2025 年 3D IC 和 2.5D IC封裝全球市場報告

預計未來幾年 3D IC 和 2.5D IC封裝市場規模將快速成長。到 2029 年，這一數字將成長至 889 億美元，年複合成長率（CAGR）為 10.7%。預測期內的成長可歸因於穿戴式和行動裝置的出現、對能源效率的不斷成長的需求、對高效能運算 (HPC) 的需求不斷成長、向系統晶片(SOC) 設計的轉變、半導體設備複雜性的不斷增加以及物聯網的普及。預測期內的關鍵趨勢包括 5G 技術進步、先進的互連技術、產業協作和標準化、半導體技術的技術進步以及封裝材料的創新。

預計未來幾年消費電子產品的需求將不斷成長將刺激 3D IC 和 2.5D IC封裝市場的擴張。家用電子電器包括供消費者購買並供個人非商業使用的電子設備。 3D IC（積體電路）和 2.5D IC封裝是先進的封裝技術，可實現更高的性能、更廣泛的功能和更小的尺寸。家用電子電器和遊戲設備需求的激增是由技術進步、可支配收入的增加、遊戲產業的擴大、數位轉型、遠端工作趨勢、娛樂偏好、不斷變化的生活方式以及社交媒體和內容消費的影響所推動的。例如，韓國家電製造商LG在2023年1月發布的年度財務報告中稱，2022與前一年同期比較增12.9%，至約527億美元。此外，LG家用電器與空氣解決方案公司經歷了令人印象深刻的一年，2022 年的收益為 225 億美元，較上年成長 10.3%。因此，消費性電子產品的需求不斷成長，推動了 3D IC 和 2.5D IC封裝市場的成長。

預計電動車（EV）的興起將在短期內推動 3D IC 和 2.5D IC封裝市場的成長。電動車是部分或全部由儲存在二次電池中的電力動力來源的汽車。在電動車中，3D IC 技術用於垂直堆疊積體電路，最佳化空間並促進電源管理、馬達控制和通訊系統在緊湊佈局中的整合。例如，根據國際能源總署（IEA）2022年5月發布的《全球電動車展望》報告，2021年電動車銷量較與前一年同期比較加倍，達到約660萬輛。此外，預計 2022 年第一季這一數字還將進一步增加，全球電動車銷量將達到 200 萬輛。因此，電動車的日益普及是3D IC和2.5D IC封裝市場擴張的關鍵驅動力。

目錄

第1章執行摘要

第2章 市場特徵

第3章 市場趨勢與策略

第 4 章 市場：宏觀經濟情景，包括利率、通膨、地緣政治、新冠疫情以及復甦對市場的影響

第5章 全球成長分析與策略分析框架

• 全球 3D IC 和 2.5D IC封裝PESTEL 分析（政治、社會、技術、環境、法律因素、促進因素、限制因素）
• 最終用途產業分析
• 全球 3D IC 和 2.5D IC封裝市場：成長率分析
• 全球 3D IC 和 2.5D IC封裝市場表現：規模和成長，2019 年至 2024 年
• 全球 3D IC 和 2.5D IC封裝市場預測：規模與成長，2024-2029 年，2034 年預測
• 全球 3D IC 和 2.5D IC封裝總目標市場 (TAM)

第6章 市場細分

• 全球 3D IC 和 2.5D IC封裝市場（按技術、效能和預測），2019-2024 年、2024-2029 年、2034 年
• 3D晶圓級構裝
• 3D TSV（穿透矽通孔）
• 是
• 全球 3D IC 和 2.5D IC封裝市場（按應用、效能和預測），2019-2024 年、2024-2029 年、2034 年
• 邏輯
• 記憶
• 成像與光電子
• MEMS 或感測器
• LED
• 其他用途
• 全球 3D IC 和 2.5D IC封裝市場（按最終用戶、業績和預測），2019-2024 年、2024-2029 年、2034 年
• 通訊
• 家電
• 車
• 軍事和航太
• 醫療設備
• 智慧科技
• 其他最終用戶
• 全球 3D IC 和 2.5D IC封裝市場 3D 晶圓級晶片規模封裝 (WLCSP) 按類型、實際和預測細分，2019-2024 年、2024-2029F、2034F
• 直接晶片連接
• 晶圓級封裝 (WLP)
• 全球 3D IC 和 2.5D IC封裝市場 3D TSV（穿透矽通孔）細分（按類型）、實際和預測，2019-2024 年、2024-2029 年、2034 年
• 基於中介層的 TSV
• 堆疊晶粒TSV
• 全球 3D IC 和 2.5D IC封裝市場、2.5D 細分市場、類型、效能和預測，2019-2024 年、2024-2029 年、2034 年
• 有源內插器

第7章 區域和國家分析

• 全球 3D IC 和 2.5D IC封裝市場（按地區、業績和預測）2019-2024 年、2024-2029 年、2034 年
• 全球 3D IC 和 2.5D IC封裝市場（按國家分類）、業績和預測，2019-2024 年、2024-2029 年、2034 年

第8章 亞太市場

第9章：中國市場

第10章 印度市場

第11章 日本市場

第12章 澳洲市場

第13章 印尼市場

第14章 韓國市場

第15章 西歐市場

第16章英國市場

第 17 章 德國市場

第 18 章 法國市場

第 19 章：義大利市場

第 20 章：西班牙市場

第21章 東歐市場

第22章 俄羅斯市場

第23章 北美市場

第24章美國市場

第 25 章：加拿大市場

第26章 南美洲市場

第 27 章：巴西市場

第28章 中東市場

第 29 章：非洲市場

第 30 章競爭格局與公司概況

• 3D IC 和 2.5D IC封裝市場：競爭格局
• 3D IC 和 2.5D IC封裝市場：公司簡介
  • Samsung Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • Siemens AG Overview, Products and Services, Strategy and Financial Analysis
  • Intel Corporation Overview, Products and Services, Strategy and Financial Analysis
  • Taiwan Semiconductor Manufacturing Company Limited Overview, Products and Services, Strategy and Financial Analysis
  • SK Hynix Inc. Overview, Products and Services, Strategy and Financial Analysis

第31章 其他大型創新企業

• Broadcom Inc.
• Fujitsu Limited
• Toshiba Corporation
• ASE Technology Holding Co. Ltd.
• Texas Instruments Incorporated
• STMicroelectronics NV
• Infineon Technologies AG
• Renesas Electronics Corporation
• United Microelectronics Corporation
• GlobalFoundries Inc.
• Amkor Technology Inc.
• Unimicron Technology Corporation
• Jiangsu Changjiang Electronics Technology Co. Ltd.
• Cadence Design Systems Inc.
• Siliconware Precision Industries Co. Ltd.

第 32 章 全球市場競爭基準化分析與儀表板

第33章 重大併購

第 34 章 近期市場趨勢

第 35 章 高市場潛力國家、細分市場與策略

• 2029 年 3D IC 與 2.5D IC封裝市場：提供新機會的國家
• 2029 年 3D IC 和 2.5D IC封裝市場：細分市場將帶來新機會
• 2029 年 3D IC 與 2.5D IC封裝市場：成長策略
  • 基於市場趨勢的策略
  • 競爭對手的策略

第 36 章 附錄

3D Integrated Circuit (IC) and 2.5D IC packaging represent advanced technologies within the semiconductor industry, aimed at enhancing chip density and overall performance. In 3D IC packaging, multiple integrated circuits are vertically stacked, facilitating heightened interconnect density and shorter interconnect lengths. On the other hand, 2.5D IC packaging achieves connectivity among multiple chips through an interposer, typically a silicon substrate.

The principal categories of 3D IC and 2.5D IC packaging encompass 3D wafer-level chip-scale packaging, 3D Through-Silicon Via (TSV), and 2.5D technology. 3D wafer-level chip-scale packaging entails integrating numerous dies or chips into a singular package at the wafer level. This technology finds applications across diverse sectors such as logic, memory, imaging, optoelectronics, MEMS or sensors, LEDs, and others. It caters to various end-users including telecommunications, consumer electronics, automotive, military and aerospace, medical devices, smart technologies, among others.

The 3D IC and 2.5D IC packaging market research report is one of a series of new reports from The Business Research Company that provides 3D IC and 2.5D IC packaging market statistics, including 3D IC and 2.5D IC packaging industry global market size, regional shares, competitors with a 3D IC and 2.5D IC packaging market share, detailed 3D IC and 2.5D IC packaging market segments, 3D IC and 2.5D IC packaging market trends and opportunities, and any further data you may need to thrive in the 3D IC and 2.5D IC packaging industry. This 3D IC and 2.5D IC packaging market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenario of the industry.

The 3D IC And 2.5D IC packaging market size has grown rapidly in recent years. It will grow from $53.51 billion in 2024 to $59.28 billion in 2025 at a compound annual growth rate (CAGR) of 10.8%. The growth in the historic period can be attributed to miniaturization of electronic devices, demand for improved power efficiency, demand for improved signal integrity, demand for consumer electronics and gaming devices, performance enhancement

The 3D IC And 2.5D IC packaging market size is expected to see rapid growth in the next few years. It will grow to $88.9 billion in 2029 at a compound annual growth rate (CAGR) of 10.7%. The growth in the forecast period can be attributed to emergence of wearable and portable devices, growing need for energy efficiency, rising demand for high-performance computing (HPC), shift toward system-on-chip (soc) designs, increasing complexity of semiconductor devices, IoT proliferation. Major trends in the forecast period include 5G technology advancements, advanced interconnect technologies, industry collaboration and standards, technological advancements in semiconductor technology, innovation in packaging materials.

The rising demand for consumer electronics is anticipated to fuel the expansion of the 3D IC and 2.5D IC packaging market in the future. Consumer electronics encompass electronic devices designed for purchase and personal, non-commercial use by consumers. 3D IC (Integrated Circuit) and 2.5D IC packaging represent advanced packaging technologies that deliver improved performance, expanded functionalities, and the downsizing of electronic gadgets. The upsurge in demand for consumer electronics and gaming devices is propelled by technological advancements, increased disposable income, the expansion of the gaming industry, digital transformation, remote work trends, entertainment preferences, evolving lifestyles, and the impact of social media and content consumption. As an illustration, LG, a South Korea-based consumer electronics company, reported a 12.9% growth in sales for 2022 in its annual financial report released in January 2023, surpassing approximately $52.70 billion in sales from the previous year. Moreover, the LG Home Appliance & Air Solution Company experienced a remarkable year, generating a revenue of $22.5 billion in 2022, marking a 10.3% surge from the preceding year. Consequently, the escalating demand for consumer electronics is a driving force behind the growth of the 3D IC and 2.5D IC packaging market.

The increasing acceptance of electric vehicles (EVs) is projected to drive the growth of the 3D IC and 2.5D IC packaging market in the foreseeable future. Electric vehicles are automobiles powered, either partially or entirely, by electricity stored in rechargeable batteries. Within electric vehicles, 3D IC technology is utilized to vertically stack integrated circuits, optimizing space and facilitating the integration of power management, motor control, and communication systems in a compact layout. For instance, as per the Global Electric Vehicle Outlook report by the International Energy Agency (IEA) released in May 2022, electric vehicle sales doubled in 2021 compared to the previous year, reaching approximately 6.6 million units. Furthermore, the first quarter of 2022 witnessed a further increase with 2 million electric cars sold globally. Thus, the growing adoption of electric vehicles stands as a key driver behind the expansion of the 3D IC and 2.5D IC packaging market.

Technological advancements stand as a prominent trend gaining traction within the 3D IC and 2.5D IC packaging market. Leading firms engaged in this sector are embracing novel technologies to maintain their market standing. A prime example occurred in June 2022 when ASE Technology Holding Co. Ltd., a semiconductor manufacturing services provider based in Taiwan, introduced VIPack. This cutting-edge packaging platform, an evolution in 3D heterogeneous integration architecture, broadens design parameters while delivering exceptionally high performance and density. VIPack empowers companies to achieve unparalleled innovation by integrating multiple chips into a single package. It leverages advanced redistribution layer (RDL) technologies, embedded integration, and 2.5D and 3D technologies. VIPack encompasses six fundamental packaging technology pillars, complemented by a comprehensive co-design ecosystem. These pillars encompass ASE's high-density through Silicon Via (TSV)-based 2.5D and 3D IC, Co-Packaged Optics processing capabilities, along with Fanout Package-on-Package (FOPoP), Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Fanout System-in-Package (FOSiP)-based technologies.

Major companies in the 3D IC and 2.5D IC packaging market are innovating new technologies, such as next-generation 2.5D technologies, to achieve a competitive advantage. 2.5D packaging technology refers to an advanced semiconductor integration method where multiple integrated circuit (IC) components, including logic dies and memory dies, are stacked on a single substrate or interposer. For example, in June 2024, Siemens Digital Industries Software, a US-based computer software company, launched Innovator3D IC, a new software solution that provides a rapid and reliable approach for planning and integrating ASICs and chiplets using the latest advanced semiconductor packaging technologies, including 2.5D and 3D substrates. Innovator3D IC offers a centralized platform for creating a digital twin, encompassing a unified data model for design planning, prototyping, and predictive analysis of the entire semiconductor package assembly. This platform streamlines implementation, multi-physics analysis, mechanical design, testing, signoff, and manufacturing release.

In January 2024, Cadence Design Systems Inc., a US-based electronic design automation (EDA) software and engineering service company, acquired Invecas Inc. for an undisclosed sum. This acquisition aligns with Cadence's strategy to bolster its capabilities in advanced packaging solutions, particularly in the areas of 3D IC and 2.5D IC packaging. By integrating Invecas' skilled system design engineering team, Cadence intends to provide custom solutions that address the evolving needs of its customers in chip design, product engineering, and embedded software development. Invecas, Inc. is a US-based product engineering company that offers custom solutions for the semiconductor industry, including 3D IC and 2.5D IC packaging solutions.

Major companies operating in the 3D IC and 2.5D IC packaging market include Samsung Electronics Co. Ltd., Siemens AG, Intel Corporation, Taiwan Semiconductor Manufacturing Company Limited, SK Hynix Inc., Broadcom Inc., Fujitsu Limited, Toshiba Corporation, ASE Technology Holding Co. Ltd., Texas Instruments Incorporated, STMicroelectronics NV, Infineon Technologies AG, Renesas Electronics Corporation, United Microelectronics Corporation, GlobalFoundries Inc., Amkor Technology Inc., Unimicron Technology Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Cadence Design Systems Inc., Siliconware Precision Industries Co. Ltd., Powertech Technology Inc., Ansys Inc., STATS ChipPAC Pte. Ltd., Synopsys Inc, UTAC Holdings Ltd., Tessolve Semiconductor Private Limited, Invensas Corporation, National Center for Advanced Packaging Co. Ltd., Tohoku-MicroTec Co. Ltd, TechSearch International Inc.

Asia-Pacific was the largest region in the 3D IC and 2.5D IC market in 2024. It is expected to be the fastest-growing region in the forecast period. The regions covered in the 3d ic and 2.5d ic packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the 3d ic and 2.5d ic packaging market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The 3D IC and 2.5D IC packaging market consists of revenues earned by entities by providing ultra-high routing density, AI accelerator for AI training, and power or optics integration. The market value includes the value of related goods sold by the service provider or included within the service offering. The 3D IC and 2.5D IC packaging market also includes sales of memory modules, system-on-chip devices, graphics processing units (GPU), electronic components, and single semiconductor wafer. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

3D IC And 2.5D IC Packaging Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on 3d ic and 2.5d ic packaging market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for 3d ic and 2.5d ic packaging ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The 3d ic and 2.5d ic packaging market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

• The market characteristics section of the report defines and explains the market.
• The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
• The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the Russia-Ukraine war, rising inflation, higher interest rates, and the legacy of the COVID-19 pandemic.

• Market segmentations break down the market into sub markets.
• The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
• The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
• The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

• Markets Covered:1) By Technology: 3D Wafer-Level Chip-Scale Packaging; 3D TSV (Through-Silicon Via); 2.5D
• 2) By Application: Logic; Memory; Imaging And Optoelectronics; MEMS Or Sensors; LED; Other Applications
• 3) By End-User: Telecommunication; Consumer Electronics; Automotive; Military And Aerospace; Medical Devices; Smart Technologies; Other End Users
• Subsegments:
• 1) By 3D Wafer-Level Chip-Scale Packaging (WLCSP): Direct Chip Attach; Wafer-Level Packaging (WLP)
• 2) By 3D TSV (Through-Silicon Via): Interposer-Based TSV; Stacked Die TSV
• 3) By 2.5D: Active Interposers
• Companies Mentioned: Samsung Electronics Co. Ltd.; Siemens AG; Intel Corporation; Taiwan Semiconductor Manufacturing Company Limited; SK Hynix Inc.
• Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
• Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
• Time series: Five years historic and ten years forecast.
• Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
• Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
• Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
• Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. 3D IC And 2.5D IC Packaging Market Characteristics

3. 3D IC And 2.5D IC Packaging Market Trends And Strategies

4. 3D IC And 2.5D IC Packaging Market - Macro Economic Scenario including the impact of Interest Rates, Inflation, Geopolitics and Covid And Recovery on the Market

5. Global 3D IC And 2.5D IC Packaging Growth Analysis And Strategic Analysis Framework

• 5.1. Global 3D IC And 2.5D IC Packaging PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
• 5.2. Analysis Of End Use Industries
• 5.3. Global 3D IC And 2.5D IC Packaging Market Growth Rate Analysis
• 5.4. Global 3D IC And 2.5D IC Packaging Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
• 5.5. Global 3D IC And 2.5D IC Packaging Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
• 5.6. Global 3D IC And 2.5D IC Packaging Total Addressable Market (TAM)

6. 3D IC And 2.5D IC Packaging Market Segmentation

• 6.1. Global 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 3D Wafer-Level Chip-Scale Packaging
• 3D TSV (Through-Silicon Via)
• 2.5D
• 6.2. Global 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Logic
• Memory
• Imaging And Optoelectronics
• MEMS Or Sensors
• LED
• Other Applications
• 6.3. Global 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Telecommunication
• Consumer Electronics
• Automotive
• Military And Aerospace
• Medical Devices
• Smart Technologies
• Other End Users
• 6.4. Global 3D IC And 2.5D IC Packaging Market, Sub-Segmentation Of 3D Wafer-Level Chip-Scale Packaging (WLCSP), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Direct Chip Attach
• Wafer-Level Packaging (WLP)
• 6.5. Global 3D IC And 2.5D IC Packaging Market, Sub-Segmentation Of 3D TSV (Through-Silicon Via), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Interposer-Based TSV
• Stacked Die TSV
• 6.6. Global 3D IC And 2.5D IC Packaging Market, Sub-Segmentation Of 2.5D, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Active Interposers

7. 3D IC And 2.5D IC Packaging Market Regional And Country Analysis

• 7.1. Global 3D IC And 2.5D IC Packaging Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 7.2. Global 3D IC And 2.5D IC Packaging Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific 3D IC And 2.5D IC Packaging Market

• 8.1. Asia-Pacific 3D IC And 2.5D IC Packaging Market Overview
• Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
• 8.2. Asia-Pacific 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.3. Asia-Pacific 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.4. Asia-Pacific 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China 3D IC And 2.5D IC Packaging Market

• 9.1. China 3D IC And 2.5D IC Packaging Market Overview
• 9.2. China 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.3. China 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.4. China 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India 3D IC And 2.5D IC Packaging Market

• 10.1. India 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.2. India 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.3. India 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan 3D IC And 2.5D IC Packaging Market

• 11.1. Japan 3D IC And 2.5D IC Packaging Market Overview
• 11.2. Japan 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.3. Japan 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.4. Japan 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia 3D IC And 2.5D IC Packaging Market

• 12.1. Australia 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.2. Australia 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.3. Australia 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia 3D IC And 2.5D IC Packaging Market

• 13.1. Indonesia 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.2. Indonesia 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.3. Indonesia 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea 3D IC And 2.5D IC Packaging Market

• 14.1. South Korea 3D IC And 2.5D IC Packaging Market Overview
• 14.2. South Korea 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.3. South Korea 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.4. South Korea 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe 3D IC And 2.5D IC Packaging Market

• 15.1. Western Europe 3D IC And 2.5D IC Packaging Market Overview
• 15.2. Western Europe 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.3. Western Europe 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.4. Western Europe 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK 3D IC And 2.5D IC Packaging Market

• 16.1. UK 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.2. UK 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.3. UK 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany 3D IC And 2.5D IC Packaging Market

• 17.1. Germany 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.2. Germany 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.3. Germany 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France 3D IC And 2.5D IC Packaging Market

• 18.1. France 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.2. France 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.3. France 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy 3D IC And 2.5D IC Packaging Market

• 19.1. Italy 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.2. Italy 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.3. Italy 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain 3D IC And 2.5D IC Packaging Market

• 20.1. Spain 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.2. Spain 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.3. Spain 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe 3D IC And 2.5D IC Packaging Market

• 21.1. Eastern Europe 3D IC And 2.5D IC Packaging Market Overview
• 21.2. Eastern Europe 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.3. Eastern Europe 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.4. Eastern Europe 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia 3D IC And 2.5D IC Packaging Market

• 22.1. Russia 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.2. Russia 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.3. Russia 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America 3D IC And 2.5D IC Packaging Market

• 23.1. North America 3D IC And 2.5D IC Packaging Market Overview
• 23.2. North America 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.3. North America 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.4. North America 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA 3D IC And 2.5D IC Packaging Market

• 24.1. USA 3D IC And 2.5D IC Packaging Market Overview
• 24.2. USA 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.3. USA 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.4. USA 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada 3D IC And 2.5D IC Packaging Market

• 25.1. Canada 3D IC And 2.5D IC Packaging Market Overview
• 25.2. Canada 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.3. Canada 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.4. Canada 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America 3D IC And 2.5D IC Packaging Market

• 26.1. South America 3D IC And 2.5D IC Packaging Market Overview
• 26.2. South America 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.3. South America 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.4. South America 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil 3D IC And 2.5D IC Packaging Market

• 27.1. Brazil 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.2. Brazil 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.3. Brazil 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East 3D IC And 2.5D IC Packaging Market

• 28.1. Middle East 3D IC And 2.5D IC Packaging Market Overview
• 28.2. Middle East 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.3. Middle East 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.4. Middle East 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa 3D IC And 2.5D IC Packaging Market

• 29.1. Africa 3D IC And 2.5D IC Packaging Market Overview
• 29.2. Africa 3D IC And 2.5D IC Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.3. Africa 3D IC And 2.5D IC Packaging Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.4. Africa 3D IC And 2.5D IC Packaging Market, Segmentation By End-User, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. 3D IC And 2.5D IC Packaging Market Competitive Landscape And Company Profiles

• 30.1. 3D IC And 2.5D IC Packaging Market Competitive Landscape
• 30.2. 3D IC And 2.5D IC Packaging Market Company Profiles
  • 30.2.1. Samsung Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.2. Siemens AG Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.3. Intel Corporation Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.4. Taiwan Semiconductor Manufacturing Company Limited Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.5. SK Hynix Inc. Overview, Products and Services, Strategy and Financial Analysis

31. 3D IC And 2.5D IC Packaging Market Other Major And Innovative Companies

• 31.1. Broadcom Inc.
• 31.2. Fujitsu Limited
• 31.3. Toshiba Corporation
• 31.4. ASE Technology Holding Co. Ltd.
• 31.5. Texas Instruments Incorporated
• 31.6. STMicroelectronics NV
• 31.7. Infineon Technologies AG
• 31.8. Renesas Electronics Corporation
• 31.9. United Microelectronics Corporation
• 31.10. GlobalFoundries Inc.
• 31.11. Amkor Technology Inc.
• 31.12. Unimicron Technology Corporation
• 31.13. Jiangsu Changjiang Electronics Technology Co. Ltd.
• 31.14. Cadence Design Systems Inc.
• 31.15. Siliconware Precision Industries Co. Ltd.

32. Global 3D IC And 2.5D IC Packaging Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The 3D IC And 2.5D IC Packaging Market

34. Recent Developments In The 3D IC And 2.5D IC Packaging Market

35. 3D IC And 2.5D IC Packaging Market High Potential Countries, Segments and Strategies

• 35.1 3D IC And 2.5D IC Packaging Market In 2029 - Countries Offering Most New Opportunities
• 35.2 3D IC And 2.5D IC Packaging Market In 2029 - Segments Offering Most New Opportunities
• 35.3 3D IC And 2.5D IC Packaging Market In 2029 - Growth Strategies
  • 35.3.1 Market Trend Based Strategies
  • 35.3.2 Competitor Strategies

36. Appendix

• 36.1. Abbreviations
• 36.2. Currencies
• 36.3. Historic And Forecast Inflation Rates
• 36.4. Research Inquiries
• 36.5. The Business Research Company
• 36.6. Copyright And Disclaimer