9.6.5 Rest of Middle East & Africa

10 Key Developments

  • 10.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 10.2 Acquisitions & Mergers
  • 10.3 New Product Launch
  • 10.4 Expansions
  • 10.5 Other Key Strategies

11 Company Profiling

  • 11.1 AGC Inc.
  • 11.2 Ibiden Co., Ltd.
  • 11.3 Corning Incorporated
  • 11.4 Saint-Gobain
  • 11.5 Schott AG
  • 11.6 Taiwan Glass Ind. Corp.
  • 11.7 Nippon Electric Glass Co., Ltd.
  • 11.8 Toray Industries, Inc.
  • 11.9 NEG
  • 11.10 Toppan Inc.
  • 11.11 Ohara Inc.
  • 11.12 LG Chem
  • 11.13 Plan Optik AG
  • 11.14 HOYA Corporation
  • 11.15 Tecnisco Ltd.

List of Tables

  • Table 1 Global Glass-reinforced Substrate Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Glass-reinforced Substrate Market Outlook, By Substrate Type (2024-2032) ($MN)
  • Table 3 Global Glass-reinforced Substrate Market Outlook, By Glass-reinforced Polyimide (2024-2032) ($MN)
  • Table 4 Global Glass-reinforced Substrate Market Outlook, By Glass-reinforced Cyanate Ester (2024-2032) ($MN)
  • Table 5 Global Glass-reinforced Substrate Market Outlook, By Glass-reinforced BT Resin (2024-2032) ($MN)
  • Table 6 Global Glass-reinforced Substrate Market Outlook, By Glass-reinforced PTFE (2024-2032) ($MN)
  • Table 7 Global Glass-reinforced Substrate Market Outlook, By Glass-reinforced Epoxy Laminates (2024-2032) ($MN)
  • Table 8 Global Glass-reinforced Substrate Market Outlook, By Other Substrate Types (2024-2032) ($MN)
  • Table 9 Global Glass-reinforced Substrate Market Outlook, By Thickness (2024-2032) ($MN)
  • Table 10 Global Glass-reinforced Substrate Market Outlook, By <= 0.1 mm (2024-2032) ($MN)
  • Table 11 Global Glass-reinforced Substrate Market Outlook, By 0.1 mm - 0.5 mm (2024-2032) ($MN)
  • Table 12 Global Glass-reinforced Substrate Market Outlook, By 0.5 mm - 1 mm (2024-2032) ($MN)
  • Table 13 Global Glass-reinforced Substrate Market Outlook, By Above 1 mm (2024-2032) ($MN)
  • Table 14 Global Glass-reinforced Substrate Market Outlook, By Application (2024-2032) ($MN)
  • Table 15 Global Glass-reinforced Substrate Market Outlook, By Printed Circuit Boards (PCBs) (2024-2032) ($MN)
  • Table 16 Global Glass-reinforced Substrate Market Outlook, By IC Packaging Substrates (2024-2032) ($MN)
  • Table 17 Global Glass-reinforced Substrate Market Outlook, By RF & Microwave Components (2024-2032) ($MN)
  • Table 18 Global Glass-reinforced Substrate Market Outlook, By Automotive Electronic Modules (2024-2032) ($MN)
  • Table 19 Global Glass-reinforced Substrate Market Outlook, By Display Panels (2024-2032) ($MN)
  • Table 20 Global Glass-reinforced Substrate Market Outlook, By Other Applications (2024-2032) ($MN)
  • Table 21 Global Glass-reinforced Substrate Market Outlook, By End User (2024-2032) ($MN)
  • Table 22 Global Glass-reinforced Substrate Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 23 Global Glass-reinforced Substrate Market Outlook, By Telecommunications (2024-2032) ($MN)
  • Table 24 Global Glass-reinforced Substrate Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 25 Global Glass-reinforced Substrate Market Outlook, By Automotive (2024-2032) ($MN)
  • Table 26 Global Glass-reinforced Substrate Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.