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市場調查報告書
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1818069

2032年半導體晶圓拋光和研磨設備市場預測：按設備類型、晶圓尺寸、技術節點、半導體類型、應用和地區的全球分析

Semiconductor Wafer Polishing and Grinding Equipment Market Forecasts to 2032 - Global Analysis By Equipment Type, Wafer Size, Technology Node, Semiconductor Type, Application and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據 Stratistics MRC 的數據，全球半導體晶圓拋光和研磨設備市場預計在 2025 年達到 29.9432 億美元，到 2032 年將達到 47.1464 億美元，預測期內的複合年成長率為 6.7%。

半導體晶圓拋光和研磨設備由先進的工具組成，旨在在半導體製造過程中精煉晶圓表面。拋光製程可去除多餘的材料並實現均勻的厚度，而拋光過程可確保微電子技術所必需的超光滑、無缺陷的表面。這些設備在提高晶圓可靠性、提高生產效率和實現精確的電路圖形化發揮關鍵作用。確保表面平整度和均勻性有助於確保整個製造鏈中精確的微影術、蝕刻和整體半導體裝置的性能。

家電需求增加

智慧型裝置、穿戴式裝置和物聯網家用電器的普及，推動了對高精度、高效能先進半導體晶圓的需求。隨著消費者對更薄、更快、更節能電子產品的期望不斷提升，製造商正在投資尖端拋光和研磨設備，以滿足嚴格的設計規範。 CMP（化學機械拋光）和超精密研磨系統等技術已成為奈米級表面均勻性的關鍵。新興趨勢包括整合基於人工智慧的製程控制和即時缺陷檢測，以提高產量比率和產量。 3D封裝和晶片架構等關鍵技術的發展進一步推動了對晶圓級精加工設備的需求。

維護複雜性

維護半導體晶圓拋光和研磨設備需要複雜的校準、頻繁的零件更換以及專業的技術知識。晶圓精加工製程所需的精度意味著即使是輕微的錯位也可能導致代價高昂的缺陷和生產延誤。多區域壓力控制和自動化漿料管理等技術使日常維護更加複雜。預測性維護和遠距離診斷等新興趨勢有助於減少停機時間，但需要大量的前期投資。關鍵挑戰包括與舊有系統的兼容性以及持續的操作員培訓。這些運作負擔通常會阻礙小型晶圓廠和代工廠大規模採用先進設備。

汽車半導體需求不斷成長

晶圓拋光和研磨設備對於製造符合汽車級規格的功率元件、感測器和微控制器至關重要。碳化矽 (SiC) 和氮化鎵 (GaN) 晶圓加工等技術需要專門的化學機械拋光 (CMP) 和拋光系統來確保熱穩定性和電氣性能。新興趨勢包括將人工智慧 (AI) 融入製程最佳化，以及採用化合物半導體的混合拋光技術。電動車平台的標準化和高級駕駛輔助系統 (ADAS) 的擴展等關鍵發展正在加速汽車工廠的設備升級。這種轉變為精密晶圓加工解決方案提供了一條利潤豐厚的成長路徑。

技術快速淘汰

隨著節點尺寸的縮小和新材料的湧現，舊有系統難以滿足不斷變化的效能和整合需求。混合鍵結、背面減薄和先進的CMP製程等技術要求設備持續升級。異構整合和基於晶片集的設計等新興趨勢正在重塑晶圓精加工需求。關鍵發展包括2.5D/3D封裝和量子計算原型設計的興起，這些技術需要超精密的表面處理。這種快速發展增加了資本風險，並縮短了設備製造商和用戶的投資回報週期。

COVID-19的影響

疫情擾亂了全球半導體供應鏈，導致設備交付放緩，工廠擴張受阻。然而，遠距辦公、數位基礎設施和醫療用電子設備的激增，再次引發了對晶圓加工產能的迫切需求。自動化拋光系統和遠端監控工具等技術已廣泛應用，以支援保持社交距離的工作。新興趨勢包括增加對國內工廠的投資以及關鍵半導體生產的回流。政府推出的晶片製造獎勵策略和設備零件的戰略儲備等關鍵舉措，有助於穩定市場。

化學機械拋光 (CMP) 工具市場預計將在預測期內成為最大的市場

預計化學機械拋光 (CMP) 工具領域將在預測期內佔據最大的市場佔有率，這得益於其在實現先進半導體元件多層平面化方面的關鍵作用。 CMP 技術對於 FinFET、3D NAND 和超薄幾何邏輯晶片的製造至關重要。新興趨勢包括漿料最佳化、增強的端點檢測以及與人工智慧主導的流程分析的整合。混合 CMP 系統和環保耗材等關鍵發展正在重塑設備設計和營運效率。多重圖形化和先進微影術的日益複雜化進一步提升了 CMP 在晶圓製造中的重要性。因此，CMP 工具將繼續佔據拋光和研磨設備市場的最大佔有率。

預計預測期內鑄造部分將以最高的複合年成長率成長。

預計在預測期內，晶圓代工領域將實現最高成長率，這得益於半導體製造外包需求的激增和先進節點能力的提升。這些工廠正在迅速採用下一代拋光和研磨工具，以支援邏輯、記憶體和混合訊號裝置的大量生產。晶圓層次電子構裝、背面拋光和用於先進互連的化學機械拋光 (CMP) 等技術正在成為尖端晶圓代工廠的標準。新興趨勢包括基於人工智慧的產量比率最佳化、模組化工具配置和即時缺陷映射。 5nm 和 3nm 製程節點的擴展以及與無廠半導體公司的策略合作夥伴關係等關鍵發展正在刺激設備升級。

比最大的地區

預計亞太地區將在預測期內佔據最大的市場佔有率，這得益於中國大陸、台灣、韓國和日本強大的半導體製造生態系統。該地區的主導地位得益於積極的工廠擴張、政府激勵措施以及消費性電子和汽車行業的強勁需求。先進的化學機械拋光 (CMP)、晶圓減薄和自動拋光系統等技術正在該地區的工廠中廣泛應用。新興趨勢包括供應鏈的垂直整合和智慧製造平台的採用。中國大陸致力於實現半導體自給自足以及台灣在先進節點領域的領先地位等關鍵發展正在塑造該地區的設備需求。

複合年成長率最高的地區

預計北美將在預測期內實現最高的複合年成長率，這得益於其國內半導體製造和創新中心的戰略投資。該地區擴大採用拋光和研磨工具來支援先進封裝、人工智慧晶片和國防半導體。用於異構整合的化學機械拋光 (CMP)、用於射頻設備的晶圓級拋光以及支援人工智慧的製程控制等技術正日益普及。新興趨勢包括工廠回流舉措、晶圓廠現代化以及公私研發合作。 《晶片法案》(CHIPS Act) 的資助、晶圓代工廠產能的擴張以及與設備供應商的合作等關鍵發展正在推動成長。

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    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章執行摘要

第2章 前言

  • 概述
  • 相關利益者
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 數據分析
    • 數據檢驗
    • 研究途徑
  • 研究材料
    • 主要研究資料
    • 次級研究資訊來源
    • 先決條件

第3章市場走勢分析

  • 驅動程式
  • 抑制因素
  • 機會
  • 威脅
  • 應用分析
  • 新興市場
  • COVID-19的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買方的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭對手之間的競爭

5. 全球半導體晶圓拋光研磨設備市場（依設備類型）

  • 晶圓研磨機
  • 晶圓磨床
  • 化學機械拋光 (CMP) 工具
  • 整合研磨機和拋光機系統
  • 邊緣研磨和斜角拋光設備

6. 全球半導體晶圓拋光研磨設備市場（依晶圓尺寸）

  • 150毫米或更小
  • 200 mm
  • 300 mm
  • 450毫米或以上

7. 全球半導體晶圓拋光研磨設備市場（依技術節點）

  • 先進節點（10nm及以下）
  • 傳統節點（10 奈米以上）

8. 全球半導體晶圓拋光和研磨設備市場（以半導體類型類型）

  • 記憶體（DRAM、NAND）
  • 邏輯和 SoC
  • 類比和混合訊號
  • 功率元件

9. 全球半導體晶圓拋光研磨設備市場（依應用）

  • 晶圓代工廠
  • 層間絕緣膜
  • 整合設備製造商 (IDM)
  • 先進封裝設施
  • 記憶體製造商
  • 其他

第10章全球半導體晶圓拋光和研磨設備市場（按地區）

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲地區

第11章 重大進展

  • 協議、夥伴關係、合作和合資企業
  • 收購與合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第12章 公司概況

  • DISCO Corporation
  • Lapmaster Wolters GmbH
  • Tokyo Seimitsu Co., Ltd.
  • Entrepix, Inc.
  • Applied Materials, Inc.
  • Koyo Machinery Co., Ltd.
  • Ebara Corporation
  • Hantop Intelligence Tech Co., Ltd.
  • Revasum, Inc.
  • G&N Genauigkeits Maschinenbau Nurnberg GmbH
  • Komatsu NTC Ltd.
  • Logitech Ltd.
  • Okamoto Machine Tool Works Co., Ltd.
  • Pureon AG
  • CMP-Tec Inc.
Product Code: SMRC31032

According to Stratistics MRC, the Global Semiconductor Wafer Polishing and Grinding Equipment Market is accounted for $2994.32 million in 2025 and is expected to reach $4714.64 million by 2032 growing at a CAGR of 6.7% during the forecast period. Semiconductor wafer polishing and grinding equipment comprises advanced tools designed to refine wafer surfaces during semiconductor fabrication. Grinding processes eliminate surplus material and achieve consistent thickness, while polishing ensures ultra-smooth, defect-free finishes essential for microelectronics. These machines play a crucial role in enhancing wafer reliability, boosting production efficiency, and enabling accurate circuit patterning. By ensuring surface flatness and uniformity, they support precise lithography, etching, and overall semiconductor device performance in the manufacturing chain.

Market Dynamics:

Driver:

Rising demand for consumer electronics

The proliferation of smart devices, wearables, and IoT-enabled appliances is intensifying the need for advanced semiconductor wafers with high precision and performance. As consumer expectations shift toward thinner, faster, and more energy-efficient electronics, manufacturers are investing in cutting-edge polishing and grinding equipment to meet stringent design specifications. Technologies such as CMP (Chemical Mechanical Polishing) and ultra-fine grinding systems are becoming essential for achieving nanoscale surface uniformity. Emerging trends include integration of AI-based process control and real-time defect detection to enhance yield and throughput. Key developments like 3D packaging and chiplet architectures are further driving demand for wafer-level finishing tools.

Restraint:

Complexity in maintenance

Maintaining semiconductor wafer polishing and grinding equipment involves intricate calibration, frequent part replacements, and specialized technical expertise. The precision required in wafer finishing processes means even minor misalignments can lead to costly defects and production delays. Technologies such as multi-zone pressure control and automated slurry management add layers of complexity to routine servicing. Emerging trends like predictive maintenance and remote diagnostics are helping mitigate downtime but require significant upfront investment. Key challenges include compatibility with legacy systems and the need for continuous operator training. These operational burdens often deter smaller fabs and foundries from adopting advanced equipment at scale.

Opportunity:

Rising demand for automotive semiconductors

Wafer polishing and grinding tools are critical for producing power devices, sensors, and microcontrollers that meet automotive-grade standards. Technologies such as SiC and GaN wafer processing require specialized CMP and grinding systems to ensure thermal stability and electrical performance. Emerging trends include integration of AI in process optimization and adoption of hybrid polishing techniques for compound semiconductors. Key developments like EV platform standardization and ADAS expansion are accelerating equipment upgrades across automotive fabs. This transformation presents a lucrative growth avenue for precision wafer processing solutions.

Threat:

Rapid technological obsolescence

As node sizes shrink and new materials emerge, legacy systems struggle to meet evolving performance and integration requirements. Technologies such as hybrid bonding, backside thinning, and advanced CMP formulations demand continuous equipment upgrades. Emerging trends like heterogeneous integration and chiplet-based designs are reshaping wafer finishing needs. Key developments include the rise of 2.5D/3D packaging and quantum computing prototypes, which require ultra-precise surface preparation. This rapid evolution increases capital risk and shortens ROI timelines for equipment manufacturers and users alike.

Covid-19 Impact

The pandemic disrupted global semiconductor supply chains, delaying equipment deliveries and halting fab expansions. However, the surge in remote work, digital infrastructure, and medical electronics created renewed urgency for wafer processing capacity. Technologies such as automated polishing systems and remote monitoring tools gained traction to support socially distanced operations. Emerging trends include increased investment in domestic fabs and reshoring of critical semiconductor production. Key developments like government-backed stimulus for chip manufacturing and strategic stockpiling of equipment components helped stabilize the market.

The chemical mechanical polishing (CMP) tools segment is expected to be the largest during the forecast period

The chemical mechanical polishing (CMP) tools segment is expected to account for the largest market share during the forecast period, due to its critical role in achieving planarization across multiple layers of advanced semiconductor devices. CMP technologies are indispensable for fabricating FinFETs, 3D NAND, and logic chips with ultra-thin geometries. Emerging trends include slurry optimization, endpoint detection enhancements, and integration with AI-driven process analytics. Key developments such as hybrid CMP systems and eco-friendly consumables are reshaping tool design and operational efficiency. The growing complexity of multi-patterning and advanced lithography is further reinforcing CMP's centrality in wafer fabrication. As a result, CMP tools continue to command the largest share of the polishing and grinding equipment market.

The foundries segment is expected to have the highest CAGR during the forecast period

Over the forecast period, the foundries segment is predicted to witness the highest growth rate, driven by surging demand for outsourced semiconductor manufacturing and advanced node capabilities. These facilities are rapidly adopting next-gen polishing and grinding tools to support high-volume production of logic, memory, and mixed-signal devices. Technologies such as wafer-level packaging, backside grinding, and CMP for advanced interconnects are becoming standard in leading-edge foundries. Emerging trends include AI-based yield optimization, modular tool configurations, and real-time defect mapping. Key developments like the expansion of 5nm and 3nm process nodes and strategic partnerships with fabless firms are fueling equipment upgrades.

Region with largest share:

During the forecast period, the Asia Pacific region is expected to hold the largest market share supported by robust semiconductor manufacturing ecosystems in China, Taiwan, South Korea, and Japan. The region's dominance is underpinned by aggressive fab expansions, government incentives, and strong demand from consumer electronics and automotive sectors. Technologies such as advanced CMP, wafer thinning and automated grinding systems are widely deployed across regional fabs. Emerging trends include vertical integration of supply chains and adoption of smart manufacturing platforms. Key developments like China's push for semiconductor self-sufficiency and Taiwan's leadership in advanced nodes are shaping regional equipment demand.

Region with highest CAGR:

Over the forecast period, the North America region is anticipated to exhibit the highest CAGR, driven by strategic investments in domestic semiconductor manufacturing and innovation hubs. The region is witnessing increased deployment of polishing and grinding tools to support advanced packaging, AI chips, and defense-grade semiconductors. Technologies such as CMP for heterogeneous integration, wafer-level grinding for RF devices, and AI-enabled process control are gaining traction. Emerging trends include reshoring initiatives, fab modernization, and public-private R&D collaborations. Key developments like CHIPS Act funding, expansion of foundry capacity, and partnerships with equipment vendors are accelerating growth.

Key players in the market

Some of the key players profiled in the Semiconductor Wafer Polishing and Grinding Equipment Market include DISCO Corporation, Lapmaster Wolters GmbH, Tokyo Seimitsu Co., Ltd., Entrepix, Inc., Applied Materials, Inc., Koyo Machinery Co., Ltd., Ebara Corporation, Hantop Intelligence Tech Co., Ltd., Revasum, Inc., G&N Genauigkeits Maschinenbau Nurnberg GmbH, Komatsu NTC Ltd., Logitech Ltd., Okamoto Machine Tool Works Co., Ltd., Pureon AG, and CMP-Tec Inc.

Key Developments:

In August 2025, DISCO announced it has been selected by Watson Farley & Williams (WFW), a prominent Global 200 law firm, as the firm's strategic partner for ediscovery technology and services to support its growing international disputes practice and client base.

In January 2024, KOYO Machinery USA merges with JTEKT Machinery Americas. Koyo Machinery USA will be integrated into JTEKT Machinery's range of products, services, and customer support operations. This merger is an extension of JTEKT Corporation's global brand unification initiative launched in 2021 which is designed to strategically reshape the company for increased efficiency and greater synergy between group companies.

Equipment Types Covered:

  • Wafer Grinding Machines
  • Wafer Polishing Machines
  • Chemical Mechanical Polishing (CMP) Tools
  • Integrated Grinder-Polisher Systems
  • Edge-Grinding and Bevel-Polishing Equipment

Wafer Sizes Covered:

  • <=150 mm
  • 200 mm
  • 300 mm
  • 450 mm and Above

Technology Nodes Covered:

  • Advanced Nodes (<=10 nm)
  • Legacy Nodes (>10 nm)

Semiconductor Types Covered:

  • Memory (DRAM, NAND)
  • Logic & SoC
  • Analog & Mixed Signal
  • Power Devices

Applications Covered:

  • Foundries
  • Interlevel Dielectric Materials
  • Integrated Device Manufacturers (IDMs)
  • Advanced Packaging Facilities
  • Memory Manufacturers
  • Other Applications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2024, 2025, 2026, 2028, and 2032
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 Emerging Markets
  • 3.8 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Equipment Type

  • 5.1 Introduction
  • 5.2 Wafer Grinding Machines
  • 5.3 Wafer Polishing Machines
  • 5.4 Chemical Mechanical Polishing (CMP) Tools
  • 5.5 Integrated Grinder-Polisher Systems
  • 5.6 Edge-Grinding and Bevel-Polishing Equipment

6 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Wafer Size

  • 6.1 Introduction
  • 6.2 <=150 mm
  • 6.3 200 mm
  • 6.4 300 mm
  • 6.5 450 mm and Above

7 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Technology Node

  • 7.1 Introduction
  • 7.2 Advanced Nodes (<=10 nm)
  • 7.3 Legacy Nodes (>10 nm)

8 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Semiconductor Type

  • 8.1 Introduction
  • 8.2 Memory (DRAM, NAND)
  • 8.3 Logic & SoC
  • 8.4 Analog & Mixed Signal
  • 8.5 Power Devices

9 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Application

  • 9.1 Introduction
  • 9.2 Foundries
  • 9.3 Interlevel Dielectric Materials
  • 9.4 Integrated Device Manufacturers (IDMs)
  • 9.5 Advanced Packaging Facilities
  • 9.6 Memory Manufacturers
  • 9.7 Other Applications

10 Global Semiconductor Wafer Polishing and Grinding Equipment Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 DISCO Corporation
  • 12.2 Lapmaster Wolters GmbH
  • 12.3 Tokyo Seimitsu Co., Ltd.
  • 12.4 Entrepix, Inc.
  • 12.5 Applied Materials, Inc.
  • 12.6 Koyo Machinery Co., Ltd.
  • 12.7 Ebara Corporation
  • 12.8 Hantop Intelligence Tech Co., Ltd.
  • 12.9 Revasum, Inc.
  • 12.10 G&N Genauigkeits Maschinenbau Nurnberg GmbH
  • 12.11 Komatsu NTC Ltd.
  • 12.12 Logitech Ltd.
  • 12.13 Okamoto Machine Tool Works Co., Ltd.
  • 12.14 Pureon AG
  • 12.15 CMP-Tec Inc.

List of Tables

  • Table 1 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Region (2024-2032) ($MN)
  • Table 2 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Equipment Type (2024-2032) ($MN)
  • Table 3 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Wafer Grinding Machines (2024-2032) ($MN)
  • Table 4 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Wafer Polishing Machines (2024-2032) ($MN)
  • Table 5 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Chemical Mechanical Polishing (CMP) Tools (2024-2032) ($MN)
  • Table 6 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Integrated Grinder-Polisher Systems (2024-2032) ($MN)
  • Table 7 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Edge-Grinding and Bevel-Polishing Equipment (2024-2032) ($MN)
  • Table 8 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Wafer Size (2024-2032) ($MN)
  • Table 9 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By <=150 mm (2024-2032) ($MN)
  • Table 10 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By 200 mm (2024-2032) ($MN)
  • Table 11 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By 300 mm (2024-2032) ($MN)
  • Table 12 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By 450 mm and Above (2024-2032) ($MN)
  • Table 13 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Technology Node (2024-2032) ($MN)
  • Table 14 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Advanced Nodes (<=10 nm) (2024-2032) ($MN)
  • Table 15 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Legacy Nodes (>10 nm) (2024-2032) ($MN)
  • Table 16 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Semiconductor Type (2024-2032) ($MN)
  • Table 17 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Memory (DRAM, NAND) (2024-2032) ($MN)
  • Table 18 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Logic & SoC (2024-2032) ($MN)
  • Table 19 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Analog & Mixed Signal (2024-2032) ($MN)
  • Table 20 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Power Devices (2024-2032) ($MN)
  • Table 21 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Application (2024-2032) ($MN)
  • Table 22 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Foundries (2024-2032) ($MN)
  • Table 23 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Interlevel Dielectric Materials (2024-2032) ($MN)
  • Table 24 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Integrated Device Manufacturers (IDMs) (2024-2032) ($MN)
  • Table 25 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Advanced Packaging Facilities (2024-2032) ($MN)
  • Table 26 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Memory Manufacturers (2024-2032) ($MN)
  • Table 27 Global Semiconductor Wafer Polishing and Grinding Equipment Market Outlook, By Other Applications (2024-2032) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.