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市場調查報告書
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1836411

先進封裝技術市場預測（至2032年）：按封裝技術、互連方法、材料類型、裝置架構、最終用戶和地區進行的全球分析

Advanced Packaging Technologies Market Forecasts to 2032 - Global Analysis By Packaging Technology, Interconnect Method, Material Type, Device Architecture, End User, and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，全球先進封裝技術市場預計在 2025 年達到 295 億美元，到 2032 年將達到 506 億美元，預測期內的複合年成長率為 8.0%。

先進封裝技術專注於創新的半導體封裝解決方案，例如2.5D/3D IC、覆晶、晶圓層次電子構裝和異質整合。這些技術可提升家用電子電器、通訊、汽車和工業應用領域設備的性能、能源效率和小型化程度。對高效能運算、物聯網設備和小型化電子產品日益成長的需求正在推動這一領域的成長。溫度控管互連技術和製造流程的進步，加上產業研發投入，正在推動全球先進封裝解決方案的採用。

小型化和性能要求

微型化和高性能需求是先進封裝的核心驅動力。隨著裝置尺寸的縮小和運算密度的提升，設計人員正在尋找能夠縮短互連長度、改善散熱並實現邏輯、記憶體和感測器異質整合整合的封裝。此外，覆晶、晶圓級扇出和 3D 堆疊技術能夠滿足 AI 加速器、行動處理器和高頻寬記憶體所需的電氣和熱性能。這種融合迫使代工廠、OSAT 和 OEM 採用先進的基板和穿透矽通孔，並在設備和製程開發方面投入巨資，以滿足更嚴格的可靠性和產量比率目標，並降低製造過程中的差異性。

經費和研發成本高

先進封裝需要大量的資本支出和持續的研發投入，這限制了其應用，尤其是在小型代工廠和OSAT廠商。晶圓級扇出、矽通孔和混合鍵合設備的購置和維護成本高昂，而製程認證和產量比率則需要漫長而昂貴的工程週期。此外，基板和材料的開發需要整個供應鏈的密切協作，這需要在工具、材料和測試能力方面投入大量的前期投資。這些經濟負擔提高了進入門檻，減緩了技術的採用，並限制了新參與企業的上市速度。

節能包裝解決方案的需求不斷增加

節能封裝需求的不斷成長，為供應商和整合商帶來了實實在在的商機。隨著處理器和人工智慧加速器不斷突破功率密度的極限，降低熱阻、改善功率分配並實現更嚴格電壓調節的封裝創新技術正變得具有商業性價值。此外，面向行動裝置、邊緣節點和資料中心的節能設計正受到原始設備製造商 (OEM) 的青睞，旨在降低營運成本並支持永續性目標。此外，節能封裝可以解鎖新的架構，例如基於晶片組 (chiplet) 的 SiP 和異質堆疊，從而提高每瓦性能、拓展潛在市場，並在汽車和工業應用中創造新的收益來源。

智慧財產權風險

智慧財產權侵權對先進封裝領域的相關人員構成重大威脅。複雜封裝涉及專有基板、鍵合製程和整合方案，這些都需要大量的研發投入。這些專有技術透過供應商、承包商或國際轉移而流失或洩露，可能會削弱競爭優勢。此外，圍繞混合連接和異質整合的重疊專利和不明確的標準會增加訴訟風險並延遲商業化。企業必須透過投資強而有力的智慧財產權保護、防禦性專利和安全的供應鏈管理來保護自己。

COVID-19的影響：

新冠疫情導致供應鏈衝擊、工廠停工和零件短缺，從而擾亂了先進封裝產業，導致產能擴張和產品發布延遲。儘管資料中心和電訊需求有所成長，但一些消費領域的需求最初有所減弱，導致復甦模式不平衡。疫情也加速了對彈性採購和自動化的投資，促使領導企業實現製造區域多元化，並優先考慮設施升級，以減輕未來的中斷影響，縮短認證週期，同時提升區域製造地的價值。

預測期內，覆晶構裝市場預計將成為最大的市場

預計覆晶構裝領域將在預測期內佔據最大的市場佔有率。這反映了覆晶的技術優勢：更短的互連長度、更佳的熱傳導性能以及適用於高密度邏輯和記憶體整合的強大電氣性能。處理器、GPU 和網路 ASIC 的主要 OEM藍圖繼續青睞覆晶組裝，許多 OSAT 廠商正在擴大凸塊、底部填充和基板的生產能力，以保持產量。此外，與較新的晶圓級方法相比，覆晶成熟的供應鏈和成熟的產量比率實踐使其具有商業性吸引力，即使扇出型和 3D 選項不斷增加，也能保持其領先地位。

預測期內，直接/混合鍵結（Cu-Cu鍵結）領域預計將以最高複合年成長率成長

預計直接/混合鍵結（銅-銅鍵結）領域將在預測期內呈現最高成長率。隨著裝置架構師追求真正的3D整合和更高的互連密度，銅-銅混合鍵結比傳統的焊料和微凸塊方法具有更優異的電氣性能和更小的尺寸。這項技術對於HBM堆疊、高階記憶體和AI加速器尤其重要，因為它們需要超低延遲和高頻寬。此外，設備供應商和代工廠正在優先考慮混合鍵合工具的開發和認證計劃，以加速生產準備並滿足邏輯和記憶體應用市場的需求。

佔比最大的地區：

預計亞太地區將在預測期內佔據最大的市場佔有率。這一優勢得益於其豐富的生態系統，包括代工廠、OSAT、基板製造商和材料供應商，這些供應商主要集中在台灣、韓國、中國大陸、馬來西亞和日本。強而有力的政府獎勵措施、本地專業知識和現有規模加快了新封裝流程的上市時間，而靠近主要OEM廠商和超大規模資料中心業者的地理位置則確保了高產量需求。此外，持續的產能和人才發展投資支持了產量的持續成長，進一步吸引了資本、技術夥伴關係和人才庫。

複合年成長率最高的地區：

預計亞太地區在預測期內將呈現最高的複合年成長率，因為各國政府和產業正在加快對封裝、測試和基板能力的投資，以從下一代半導體中獲取價值。在馬來西亞、中國大陸、台灣和韓國，產能擴充和激勵計畫正在推動混合鍵合和扇出型晶圓級封裝等先進封裝製程的快速發展。此外，人才、設備供應商和超大規模資料中心業者的集中正在縮短認證週期，並提高新封裝架構的採用率。與關鍵客戶的區域合作正在加速商業化進程，這將在預測期內顯著推動區域成長。

免費客製化服務：

此報告的訂閱者可以使用以下免費自訂選項之一：

  • 公司簡介
    • 全面分析其他市場參與者（最多 3 家公司）
    • 主要企業的SWOT分析（最多3家公司）
  • 區域細分
    • 根據客戶興趣對主要國家進行的市場估計、預測和複合年成長率（註：基於可行性檢查）
  • 競爭基準化分析
    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 數據分析
    • 數據檢驗
    • 研究途徑
  • 研究材料
    • 主要研究資料
    • 次級研究資訊來源
    • 先決條件

第3章市場走勢分析

  • 驅動程式
  • 抑制因素
  • 機會
  • 威脅
  • 技術分析
  • 最終用戶分析
  • 新興市場
  • COVID-19的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買方的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭對手之間的競爭

5. 全球先進封裝技術市場（依封裝技術）

  • 覆晶構裝
    • 覆晶球柵陣列（FCBGA）
    • 覆晶尺寸封裝（FCCSP）
  • 晶圓級構裝（WLP）
    • 扇出型晶圓級封裝（FO-WLP/FOPLP）
    • 扇入晶圓級封裝（FI-WLP）
  • 2.5D/3D積體電路（IC）封裝
    • 2.5D封裝
    • 3D IC堆疊
  • 系統級封裝(SiP)/系統模組 (SoM)
  • 嵌入式晶片封裝

6. 全球先進封裝技術市場（依互連方法）

  • 焊料凸塊/微凸塊
  • 銅柱
  • 直接鍵結/混合鍵結（Cu-Cu鍵結）
  • 引線接合法

7. 全球先進封裝技術市場（依材料類型）

  • 基板和中介層
    • 有機基材
    • 矽中介層
    • 玻璃基板/中介層
  • 晶片黏接材料
    • 環氧樹脂基
    • 焊錫基底
  • 封裝和底部填充材料
    • 環氧模塑（EMC）
    • 非導電漿料/薄膜（NCP/NCF）底部填充材料
  • 熱干擾材料（TIM）
  • 鍵合線

8. 全球先進封裝技術市場-元件架構

  • 2D IC
  • 3D IC
  • 晶片

9. 全球先進封裝技術市場（依最終用戶）

  • 家電
  • 車
  • 資料中心和人工智慧加速器
  • 資訊科技/通訊
  • 工業和物聯網
  • 醫療保健和醫療設備
  • 航太和國防
  • 其他最終用戶

第 10 章：全球先進封裝技術市場（按地區）

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第11章 重大進展

  • 協議、夥伴關係、合作和合資企業
  • 收購與合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第 12 章：公司概況

  • Amkor Technology, Inc.
  • Taiwan Semiconductor Manufacturing Company Limited（TSMC）
  • Advanced Semiconductor Engineering Inc.（ASE Group）
  • Intel Corporation
  • JCET Group Co., Ltd.
  • Samsung Electronics Co., Ltd.
  • ASMPT SMT Solutions
  • IPC International, Inc.
  • Prodrive Technologies BV
  • Broadcom Inc.
  • Texas Instruments Incorporated
  • SK hynix Inc.
  • Applied Materials, Inc.
  • BE Semiconductor Industries NV（BESI）
  • Advanced Micro Devices, Inc.（AMD）
  • GlobalFoundries Inc.
  • Siliconware Precision Industries Co., Ltd.（SPIL）
  • J-Devices Corporation
  • DISCO Corporation
  • Ajinomoto Co., Inc.
Product Code: SMRC31535

According to Stratistics MRC, the Global Advanced Packaging Technologies Market is accounted for $29.5 billion in 2025 and is expected to reach $50.6 billion by 2032 growing at a CAGR of 8.0% during the forecast period. Advanced Packaging Technologies focuses on innovative semiconductor packaging solutions, including 2.5D/3D ICs, flip-chip, wafer-level packaging, and heterogeneous integration. These technologies enhance performance, power efficiency, and miniaturization of devices used in consumer electronics, telecommunications, automotive, and industrial applications. Growth is driven by rising demand for high-performance computing, IoT devices, and compact electronics. Advancements in thermal management interconnect technologies, and manufacturing processes, coupled with industry investment in R&D, are propelling the adoption of advanced packaging solutions globally.

Market Dynamics:

Driver:

Miniaturization and Performance Demands

Miniaturization and higher performance requirements are central drivers for advanced packaging. As devices become smaller and compute densities rise, designers demand packages that shorten interconnect lengths, improve thermal dissipation, and enable heterogeneous integration of logic, memory, and sensors. Furthermore, flip-chip, fan-out wafer-level, and 3D stacking techniques deliver the electrical and thermal performance required by AI accelerators, mobile processors, and high-bandwidth memory. This convergence forces foundries, OSATs, and OEMs to adopt advanced substrates and through-silicon vias, and to invest heavily in equipment and process development to satisfy stricter reliability and yield targets and reduce manufacturing variability.

Restraint:

High Capital and R&D Costs

Advanced packaging requires substantial capital expenditure and sustained R&D investment, which constrain adoption especially among smaller foundries and OSATs. Equipment for wafer-level fan-out, through-silicon vias, and hybrid bonding carries high purchase and maintenance costs, while process qualification and yield ramp-up demand lengthy, expensive engineering cycles. Additionally, substrate and material development requires close collaboration across supply chains, increasing upfront spending on tooling, materials, and test capabilities. These financial burdens raise barriers to entry, slow technology diffusion, and limit how quickly new players can enter the market.

Opportunity:

Increasing demand for energy-efficient packaging solutions

Growing demand for energy-efficient packaging presents a tangible opportunity for suppliers and integrators. As processors and AI accelerators push power density limits, packaging innovations that lower thermal resistance, improve power distribution, and enable tighter voltage regulation become commercially valuable. Moreover, energy-aware designs for mobile devices, edge nodes, and data centers reduce operating expense and support sustainability goals, attracting OEM preference. Additionally, energy-efficient packaging can unlock new architectures such as chiplet-based SiP and heterogeneous stacks, improving performance per watt and broadening addressable markets and open revenue streams in automotive and industrial applications.

Threat:

Intellectual Property Risks

Intellectual property exposure poses a meaningful threat to advanced packaging stakeholders. Complex packaging involves proprietary substrates, bonding processes, and integration recipes that represent material R&D investment; loss or leakage of this know-how through suppliers, contractors, or international transfers can erode competitive advantage. Moreover, overlapping patents and unclear standards around hybrid bonding and heterogeneous integration increase litigation risk and slow commercialization. Companies must invest in robust IP protection, defensive patenting, and secure supply-chain controls to protect.

Covid-19 Impact:

COVID-19 disrupted advanced packaging through supply-chain shocks, factory slowdowns, and component shortages that delayed capacity expansion and product launches. Initially, demand softened for some consumer segments even as datacenter and telecom needs rose, producing uneven recovery patterns. The pandemic also accelerated investment in resilient sourcing and automation, prompting lead firms to diversify manufacturing geographies and to prioritize equipment upgrades to mitigate future disruptions and shorten qualification timelines while reinforcing the value of regional manufacturing hubs.

The flip-chip packaging segment is expected to be the largest during the forecast period

The flip-chip packaging segment is expected to account for the largest market share during the forecast period. This outcome reflects flip-chip's technical advantages reduced interconnect length, improved heat conduction, and robust electrical performance that suit high-density logic and memory integration. Major OEM roadmaps for processors, GPUs, and network ASICs continue to favor flip-chip assembly, and many OSATs are expanding bumping, underfill, and substrate capacity to sustain throughput. Furthermore, flip-chip's mature supply chain and established yield practices make it commercially attractive relative to newer wafer-level approaches, enabling it to retain leadership even as fan-out and 3D options grow.

The direct/hybrid bonding (Cu-to-Cu Bonding) segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the direct/hybrid bonding (Cu-to-Cu Bonding) segment is predicted to witness the highest growth rate. As device architects pursue true 3D integration and higher interconnect density, Cu-to-Cu hybrid bonding offers superior electrical performance and smaller form factors than traditional solder or micro-bump approaches. This technology is particularly critical for HBM stacks, advanced memory, and AI accelerators that require ultralow latency and high bandwidth. Additionally, equipment suppliers and foundries are prioritizing hybrid-bond tool development and qualification programs, accelerating volume readiness and addressing markets across logic and memory applications.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share. This dominance stems from a deep ecosystem of foundries, OSATs, substrate makers, and materials suppliers clustered across Taiwan, South Korea, China, Malaysia, and Japan. Strong government incentives, local expertise, and existing scale reduce time-to-market for new packaging processes while proximity to large OEMs and hyperscalers secures high-volume demand. Additionally, continual investment in capacity and workforce development supports sustained production growth and attracts further capital and technology partnerships and talent pools.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR as governments and industry accelerate investments in packaging, testing, and substrate capabilities to capture value from next-generation semiconductors. Capacity additions and incentive schemes in Malaysia, China, Taiwan, and South Korea enable rapid scaling of advanced processes such as hybrid bonding and fan-out wafer-level packaging. Moreover, clustering of talent, equipment suppliers, and hyperscalers shortens qualification cycles and supports stronger adoption rates for new packaging architectures. Local co-development with lead customers accelerates commercialization and fuels regional growth over the forecast period significantly.

Key players in the market

Some of the key players in Advanced Packaging Technologies Market include Amkor Technology, Inc., Taiwan Semiconductor Manufacturing Company Limited (TSMC), Advanced Semiconductor Engineering Inc. (ASE Group), Intel Corporation, JCET Group Co., Ltd., Samsung Electronics Co., Ltd., ASMPT SMT Solutions, IPC International, Inc., Prodrive Technologies B.V., Broadcom Inc., Texas Instruments Incorporated, SK hynix Inc., Applied Materials, Inc., BE Semiconductor Industries N.V. (BESI), Advanced Micro Devices, Inc. (AMD), GlobalFoundries Inc., Siliconware Precision Industries Co., Ltd. (SPIL), J-Devices Corporation, DISCO Corporation, and Ajinomoto Co., Inc.

Key Developments:

In September 2025, TSMC showcased advancements in CoWoS (Chip-on-Wafer-on-Substrate) and SoIC (System-on-Integrated-Chip) during its Open Innovation Platform event, targeting next-gen HPC and automotive systems.

In July 2025, JCET launched its new XDFOI (eXtended Die Fan-Out Interposer) technology, further enhancing heterogeneous integration for consumer electronics.

In May 2025, Amkor published that it had entered into a Strategic Partnership with Intel to expand EMIB (Embedded Multi-Die Interconnect Bridge) packaging capacity in the U.S.

Packaging Technologies Covered:

  • Flip-Chip Packaging
  • Wafer-Level Packaging (WLP)
  • 2.5D/3D Integrated Circuit (IC) Packaging
  • System-in-Package (SiP) / System-on-Module (SoM)
  • Embedded Die Packaging

Interconnect Methods Covered:

  • Solder Bumps/Microbumps
  • Copper Pillars
  • Direct/Hybrid Bonding (Cu-to-Cu Bonding)
  • Wire Bonding

Material Types Covered:

  • Substrates & Interposers
  • Die Attach Materials
  • Encapsulation & Underfill Materials
  • Thermal Interface Materials (TIMs)
  • Bonding Wires

Device Architectures Covered:

  • 2D Ics
  • 3D Ics
  • Chiplets

End Users Covered:

  • Consumer Electronics
  • Automotive
  • Data Centers & AI Accelerators
  • IT & Telecommunication
  • Industrial & IoT
  • Healthcare & Medical Devices
  • Aerospace & Defense
  • Other End Users

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Advanced Packaging Technologies Market, By Packaging Technology

  • 5.1 Introduction
  • 5.2 Flip-Chip Packaging
    • 5.2.1 Flip-Chip Ball Grid Array (FCBGA)
    • 5.2.2 Flip-Chip Chip Scale Package (FCCSP)
  • 5.3 Wafer-Level Packaging (WLP)
    • 5.3.1 Fan-Out Wafer-Level Packaging (FO-WLP / FOPLP)
    • 5.3.2 Fan-In Wafer-Level Packaging (FI-WLP)
  • 5.4 2.5D/3D Integrated Circuit (IC) Packaging
    • 5.4.1 2.5D Packaging
    • 5.4.2 3D IC Stacking
  • 5.5 System-in-Package (SiP) / System-on-Module (SoM)
  • 5.6 Embedded Die Packaging

6 Global Advanced Packaging Technologies Market, By Interconnect Method

  • 6.1 Introduction
  • 6.2 Solder Bumps/Microbumps
  • 6.3 Copper Pillars
  • 6.4 Direct/Hybrid Bonding (Cu-to-Cu Bonding)
  • 6.5 Wire Bonding

7 Global Advanced Packaging Technologies Market, By Material Type

  • 7.1 Introduction
  • 7.2 Substrates & Interposers
    • 7.2.1 Organic Substrates
    • 7.2.2 Silicon Interposers
    • 7.2.3 Glass Substrates/Interposers
  • 7.3 Die Attach Materials
    • 7.3.1 Epoxy-based
    • 7.3.2 Solder-based
  • 7.4 Encapsulation & Underfill Materials
    • 7.4.1 Epoxy Molding Compounds (EMC)
    • 7.4.2 Non-Conductive Paste/Film (NCP/NCF) Underfill
  • 7.5 Thermal Interface Materials (TIMs)
  • 7.6 Bonding Wires

8 Global Advanced Packaging Technologies Market, By Device Architecture

  • 8.1 Introduction
  • 8.2 2D Ics
  • 8.3 3D Ics
  • 8.4 Chiplets

9 Global Advanced Packaging Technologies Market, By End User

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Automotive
  • 9.4 Data Centers & AI Accelerators
  • 9.5 IT & Telecommunication
  • 9.6 Industrial & IoT
  • 9.7 Healthcare & Medical Devices
  • 9.8 Aerospace & Defense
  • 9.9 Other End Users

10 Global Advanced Packaging Technologies Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Amkor Technology, Inc.
  • 12.2 Taiwan Semiconductor Manufacturing Company Limited (TSMC)
  • 12.3 Advanced Semiconductor Engineering Inc. (ASE Group)
  • 12.4 Intel Corporation
  • 12.5 JCET Group Co., Ltd.
  • 12.6 Samsung Electronics Co., Ltd.
  • 12.7 ASMPT SMT Solutions
  • 12.8 IPC International, Inc.
  • 12.9 Prodrive Technologies B.V.
  • 12.10 Broadcom Inc.
  • 12.11 Texas Instruments Incorporated
  • 12.12 SK hynix Inc.
  • 12.13 Applied Materials, Inc.
  • 12.14 BE Semiconductor Industries N.V. (BESI)
  • 12.15 Advanced Micro Devices, Inc. (AMD)
  • 12.16 GlobalFoundries Inc.
  • 12.17 Siliconware Precision Industries Co., Ltd. (SPIL)
  • 12.18 J-Devices Corporation
  • 12.19 DISCO Corporation
  • 12.20 Ajinomoto Co., Inc.

List of Tables

  • Table 1 Global Advanced Packaging Technologies Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Advanced Packaging Technologies Market Outlook, By Packaging Technology (2024-2032) ($MN)
  • Table 3 Global Advanced Packaging Technologies Market Outlook, By Flip-Chip Packaging (2024-2032) ($MN)
  • Table 4 Global Advanced Packaging Technologies Market Outlook, By Flip-Chip Ball Grid Array (FCBGA) (2024-2032) ($MN)
  • Table 5 Global Advanced Packaging Technologies Market Outlook, By Flip-Chip Chip Scale Package (FCCSP) (2024-2032) ($MN)
  • Table 6 Global Advanced Packaging Technologies Market Outlook, By Wafer-Level Packaging (WLP) (2024-2032) ($MN)
  • Table 7 Global Advanced Packaging Technologies Market Outlook, By Fan-Out Wafer-Level Packaging (FO-WLP / FOPLP) (2024-2032) ($MN)
  • Table 8 Global Advanced Packaging Technologies Market Outlook, By Fan-In Wafer-Level Packaging (FI-WLP) (2024-2032) ($MN)
  • Table 9 Global Advanced Packaging Technologies Market Outlook, By 2.5D/3D Integrated Circuit (IC) Packaging (2024-2032) ($MN)
  • Table 10 Global Advanced Packaging Technologies Market Outlook, By 2.5D Packaging (2024-2032) ($MN)
  • Table 11 Global Advanced Packaging Technologies Market Outlook, By 3D IC Stacking (2024-2032) ($MN)
  • Table 12 Global Advanced Packaging Technologies Market Outlook, By System-in-Package (SiP) / System-on-Module (SoM) (2024-2032) ($MN)
  • Table 13 Global Advanced Packaging Technologies Market Outlook, By Embedded Die Packaging (2024-2032) ($MN)
  • Table 14 Global Advanced Packaging Technologies Market Outlook, By Interconnect Method (2024-2032) ($MN)
  • Table 15 Global Advanced Packaging Technologies Market Outlook, By Solder Bumps/Microbumps (2024-2032) ($MN)
  • Table 16 Global Advanced Packaging Technologies Market Outlook, By Copper Pillars (2024-2032) ($MN)
  • Table 17 Global Advanced Packaging Technologies Market Outlook, By Direct/Hybrid Bonding (Cu-to-Cu Bonding) (2024-2032) ($MN)
  • Table 18 Global Advanced Packaging Technologies Market Outlook, By Wire Bonding (2024-2032) ($MN)
  • Table 19 Global Advanced Packaging Technologies Market Outlook, By Material Type (2024-2032) ($MN)
  • Table 20 Global Advanced Packaging Technologies Market Outlook, By Substrates & Interposers (2024-2032) ($MN)
  • Table 21 Global Advanced Packaging Technologies Market Outlook, By Organic Substrates (2024-2032) ($MN)
  • Table 22 Global Advanced Packaging Technologies Market Outlook, By Silicon Interposers (2024-2032) ($MN)
  • Table 23 Global Advanced Packaging Technologies Market Outlook, By Glass Substrates/Interposers (2024-2032) ($MN)
  • Table 24 Global Advanced Packaging Technologies Market Outlook, By Die Attach Materials (2024-2032) ($MN)
  • Table 25 Global Advanced Packaging Technologies Market Outlook, By Epoxy-based (2024-2032) ($MN)
  • Table 26 Global Advanced Packaging Technologies Market Outlook, By Solder-based (2024-2032) ($MN)
  • Table 27 Global Advanced Packaging Technologies Market Outlook, By Encapsulation & Underfill Materials (2024-2032) ($MN)
  • Table 28 Global Advanced Packaging Technologies Market Outlook, By Epoxy Molding Compounds (EMC) (2024-2032) ($MN)
  • Table 29 Global Advanced Packaging Technologies Market Outlook, By Non-Conductive Paste/Film (NCP/NCF) Underfill (2024-2032) ($MN)
  • Table 30 Global Advanced Packaging Technologies Market Outlook, By Thermal Interface Materials (TIMs) (2024-2032) ($MN)
  • Table 31 Global Advanced Packaging Technologies Market Outlook, By Bonding Wires (2024-2032) ($MN)
  • Table 32 Global Advanced Packaging Technologies Market Outlook, By Device Architecture (2024-2032) ($MN)
  • Table 33 Global Advanced Packaging Technologies Market Outlook, By 2D ICs (2024-2032) ($MN)
  • Table 34 Global Advanced Packaging Technologies Market Outlook, By 3D ICs (2024-2032) ($MN)
  • Table 35 Global Advanced Packaging Technologies Market Outlook, By Chiplets (2024-2032) ($MN)
  • Table 36 Global Advanced Packaging Technologies Market Outlook, By End User (2024-2032) ($MN)
  • Table 37 Global Advanced Packaging Technologies Market Outlook, By Consumer Electronics (2024-2032) ($MN)
  • Table 38 Global Advanced Packaging Technologies Market Outlook, By Automotive (2024-2032) ($MN)
  • Table 39 Global Advanced Packaging Technologies Market Outlook, By Data Centers & AI Accelerators (2024-2032) ($MN)
  • Table 40 Global Advanced Packaging Technologies Market Outlook, By IT & Telecommunication (2024-2032) ($MN)
  • Table 41 Global Advanced Packaging Technologies Market Outlook, By Industrial & IoT (2024-2032) ($MN)
  • Table 42 Global Advanced Packaging Technologies Market Outlook, By Healthcare & Medical Devices (2024-2032) ($MN)
  • Table 43 Global Advanced Packaging Technologies Market Outlook, By Aerospace & Defense (2024-2032) ($MN)
  • Table 44 Global Advanced Packaging Technologies Market Outlook, By Other End Users (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.