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1371887

2030 年先進封裝和切割設備市場預測：按類型、材料、組件、技術、用途和地區進行的全球分析

Advanced Packaging and Cutting Equipment Market Forecasts to 2030 - Global Analysis By Type, Material, Component, Technology, Application and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 200+ Pages | 商品交期: 2-3個工作天內

價格

根據Stratistics MRC預測，2023年全球先進封裝和切割設備市場規模將達317億美元，預計到2030年將達到612億美元，預測期內年複合成長率為9.84%。

一種稱為「先進包裝和切割設備」的產品類型用於多種領域，以有效包裝、加工和切割材料和產品。這些尖端解決方案旨在加強品管、減少浪費並改善製造和包裝業務中的生產流程。技術進步不斷刺激該領域的創新，創造出更有效、更具適應性的機器。

印度電子與半導體協會預計，到2025年，該國半導體零件市場價值預計將達到323.5億美元。

提高效率

現代機器實現切割和包裝操作的自動化，減少了對體力勞動的需求並提高了生產力。快速的處理速度可提高產量並縮短製造時間。先進的機械確保透過使用精確的檢測和切割方法定期將產品切割成正確的尺寸和形狀。這種精度減少了浪費並提高了最終產品的品質。這些都是市場拓展的動力。

彈性有限

有些切割和包裝技術不夠彈性，無法適應不同的產品變化和包裝設計。對於需要頻繁更換生產線的公司來說，這種限制可能是一個問題。將新設備整合到當前的生產線中可能很困難，並且可能需要對製造過程中的其他步驟進行更改或改進。因此，這阻礙了市場的成長。

增強安全性

感測器、緊急停止機制和防護屏障等安全元件經常被涵蓋先進技術中，以減少事故和傷害的可能性。自動化可以減少操作員面臨潛在危險任務的機會。透過將最先進的包裝設備與追蹤和追溯系統整合，可以改善整個供應鏈的庫存管理和產品監控。因此，這些都是推動市場擴張的因素。

初始成本高

安裝和購買最先進的包裝設備的成本可能很高。對於新參與企業和小型企業來說，這種初期成本可能是一個主要障礙。該設備經常需要定期維護才能保持正常運作。隨著時間的推移，維護成本將會增加，包括替換零件、技術人員成本和維修停機時間。這些都阻礙了市場的拓展。

COVID-19 的影響：

疫情擾亂了全球供應系統，影響了先進包裝器材和切割機械的製造和分銷。許多製造商在所需零件和消耗品的交付方面遇到了問題，影響了他們完成訂單的能力。由於經濟不確定性和封鎖措施，汽車和航太航太等一些嚴重依賴先進封裝和切割技術的領域在疫情期間出現了需求減少。因此，設備訂單減少。

切割機部門預計將在預測期內成為最大的行業

預計切割機領域在預測期內將是最大的。切割機是一種使用一種或多種磨料來研磨、刮擦、切割、剪切或以其他方式從工件上去除材料的設備。水平加工中心和立式加工中心是最常用的兩種切削設備。立式加工中心用於45度切削等銳角加工，水平加工中心用於直線加工。

汽車電子設備領域預計在預測期內複合年複合成長率最高

預計汽車電子領域在預測期內年複合成長率最高。隨著越來越多的消費者選擇高科技汽車並要求電氣元件採用優質包裝，對汽車產品的需求不斷增加。由於對智慧型手機、平板電腦等攜帶式設備、筆記型電腦和上網本等電腦配件的需求迅速成長，以及消費者可支配所得的增加，預計消費性電子產品將在未來年度大幅成長。

佔比最大的地區：

預計北美在預測期內將佔據最大的市場佔有率，可可支配所得的增加刺激了對先進包裝解決方案的需求。能源和電力部門更先進技術的使用正在推動市場擴張。此外，預計在預測期內微控制器和微處理器在家用電子電器和電動車中的使用將會增加，從而推動對先進封裝解決方案的需求。

複合年複合成長率最高的地區：

預計亞太地區在預測期內將維持最高的年複合成長率。最尖端科技的可用性、對智慧產品的需求激增以及該地區工業部門的持續成長是這一驚人成長的原因。許多非營利組織正在積極致力於開發改進的電力基礎設施，進一步加速先進封裝領域的擴張和封裝技術的進步。

免費客製化服務

訂閱此報告的客戶可以存取以下免費自訂選項之一：

  • 公司簡介
    • 其他市場參與者的綜合分析（最多 3 家公司）
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    • 根據產品系列、地理分佈和策略聯盟對主要企業基準化分析

目錄

第1章 執行摘要

第2章 前言

  • 概述
  • 利害關係人
  • 調查範圍
  • 調查方法
    • 資料探勘
    • 資料分析
    • 資料檢驗
    • 研究途徑
  • 調查來源
    • 主要調查來源
    • 二次調查來源
    • 先決條件

第3章 市場趨勢分析

  • 促進因素
  • 抑制因素
  • 機會
  • 威脅
  • 技術分析
  • 應用分析
  • 新興市場
  • 新型冠狀病毒感染疾病（COVID-19）的影響

第4章 波特五力分析

  • 供應商的議價能力
  • 買方議價能力
  • 替代的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第5章 全球先進包裝和切割設備市場：按類型

  • 切割機
  • 底線機
  • 包裝機

5.5

旋轉模具

  • 旋蓋機
  • CNC機
  • 切丁機
  • 層壓機
  • 其他類型

第6章 全球先進封裝與切割設備市場：依材料分類

  • 金屬
  • 陶瓷製品
  • 塑膠
  • 混合
  • 玻璃
  • 其他材料

第7章 全球先進包裝和切割設備市場：按組成部分

  • 軟體
  • 硬體
  • 服務
  • 其他組件

第8章 全球先進封裝與切割設備市場：依技術分類

  • 雷射基地
  • 機械的
  • 水刀
  • 電漿
  • 其他技術

第9章 全球先進封裝與切割設備市場：依用途

  • 家用電器
  • 汽車電子
  • 溝通
  • 航太和國防
  • 工業的
  • 衛生保健
  • 其他用途

第10章 全球先進封裝與切割設備市場：按地區

  • 北美洲
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 義大利
    • 法國
    • 西班牙
    • 其他歐洲國家
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳洲
    • 紐西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 南美洲其他地區
  • 中東和非洲
    • 沙烏地阿拉伯
    • 阿拉伯聯合大公國
    • 卡達
    • 南非
    • 其他中東和非洲

第11章進展

  • 合約、夥伴關係、協作和合資企業
  • 收購和合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第12章公司簡介

  • Microchip Technology Inc.
  • ASM Pacific
  • Teradyne
  • Advantest
  • COHU Semiconductor Equipment Group
  • Intel
  • SUSS Microtec
  • Tokyo Seimitsu
  • Samsung Electronics Co. Ltd
  • Applied Material
  • Shinkawa
  • Hitachi
  • Toray Engineering
  • DISCO
  • KulickeandSoffa
Product Code: SMRC23944

According to Stratistics MRC, the Global Advanced Packaging and Cutting Equipment Market is accounted for $31.7 billion in 2023 and is expected to reach $61.2 billion by 2030 growing at a CAGR of 9.84% during the forecast period. A type of equipment and technology known as "advanced packaging and cutting equipment" is used in a number of different sectors to effectively package, process, and cut materials or products. These cutting-edge solutions are intended to boost quality control, decrease waste, and enhance production processes in manufacturing and packaging operations. Technology advancements continue to spur innovation in this area, resulting in more effective and adaptable machinery.

According to India Electronics and Semiconductor Association, the semiconductor component market in the country is expected to be worth $ 32.35 billion by 2025.

Market Dynamics:

Driver:

Increased efficiency

Modern machinery automates the cutting and packing operations, lowering manual labor requirements and boosting productivity. Quicker output and shorter manufacturing times result from quicker processing rates. Advanced machinery ensures that items are regularly cut to the proper size and form via the use of accurate measurements and cutting methods. This accuracy lowers waste and raises the caliber of the final product. These are the elements driving the market's expansion.

Restraint:

Limited Flexibility

Some cutting and packing technology may not be flexible enough to accommodate a variety of product variants or packaging designs. For companies that need to alter their manufacturing lines often, this constraint might be an issue. It can be challenging to integrate new equipment into current production lines and may call for alterations or improvements to other steps in the manufacturing process. Consequently, this hinders market growth.

Opportunity:

Enhanced safety

Safety elements like sensors, emergency stop mechanisms, and protective barriers are frequently incorporated into advanced technology to lower the chance of accidents and injuries. Automation can reduce the amount of time operators are exposed to potentially dangerous jobs. Improved inventory management and product monitoring across the supply chain are made possible by the integration of cutting-edge packaging equipment with tracking and traceability systems. Therefore, these are the elements driving the market's expansion.

Threat:

High initial cost

The cost of installing and buying cutting-edge packing equipment might be high. For new or small firms, this upfront cost can be a major obstacle. To make sure that they function properly, this equipment frequently needs routine maintenance. Over time, maintenance costs, such as those for replacement components, technician fees, and downtime for repairs, can mount. These are the things that are impeding the market's expansion.

COVID-19 Impact:

The pandemic affected the manufacturing and distribution of sophisticated packaging and cutting machinery by upsetting global supply systems. Many manufacturers experienced issues with the delivery of necessary parts and supplies, which affected their capacity to complete orders. Due to economic uncertainty and lockdown measures, several sectors that significantly rely on sophisticated packaging and cutting technology, such as the automotive and aerospace industry, saw a decline in demand during the epidemic. As a result, fewer equipment orders were placed.

The cutting machine segment is expected to be the largest during the forecast period

The cutting machine segment is expected to be the largest during the forecast period. A cutting machine is a device that grinds, shaves, snips, shears, or otherwise removes material from a work piece using one or more abrasives. Horizontal and vertical machining centers are the two most used types of cutting equipment. Vertical machining centers are used to create 45-degree cuts and other sharp angles, whereas horizontal machining centers are used to produce straight cuts.

The automotive electronics segment is expected to have the highest CAGR during the forecast period

The automotive electronics segment is expected to have the highest CAGR during the forecast period. The need for automotive electronics is rising as more consumers choose high-tech automobiles, which necessitate premium packaging for electrical components. Over the next years, consumer electronics are expected to experience significant growth due to the quickly rising demand for portable devices like smartphones, tablets, and PC accessories like laptops and Netbooks, as well as an increase in consumer disposable income.

Region with largest share:

North America is projected to hold the largest market share during the forecast period due to increase in disposable income among the population has spurred the demand for advanced packaging solutions. The use of more advanced technologies by the energy and power sector has boosted market expansion. During the market's forecast period, it is also anticipated that the increasing use of microcontrollers and microprocessors in consumer electronics and electric cars would fuel demand for advanced packaging solutions.

Region with highest CAGR:

Asia Pacific is projected to hold the highest CAGR over the forecast period. The availability of cutting-edge technology, the soaring demand for smart gadgets, and the ongoing rise of the region's industrial industries are all credited with this astounding increase. A number of non-profit organizations actively engage in the development of improved power infrastructure, further accelerating the expansion of the advanced packaging sector and advancing packaging technology.

Key players in the market:

Some of the key players in Advanced Packaging and Cutting Equipment Market include: Microchip Technology Inc., ASM Pacific, Teradyne, Advantest, COHU Semiconductor Equipment Group, Intel, SUSS Microtec, Tokyo Seimitsu, Samsung Electronics Co. Ltd, Applied Material, Shinkawa, Hitachi, Toray Engineering, DISCO and KulickeandSoffa.

Key Developments:

In August 2023, Samsung announced its collaboration with Intel to deliver cutting-edge vRAN solutions with enhanced performance to meet rising capacity demands.

In July 2023, Microchip Technology Incorporated announced a multi-year initiative to invest approximately $300 million in expanding its operations in India.

In June 2023, Intel announced that it is using its own EMIB packaging technology for its new Xeon Scalable processors. EMIB is a 2.5D packaging technology that can integrate multiple dies on a single substrate.

Types Covered:

  • Cutting Machine
  • Scribing Machine
  • Packaging machines
  • Rotary die
  • Capping machines
  • CNC machine
  • Dicing Machine
  • Lamination Machine
  • Other Types

Materials Covered:

  • Metal
  • Ceramic
  • Plastic
  • Hybrid
  • Glass
  • Other Materials

Components Covered:

  • Software
  • Hardware
  • Services
  • Other Components

Technologies Covered:

  • Laser-Based
  • Mechanical
  • Waterjet
  • Plasma
  • Other Technologies

Applications Covered:

  • Consumer Electronics
  • Automotive Electronics
  • Communication
  • Aerospace & Defense
  • Industrial
  • Healthcare
  • Other Applications

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Technology Analysis
  • 3.7 Application Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global Advanced Packaging and Cutting Equipment Market, By Type

  • 5.1 Introduction
  • 5.2 Cutting Machine
  • 5.3 Scribing Machine
  • 5.4 Packaging machines

5.5

Rotary die

  • 5.6 Capping machines
  • 5.7 CNC machine
  • 5.8 Dicing Machine
  • 5.9 Lamination Machine
  • 5.10 Other Types

6 Global Advanced Packaging and Cutting Equipment Market, By Material

  • 6.1 Introduction
  • 6.2 Metal
  • 6.3 Ceramic
  • 6.4 Plastic
  • 6.5 Hybrid
  • 6.6 Glass
  • 6.7 Other Materials

7 Global Advanced Packaging and Cutting Equipment Market, By Component

  • 7.1 Introduction
  • 7.2 Software
  • 7.3 Hardware
  • 7.4 Services
  • 7.5 Other Components

8 Global Advanced Packaging and Cutting Equipment Market, By Technology

  • 8.1 Introduction
  • 8.2 Laser-Based
  • 8.3 Mechanical
  • 8.4 Waterjet
  • 8.5 Plasma
  • 8.6 Othe Technologies

9 Global Advanced Packaging and Cutting Equipment Market, By Application

  • 9.1 Introduction
  • 9.2 Consumer Electronics
  • 9.3 Automotive Electronics
  • 9.4 Communication
  • 9.5 Aerospace & Defense
  • 9.6 Industrial
  • 9.7 Healthcare
  • 9.8 Other Applications

10 Global Advanced Packaging and Cutting Equipment Market, By Geography

  • 10.1 Introduction
  • 10.2 North America
    • 10.2.1 US
    • 10.2.2 Canada
    • 10.2.3 Mexico
  • 10.3 Europe
    • 10.3.1 Germany
    • 10.3.2 UK
    • 10.3.3 Italy
    • 10.3.4 France
    • 10.3.5 Spain
    • 10.3.6 Rest of Europe
  • 10.4 Asia Pacific
    • 10.4.1 Japan
    • 10.4.2 China
    • 10.4.3 India
    • 10.4.4 Australia
    • 10.4.5 New Zealand
    • 10.4.6 South Korea
    • 10.4.7 Rest of Asia Pacific
  • 10.5 South America
    • 10.5.1 Argentina
    • 10.5.2 Brazil
    • 10.5.3 Chile
    • 10.5.4 Rest of South America
  • 10.6 Middle East & Africa
    • 10.6.1 Saudi Arabia
    • 10.6.2 UAE
    • 10.6.3 Qatar
    • 10.6.4 South Africa
    • 10.6.5 Rest of Middle East & Africa

11 Key Developments

  • 11.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 11.2 Acquisitions & Mergers
  • 11.3 New Product Launch
  • 11.4 Expansions
  • 11.5 Other Key Strategies

12 Company Profiling

  • 12.1 Microchip Technology Inc.
  • 12.2 ASM Pacific
  • 12.3 Teradyne
  • 12.4 Advantest
  • 12.5 COHU Semiconductor Equipment Group
  • 12.6 Intel
  • 12.7 SUSS Microtec
  • 12.8 Tokyo Seimitsu
  • 12.9 Samsung Electronics Co. Ltd
  • 12.10 Applied Material
  • 12.11 Shinkawa
  • 12.12 Hitachi
  • 12.13 Toray Engineering
  • 12.14 DISCO
  • 12.15 KulickeandSoffa

List of Tables

  • Table 1 Global Advanced Packaging and Cutting Equipment Market Outlook, By Region (2021-2030) ($MN)
  • Table 2 Global Advanced Packaging and Cutting Equipment Market Outlook, By Type (2021-2030) ($MN)
  • Table 3 Global Advanced Packaging and Cutting Equipment Market Outlook, By Cutting Machine (2021-2030) ($MN)
  • Table 4 Global Advanced Packaging and Cutting Equipment Market Outlook, By Scribing Machine (2021-2030) ($MN)
  • Table 5 Global Advanced Packaging and Cutting Equipment Market Outlook, By Packaging machines (2021-2030) ($MN)
  • Table 6 Global Advanced Packaging and Cutting Equipment Market Outlook, By

Table Rotary die (2021-2030) ($MN)

  • Table 7 Global Advanced Packaging and Cutting Equipment Market Outlook, By Capping machines (2021-2030) ($MN)
  • Table 8 Global Advanced Packaging and Cutting Equipment Market Outlook, By CNC machine (2021-2030) ($MN)
  • Table 9 Global Advanced Packaging and Cutting Equipment Market Outlook, By Dicing Machine (2021-2030) ($MN)
  • Table 10 Global Advanced Packaging and Cutting Equipment Market Outlook, By Lamination Machine (2021-2030) ($MN)
  • Table 11 Global Advanced Packaging and Cutting Equipment Market Outlook, By Other Types (2021-2030) ($MN)
  • Table 12 Global Advanced Packaging and Cutting Equipment Market Outlook, By Material (2021-2030) ($MN)
  • Table 13 Global Advanced Packaging and Cutting Equipment Market Outlook, By Metal (2021-2030) ($MN)
  • Table 14 Global Advanced Packaging and Cutting Equipment Market Outlook, By Ceramic (2021-2030) ($MN)
  • Table 15 Global Advanced Packaging and Cutting Equipment Market Outlook, By Plastic (2021-2030) ($MN)
  • Table 16 Global Advanced Packaging and Cutting Equipment Market Outlook, By Hybrid (2021-2030) ($MN)
  • Table 17 Global Advanced Packaging and Cutting Equipment Market Outlook, By Glass (2021-2030) ($MN)
  • Table 18 Global Advanced Packaging and Cutting Equipment Market Outlook, By Other Materials (2021-2030) ($MN)
  • Table 19 Global Advanced Packaging and Cutting Equipment Market Outlook, By Component (2021-2030) ($MN)
  • Table 20 Global Advanced Packaging and Cutting Equipment Market Outlook, By Software (2021-2030) ($MN)
  • Table 21 Global Advanced Packaging and Cutting Equipment Market Outlook, By Hardware (2021-2030) ($MN)
  • Table 22 Global Advanced Packaging and Cutting Equipment Market Outlook, By Services (2021-2030) ($MN)
  • Table 23 Global Advanced Packaging and Cutting Equipment Market Outlook, By Other Components (2021-2030) ($MN)
  • Table 24 Global Advanced Packaging and Cutting Equipment Market Outlook, By Technology (2021-2030) ($MN)
  • Table 25 Global Advanced Packaging and Cutting Equipment Market Outlook, By Laser-Based (2021-2030) ($MN)
  • Table 26 Global Advanced Packaging and Cutting Equipment Market Outlook, By Mechanical (2021-2030) ($MN)
  • Table 27 Global Advanced Packaging and Cutting Equipment Market Outlook, By Waterjet (2021-2030) ($MN)
  • Table 28 Global Advanced Packaging and Cutting Equipment Market Outlook, By Plasma (2021-2030) ($MN)
  • Table 29 Global Advanced Packaging and Cutting Equipment Market Outlook, By Othe Technologies (2021-2030) ($MN)
  • Table 30 Global Advanced Packaging and Cutting Equipment Market Outlook, By Application (2021-2030) ($MN)
  • Table 31 Global Advanced Packaging and Cutting Equipment Market Outlook, By Consumer Electronics (2021-2030) ($MN)
  • Table 32 Global Advanced Packaging and Cutting Equipment Market Outlook, By Automotive Electronics (2021-2030) ($MN)
  • Table 33 Global Advanced Packaging and Cutting Equipment Market Outlook, By Communication (2021-2030) ($MN)
  • Table 34 Global Advanced Packaging and Cutting Equipment Market Outlook, By Aerospace & Defense (2021-2030) ($MN)
  • Table 35 Global Advanced Packaging and Cutting Equipment Market Outlook, By Industrial (2021-2030) ($MN)
  • Table 36 Global Advanced Packaging and Cutting Equipment Market Outlook, By Healthcare (2021-2030) ($MN)
  • Table 37 Global Advanced Packaging and Cutting Equipment Market Outlook, By Other Applications (2021-2030) ($MN)

Note: Tables for North America, Europe, APAC, South America, and Middle East & Africa Regions are also represented in the same manner as above.