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市場調查報告書
商品編碼
1747741

全球半導體拋光墊片市場

Semiconductor Polishing Pads
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 164 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

預計到 2030 年全球半導體拋光墊片市場規模將達到 12 億美元

全球半導體拋光墊片市場規模預計在2024年為8.516億美元，預計到2030年將達到12億美元，在2024-2030年的分析期內，複合年成長率為5.8%。作為本報告分析的細分市場之一，硬質CMP墊片預計將實現6.7%的複合年成長率，並在分析期結束時達到7.971億美元。軟質CMP墊片細分市場的複合年成長率預計在分析期間為4.3%。

美國市場規模估計為 2.239 億美元，中國市場預期複合年成長率為 5.6%

美國半導體拋光墊片市場規模預計2024年達到2.239億美元。預計到2030年，作為世界第二大經濟體的中國市場規模將達到1.91億美元，在2024-2030年的分析期內，複合年成長率為5.6%。其他值得關注的區域市場包括日本和加拿大，預計在分析期間內，這兩個市場的複合年成長率分別為5.3%和4.9%。在歐洲，預計德國市場的複合年成長率為4.6%。

全球「半導體拋光墊片」市場—主要趨勢與促進因素摘要

為什麼拋光墊片是尖端表面精加工的關鍵？

半導體拋光墊片是化學機械平坦化 (CMP) 製程中的關鍵耗材。隨著對更小、更快、更強大的晶片的需求不斷成長，對完美晶圓表面形貌的要求也空前高漲。拋光墊片墊片與研磨液和修整劑搭配使用，去除多餘的材料，而不會刮傷或污染晶圓。它們的性能在 FEOL 和 BEOL 製程中都至關重要，因為它直接影響晶粒產量比率、線寬控制和平坦化精度。

多區域和特殊墊片重新定義精度和壽命？

拋光墊片正在快速發展，以滿足新裝置架構的細微要求。先進的CMP製程如今採用多墊片和凹槽墊片，以實現更佳的漿料分佈、更穩定的去除速率和更卓越的終點檢測。微孔和奈米結構墊片表面的引入，旨在改善表面接觸，且不會引入缺陷。對於3D NAND和先進的互連技術，墊片必須能夠適應更深的層級和多樣化的物料輸送，包括鎢、​​銅和電介質複合材料。這些應用要求墊片具有較長的使用壽命，並且在高晶圓數量下也能保持穩定的性能。此外，墊片的設計必須針對單晶圓CMP和批量工具進行客製化，並具有不同的下壓力分佈。隨著拋光製程的選擇性和應用針對性越來越強，墊片市場正朝著高性能、低污染和製程最佳化的產品方向發展。

永續性推動下一波墊片創新？

環境問題和總擁有成本 (TCO) 壓力正在推動晶圓廠尋求更永續、更持久的拋光墊片。供應商正在開發需要更少漿料、提供更長修整間隔並降低整體製程成本的拋光墊片。可回收的墊片材料和廢棄物減少系統也在開發中。拋光盤無需過度拋光即可延長墊片表面的均勻性，這正在成為專注於降低成本和產量比率的晶圓廠的標準配置。使用 RFID 或光學掃描的整合式墊片監控系統使晶圓廠能夠即時追蹤墊片的磨損並最佳化使用週期。這些創新不僅可以減少對環境的影響，還可以減少因過早更換墊片而導致的營運中斷。隨著晶圓廠推動綠色製造並提高利潤率，拋光墊片設計正在成為永續半導體製造的關鍵槓桿。

推動全球半導體拋光墊片市場成長的因素是什麼？

全球半導體拋光墊片市場的成長受到多種因素的推動，包括節點縮小、3D 架構和晶圓吞吐量的提高。隨著晶片製造商向 3nm 及以下發展，平坦化在邏輯、記憶體和混合訊號設備上變得更加關鍵。 3D NAND 和先進封裝技術的爆炸性成長透過增加每個晶圓的 CMP 步驟數來推動對高性能墊片的需求。中國大陸、韓國、美國和台灣的工廠快速擴張導致墊片消費量大幅增加。同時，CMP 在化合物半導體和功率 IC 製造中的應用日益廣泛，正在將市場擴展到新的領域。隨著工廠對每個晶圓的成本、製程產量比率和環境合規性的日益重視，它們青睞具有耐用性、生態漿體相容性和精確製程控制的墊片。擁有成熟的墊片-漿體協同效應和長期OEM關係的供應商尤其適合引領市場。

部分

類型（硬式CMP墊片、軟式CMP墊片）；應用（300M晶圓、200M晶圓、其他應用）

受訪公司範例（值得關注的32家公司）

  • 3M
  • AGC Inc.
  • Atotech
  • Cabot Microelectronics
  • DuPont
  • Entegris
  • Ferro Corporation
  • FNS TECH Co., Ltd.
  • Fujibo Holdings, Inc.
  • Fujimi Incorporated
  • Hubei Dinglong Co., Ltd.
  • Kuraray Co., Ltd.
  • Mipox Corporation
  • Nitta Haas Incorporated
  • Pureon
  • Rodel（a DuPont company）
  • Saniwave Technology Co., Ltd.
  • SK enpulse
  • Spartan Felt Company
  • Topco Scientific Co., Ltd.

關稅影響係數

全球產業分析師根據公司總部所在國家、製造地、進出口（成品和原始OEM）來預測其競爭地位的變化。這種複雜且多面向的市場動態預計將以多種方式影響競爭對手，包括人為提高銷貨成本、盈利下降、供應鏈重組以及其他微觀和宏觀市場動態。

全球產業分析師密切關注來自全球頂尖首席經濟學家（14,949位）、智庫（62家）以及貿易和產業協會（171家）的專家的意見，以評估其對生態系統的影響並應對新的市場現實。我們追蹤了來自每個主要國家的專家和經濟學家對關稅及其對本國影響的看法。

全球產業分析師預計，這場動盪將在未來2-3個月內逐漸平息，新的世界秩序將更加清晰地建立。全球產業分析師正在即時追蹤這些事態發展。

2025年4月：談判階段

在4月的報告中，我們將探討關稅對全球整體市場的影響，並提供區域市場調整。我們的預測是基於歷史數據和不斷變化的市場影響因素。

2025年7月：最終關稅調整

在各國宣布最終重置後，客戶將在 7 月收到免費更新，最終更新將包含明確的關稅影響分析。

相互和雙邊貿易及關稅影響分析：

美國<>中國<>墨西哥<>加拿大<>歐盟<>日本<>印度<>其他176個國家

領先的產業經濟學家：全球產業分析師知識庫追蹤了 14,949 位經濟學家，其中包括來自民族國家、智庫、貿易和產業協會、大型企業以及各領域專家的最具影響力的首席經濟學家，他們共用了這場前所未有的全球經濟狀況模式轉移的影響。我們超過 16,491 份報告大多遵循基於里程碑的兩階段發布計劃。

目錄

第1章調查方法

第2章執行摘要

  • 市場概覽
  • 主要企業
  • 市場趨勢和促進因素
  • 全球市場展望

第3章市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 其他歐洲國家
  • 亞太地區
  • 其他地區

第4章 競賽

簡介目錄
Product Code: MCP35727

Global Semiconductor Polishing Pads Market to Reach US$1.2 Billion by 2030

The global market for Semiconductor Polishing Pads estimated at US$851.6 Million in the year 2024, is expected to reach US$1.2 Billion by 2030, growing at a CAGR of 5.8% over the analysis period 2024-2030. Hard CMP Pads, one of the segments analyzed in the report, is expected to record a 6.7% CAGR and reach US$797.1 Million by the end of the analysis period. Growth in the Soft CMP Pads segment is estimated at 4.3% CAGR over the analysis period.

The U.S. Market is Estimated at US$223.9 Million While China is Forecast to Grow at 5.6% CAGR

The Semiconductor Polishing Pads market in the U.S. is estimated at US$223.9 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$191.0 Million by the year 2030 trailing a CAGR of 5.6% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 5.3% and 4.9% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 4.6% CAGR.

Global "Semiconductor Polishing Pads" Market - Key Trends & Drivers Summarized

Why Are Polishing Pads at the Heart of Advanced Chip Surface Finishing?

Semiconductor polishing pads are crucial consumables used in Chemical Mechanical Planarization (CMP), a process that ensures ultra-flat wafer surfaces before lithography and metal layer deposition. With rising demand for smaller, faster, and more powerful chips, the need for flawless wafer topography has never been greater. Polishing pads-typically made from polyurethane or composite materials-must balance surface uniformity, durability, and chemical compatibility across dozens of CMP steps per wafer. In logic, memory, and power semiconductors alike, even a few nanometers of surface deviation can degrade device performance. Pads must work in tandem with slurries and conditioners to remove excess material without scratching or contaminating the wafer. Their performance directly impacts die yield, line-width control, and planarization accuracy, making them indispensable across both FEOL and BEOL processes.

Are Multi-Zone and Specialty Pads Redefining Precision and Lifespan?

Polishing pads are evolving rapidly to meet the nuanced requirements of newer device architectures. Advanced CMP processes now use multi-zone or grooved pads that provide better slurry distribution, consistent removal rates, and superior endpoint detection. Micro-porous and nanostructured pad surfaces are being introduced to improve surface contact without generating defects. In 3D NAND and advanced interconnects, pads must handle deeper layers and varied materials like tungsten, copper, or dielectric composites. These applications require longer pad life and stable performance over high wafer counts. Additionally, pad design is being customized to suit single-wafer CMP tools and batch tools with different downforce profiles. As polishing becomes more selective and application-specific, the pad market is witnessing a shift toward high-performance, low-contamination, and process-optimized products.

Can Sustainability and Process Efficiency Drive the Next Wave of Pad Innovation?

Environmental considerations and total cost of ownership (TCO) pressures are pushing fabs to seek more sustainable and longer-lasting polishing pads. Vendors are developing pads that require less slurry and offer longer dressing intervals, reducing overall process costs. Recyclable pad materials and waste-reduction systems are also in development. Conditioning disks that prolong pad surface consistency without aggressive abrasion are becoming standard in fabs focused on cost savings and yield enhancement. Integrated pad monitoring systems-using RFID or optical scanning-allow fabs to track pad wear in real time and optimize usage cycles. These innovations not only reduce environmental impact but also lower operational interruptions caused by premature pad replacement. As fabs push for green manufacturing alongside better margins, polishing pad design is becoming a key lever in sustainable semiconductor fabrication.

What’s Driving Growth in the Global Semiconductor Polishing Pad Market?

The growth in the global semiconductor polishing pads market is driven by several factors including node shrinkage, 3D architectures, and higher wafer throughput. As chipmakers move to 3nm and beyond, planarization becomes more critical across logic, memory, and mixed-signal devices. The explosive growth of 3D NAND and advanced packaging technologies is increasing the number of CMP steps per wafer, amplifying demand for high-performance pads. Rapid fab expansions across China, South Korea, the U.S., and Taiwan are scaling up pad consumption volumes significantly. At the same time, increasing adoption of CMP in compound semiconductor and power IC production is expanding the market into new verticals. The growing emphasis on cost per wafer, process yield, and environmental compliance is driving fabs to favor pads that offer durability, compatibility with eco-slurries, and precise process control. Vendors with proven pad-slurry synergy and long-standing OEM relationships are particularly well-positioned for market leadership.

SCOPE OF STUDY:

The report analyzes the Semiconductor Polishing Pads market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Hard CMP Pads, Soft CMP Pads); Application (300M Wafer, 200Mm Wafer, Other Applications)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 32 Featured) -

  • 3M
  • AGC Inc.
  • Atotech
  • Cabot Microelectronics
  • DuPont
  • Entegris
  • Ferro Corporation
  • FNS TECH Co., Ltd.
  • Fujibo Holdings, Inc.
  • Fujimi Incorporated
  • Hubei Dinglong Co., Ltd.
  • Kuraray Co., Ltd.
  • Mipox Corporation
  • Nitta Haas Incorporated
  • Pureon
  • Rodel (a DuPont company)
  • Saniwave Technology Co., Ltd.
  • SK enpulse
  • Spartan Felt Company
  • Topco Scientific Co., Ltd.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA <> CHINA <> MEXICO <> CANADA <> EU <> JAPAN <> INDIA <> 176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

COMPLIMENTARY PREVIEW

Contact your sales agent to request an online 300+ page complimentary preview of this research project. Our preview will present full stack sources, and validated domain expert data transcripts. Deep dive into our interactive data-driven online platform.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • Semiconductor Polishing Pads - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Increased CMP Complexity in Advanced Nodes Drives Innovation in Pad Material Design
    • Growth in 3D NAND and FinFET Architectures Spurs Demand for High-Performance Polishing Pads
    • Rising Focus on Surface Defect Reduction Strengthens Business Case for Next-Gen Pads
    • Integration with Low-k and Ultra Low-k Materials Requires Customized Pad Properties
    • Advanced Packaging Trends Propel Demand for Planarization Pads in Wafer-Level Processing
    • Push for Cost-Effective Consumables Expands Market for Long-Life, Reconditionable Pads
    • Eco-Friendly and Low Particle Generation Pads Gain Traction Amid Regulatory Pressure
    • CMP Process Optimization in Smart Fabs Throws Spotlight on Pad-Wafer Interaction Models
    • Increase in CMP Tool Installations Worldwide Drives Volume Growth in Pad Consumption
    • Collaborative Development Between Pad and Slurry Vendors Enhances Process Synergies
    • Growing Use in MEMS and Sensor Wafer Fabrication Opens New Market Frontiers
    • R&D in Nanocomposite Pads Expands Performance Capabilities in Ultrafine Planarization
    • Global Supply Chain Diversification Creates New Opportunities for Regional Pad Manufacturers
    • AI and Machine Learning Integration in CMP Tools Spurs Demand for Predictable Pad Behavior
    • Emergence of Advanced Interconnect Materials Propels Innovation in Application-Specific Pads
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Semiconductor Polishing Pads Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Semiconductor Polishing Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for Semiconductor Polishing Pads by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Hard CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Hard CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for Hard CMP Pads by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Soft CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Soft CMP Pads by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for Soft CMP Pads by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for 300M Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for 300M Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for 300M Wafer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for 200Mm Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for 200Mm Wafer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for 200Mm Wafer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 20: USA Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 21: USA Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 22: USA 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 23: USA Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 24: USA Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 25: USA 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 26: Canada Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 27: Canada Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 28: Canada 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 29: Canada Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 30: Canada Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 31: Canada 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • JAPAN
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 32: Japan Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Japan Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 34: Japan 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 35: Japan Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 36: Japan Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 37: Japan 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • CHINA
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 38: China Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 39: China Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 40: China 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 41: China Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 42: China Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 43: China 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • EUROPE
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 44: Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 45: Europe Historic Review for Semiconductor Polishing Pads by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 46: Europe 15-Year Perspective for Semiconductor Polishing Pads by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 47: Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 48: Europe Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 49: Europe 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 50: Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Europe Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 52: Europe 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • FRANCE
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 53: France Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 54: France Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 55: France 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 56: France Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 57: France Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 58: France 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • GERMANY
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 59: Germany Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Germany Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 61: Germany 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 62: Germany Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Germany Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 64: Germany 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 65: Italy Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Italy Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 67: Italy 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 68: Italy Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Italy Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 70: Italy 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 71: UK Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 72: UK Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 73: UK 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 74: UK Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 75: UK Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 76: UK 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 77: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 78: Rest of Europe Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 79: Rest of Europe 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 80: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Rest of Europe Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 82: Rest of Europe 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • Semiconductor Polishing Pads Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 83: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Asia-Pacific Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 85: Asia-Pacific 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 86: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Asia-Pacific Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 88: Asia-Pacific 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030
  • REST OF WORLD
    • TABLE 89: Rest of World Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 90: Rest of World Historic Review for Semiconductor Polishing Pads by Type - Hard CMP Pads and Soft CMP Pads Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 91: Rest of World 15-Year Perspective for Semiconductor Polishing Pads by Type - Percentage Breakdown of Value Sales for Hard CMP Pads and Soft CMP Pads for the Years 2015, 2025 & 2030
    • TABLE 92: Rest of World Recent Past, Current & Future Analysis for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Rest of World Historic Review for Semiconductor Polishing Pads by Application - 300M Wafer, 200Mm Wafer and Other Applications Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 94: Rest of World 15-Year Perspective for Semiconductor Polishing Pads by Application - Percentage Breakdown of Value Sales for 300M Wafer, 200Mm Wafer and Other Applications for the Years 2015, 2025 & 2030

IV. COMPETITION