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市場調查報告書

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1833600

2032 年直接晶片再利用市場預測：按晶片類型、來源、製程、最終用戶和地區進行的全球分析

Direct Chip Reuse Market Forecasts to 2032 - Global Analysis By Chip Type, Source, Process, End User and By Geography

出版日期: 2025年10月01日 | 出版商:

Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

簡介目錄圖表

根據 Stratistics MRC 的數據，全球直接吸頭再利用市場預計在 2025 年達到 25 億美元，到 2032 年將達到 91 億美元，預測期內的複合年成長率為 20.2%。

直接晶片再利用強調永續的半導體實踐，即直接翻新、返工和再利用廢棄電子設備中的晶片，而無需全面再製造。這種方法可以減少廢棄物，節省原料，降低生產成本，同時保持效能。循環經濟模式日益成長的需求以及對更環保技術解決方案的監管壓力推動了這種模式的採用。關鍵領域包括家用電器、工業系統和汽車。隨著對綠色供應鏈的日益關注，製造商將永續性與成本最佳化策略結合，市場也越來越受到青睞。

經濟高效

成本效率是直接晶片再利用市場的關鍵驅動力。透過回收和檢驗記憶體和邏輯組件，製造商可以大幅降低原料和製造成本，即使在晶圓供應和前置作業時間受限的情況下也能保障利潤。再利用縮短了採購週期，並降低了更換庫存所需的資金，為原始設備製造商 (OEM)、電子製造服務 (EMS) 供應商和售後翻新商帶來了極具吸引力的收益。此外，這些成本優勢使翻新零件對價格敏感的細分市場更具吸引力，並催生了一個服務供應商生態系統，降低了中小企業的進入門檻。

品質保證挑戰

拆卸、清潔和返工過程中遇到的機械應力和熱應力可能會造成難以用傳統測試方法檢測的潛在缺陷，從而為系統整合商帶來可靠性不確定性。零散的認證標準、不一致的來源追蹤以及有限的保固框架增加了買家的檢驗成本和部署後的責任。因此，許多原始設備製造商堅持進行大量的重新測試、採取保守的使用政策，或傾向於在安全關鍵型應用中使用新零件，從而推遲了大規模的商業性應用。

測試技術的進步

自動光學檢測、X光斷層掃描和可擴展電氣測試儀如今能夠更可靠地檢測出微小的互連和封裝缺陷。結合多模態測試資料的機器學習分析和更完善的數位可追溯性，這些技術能夠提高回收零件的可用產量比率並減少廢品率。此外，標準化的測試通訊協定和平台化的品質記錄增強了買家信心，降低了重新認證成本，並使再利用從利基再製造領域轉變為眾多終端市場中可行的供應鏈角色。

智慧財產權風險

其他活動，例如探測、解封裝和詳細的電氣特性分析，可能會無意中洩露佈局提示、嵌入式韌體以及設計人員想要保護的其他專有元素。未經授權的逆向工程和不受監管的回收組件再分配可能會削弱競爭優勢，並使其面臨法律風險，尤其是在智慧財產權執法不力的司法管轄區。因此，許多無廠半導體公司和 IP 所有者在同意再利用計劃之前，都要求嚴格的合約控制、審核的再利用合作夥伴以及安全的處理流程。

COVID-19的影響：

新冠疫情對直接晶片再利用產生了雙重影響：短期營運中斷，長期策略加速。設施關閉和出入限制降低了回收和維修產能，跨站點認證延遲則直接導致產能和物流受挫。相反，疫情期間新半導體的短缺和供應鏈脆弱性促使製造商和買家探索包括回收零件在內的替代來源，並投資於再利用能力以增強韌性。最終結果是，初期營運壓力加大，隨後策略利益增強，並有針對性地投資於再利用專案。

預計記憶體晶片市場將成為預測期內最大的市場

DRAM 和 NAND 裝置產量高、封裝標準化且電氣特性易於理解，因此易於回收和重新測試。這些特性降低了單位認證成本，並支援高吞吐量的重新測試流程，使記憶體成為可重複利用專案的經濟實惠的目標。此外，內存在從伺服器和 PC 到消費性設備和工業系統等各種系統中的普及，提供了穩定的二手模組來源。此外，由於記憶體通常佔系統元件成本的很大一部分，有效的重複利用可以帶來切實的成本節省並加速商業性應用。

預計家用電子電器領域在預測期內將達到最高複合年成長率

預計家用電子電器產業將在預測期內呈現最高成長率。智慧型手機、平板電腦、穿戴式裝置和智慧家居設備正在快速更換，從而形成穩定的二手硬體流，可供次市場和翻新商大規模回收。品牌和零售商也擴大透過提供商業性獎勵，將再利用納入其翻新和回購計劃，以推廣循環經濟理念。大規模生產、不斷發展的經營模式以及永續性的壓力，共同推動著該行業再利用活動的快速成長。

佔比最大的地區：

預計亞太地區將在預測期內佔據最大的市場佔有率。該地區在電子製造業的主導地位和密集的再製造生態系統確保了其豐富的二手消費和工業電子產品來源。毗鄰主要原始設備製造商 (OEM) 和委託製造製造商的優勢縮短了逆向物流週期並簡化了認證流程，而成熟的零件交易中心和極具競爭力的營運成本則支持再利用服務的擴大。此外，該地區在全球電子組裝的長期地位使其成為大規模晶片回收和有益再利用工業化的天然中心。

複合年成長率最高的地區：

預計亞太地區將在預測期內實現最高的複合年成長率，這得益於電子產品消費的成長以及政策對循環性和供應鏈韌性的日益重視。快速的設備週轉加速了可回收零件的數量，而該地區在測試自動化、維修Start-Ups和數位可追溯性方面的投資正在提高回收率。此外，政府獎勵、不斷完善的電子廢棄物法規以及注重資源效率的產業聯盟可能會刺激新的再利用經營模式，從而推動該地區的成長。

免費客製化服務：

此報告的訂閱者可以使用以下免費自訂選項之一：

公司簡介
- 對最多三家其他市場公司進行全面分析
- 主要企業的SWOT分析（最多3家公司）
區域細分
- 根據客戶興趣對主要國家進行的市場估計、預測和複合年成長率（註：基於可行性檢查）
競爭基準化分析
- 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

北美洲
- 美國
- 加拿大
- 墨西哥
歐洲
- 德國
- 英國
- 義大利
- 法國
- 西班牙
- 其他歐洲國家
亞太地區
- 日本
- 中國
- 印度
- 澳洲
- 紐西蘭
- 韓國
- 其他亞太地區
南美洲
- 阿根廷
- 巴西
- 智利
- 其他南美
中東和非洲
- 沙烏地阿拉伯
- 阿拉伯聯合大公國
- 卡達
- 南非
- 其他中東和非洲地區

第10章：重大進展

協議、夥伴關係、合作和合資企業
收購與合併
新產品發布
業務擴展
其他關鍵策略

第11章公司概況

TSMC
Intel
Samsung Electronics
AMD
NVIDIA
Arm
Synopsys
Cadence Design Systems
ASE Technology Holding
Amkor Technology
JCET Group
GlobalFoundries
IC Recovery
Xtreme Semiconductor（Chip Recovery（TM））
ChipsRecycle
Veolia

簡介目錄圖表

Product Code: SMRC31433

According to Stratistics MRC, the Global Direct Chip Reuse Market is accounted for $2.5 billion in 2025 and is expected to reach $9.1 billion by 2032 growing at a CAGR of 20.2% during the forecast period. Direct Chip Reuse emphasizes sustainable semiconductor practices by reclaiming, reprocessing, and reusing chips directly from discarded electronics without full remanufacturing. This approach reduces electronic waste, conserves raw materials, and lowers production costs while maintaining performance. Adoption is driven by the growing demand for circular economy models and regulatory pressures toward greener technology solutions. Key sectors include consumer electronics, industrial systems, and automotive sectors. With rising focus on eco-friendly supply chains, the market is gaining traction as manufacturers embrace sustainability alongside cost optimization strategies.

Market Dynamics:

Driver:

Cost Efficiency

Cost efficiency is the primary driver for the Direct Chip Reuse market. By recovering and revalidating memory and logic components, manufacturers can materially reduce raw-material and fabrication expenses, protecting margins when wafer supply or lead times are constrained. Reuse shortens procurement cycles and lowers capital tied up in replacement inventory, benefits that appeal to OEMs, EMS providers and aftermarket refurbishers. Furthermore, these cost advantages make refurbished components attractive to price-sensitive segments and encourage service-provider ecosystems that lower the barrier to entry for smaller players.

Restraint:

Quality Assurance Challenges

The mechanical and thermal stresses introduced during removal, cleaning and rework can produce latent defects that are difficult to detect with legacy test regimes, creating reliability uncertainty for system integrators. Fragmented qualification standards, inconsistent provenance tracking and limited warranty frameworks increase validation costs and post-deployment liability for buyers. Consequently, many OEMs insist on extensive retesting, conservative usage policies, or prefer new parts for safety-critical applications, which slows large-scale commercial uptake.

Opportunity:

Advancements in Testing Technologies

Automated optical inspection, X-ray tomography, and scalable electrical testers now detect subtle interconnect and packaging defects more reliably. When combined with machine-learning analysis of multi-modal test data and improved digital traceability, these techniques raise usable yields from recovered components and reduce false rejects. Additionally, standardized test protocols and platformed quality records build buyer confidence and lower re-qualification costs, enabling reuse to move from niche refurbishing into validated supply-chain roles for many end markets.

Threat:

Intellectual Property Risks

Activities such as probing, decapsulation or detailed electrical characterization can inadvertently reveal layout hints, embedded firmware or other proprietary elements that designers wish to safeguard. Unauthorized reverse-engineering or unregulated redistribution of recovered components could erode competitive advantages and result in legal exposure, particularly across jurisdictions with uneven IP enforcement. As a result, many fabless companies and IP owners demand strict contractual controls, audited reuse partners and secure handling processes before consenting to reuse programs.

Covid-19 Impact:

The COVID-19 pandemic had a twofold impact on direct chip reuse, short-term operational disruption and longer-term strategic acceleration. Lockdowns and restricted facility access reduced collection and refurbishment throughput and delayed cross-site certification, creating immediate capacity and logistics setbacks. Conversely, pandemic-era shortages of new semiconductors and supply-chain fragility prompted manufacturers and buyers to explore alternative sources including recovered components and to invest in reuse capability to improve resilience. The net effect was initial operational strain followed by increased strategic interest and targeted investment in reuse programs.

The memory chips segment is expected to be the largest during the forecast period

The memory chips segment is expected to account for the largest market share during the forecast period because DRAM and NAND devices combine high production volumes with standardized packages and well-understood electrical behaviours that simplify recovery and retesting. These attributes reduce per-unit qualification cost and permit high-throughput retesting flows, making memory an economical target for reuse programs. Memory's ubiquity across servers, PCs, consumer devices and industrial systems also provides a steady feedstock of end-of-life modules for harvest. Moreover, because memory often constitutes a meaningful portion of a system's BOM cost, validated reuse delivers tangible savings that accelerate commercial adoption.

The consumer electronics segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the consumer electronics segment is predicted to witness the highest growth rate. Smartphones, tablets, wearables and smart-home devices are replaced rapidly, producing steady streams of end-of-life hardware that secondary markets and refurbishers can harvest at scale. Brands and retailers are also increasingly promoting circular-economy credentials, providing commercial incentives to integrate reuse into refurbishment and buy-back programs. The combination of high volumes, evolving business models and sustainability pressure drives rapid growth in reuse activity in this segment.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share. The region's dominance in electronics manufacturing and dense refurbishment ecosystems ensures abundant feedstock of end-of-life consumer and industrial electronics. Proximity to major OEMs and contract manufacturers shortens reverse-logistics cycles and simplifies qualification workflows, while established component trading hubs and competitive operating costs support scaling of reuse services. Furthermore, the region's long-standing role in global electronics assembly positions it as a natural centre for industrializing chip recovery and validated reuse at scale.

Region with highest CAGR:

Over the forecast period, the Asia Pacific region is anticipated to exhibit the highest CAGR as consumption of electronic devices grows and policy attention to circularity and supply-chain resilience increases. Rapid device turnover produces accelerating volumes of recoverable components, and regional investment in testing automation, refurbishment startups and digital traceability enhances recovery yields. Additionally, government incentives, evolving e-waste regulation and industry consortia focused on resource efficiency are likely to stimulate new reuse business models, driving faster growth in the region.

Key players in the market

Some of the key players in Direct Chip Reuse Market include TSMC, Intel, Samsung Electronics, AMD, NVIDIA, Arm, Synopsys, Cadence Design Systems, ASE Technology Holding, Amkor Technology, JCET Group, GlobalFoundries, IC Recovery, Xtreme Semiconductor (Chip Recovery(TM)), ChipsRecycle, and Veolia.

Key Developments:

In September 2025, NVIDIA is innovating in GPUs tailored for more efficient data center workloads. Mentioned is a platform that supports reuse of existing GPU systems (Vera Rubin NVL144) with a new Rubin CPX GPU compute tray, indicating reuse of hardware platforms.

In September 2022, Samsung Electronics Co., Ltd. announced its new environmental strategy, a comprehensive effort to join global efforts to tackle climate change. It includes commitments to achieve enterprise-wide net zero carbon emissions and plans to use more renewable energy, as well as to invest in and research new technologies to develop energy-efficient products, increase water reuse and develop carbon capture technology.

Chip Types Covered:

Processors
Memory Chips
Power Management ICs (PMICs)
Analog & Mixed-Signal Ics
Microcontrollers (MCUs) & Microprocessors (MPUs)
Programmable Logic Devices
RF and Wireless Ics

Sources Covered:

Consumer Electronics
Industrial Electronics
Automotive Electronics
IT & Telecom Equipment
Aerospace & Defense Equipment
Other Sources

Processes Covered:

Testing, Sorting, and Verification
De-soldering and Re-balling
Re-programming
Re-packaging

End Users Covered:

Consumer Electronics Manufacturers
Automotive Industry
Industrial Automation and Control Systems
IT & Networking Equipment Providers
Internet of Things (IoT) and Edge Computing Device Manufacturers
Medical Device Manufacturers
Aerospace and Defense (A&D) Contractors
Other End Users

Regions Covered:

North America
- US
- Canada
- Mexico
Europe
- Germany
- UK
- Italy
- France
- Spain
- Rest of Europe
Asia Pacific
- Japan
- China
- India
- Australia
- New Zealand
- South Korea
- Rest of Asia Pacific
South America
- Argentina
- Brazil
- Chile
- Rest of South America
Middle East & Africa
- Saudi Arabia
- UAE
- Qatar
- South Africa
- Rest of Middle East & Africa

What our report offers:

Market share assessments for the regional and country-level segments
Strategic recommendations for the new entrants
Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
Strategic recommendations in key business segments based on the market estimations
Competitive landscaping mapping the key common trends
Company profiling with detailed strategies, financials, and recent developments
Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

Company Profiling
- Comprehensive profiling of additional market players (up to 3)
- SWOT Analysis of key players (up to 3)
Regional Segmentation
- Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
Competitive Benchmarking
- Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

1 Executive Summary

2 Preface

2.1 Abstract
2.2 Stake Holders
2.3 Research Scope
2.4 Research Methodology
- 2.4.1 Data Mining
- 2.4.2 Data Analysis
- 2.4.3 Data Validation
- 2.4.4 Research Approach
2.5 Research Sources
- 2.5.1 Primary Research Sources
- 2.5.2 Secondary Research Sources
- 2.5.3 Assumptions

3 Market Trend Analysis

3.1 Introduction
3.2 Drivers
3.3 Restraints
3.4 Opportunities
3.5 Threats
3.6 End User Analysis
3.7 Emerging Markets
3.8 Impact of Covid-19

4 Porters Five Force Analysis

4.1 Bargaining power of suppliers
4.2 Bargaining power of buyers
4.3 Threat of substitutes
4.4 Threat of new entrants
4.5 Competitive rivalry

5 Global Direct Chip Reuse Market, By Chip Type

5.1 Introduction
5.2 Processors
5.3 Memory Chips
5.4 Power Management ICs (PMICs)
5.5 Analog & Mixed-Signal Ics
5.6 Microcontrollers (MCUs) & Microprocessors (MPUs)
5.7 Programmable Logic Devices
5.8 RF and Wireless Ics

6 Global Direct Chip Reuse Market, By Source

6.1 Introduction
6.2 Consumer Electronics
6.3 Industrial Electronics
6.4 Automotive Electronics
6.5 IT & Telecom Equipment
6.6 Aerospace & Defense Equipment
6.7 Other Sources

7 Global Direct Chip Reuse Market, By Process

7.1 Introduction
7.2 Testing, Sorting, and Verification
7.3 De-soldering and Re-balling
7.4 Re-programming
7.5 Re-packaging

8 Global Direct Chip Reuse Market, By End User

8.1 Introduction
8.2 Consumer Electronics Manufacturers
8.3 Automotive Industry
8.4 Industrial Automation and Control Systems
8.5 IT & Networking Equipment Providers
8.6 Internet of Things (IoT) and Edge Computing Device Manufacturers
8.7 Medical Device Manufacturers
8.8 Aerospace and Defense (A&D) Contractors
8.9 Other End Users

9 Global Direct Chip Reuse Market, By Geography

9.1 Introduction
9.2 North America
- 9.2.1 US
- 9.2.2 Canada
- 9.2.3 Mexico
9.3 Europe
- 9.3.1 Germany
- 9.3.2 UK
- 9.3.3 Italy
- 9.3.4 France
- 9.3.5 Spain
- 9.3.6 Rest of Europe
9.4 Asia Pacific
- 9.4.1 Japan
- 9.4.2 China
- 9.4.3 India
- 9.4.4 Australia
- 9.4.5 New Zealand
- 9.4.6 South Korea
- 9.4.7 Rest of Asia Pacific
9.5 South America
- 9.5.1 Argentina
- 9.5.2 Brazil
- 9.5.3 Chile
- 9.5.4 Rest of South America
9.6 Middle East & Africa
- 9.6.1 Saudi Arabia
- 9.6.2 UAE
- 9.6.3 Qatar
- 9.6.4 South Africa
- 9.6.5 Rest of Middle East & Africa

10 Key Developments

10.1 Agreements, Partnerships, Collaborations and Joint Ventures
10.2 Acquisitions & Mergers
10.3 New Product Launch
10.4 Expansions
10.5 Other Key Strategies

11 Company Profiling

11.1 TSMC
11.2 Intel
11.3 Samsung Electronics
11.4 AMD
11.5 NVIDIA
11.6 Arm
11.7 Synopsys
11.8 Cadence Design Systems
11.9 ASE Technology Holding
11.10 Amkor Technology
11.11 JCET Group
11.12 GlobalFoundries
11.13 IC Recovery
11.14 Xtreme Semiconductor (Chip Recovery(TM))
11.15 ChipsRecycle
11.16 Veolia

簡介目錄圖表

List of Tables

Table 1 Global Direct Chip Reuse Market Outlook, By Region (2024-2032) ($MN)
Table 2 Global Direct Chip Reuse Market Outlook, By Chip Type (2024-2032) ($MN)
Table 3 Global Direct Chip Reuse Market Outlook, By Processors (2024-2032) ($MN)
Table 4 Global Direct Chip Reuse Market Outlook, By Memory Chips (2024-2032) ($MN)
Table 5 Global Direct Chip Reuse Market Outlook, By Power Management ICs (PMICs) (2024-2032) ($MN)
Table 6 Global Direct Chip Reuse Market Outlook, By Analog & Mixed-Signal ICs (2024-2032) ($MN)
Table 7 Global Direct Chip Reuse Market Outlook, By Microcontrollers (MCUs) & Microprocessors (MPUs) (2024-2032) ($MN)
Table 8 Global Direct Chip Reuse Market Outlook, By Programmable Logic Devices (2024-2032) ($MN)
Table 9 Global Direct Chip Reuse Market Outlook, By RF and Wireless ICs (2024-2032) ($MN)
Table 10 Global Direct Chip Reuse Market Outlook, By Source (2024-2032) ($MN)
Table 11 Global Direct Chip Reuse Market Outlook, By Consumer Electronics (2024-2032) ($MN)
Table 12 Global Direct Chip Reuse Market Outlook, By Industrial Electronics (2024-2032) ($MN)
Table 13 Global Direct Chip Reuse Market Outlook, By Automotive Electronics (2024-2032) ($MN)
Table 14 Global Direct Chip Reuse Market Outlook, By IT & Telecom Equipment (2024-2032) ($MN)
Table 15 Global Direct Chip Reuse Market Outlook, By Aerospace & Defense Equipment (2024-2032) ($MN)
Table 16 Global Direct Chip Reuse Market Outlook, By Other Sources (2024-2032) ($MN)
Table 17 Global Direct Chip Reuse Market Outlook, By Process (2024-2032) ($MN)
Table 18 Global Direct Chip Reuse Market Outlook, By Testing, Sorting, and Verification (2024-2032) ($MN)
Table 19 Global Direct Chip Reuse Market Outlook, By De-soldering and Re-balling (2024-2032) ($MN)
Table 20 Global Direct Chip Reuse Market Outlook, By Re-programming (2024-2032) ($MN)
Table 21 Global Direct Chip Reuse Market Outlook, By Re-packaging (2024-2032) ($MN)
Table 22 Global Direct Chip Reuse Market Outlook, By End User (2024-2032) ($MN)
Table 23 Global Direct Chip Reuse Market Outlook, By Consumer Electronics Manufacturers (2024-2032) ($MN)
Table 24 Global Direct Chip Reuse Market Outlook, By Automotive Industry (2024-2032) ($MN)
Table 25 Global Direct Chip Reuse Market Outlook, By Industrial Automation and Control Systems (2024-2032) ($MN)
Table 26 Global Direct Chip Reuse Market Outlook, By IT & Networking Equipment Providers (2024-2032) ($MN)
Table 27 Global Direct Chip Reuse Market Outlook, By Internet of Things (IoT) and Edge Computing Device Manufacturers (2024-2032) ($MN)
Table 28 Global Direct Chip Reuse Market Outlook, By Medical Device Manufacturers (2024-2032) ($MN)
Table 29 Global Direct Chip Reuse Market Outlook, By Aerospace and Defense (A&D) Contractors (2024-2032) ($MN)
Table 30 Global Direct Chip Reuse Market Outlook, By Other End Users (2024-2032) ($MN)