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半導體生產設備測量儀器半導體製造設備

市場調查報告書

商品編碼

1856889

半導體計量和檢測設備市場預測至2032年：按設備類型、技術、應用、最終用戶和地區分類的全球分析

Semiconductor Metrology and Inspection Equipment Market Forecasts to 2032 - Global Analysis By Equipment Type (Lithography Metrology, Wafer Inspection, Thin Film Metrology, and Other Equipment Types), Technology, Application, End User and By Geography

出版日期: 2025年10月01日 | 出版商:

Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

簡介目錄圖表

根據 Stratistics MRC 的數據，全球半導體計量和測試設備市場預計到 2025 年將達到 97.7 億美元，到 2032 年將達到 177.6 億美元，預測期內複合年成長率為 8.9%。

半導體計量和檢測設備由精密儀器組成，旨在評估和監控半導體晶圓和裝置在製造過程中的特性。這些儀器有助於識別缺陷、尺寸偏差和不規則性，從而確保精度、品質和一致性。透過實現極小尺度的精確測量和分析，它們在製程控制、最大限度提高生產產量比率以及遵守嚴格的行業標準方面發揮關鍵作用，從而促進生產用於電子應用的可靠、高性能半導體元件。

根據 arXiv 在 2025 年 3 月發布的預測，大型超級電腦將使用約 20 萬個 AI 晶片，硬體成本為 70 億美元，耗電量為 300 兆瓦。

對更高品質和更高產量比率晶片的需求日益成長。

半導體產業對高性能、低缺陷晶片的需求激增。這一趨勢主要受人工智慧、5G 和自動駕駛系統等先進應用的普及所推動，這些應用對製造精度要求極高。隨著裝置尺寸的縮小，誤差容許度也隨之降低，因此高解析度計量和偵測工具至關重要。製造商正加大對下一代設備的投資，以確保更嚴格的製程控制和更高的生產產量比率。光學和電子束檢測技術的創新使得即時缺陷檢測和製程最佳化成為可能。這種對品質保證日益成長的重視預計將顯著推動整個價值鏈的市場成長。

系統複雜度增加和吞吐量瓶頸

隨著半導體製程節點推進到5奈米以下，檢測和計量系統的複雜度呈指數級成長。這些工具現在必須以極高的精度分析複雜的3D結構和多層封裝。然而，檢測過程中產生的資料量極為龐大，需要先進的分析技術和高效能運算基礎設施。因此，檢測速度往往落後於生產速度，造成產能挑戰。此外，將這些系統整合到現有工廠工作流程中需要專業知識和大量資金投入。這些營運和技術障礙減緩了系統的普及，並阻礙了市場加速發展。

對先進包裝計量技術的需求日益成長

隨著晶片組、2.5D/3D積體電路和扇出型晶圓級封裝的日益普及，互連、凸塊高度和通孔的精確測量變得至關重要。新的計量解決方案正在被設計出來，以奈米級精度來應對這些複雜的架構。設備供應商正與外包半導體組裝測試公司（OSAT）和整合裝置製造商（IDM）合作，開發專為先進封裝生產線量身定做的工具。光學、X光和混合計量技術的融合，使得全面的跨層檢測成為可能。這種不斷發展的格局為專業計量供應商創造了巨大的成長機會。

科技快速過時

由於晶片設計、小型化和製造流程的持續技術創新，半導體產業正經歷快速發展。隨著製程節點縮小和裝置架構日益複雜，現有的計量和偵測工具很快就會過時，需要頻繁升級或徹底更換。這縮短了產品生命週期，並增加了製造商的研發和資本成本。隨著客戶對需要高精度和高準確度的先進解決方案的需求不斷成長，無法跟上新興技術步伐的公司將面臨失去競爭優勢的風險。因此，技術創新的步伐對企業維持技術相關性和盈利構成了持續的挑戰。

新冠疫情的影響：

新冠疫情初期擾亂了全球供應鏈，導致計量和檢測設備的交付和安裝延誤。然而，疫情也凸顯了半導體工廠自動化和遠端監控的重要性。因此，在疫情恢復期，對人工智慧賦能、雲端連線的偵測工具的需求激增。供應商加快了非接觸式和預測性維護解決方案的開發，以減少人為干預。此次危機也促使企業策略轉向區域化製造和供應鏈復甦。

預計在預測期內，微影術計量領域將成為最大的細分市場。

由於微影術在確保先進製程節點的圖案保真度和套刻精度方面發揮關鍵作用，預計在預測期內，光刻計量領域將佔據最大的市場佔有率。隨著極微影術的普及，精確測量關鍵尺寸和線邊緣粗糙度的需求日益成長。這些工具對於檢測可能影響裝置性能的圖形化缺陷至關重要。解析度、靈敏度和吞吐量的持續提升正在推動其在先進晶圓廠的應用。設備供應商也在整合人工智慧和機器學習技術，以增強缺陷分類和製程控制。

預計在預測期內，OSAT供應商細分市場將以最高的複合年成長率成長。

由於先進封裝技術的日益複雜，預計在預測期內，OSAT（外包半導體封裝測試）服務商將實現最高成長率。隨著晶片製造商越來越依賴OSAT進行2.5D/3D整合和異構封裝，對專用計量工具的需求也隨之激增。這些服務商正在投資高精度檢測系統，以確保互連可靠性和封裝完整性。 X光、聲學和混合計量技術的創新應用正被迅速採用，以滿足嚴格的品質標準。向「精簡晶圓廠」模式和設計外包的趨勢進一步提升了OSAT的戰略重要性。這種轉變使OSAT成為不斷發展的半導體產業的關鍵驅動力。

比最大的地區

預計亞太地區將在預測期內佔據最大的市場佔有率，這主要得益於中國、台灣、韓國和日本等國家和地區強大的半導體製造生態系統。這些國家和地區擁有眾多大型晶圓代工廠和整合裝置製造商 (IDM)，它們正積極投資於先進的計量基礎設施。政府支持國內晶片生產和研發的舉措進一步推動了該地區的成長。主要設備供應商的存在以及強大的外包半導體組裝與測試 (OSAT) 體係也推動了對檢測工具的需求。此外，該地區對人工智慧、5G 和汽車電子領域的關注也促使人們對更高品質的晶片提出了更高的要求。

複合年成長率最高的地區：

預計北美地區在預測期內將呈現最高的複合年成長率。美國的《晶片技術創新與應用法案》（CHIPS Act）及其相關資助計畫正在推動國內製造業和設備創新。領先企業正在開發下一代計量工具，以支援5奈米以下和3D封裝技術。該地區對人工智慧主導的分析、網路安全和自動化技術的重視，正在增強其檢測能力。學術界、國家實驗室和產業界之間的合作正在培養一個充滿活力的創新生態系統。

免費客製化服務

訂閱本報告的用戶可享有以下免費客製化服務之一：

公司簡介
- 對至多三家其他市場公司進行全面分析
- 對主要企業進行SWOT分析（最多3家公司）
區域細分
- 根據客戶興趣對主要國家進行市場估算、預測和複合年成長率分析（註：基於可行性檢查）
競爭基準化分析
- 基於產品系列、地域覆蓋和策略聯盟對主要企業基準化分析

北美洲
- 美國
- 加拿大
- 墨西哥
歐洲
- 德國
- 英國
- 義大利
- 法國
- 西班牙
- 其他歐洲
亞太地區
- 日本
- 中國
- 印度
- 澳洲
- 紐西蘭
- 韓國
- 亞太其他地區
南美洲
- 阿根廷
- 巴西
- 智利
- 其他南美洲
中東和非洲
- 沙烏地阿拉伯
- 阿拉伯聯合大公國
- 卡達
- 南非
- 其他中東和非洲地區

第10章：重大進展

協議、夥伴關係、合作和合資企業
收購與併購
新產品上市
業務拓展
其他關鍵策略

第11章企業概況

KLA Corporation
Toray Engineering Co., Ltd.
Hitachi High-Tech Corporation
JEOL Ltd.
Applied Materials Inc.
Lasertec Corporation
Onto Innovation Inc.
SCREEN Holdings Co., Ltd.
ASML Holding NV
Advantest Corporation
Tokyo Electron Limited
Nikon Corporation
Nova Ltd.
Carl Zeiss SMT GmbH
Camtek Ltd.

簡介目錄圖表

Product Code: SMRC31761

According to Stratistics MRC, the Global Semiconductor Metrology and Inspection Equipment Market is accounted for $9.77 billion in 2025 and is expected to reach $17.76 billion by 2032 growing at a CAGR of 8.9% during the forecast period. Semiconductor Metrology and Inspection Equipment comprises advanced instruments designed to assess and monitor the characteristics of semiconductor wafers and devices during manufacturing. These tools help identify defects, dimensional variations, and irregularities, ensuring accuracy, quality, and consistency. By enabling precise measurement and analysis at extremely small scales, they play a vital role in process control, maximizing production yield, and adhering to rigorous industry standards, thereby facilitating the creation of reliable and high-performance semiconductor components for electronic applications.

According to arXiv in March 2025, the leading supercomputer used approximately 200,000 AI chips cost USD 7 billion in hardware, and draw 300 MW of power.

Market Dynamics:

Driver:

Rising demand for higher chip quality and yield

The semiconductor industry is witnessing a surge in demand for chips with superior performance and minimal defects. This trend is driven by the proliferation of advanced applications such as AI, 5G, and autonomous systems, which require extremely precise fabrication. As device geometries shrink, the margin for error narrows, making high-resolution metrology and inspection tools indispensable. Manufacturers are increasingly investing in next-generation equipment to ensure tighter process control and higher production yields. Innovations in optical and e-beam inspection technologies are enabling real-time defect detection and process optimization. This heightened focus on quality assurance is expected to significantly propel market growth across the value chain.

Restraint:

Increasing system complexity and throughput bottlenecks

As semiconductor nodes advance below 5nm, the complexity of inspection and metrology systems has grown exponentially. These tools must now analyze intricate 3D structures and multilayered packaging with extreme precision. However, the volume of data generated during inspection is massive, requiring sophisticated analytics and high-performance computing infrastructure. This creates throughput challenges, as inspection speed often lags behind production rates. Additionally, integrating these systems into existing fab workflows demands specialized expertise and significant capital investment. These operational and technical hurdles are slowing down widespread adoption, acting as a brake on market acceleration.

Opportunity:

Growing need for advanced packaging metrology

As chiplets, 2.5D/3D ICs, and fan-out wafer-level packaging gain traction, precise measurement of interconnects, bump heights, and TSVs becomes critical. Emerging metrology solutions are being designed to handle these complex architectures with nanometer-level accuracy. Equipment vendors are collaborating with OSATs and IDMs to develop tools tailored for advanced packaging lines. The convergence of optical, X-ray, and hybrid metrology techniques is enabling comprehensive inspection across layers. This evolving landscape presents a significant growth opportunity for specialized metrology providers.

Threat:

Rapid technological obsolescence

The semiconductor industry evolves swiftly, driven by continuous innovations in chip design, miniaturization, and manufacturing processes. As nodes shrink and device architectures become more complex, existing metrology and inspection tools can quickly become outdated, requiring frequent upgrades or complete replacements. This shortens product life cycles and increases R&D and capital costs for manufacturers. Companies that fail to keep pace with emerging technologies risk losing competitiveness, as customers demand advanced solutions for precision and accuracy. Consequently, the pace of innovation poses a persistent challenge to maintaining technological relevance and profitability.

Covid-19 Impact:

The COVID-19 pandemic initially disrupted global supply chains, delaying the delivery and installation of metrology and inspection equipment. However, it also underscored the importance of automation and remote monitoring in semiconductor fabs. As a result, demand for AI-enabled, cloud-connected inspection tools surged during the recovery phase. Vendors accelerated the development of contactless and predictive maintenance solutions to reduce human intervention. The crisis also prompted strategic shifts toward regional manufacturing and supply chain resilience.

The lithography metrology segment is expected to be the largest during the forecast period

The lithography metrology segment is expected to account for the largest market share during the forecast period, due to its critical role in ensuring pattern fidelity and overlay accuracy at advanced nodes. As EUV lithography becomes mainstream, the need for precise measurement of critical dimensions and line-edge roughness intensifies. These tools are essential for detecting patterning defects that could compromise device performance. Continuous improvements in resolution, sensitivity, and throughput are driving adoption across leading-edge fabs. Equipment providers are also integrating AI and machine learning to enhance defect classification and process control.

The OSAT providers segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the OSAT providers segment is predicted to witness the highest growth rate, driven by the rising complexity of advanced packaging. As chipmakers increasingly rely on OSATs for 2.5D/3D integration and heterogeneous assembly, demand for specialized metrology tools is surging. These providers are investing in high-precision inspection systems to ensure interconnect reliability and package integrity. Innovations in X-ray, acoustic, and hybrid metrology are being rapidly adopted to meet stringent quality standards. The growing trend of fab-lite models and design outsourcing further amplifies OSATs' strategic importance. This shift positions them as key growth drivers in the evolving semiconductor landscape.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share, fueled by robust semiconductor manufacturing ecosystems in countries like China, Taiwan, South Korea, and Japan. These nations are home to major foundries and IDMs that are aggressively investing in advanced metrology infrastructure. Government initiatives supporting domestic chip production and R&D are further accelerating regional growth. The presence of leading equipment vendors and a strong OSAT base enhances the demand for inspection tools. Additionally, the region's focus on AI, 5G, and automotive electronics is driving the need for higher chip quality.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by strong investments in semiconductor R&D and fab expansion. The U.S. CHIPS Act and related funding initiatives are catalyzing domestic manufacturing and equipment innovation. Leading players are developing next-gen metrology tools to support sub-5nm and 3D packaging technologies. The region's emphasis on AI-driven analytics, cybersecurity, and automation is enhancing inspection capabilities. Collaborations between academia, national labs, and industry are fostering a vibrant innovation ecosystem.

Key players in the market

Some of the key players in Semiconductor Metrology and Inspection Equipment Market include KLA Corporation, Toray Engineering Co., Ltd., Hitachi High-Tech Corporation, JEOL Ltd., Applied Materials Inc., Lasertec Corporation, Onto Innovation Inc., SCREEN Holdings Co., Ltd., ASML Holding N.V., Advantest Corporation, Tokyo Electron Limited, Nikon Corporation, Nova Ltd., Carl Zeiss SMT GmbH, and Camtek Ltd.

Key Developments:

In August 2025, Hitachi Energy has completed the acquisition of the remaining stake in eks Energy, a technology and market leader in power electronics and control solutions to deliver a scalable, flexible, and complete approach for energy storage customers. Hitachi Energy acquired a majority stake in eks Energy.

In April 2025, Major League Pickleball (MLP) and Japanese materials manufacturer Toray Industries, Inc. announced an agreement naming Toray a platinum partner with Kitchen branding at the professional, coed, team pickleball league's events. This partnership makes Toray the first-ever Asia-based partner of MLP, expanding the league's brand reach internationally as pickleball continues its unmatched domestic growth.

Equipment Types Covered:

Lithography Metrology
Wafer Inspection
Thin Film Metrology
Other Equipment Types

Technologies Covered:

Optical Metrology
Infrared and Thermal Imaging
Electron Beam Metrology
X-ray Metrology
Scanning Probe Metrology

Applications Covered:

Front-End Semiconductor Manufacturing
Back-End Semiconductor Packaging
R&D and Process Development
Quality Assurance and Reliability Testing
Other Applications

End Users Covered:

Integrated Device Manufacturers (IDMs)
Foundries
Outsourced Semiconductor Assembly and Test (OSAT) Providers
Research Institutions
Other End Users

Regions Covered:

North America
- US
- Canada
- Mexico
Europe
- Germany
- UK
- Italy
- France
- Spain
- Rest of Europe
Asia Pacific
- Japan
- China
- India
- Australia
- New Zealand
- South Korea
- Rest of Asia Pacific
South America
- Argentina
- Brazil
- Chile
- Rest of South America
Middle East & Africa
- Saudi Arabia
- UAE
- Qatar
- South Africa
- Rest of Middle East & Africa

What our report offers:

Market share assessments for the regional and country-level segments
Strategic recommendations for the new entrants
Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
Strategic recommendations in key business segments based on the market estimations
Competitive landscaping mapping the key common trends
Company profiling with detailed strategies, financials, and recent developments
Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

Company Profiling
- Comprehensive profiling of additional market players (up to 3)
- SWOT Analysis of key players (up to 3)
Regional Segmentation
- Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
Competitive Benchmarking
- Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

1 Executive Summary

2 Preface

2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
- 2.4.1 Data Mining
- 2.4.2 Data Analysis
- 2.4.3 Data Validation
- 2.4.4 Research Approach
2.5 Research Sources
- 2.5.1 Primary Research Sources
- 2.5.2 Secondary Research Sources
- 2.5.3 Assumptions

3 Market Trend Analysis

3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 Technology Analysis
3.7 Application Analysis
3.8 End User Analysis
3.9 Emerging Markets
3.10 Impact of Covid-19

4 Porters Five Force Analysis

4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry

5 Global Semiconductor Metrology and Inspection Equipment Market, By Equipment Type

5.1 Introduction
5.2 Lithography Metrology
- 5.2.1 Overlay Metrology
- 5.2.2 Critical Dimension (CD) Metrology
- 5.2.3 Mask Inspection/Metrology
5.3 Wafer Inspection
- 5.3.1 Defect Inspection
- 5.3.2 Unpatterned Wafer Inspection
- 5.3.3 Patterned Inspection
5.4 Thin Film Metrology
- 5.4.1 Film Thickness Measurement
- 5.4.2 Refractive Index Profiling
5.5 Other Equipment Types

6 Global Semiconductor Metrology and Inspection Equipment Market, By Technology

6.1 Introduction
6.2 Optical Metrology
6.3 Infrared and Thermal Imaging
6.4 Electron Beam Metrology
6.5 X-ray Metrology
6.6 Scanning Probe Metrology

7 Global Semiconductor Metrology and Inspection Equipment Market, By Application

7.1 Introduction
7.2 Front-End Semiconductor Manufacturing
7.3 Back-End Semiconductor Packaging
7.4 R&D and Process Development
7.5 Quality Assurance and Reliability Testing
7.6 Other Applications

8 Global Semiconductor Metrology and Inspection Equipment Market, By End User

8.1 Introduction
8.2 Integrated Device Manufacturers (IDMs)
8.3 Foundries
8.4 Outsourced Semiconductor Assembly and Test (OSAT) Providers
8.5 Research Institutions
8.6 Other End Users

9 Global Semiconductor Metrology and Inspection Equipment Market, By Geography

9.1 Introduction
9.2 North America
- 9.2.1 US
- 9.2.2 Canada
- 9.2.3 Mexico
9.3 Europe
- 9.3.1 Germany
- 9.3.2 UK
- 9.3.3 Italy
- 9.3.4 France
- 9.3.5 Spain
- 9.3.6 Rest of Europe
9.4 Asia Pacific
- 9.4.1 Japan
- 9.4.2 China
- 9.4.3 India
- 9.4.4 Australia
- 9.4.5 New Zealand
- 9.4.6 South Korea
- 9.4.7 Rest of Asia Pacific
9.5 South America
- 9.5.1 Argentina
- 9.5.2 Brazil
- 9.5.3 Chile
- 9.5.4 Rest of South America
9.6 Middle East & Africa
- 9.6.1 Saudi Arabia
- 9.6.2 UAE
- 9.6.3 Qatar
- 9.6.4 South Africa
- 9.6.5 Rest of Middle East & Africa

10 Key Developments

10.1 Agreements, Partnerships, Collaborations and Joint Ventures
10.2 Acquisitions & Mergers
10.3 New Product Launch
10.4 Expansions
10.5 Other Key Strategies

11 Company Profiling

11.1 KLA Corporation
11.2 Toray Engineering Co., Ltd.
11.3 Hitachi High-Tech Corporation
11.4 JEOL Ltd.
11.5 Applied Materials Inc.
11.6 Lasertec Corporation
11.7 Onto Innovation Inc.
11.8 SCREEN Holdings Co., Ltd.
11.9 ASML Holding N.V.
11.10 Advantest Corporation
11.11 Tokyo Electron Limited
11.12 Nikon Corporation
11.13 Nova Ltd.
11.14 Carl Zeiss SMT GmbH
11.15 Camtek Ltd.

簡介目錄圖表

List of Tables

Table 1 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Region (2024-2032) ($MN)
Table 2 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Equipment Type (2024-2032) ($MN)
Table 3 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Lithography Metrology (2024-2032) ($MN)
Table 4 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Overlay Metrology (2024-2032) ($MN)
Table 5 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Critical Dimension (CD) Metrology (2024-2032) ($MN)
Table 6 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Mask Inspection/Metrology (2024-2032) ($MN)
Table 7 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Wafer Inspection (2024-2032) ($MN)
Table 8 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Defect Inspection (2024-2032) ($MN)
Table 9 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Unpatterned Wafer Inspection (2024-2032) ($MN)
Table 10 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Patterned Inspection (2024-2032) ($MN)
Table 11 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Thin Film Metrology (2024-2032) ($MN)
Table 12 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Film Thickness Measurement (2024-2032) ($MN)
Table 13 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Refractive Index Profiling (2024-2032) ($MN)
Table 14 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Other Equipment Types (2024-2032) ($MN)
Table 15 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Technology (2024-2032) ($MN)
Table 16 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Optical Metrology (2024-2032) ($MN)
Table 17 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Infrared and Thermal Imaging (2024-2032) ($MN)
Table 18 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Electron Beam Metrology (2024-2032) ($MN)
Table 19 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By X-ray Metrology (2024-2032) ($MN)
Table 20 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Scanning Probe Metrology (2024-2032) ($MN)
Table 21 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Application (2024-2032) ($MN)
Table 22 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Front-End Semiconductor Manufacturing (2024-2032) ($MN)
Table 23 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Back-End Semiconductor Packaging (2024-2032) ($MN)
Table 24 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By R&D and Process Development (2024-2032) ($MN)
Table 25 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Quality Assurance and Reliability Testing (2024-2032) ($MN)
Table 26 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Other Applications (2024-2032) ($MN)
Table 27 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By End User (2024-2032) ($MN)
Table 28 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Integrated Device Manufacturers (IDMs) (2024-2032) ($MN)
Table 29 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Foundries (2024-2032) ($MN)
Table 30 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Outsourced Semiconductor Assembly and Test (OSAT) Providers (2024-2032) ($MN)
Table 31 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Research Institutions (2024-2032) ($MN)
Table 32 Global Semiconductor Metrology and Inspection Equipment Market Outlook, By Other End Users (2024-2032) ($MN)