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1284189

到 2028 年的 3D IC 和 2.5D IC 封裝市場預測 - 按封裝技術（3D 矽通孔 (TSV)、3D 晶圓級芯片級封裝 (WLCSP)、2.5D）、按應用、按最終用戶、按地區進行全球分析

3D IC and 2.5D IC Packaging Market Forecasts to 2028 - Global Analysis By Packaging Technology (3D Through-Silicon Via, 3D Wafer-Level Chip-Scale Packaging and 2.5D), Application, End User and By Geography
出版日期: | 出版商: Stratistics Market Research Consulting | 英文 175+ Pages | 商品交期: 2-3個工作天內

價格

根據Stratistics MRC，2022年全球3D IC & 2.5D IC封裝市場規模將達到493億美元，預計2028年將達到1010億美元，預測期以復合年增長率增長期間的 12.7%

2.5D/3D 封裝是一種將許多集成電路 (IC) 封裝到同一封裝中的方法。 對於 2.5D，兩個或多個有源半導體芯片並排放置在矽中介層的頂部，以實現非常高的芯片到芯片連接密度。 有源芯片的三維結構與芯片堆疊集成在一起，以實現最短的連接和最小的封裝尺寸。 2.5D 和 3D 憑藉極高的封裝密度和出色的能效等優勢，近年來成為合適的 chiplet 集成平台。

根據 WSTS 的數據，由於傳感器和 MEMS 中先進晶圓級封裝技術的使用激增，半導體 IC 市場的收入將在 2021 年達到 4630 億美元，到 2022 年將增長 10% 以上，達到 5109 億美元。預計將達到 6000 萬美元，相信在預測期內將為 3D IC 封裝市場提供增長前景。

市場動態：

驅動程序：

消費電子產品和遊戲機越來越受歡迎

由於最近的技術進步，許多新產品進入市場，例如電子書閱讀器、遊戲設備、平板電腦、3D 智能眼鏡、增強現實和虛擬現實產品，這些產品具有高性能。電子元件是必要的。 3D IC 封裝技術通過縮短關鍵路徑和減少延遲來幫助克服處理器和內存之間的性能差距。 通過將重點從器件級縮放轉移到電路和系統級縮放，縮放可以以有效的方式繼續進行。

抑制：

與高集成相關的散熱問題

3D IC 的單位面積集成度非常高。 雖然這對於許多關注小型化的應用很有吸引力，但它也帶來了熱管理挑戰，因為更高的集成度會導致更高的片上溫度。 由於集成度的提高導致芯片內部溫度升高，因此3D IC存在必須解決的難題，例如更大的外形尺寸、更大的矽中介層和更長的設計週期。 在使用 TSV 製造 3D IC 時觀察到過熱現象。 溫度升高導致閾值電壓下降和遷移率下降。

機會

智能基礎設施和智能城市計劃正在蓄勢待發

3D IC 封裝可以在智慧城市技術的開發和部署中發揮重要作用。 智慧城市使用各種電子設備、傳感器和系統來實時收集和分析數據，以實現更好的決策制定和資源管理。 通過利用 3D IC 封裝，這些設備和系統可以做得更小、功能更強大且更節能。 這可以降低智慧城市基礎設施的總成本和規模，同時提高性能和可靠性。

威脅

3D IC 封裝可靠性挑戰

信息化、雲、可訪問性和物聯網 (IoT) 應用正在推動半導體行業的業務發展。 為了滿足現代信息和通信技術 (ICT) 系統的需求，隨著集成電路 (IC) 技術的縮小，需要改進封裝技術。 封裝開發和設計必須同時滿足價格、效率、外形尺寸和可靠性的目標。 在佈局操作方面，給定封裝的功率密度高於典型的 2D 芯片。 然而，解決可靠性問題非常重要，也是阻礙市場增長的一個因素。

COVID-19 的影響：

COVID-19 大流行對各種業務產生了重大影響，並推動了全球新醫療設備和小工具的開發。 自大流行爆發以來，多家醫療設備製造商宣布增加幾種新儀器和設備的產量。 由於 3D IC 封裝在醫療和保健行業有許多應用，製造工作的增加預計將增加對 3D IC 和 2.5D IC 封裝的需求。

預計 3D 晶圓級芯片尺寸封裝 (WLCSP) 細分市場將成為預測期內最大的細分市場。

3D 晶圓級芯片級封裝 (WLCSP) 細分市場是要求最苛刻的封裝類型之一，並且由於它提供了增強的印刷電路板功能和改進的熱穩定性，因此將實現有利可圖的增長。預計 3D WLCSP 是一種用於製造 3D IC 的更簡單的工藝架構，採用能夠承受高溫的聚合物並解決了市場最大的挑戰：熱穩定性。 3D WLCSP 在空間受限的消費電子產品、其他便攜式設備和工業產品中越來越受歡迎，以提供經濟、緊湊、輕便和高性能的半導體解決方案。

預計 MEMS/傳感器領域在預測期內的複合年增長率最高

在預測期內，MEMS/傳感器領域預計將以最高複合年增長率增長。 MEMS 功能組件包括微傳感器、微執行器和微電子器件。 先進的 MEMS 器件包括加速度計、陀螺儀、數字羅盤、慣性模塊、壓力傳感器、濕度傳感器、麥克風和智能傳感器。 在所有這些組件和傳感器中，基本要求是小型化結構。 因此，很多傳感器都採用了3D IC和2.5D IC封裝。

市場份額最高的地區

由於在許多消費電子產品（包括智能手機和平板電腦設備）中的廣泛使用，預計亞太地區在預測期內將佔據最高的市場份額。 這是由於該地區人口密度高，使其成為四大區域中3D IC和2.5D IC封裝潛在市場最大的區域。

複合年增長率最高的地區：

預計在預測期內，北美的複合年增長率最高。 這是由於對電子產品的需求增加、遠程工作和操作模式的增加以及數字化的增加，所有這些都增加了美國對尖端半導體設備的需求。 隨著對半導體設備的需求不斷增長，最新的封裝技術提供了當今數字世界所需的處理能力和外形規格。 預計這些因素將推動 3D IC 和 2.5D IC 在美國的銷售。

主要發展：

2023 年 4 月，三星將在倫敦和紐約的微軟體驗中心推出與 Xbox 合作的免費遊戲專區。使用 Game Pass Ultimate，您可以通過 Xbox 串流 100 多款高品質遊戲應用程序。

2023 年 4 月，三星和 TOILETPAPER 將合作為 Bespoke Appliances 引入前衛的標誌性設計。 我們與創意合作夥伴 TOILETPAPER 一起推出了一款全新的限量版 Bespoke 面板，可在廚房中最大限度地展現大膽的自我表達和個性化。

2023 年 3 月，Amkor 擴展了汽車電氣化的電源解決方案。 隨著對電氣化、可再生能源和高效電源的需求增加，Amkor 正在加緊在碳化矽方面的努力。

我們的報告提供了什麼

  • 區域和國家級細分市場的市場份額評估
  • 向新進入者提出戰略建議
  • 2020、2021、2022、2025 和 2028 年的綜合市場數據
  • 市場趨勢（驅動因素、制約因素、機會、威脅、挑戰、投資機會、建議）
  • 根據市場預測在關鍵業務領域提出戰略建議
  • 競爭格局映射關鍵共同趨勢。
  • 公司簡介，包括詳細的戰略、財務狀況和近期發展
  • 映射最新技術進步的供應鏈趨勢

免費定制優惠：

購買此報告的客戶將獲得以下免費定制選項之一：

  • 公司簡介
    • 其他市場參與者的綜合概況（最多 3 家公司）
    • 主要參與者的 SWOT 分析（最多 3 家公司）
  • 區域細分
    • 根據客戶的要求對主要國家/地區的市場估計/預測/複合年增長率（注意：基於可行性檢查）。
  • 競爭基準
    • 根據產品組合、區域影響力和戰略聯盟對主要參與者進行基準測試

內容

第 1 章執行摘要

第二章前言

  • 概覽
  • 利益相關者
  • 調查範圍
  • 調查方法
    • 數據挖掘
    • 數據分析
    • 數據驗證
    • 研究方法
  • 調查來源
    • 主要研究來源
    • 二級研究來源
    • 假設

第三章市場趨勢分析

  • 司機
  • 約束因素
  • 機會
  • 威脅
  • 應用分析
  • 最終用戶分析
  • 新興市場
  • COVID-19 的影響

第 4 章波特五力分析

  • 供應商的議價能力
  • 買家的議價能力
  • 替代品的威脅
  • 新進入者的威脅
  • 競爭公司之間的敵對關係

第 5 章全球 3D IC 和 2.5D IC 封裝市場：按封裝技術分類

  • 3D 矽通孔 (TSV)
  • 3D 晶圓級芯片尺寸封裝 (WLCSP)
  • 2.5D

第 6 章全球 3D IC 和 2.5D IC 封裝市場：按應用分類

  • 成像和光電
  • 內存
  • 邏輯
  • MEMS/傳感器
  • LED
  • 其他應用

第 7 章全球 3D IC 和 2.5D IC 封裝市場：按最終用戶分類

  • 行業
  • 電信
  • 消費類電子產品
  • 軍事和航空航天
  • 醫療設備
  • 汽車

第 8 章全球 3D IC 和 2.5D IC 封裝市場：按地區

  • 北美
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 德國
    • 英國
    • 意大利
    • 法國
    • 西班牙
    • 其他歐洲
  • 亞太地區
    • 日本
    • 中國
    • 印度
    • 澳大利亞
    • 新西蘭
    • 韓國
    • 其他亞太地區
  • 南美洲
    • 阿根廷
    • 巴西
    • 智利
    • 其他南美洲
  • 中東和非洲
    • 沙特阿拉伯
    • 阿拉伯聯合酋長國
    • 卡塔爾
    • 南非
    • 其他中東和非洲地區

第九章主要進展

  • 合同、夥伴關係、協作和合資企業
  • 收購與合併
  • 新產品發布
  • 業務擴展
  • 其他關鍵策略

第10章公司簡介

  • Samsung
  • ASE Technology Holding Co., Ltd.
  • Amkor Technology
  • Broadcom
  • United Microelectronics Corporation
  • Texas Instruments Inc
  • Powertech Technology Inc.
  • JCET Group Co., Ltd.
  • Taiwan Semiconductor Manufacturing Company, Ltd.
  • Intel Corporation
  • Toshiba Corporation
  • Invensas
  • GlobalFoundries
  • Siliconware Precision Industries Co. Ltd（SPIL）
  • Jiangsu Changjiang Electronics Technology Co., Ltd.
Product Code: SMRC23021

According to Stratistics MRC, the Global 3D IC and 2.5D IC Packaging Market is accounted for $49.3 billion in 2022 and is expected to reach $101.0 billion by 2028 growing at a CAGR of 12.7% during the forecast period. 2.5D / 3D packaging is a way of putting numerous integrated circuits (IC) into the same package. Two or more active semiconductor chips are put side by side atop a silicon interposer in a 2.5D arrangement to achieve extraordinarily high die-to-die connection density. Active chips in 3D structures are integrated via die stacking for the shortest connectivity and lowest package footprint. Because of their advantages in obtaining exceptionally high package density and great energy efficiency, 2.5D and 3D have gained traction as an appropriate chiplet integration platform in recent years.

According to WSTS, the IC market for semiconductors reached USD 463 billion in revenue in 2021 and is expected to grow by over 10% to USD 510.96 billion in 2022 due to the surging usage of advanced wafer-level packaging technologies in sensors and MEMS, is expected to provide growth prospects for the 3D IC packaging market during the forecast period.

Market Dynamics:

Driver:

Consumer gadgets and gaming devices are becoming increasingly popular

Many new gadgets are entering the market as a result of recent technological advancements, such as e-book readers, gaming devices, tablet computers, 3D smart glass, augmented reality, and virtual reality products, all of which require high-performance electronic components. By shortening the critical route and lowering latency, 3D IC packaging technology has helped overcome the processor memory performance gap. It also enables scaling to continue in an effective manner by shifting the emphasis from device-level scaling to circuit- and system-level scaling.

Restraint:

Thermal difficulties caused by a higher level of integration

3D integrated circuits provide extremely dense multi-level integration per unit footprint. Though this is appealing for many applications where miniaturisation is a concern, it also poses thermal management challenges; increased integration leads to high on-chip temperatures. A bigger form factor, the need for a larger silicon interposer, and lengthier design cycles are all difficulties that must be addressed with 3D ICs. During the production of 3D ICs with TSVs, overheating has been observed. Elevated temperatures cause a decrease in threshold voltage and mobility deterioration.

Opportunity:

A growing number of smart infrastructure and smart city initiatives are being developed

3D IC packaging has the potential to play an important role in the development and deployment of smart city technologies. Smart cities use a range of electronic devices, sensors, and systems to gather and analyse data in real time, allowing for better decision-making and resource management. These devices and systems can be made smaller, more powerful, and energy efficient by utilising 3D IC packaging. This contributes to lowering the total cost and size of smart city infrastructure while enhancing performance and dependability.

Threat:

3D IC packaging reliability challenges

Applications like as information centred, cloud, accessibility, and the Internet of Things (IoT) drive the semiconductor sector business. To meet the needs of modern information and communication technology (ICT) systems, packaging technology must improve in tandem with the scaling of integrated circuit (IC) technology. Package development and design must fulfil price, efficiency, form factor, and dependability goals all at the same time. When it comes to operating the layout, the power density for a given footprint is higher than for typical 2D chips. However, addressing issues of dependability will be critical which hampers the growth of the market.

COVID-19 Impact:

The COVID-19 pandemic has had a huge influence on different businesses while also propelling the development of new medical equipment and gadgets throughout the world. Following the pandemic outbreak, several medical equipment manufacturing companies announced an increase in the production of several new equipment and devices. Because 3D IC packaging has numerous applications in the medical and healthcare industries, increased manufacturing initiatives are expected to increase demand for 3D IC and 2.5D IC packaging.

The 3D wafer-level chip-scale packaging (WLCSP) segment is expected to be the largest during the forecast period

The 3D wafer-level chip-scale packaging (WLCSP) segment is estimated to have a lucrative growth, due to its one of most tightly packaging type, offering enhanced capabilities and improved thermal stability in printed circuit boards. 3D WLCSP is a simpler process architecture for producing 3D ICs, which employs polymers that can withstand high temperatures, resolving the thermal stability issue, which is the market's biggest difficulty. Because it provides economical, small, lightweight, exceptional performance semiconductor solutions, 3D WLCSP has been gaining prominence in facility-constrained consumer's electronic applications and other portable consumer devices, as well as industrial products.

The MEMS/Sensors segment is expected to have the highest CAGR during the forecast period

The MEMS/Sensors segment is anticipated to witness the highest CAGR growth during the forecast period, because MEMS functional components include micro sensors, micro actuators, and microelectronics. MEMS advanced elements include accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, microphones, and smart sensors, among others. The essential need in all of these parts and sensors is a miniaturised construction. As a result, many sensors are now using 3D IC and 2.5D IC packaging.

Region with highest share:

Asia Pacific is projected to hold the highest market share during the forecast period owing to its extensive reach in numerous consumer electronics applications, notably smartphone and tablets, the Asia Pacific area is one of the important markets for 3D IC and 2.5D IC packaging. This is mostly due to the region's high population density, which makes it the greatest potential market for 3D IC and 2.5D IC packaging among the four key areas.

Region with highest CAGR:

North America is projected to have the highest CAGR over the forecast period, owing to rising demand for electronics; growing patterns of remote work and remote operations, and boosting digitalization have all contributed to the need for cutting-edge semiconductor devices in the United States. As the demand for semiconductor devices rises, modern packaging techniques provide the processing power and form factor required for today's digital world. These factors are expected to drive 3D IC and 2.5D IC sales in the United States.

Key players in the market:

Some of the key players profiled in the 3D IC and 2.5D IC Packaging Market include Samsung, ASE Technology Holding Co., Ltd., Amkor Technology, Broadcom, United Microelectronics Corporation, Texas Instruments Inc, Powertech Technology Inc., JCET Group Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., Intel Corporation, Toshiba Corporation, Invensas, GlobalFoundries, Siliconware Precision Industries Co. Ltd (SPIL) and Jiangsu Changjiang Electronics Technology Co., Ltd.

Key Developments:

In April 2023, Samsung Opens Free-to-Play Gaming Zones in Collaboration With Xbox at Microsoft Experience Centers in London, New York, with this partnership, Samsung Gaming Hub users are now able to stream over 100 high-quality games through the Xbox App by subscribing to Xbox Game Pass Ultimate.

In April 2023, Samsung and TOILETPAPER Collaborate to Introduce Edgy, Iconic Designs for Bespoke Appliances, together with creative partner TOILETPAPER, Samsung offers new, limited-edition Bespoke panels that maximize bold self-expression and personalization in the kitchen.

In March 2023, Amkor Expands Power Solutions for Automotive Electrification, as the demand for electrification, renewable energy, and efficient power delivery continues to grow, Amkor is focusing increased effort on silicon carbide

Packaging Technologies Covered:

  • 3D Through-Silicon Via (TSV)
  • 3D Wafer-Level Chip-Scale Packaging (WLCSP)
  • 2.5D

Applications Covered:

  • Imaging & Optoelectronics
  • Memory
  • Logic
  • MEMS/Sensors
  • LED
  • Other Applications

End Users Covered:

  • Industrial
  • Telecommunications
  • Consumer Electronics
  • Military & Aerospace
  • Medical Devices
  • Automotive

Regions Covered:

  • North America
    • US
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • Italy
    • France
    • Spain
    • Rest of Europe
  • Asia Pacific
    • Japan
    • China
    • India
    • Australia
    • New Zealand
    • South Korea
    • Rest of Asia Pacific
  • South America
    • Argentina
    • Brazil
    • Chile
    • Rest of South America
  • Middle East & Africa
    • Saudi Arabia
    • UAE
    • Qatar
    • South Africa
    • Rest of Middle East & Africa

What our report offers:

  • Market share assessments for the regional and country-level segments
  • Strategic recommendations for the new entrants
  • Covers Market data for the years 2020, 2021, 2022, 2025, and 2028
  • Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
  • Strategic recommendations in key business segments based on the market estimations
  • Competitive landscaping mapping the key common trends
  • Company profiling with detailed strategies, financials, and recent developments
  • Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

  • Company Profiling
    • Comprehensive profiling of additional market players (up to 3)
    • SWOT Analysis of key players (up to 3)
  • Regional Segmentation
    • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
  • Competitive Benchmarking
    • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

  • 2.1 Abstract
  • 2.2 Stake Holders
  • 2.3 Research Scope
  • 2.4 Research Methodology
    • 2.4.1 Data Mining
    • 2.4.2 Data Analysis
    • 2.4.3 Data Validation
    • 2.4.4 Research Approach
  • 2.5 Research Sources
    • 2.5.1 Primary Research Sources
    • 2.5.2 Secondary Research Sources
    • 2.5.3 Assumptions

3 Market Trend Analysis

  • 3.1 Introduction
  • 3.2 Drivers
  • 3.3 Restraints
  • 3.4 Opportunities
  • 3.5 Threats
  • 3.6 Application Analysis
  • 3.7 End User Analysis
  • 3.8 Emerging Markets
  • 3.9 Impact of Covid-19

4 Porters Five Force Analysis

  • 4.1 Bargaining power of suppliers
  • 4.2 Bargaining power of buyers
  • 4.3 Threat of substitutes
  • 4.4 Threat of new entrants
  • 4.5 Competitive rivalry

5 Global 3D IC and 2.5D IC Packaging Market, By Packaging Technology

  • 5.1 Introduction
  • 5.2 3D Through-Silicon Via (TSV)
  • 5.3 3D Wafer-Level Chip-Scale Packaging (WLCSP)
  • 5.4 2.5D

6 Global 3D IC and 2.5D IC Packaging Market, By Application

  • 6.1 Introduction
  • 6.2 Imaging & Optoelectronics
  • 6.3 Memory
  • 6.4 Logic
  • 6.5 MEMS/Sensors
  • 6.6 LED
  • 6.7 Other Applications

7 Global 3D IC and 2.5D IC Packaging Market, By End User

  • 7.1 Introduction
  • 7.2 Industrial
  • 7.3 Telecommunications
  • 7.4 Consumer Electronics
  • 7.5 Military & Aerospace
  • 7.6 Medical Devices
  • 7.7 Automotive

8 Global 3D IC and 2.5D IC Packaging Market, By Geography

  • 8.1 Introduction
  • 8.2 North America
    • 8.2.1 US
    • 8.2.2 Canada
    • 8.2.3 Mexico
  • 8.3 Europe
    • 8.3.1 Germany
    • 8.3.2 UK
    • 8.3.3 Italy
    • 8.3.4 France
    • 8.3.5 Spain
    • 8.3.6 Rest of Europe
  • 8.4 Asia Pacific
    • 8.4.1 Japan
    • 8.4.2 China
    • 8.4.3 India
    • 8.4.4 Australia
    • 8.4.5 New Zealand
    • 8.4.6 South Korea
    • 8.4.7 Rest of Asia Pacific
  • 8.5 South America
    • 8.5.1 Argentina
    • 8.5.2 Brazil
    • 8.5.3 Chile
    • 8.5.4 Rest of South America
  • 8.6 Middle East & Africa
    • 8.6.1 Saudi Arabia
    • 8.6.2 UAE
    • 8.6.3 Qatar
    • 8.6.4 South Africa
    • 8.6.5 Rest of Middle East & Africa

9 Key Developments

  • 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
  • 9.2 Acquisitions & Mergers
  • 9.3 New Product Launch
  • 9.4 Expansions
  • 9.5 Other Key Strategies

10 Company Profiling

  • 10.1 Samsung
  • 10.2 ASE Technology Holding Co., Ltd.
  • 10.3 Amkor Technology
  • 10.4 Broadcom
  • 10.5 United Microelectronics Corporation
  • 10.6 Texas Instruments Inc
  • 10.7 Powertech Technology Inc.
  • 10.8 JCET Group Co., Ltd.
  • 10.9 Taiwan Semiconductor Manufacturing Company, Ltd.
  • 10.10 Intel Corporation
  • 10.11 Toshiba Corporation
  • 10.12 Invensas
  • 10.13 GlobalFoundries
  • 10.14 Siliconware Precision Industries Co. Ltd (SPIL)
  • 10.15 Jiangsu Changjiang Electronics Technology Co., Ltd.

List of Tables

  • Table 1 Global 3D IC and 2.5D IC Packaging Market Outlook, By Region (2020-2028) ($MN)
  • Table 2 Global 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
  • Table 3 Global 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
  • Table 4 Global 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
  • Table 5 Global 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
  • Table 6 Global 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
  • Table 7 Global 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
  • Table 8 Global 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
  • Table 9 Global 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
  • Table 10 Global 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
  • Table 11 Global 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
  • Table 12 Global 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
  • Table 13 Global 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
  • Table 14 Global 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
  • Table 15 Global 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
  • Table 16 Global 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
  • Table 17 Global 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
  • Table 18 Global 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
  • Table 19 Global 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
  • Table 20 North America 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
  • Table 21 North America 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
  • Table 22 North America 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
  • Table 23 North America 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
  • Table 24 North America 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
  • Table 25 North America 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
  • Table 26 North America 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
  • Table 27 North America 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
  • Table 28 North America 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
  • Table 29 North America 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
  • Table 30 North America 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
  • Table 31 North America 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
  • Table 32 North America 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
  • Table 33 North America 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
  • Table 34 North America 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
  • Table 35 North America 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
  • Table 36 North America 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
  • Table 37 North America 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
  • Table 38 North America 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
  • Table 39 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
  • Table 40 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
  • Table 41 Europe 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
  • Table 42 Europe 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
  • Table 43 Europe 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
  • Table 44 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
  • Table 45 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
  • Table 46 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
  • Table 47 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
  • Table 48 Europe 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
  • Table 49 Europe 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
  • Table 50 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
  • Table 51 Europe 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
  • Table 52 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
  • Table 53 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
  • Table 54 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
  • Table 55 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
  • Table 56 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
  • Table 57 Europe 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
  • Table 58 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
  • Table 59 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
  • Table 60 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
  • Table 61 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
  • Table 62 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
  • Table 63 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
  • Table 64 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
  • Table 65 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
  • Table 66 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
  • Table 67 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
  • Table 68 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
  • Table 69 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
  • Table 70 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
  • Table 71 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
  • Table 72 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
  • Table 73 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
  • Table 74 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
  • Table 75 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
  • Table 76 Asia Pacific 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
  • Table 77 South America 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
  • Table 78 South America 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
  • Table 79 South America 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
  • Table 80 South America 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
  • Table 81 South America 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
  • Table 82 South America 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
  • Table 83 South America 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
  • Table 84 South America 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
  • Table 85 South America 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
  • Table 86 South America 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
  • Table 87 South America 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
  • Table 88 South America 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
  • Table 89 South America 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
  • Table 90 South America 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
  • Table 91 South America 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
  • Table 92 South America 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
  • Table 93 South America 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
  • Table 94 South America 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
  • Table 95 South America 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)
  • Table 96 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Country (2020-2028) ($MN)
  • Table 97 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Packaging Technology (2020-2028) ($MN)
  • Table 98 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By 3D Through-Silicon Via (TSV) (2020-2028) ($MN)
  • Table 99 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By 3D Wafer-Level Chip-Scale Packaging (WLCSP) (2020-2028) ($MN)
  • Table 100 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By 2.5D (2020-2028) ($MN)
  • Table 101 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Application (2020-2028) ($MN)
  • Table 102 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Imaging & Optoelectronics (2020-2028) ($MN)
  • Table 103 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Memory (2020-2028) ($MN)
  • Table 104 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Logic (2020-2028) ($MN)
  • Table 105 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By MEMS/Sensors (2020-2028) ($MN)
  • Table 106 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By LED (2020-2028) ($MN)
  • Table 107 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Other Applications (2020-2028) ($MN)
  • Table 108 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By End User (2020-2028) ($MN)
  • Table 109 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Industrial (2020-2028) ($MN)
  • Table 110 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Telecommunications (2020-2028) ($MN)
  • Table 111 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Consumer Electronics (2020-2028) ($MN)
  • Table 112 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Military & Aerospace (2020-2028) ($MN)
  • Table 113 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Medical Devices (2020-2028) ($MN)
  • Table 114 Middle East & Africa 3D IC and 2.5D IC Packaging Market Outlook, By Automotive (2020-2028) ($MN)