多層印刷電路基板市場規模、佔有率和成長分析（按材料類型、基板、通路、層數、應用和地區分類）—2026-2033年產業預測

預計到 2024 年，全球多層印刷電路基板(PCB) 市場規模將達到 812.4 億美元，到 2025 年將達到 853.9 億美元，到 2033 年將達到 1271.2 億美元，預測期（2026-2033 年）的複合年成長率為 5.1%。

由於其許多技術優勢，包括尺寸緊湊、重量輕、耐用性和柔軟性，全球多層印刷電路基板(PCB) 市場正經歷顯著成長。這些特性滿足了智慧型手機和電腦對輕量化、高效組件日益成長的需求。多層 PCB 的應用領域十分廣泛，涵蓋電子、軍事、醫療以及快速發展的智慧家庭自動化市場。多層整合能夠實現更強大的功能和更優異的電氣性能，在緊湊的面積內提供高容量和高速度。雖然剛性和軟性設計的可製造柔軟性帶來了機遇，但高昂的維護成本以及對緊湊型多層解決方案的需求也為市場擴張帶來了挑戰。

推動全球多層印刷基板市場發展的因素

全球對智慧型手機、筆記型電腦和智慧型電視等電子設備的需求是推動多層印刷基板市場成長的主要因素。隨著全球人口的成長，這些重要設備的普及率顯著提高，從而帶動了對印刷電路基板的需求。這些元件在確保效率和功能方面發揮著至關重要的作用，不僅在家用電子電器領域，而且在航太、軍事和政府機構等關鍵領域也是如此。此外，自動化機械和通訊基礎設施整合的進步也進一步推動了各工業領域對多層印刷電路基板的需求成長。

限制全球多層印刷基板市場的因素

多層印刷基板的製造流程面臨許多挑戰，主要原因在於其生產、設計和分板等環節的高成本。這些環節的高昂成本促使企業尋求更經濟的替代方案，尤其是在電子產業的競爭對手積極採用低成本解決方案的情況下。此外，與傳統的單層或雙層基板相比，多層基板的製造週期更長，這進一步增加了成本，最終影響成品的整體定價。這些因素共同限制了多層印刷電路基板在全球市場的成長與普及。

全球多層印刷基板市場趨勢

受人工智慧、物聯網和5G等先進技術需求不斷成長的推動，全球多層印刷基板市場正經歷強勁成長。隨著數位轉型加速，這些技術需要高效的資料傳輸、處理和管理能力，而多層印刷電路板憑藉其能夠容納複雜電路設計和高密度應用的能力，恰好滿足了這些需求。電子設備小型化和高性能的趨勢進一步推動了對多層印刷電路基板的需求，使製造商能夠開發緊湊、高性能的產品，以應對低延遲和數據密集型應用的挑戰。這些技術的融合使多層印刷電路基板成為不斷發展的電子產業中不可或缺的關鍵組成部分。

目錄

介紹

• 調查目標
• 調查範圍
• 定義

調查方法

• 資訊收集
• 二手資料和一手資料方法
• 市場規模預測
• 市場假設與限制

執行摘要

• 全球市場展望
• 供需趨勢分析
• 細分市場機會分析

市場動態與展望

• 市場規模
• 市場動態
  • 促進因素和機遇
  • 限制與挑戰
• 波特分析

關鍵市場考察

• 關鍵成功因素
• 競爭程度
• 關鍵投資機會
• 市場生態系統
• 市場吸引力指數（2025）
• PESTEL 分析
• 總體經濟指標
• 價值鏈分析
• 定價分析
• 案例研究
• 顧客購買行為分析

全球多層印刷基板市場規模（按材料類型和複合年成長率分類）（2026-2033 年）

• 環氧樹脂
• 聚醯亞胺
• CFR-環氧樹脂
• 聚四氟乙烯（PTFE）
• 熱塑性樹脂

全球多層印刷基板市場規模（按基板和複合年成長率分類）（2026-2033 年）

• 剛性基板
• 軟式電路板
• 軟硬複合

全球多層印刷電路基板市場規模（依通路分類）及複合年成長率（2026-2033 年）

• 直銷
• 經銷商
• 線上銷售
• OEM

全球多層印刷基板市場規模（按層數和複合年成長率分類）（2026-2033 年）

• 4層
• 6層
• 8層
• 10層
• 10層或更多層

全球多層印刷基板市場規模（按應用及複合年成長率分類）（2026-2033 年）

• 工業電子
• 衛生保健
• 航太/國防
• 車
• 資訊科技/通訊
• 家用電子電器
• 其他

全球多層印刷電路基板市場規模及複合年成長率（2026-2033）

• 北美洲
  • 美國
  • 加拿大
• 歐洲
  • 德國
  • 西班牙
  • 法國
  • 英國
  • 義大利
  • 其他歐洲地區
• 亞太地區
  • 中國
  • 印度
  • 日本
  • 韓國
  • 亞太其他地區
• 拉丁美洲
  • 巴西
  • 其他拉丁美洲地區
• 中東和非洲
  • 海灣合作理事會國家
  • 南非
  • 其他中東和非洲地區

競爭資訊

• 前五大公司對比
• 主要企業的市場定位（2025 年）
• 主要市場參與者所採取的策略
• 近期市場趨勢
• 公司市佔率分析（2025 年）
• 主要企業公司簡介
  • 公司詳情
  • 產品系列分析
  • 依業務板塊進行公司股票分析
  • 2023-2025年營收年比比較

主要企業簡介

• Vector Electronics
• Compal Electronics
• Flex Ltd.
• Jabil Circuit
• Banda Electronics
• Zhen Ding Technology
• Taiwan Semiconductor Manufacturing Company
• Shenzhen Fastprint Electronics
• Sanmina Corporation
• Shenzhen Kaifa Technology
• Unimicron Technology
• Samsung Electronics
• Millennium Circuits Limited
• Nippon Mektron

結論與建議

Global Multilayer Printed Circuit Board Market size was valued at USD 81.24 Billion in 2024 and is poised to grow from USD 85.39 Billion in 2025 to USD 127.12 Billion by 2033, growing at a CAGR of 5.1% during the forecast period (2026-2033).

The global market for Multilayer Printed Circuit Boards (PCBs) is witnessing significant growth driven by their numerous technical advantages, including compact size, lightweight design, durability, and enhanced flexibility. These features cater to the increasing demand for lightweight and efficient components in smartphones and computers. Multilayer PCBs find applications across diverse sectors, such as electronics, military, healthcare, and the rapidly evolving smart home automation market. Their ability to integrate multiple layers allows for greater functionality and superior electrical performance with high capacity and speed in a reduced footprint. While the flexibility in manufacturing both rigid and flexible designs presents opportunities, the higher costs associated with service availability and the need for compact, multi-layer solutions pose challenges to market expansion.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Multilayer Printed Circuit Board market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Multilayer Printed Circuit Board Market Segments Analysis

Global Multilayer Printed Circuit Board Market is segmented by Material Type, Substrate, Distribution Channel, Number of Layers, Application and region. Based on Material Type, the market is segmented into Epoxy Resin, Polyimide, CFR-epoxy, PTFE and Thermoplastic. Based on Substrate, the market is segmented into Rigid, Flexible and Rigid-Flex. Based on Distribution Channel, the market is segmented into Direct Sales, Distributors, Online Sales and OEMs. Based on Number of Layers, the market is segmented into 4 Layers, 6 Layers, 8 Layers, 10 Layers and More than 10 Layers. Based on Application, the market is segmented into Industrial Electronics, Healthcare, Aerospace and Defense, Automotive, IT and Telecom, Consumer Electronics and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Multilayer Printed Circuit Board Market

The global demand for electronic devices, including smartphones, laptops, and smart televisions, is a primary catalyst driving the growth of the multilayer printed circuit board market. As the global population continues to rise, the penetration of these essential devices has significantly increased, leading to a heightened need for printed circuit boards. These components play a crucial role not only in consumer electronics but also in critical sectors such as aerospace, military, and government institutions, ensuring efficiency and functionality. Additionally, the integration of automated machinery and advancements in telecommunications infrastructure further support the burgeoning demand for multilayer printed circuit boards across various industries.

Restraints in the Global Multilayer Printed Circuit Board Market

The manufacturing process of multilayer printed circuit boards faces significant challenges, primarily due to high costs associated with production, design, and depaneling. The expense of these processes often leads companies to seek more affordable alternatives, particularly as competitors in the electronics sector increasingly adopt lower-cost solutions. Additionally, the extended production time required for multilayer boards, compared to traditional single or double-layer options, further exacerbates costs, ultimately impacting the overall pricing of the final product. This combination of factors poses a considerable restraint on the growth and adoption of multilayer printed circuit boards in the global market.

Market Trends of the Global Multilayer Printed Circuit Board Market

The Global Multilayer Printed Circuit Board market is experiencing robust growth, driven by the increasing demand for advanced technologies such as AI, IoT, and 5G. As digital transformation accelerates, these technologies require efficient data transmission, processing, and management capabilities, which multilayer PCBs facilitate through their ability to handle complex circuit designs and high-density applications. The trend towards miniaturization and enhanced performance in electronic devices further fuels the need for multilayer PCBs, enabling manufacturers to create compact, high-performance products that meet the challenges of low latency and data-intensive applications. This convergence of technological advancements positions multilayer PCBs as a critical component in the evolving electronics landscape.

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Drivers & Opportunities
  • Restraints & Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2025
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis
• Case Studies
• Customer Buying Behavior Analysis

Global Multilayer Printed Circuit Board Market Size by Material Type & CAGR (2026-2033)

• Market Overview
• Epoxy Resin
• Polyimide
• CFR-epoxy
• PTFE
• Thermoplastic

Global Multilayer Printed Circuit Board Market Size by Substrate & CAGR (2026-2033)

• Market Overview
• Rigid
• Flexible
• Rigid-Flex

Global Multilayer Printed Circuit Board Market Size by Distribution Channel & CAGR (2026-2033)

• Market Overview
• Direct Sales
• Distributors
• Online Sales
• OEMs

Global Multilayer Printed Circuit Board Market Size by Number of Layers & CAGR (2026-2033)

• Market Overview
• 4 Layers
• 6 Layers
• 8 Layers
• 10 Layers
• More than 10 Layers

Global Multilayer Printed Circuit Board Market Size by Application & CAGR (2026-2033)

• Market Overview
• Industrial Electronics
• Healthcare
• Aerospace and Defense
• Automotive
• IT and Telecom
• Consumer Electronics
• Others

Global Multilayer Printed Circuit Board Market Size & CAGR (2026-2033)

• North America (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • US
  • Canada
• Europe (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • Brazil
  • Rest of Latin America
• Middle East & Africa (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2025
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2025
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2023-2025)

Key Company Profiles

• Vector Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Compal Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Flex Ltd.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Jabil Circuit
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Banda Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Zhen Ding Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Taiwan Semiconductor Manufacturing Company
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shenzhen Fastprint Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Sanmina Corporation
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shenzhen Kaifa Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Unimicron Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Samsung Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Millennium Circuits Limited
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Nippon Mektron
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendations