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市場調查報告書
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1798962

多層印刷電路基板的全球市場

Multilayer Printed Circuit Boards
出版日期: | 出版商: Global Industry Analysts, Inc. | 英文 287 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

2030年，全球多層印刷電路基板市場規模將達1,142億美元

全球多層印刷電路基板市場規模預計在2024年達到892億美元，預計2024年至2030年期間的複合年成長率為4.2%，到2030年將達到1142億美元。剛性PCB是本報告分析的細分市場之一，預計其複合年成長率為5.6%，到分析期結束時市場規模將達到316億美元。標準多層PCB細分市場在分析期間的複合年成長率預計為2.9%。

美國市場規模預估達 243 億美元，中國市場複合年成長率將達 7.9%

美國多層印刷基板市場規模預計2024年達到243億美元。作為世界第二大經濟體，中國市場規模預計到2030年將達到237億美元，在2024-2030年的分析期間內，複合年成長率為7.9%。其他值得關注的區域市場包括日本和加拿大，預計在分析期間內，這兩個市場的複合年成長率分別為1.6%和3.3%。在歐洲，預計德國市場的複合年成長率為2.4%。

全球多層印刷電路基板市場—主要趨勢與促進因素摘要

為什麼多層印刷電路基板對於尖端電子產品至關重要？

多層印刷電路基板(PCB) 包含三層或多層導電銅層，這些銅層嵌入在絕緣材料之間，已成為當今電子設備日益小型化和複雜化的關鍵推動因素。與單層和雙層電路板相比，這些基板具有更高的佈線密度、更好的訊號完整性和更高的可靠性，使其成為航太和國防、通訊、醫療用電子設備、汽車和工業自動化等領域的必備元件。對緊湊型、高功能電子產品的日益成長的需求，推動了從智慧型手機和伺服器到電動車和衛星等各種設備中多層 PCB 的部署。

5G 網路、物聯網 (IoT) 生態系統、人工智慧 (AI) 整合和邊緣運算的演進，推動了對支援更高互連性、訊號保真度和電源管理的電路基板的需求。多層 PCB 非常適合這些應用，因為它們能夠支援差分訊號佈線、受控電阻以及高密度元件的散熱。多層架構能夠最佳化接地層和電源層的佈局，這對於減少高頻電路中的電磁干擾 (EMI) 和訊號損耗至關重要。

改變 PCB 設計和製造的關鍵技術創新有哪些？

在材料、製造技術和電腦輔助設計的推動下，多層PCB市場正在經歷重大的技術變革。聚醯亞胺、PTFE（特氟龍）和陶瓷填充層壓板等高性能基板正日益用於支援高速數位和射頻應用。這些基板具有較高的玻璃化轉變溫度 (Tg)、較低的介電損耗和優異的熱穩定性，使其成為航太、國防和高階運算應用的關鍵材料。

雷射鑽孔和順序層壓技術使得高密度互連 (HDI) 多層 PCB 成為可能，而微孔和焊盤內墊片設計則顯著提高了元件密度和電氣性能。嵌入式元件、埋孔和堆疊通孔結構的使用提高了現代基板的緊湊性和功能性。此外，結合了軟硬複合PCB）在穿戴式裝置、醫療設備和軍用電子設備中發展勢頭強勁，因為節省空間和可靠性對這些軟式電路板至關重要。

整合模擬功能、訊號完整性分析和3D建模的設計軟體正在提高佈局效率並減少原型製作錯誤。同時，製造商正在其PCB製造工廠中採用數位雙胞胎和工業4.0概念，透過自動化、機器人技術和人工智慧驅動的視覺檢測來提高產量和缺陷檢測能力。永續性也正成為核心關注點，相關舉措旨在實現無鹵層壓、無鉛焊接以及蝕刻和電鍍製程中的廢棄物最小化。

哪些終端產業和地區正在影響全球需求？

這主要源自於人們對更輕薄、更快、功能更豐富的裝置（例如智慧型手機、平板電腦、筆記型電腦、智慧型手錶和遊戲機）不斷變化的需求。多層PCB對於在有限的基板空間內實現緊湊的系統晶片(SoC) 整合、高速記憶體介面和複雜的訊號佈線至關重要。 ADAS（高級駕駛輔助系統）、資訊娛樂單元、數位儀錶板和電動車電池管理系統的普及，推動了對高可靠性多層設計的需求。

在醫療用電子設備市場，診斷影像系統、植入式設備、可攜式監視器、機器人手術平台等領域，多層PCB的應用日益廣泛。這些應用需要高可靠性、生物相容性和高密度的PCB，並滿足嚴格的合規性要求。同時，機器視覺系統、製程自動化控制器和智慧電錶等工業應用也正在利用多層PCB來處理複雜的感測器陣列和通訊協定。

亞太地區在全球供應和需求格局中佔據主導地位，其中以中國大陸、台灣、韓國和日本為首，這些地區擁有全球最先進的PCB製造集群和電子組裝。北美和歐洲仍然是技術創新的關鍵中心，尤其是在航太、國防和高效能運算領域。印度和越南等新興經濟體憑藉著優惠的製造業政策、低廉的人事費用以及不斷成長的國內電子產品消費，正在吸引PCB製造業的投資。

推動全球多層 PCB 市場成長的因素有哪些？

全球多層印刷基板市場的成長受到多種因素的推動，包括先進電子產品的普及、設備小型化以及終端使用領域系統複雜性的不斷提升。隨著消費者和產業對更快的處理速度、更佳的連接性和更智慧的介面的需求，多層PCB正成為硬體架構的基礎。它們支援高速訊號傳輸、電源完整性和EMI屏蔽的能力使其成為下一代電子產品的關鍵。

5G基礎設施、汽車電氣化、航太現代化和醫療設備創新的興起，正在加速對高層數和HDI PCB的投資。此外，數位雙胞胎、自動化系統和智慧工廠等趨勢正在將PCB應用範圍擴展到需要可靠多層互連的新領域。供應鏈整合、協同設計生態系統以及材料科學的進步正在縮短從設計到部署的時間，並提升基板的功能。

全球各地（尤其是美國、歐盟和印度）關於本土半導體製造的政策轉變，正在鼓勵國內 PCB 生產，並提振區域需求。同時，永續性措施正在推動可回收基板和無鉛製程的發展，擴大多層 PCB 在綠色電子產品中的吸引力。隨著技術週期縮短和創新加速，多層 PCB 市場預計將經歷持續的變革性成長。

部分

產品（剛性PCB、標準多層PCB、HDI/積層/微孔PCB、軟性電路、IC基板、其他產品）、材料（剛性材料、軟性材料、剛撓結合材料）

受訪公司範例

  • AT&S Austria Technologie & Systemtechnik
  • Chin Poon Industrial Co., Ltd.
  • CMK Corporation
  • Daeduck Electronics Co., Ltd.
  • DLPCB Co., Ltd.
  • Eltek Ltd.
  • HannStar Board Corporation
  • Ibiden Co., Ltd.
  • Jiangsu Suhan Circuit Co., Ltd.
  • Kingboard Holdings Limited
  • Meiko Electronics Co., Ltd.
  • Nippon Mektron, Ltd.
  • Olympic Circuit Technology Co., Ltd.
  • Shennan Circuits Co., Ltd.
  • Shinko Electric Industries Co., Ltd.
  • Simmtech Co., Ltd.
  • Tripod Technology Corporation
  • TTM Technologies, Inc.
  • Unimicron Technology Corporation
  • Zhen Ding Technology Holding Ltd.

人工智慧整合

我們正在利用有效的專家內容和人工智慧工具來改變市場和競爭情報。

Global 特定產業產業SLM 的典型規範，而是建立了一個從世界各地專家收集的內容庫，包括影片錄影、部落格、搜尋引擎研究以及大量的公司、產品/服務和市場數據。

關稅影響係數

全球產業分析師根據公司總部所在國家、製造地和進出口（成品和原始設備製造商）情況預測其競爭地位的變化。這種複雜而多面的市場動態預計將以多種方式影響競爭對手，包括銷貨成本(COGS) 上升、盈利下降、供應鏈重組以及其他微觀和宏觀市場動態。

目錄

第1章調查方法

第2章執行摘要

  • 市場概覽
  • 主要企業
  • 市場趨勢和促進因素
  • 全球市場展望

第3章市場分析

  • 美國
  • 加拿大
  • 日本
  • 中國
  • 歐洲
  • 法國
  • 德國
  • 義大利
  • 英國
  • 西班牙
  • 俄羅斯
  • 其他歐洲國家
  • 亞太地區
  • 澳洲
  • 印度
  • 韓國
  • 其他亞太地區
  • 拉丁美洲
  • 阿根廷
  • 巴西
  • 墨西哥
  • 其他拉丁美洲
  • 中東
  • 伊朗
  • 以色列
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 其他中東地區
  • 非洲

第4章 競賽

簡介目錄
Product Code: MCP39079

Global Multilayer Printed Circuit Boards Market to Reach US$114.2 Billion by 2030

The global market for Multilayer Printed Circuit Boards estimated at US$89.2 Billion in the year 2024, is expected to reach US$114.2 Billion by 2030, growing at a CAGR of 4.2% over the analysis period 2024-2030. Rigid PCBs, one of the segments analyzed in the report, is expected to record a 5.6% CAGR and reach US$31.6 Billion by the end of the analysis period. Growth in the Standard Multilayer PCBs segment is estimated at 2.9% CAGR over the analysis period.

The U.S. Market is Estimated at US$24.3 Billion While China is Forecast to Grow at 7.9% CAGR

The Multilayer Printed Circuit Boards market in the U.S. is estimated at US$24.3 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$23.7 Billion by the year 2030 trailing a CAGR of 7.9% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 1.6% and 3.3% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 2.4% CAGR.

Global Multilayer Printed Circuit Boards Market - Key Trends & Drivers Summarized

Why Are Multilayer Printed Circuit Boards Becoming Indispensable in Advanced Electronics?

Multilayer printed circuit boards (PCBs), composed of three or more conductive copper layers embedded between insulating material, are emerging as critical enablers in the miniaturization and complexity of today’s electronic devices. These boards offer superior routing density, improved signal integrity, and greater reliability compared to single or double-layer alternatives, making them integral to sectors like aerospace, defense, telecommunications, medical electronics, automotive, and industrial automation. The surge in demand for compact, high-functionality electronics is propelling the deployment of multilayer PCBs in everything from smartphones and servers to electric vehicles and satellites.

The ongoing evolution toward 5G networks, Internet of Things (IoT) ecosystems, artificial intelligence (AI) integration, and edge computing is creating a need for circuit boards that support higher interconnectivity, signal fidelity, and power management. Multilayer PCBs are ideally suited for these roles due to their ability to support differential signal routing, controlled impedance, and heat dissipation across densely packed components. Their multilayer architecture allows for optimized placement of ground and power planes, essential for reducing electromagnetic interference (EMI) and signal loss in high-frequency circuits.

What Are the Key Innovations Transforming PCB Design and Fabrication?

The multilayer PCB market is undergoing significant technological transformation fueled by advancements in materials, manufacturing techniques, and computer-aided design. High-performance base materials such as polyimide, PTFE (Teflon), and ceramic-filled laminates are being increasingly used to support high-speed digital and RF applications. These substrates provide high glass transition temperatures (Tg), low dielectric loss, and excellent thermal stability-key for applications in aerospace, defense, and high-end computing.

Laser drilling and sequential lamination techniques have enabled the creation of high-density interconnect (HDI) multilayer PCBs, where microvias and via-in-pad designs drastically improve component density and electrical performance. The use of embedded components, buried vias, and stacked via structures is enhancing the compactness and functionality of modern multilayer boards. Moreover, hybrid multilayer PCBs that combine rigid and flexible substrates (rigid-flex PCBs) are gaining momentum in wearables, medical devices, and military-grade electronics, where space-saving and reliability are paramount.

Design software with integrated simulation capabilities, signal integrity analysis, and 3D modeling is improving layout efficiency and reducing prototyping errors. Concurrently, manufacturers are adopting digital twins and Industry 4.0 concepts in PCB fabrication facilities-utilizing automation, robotics, and AI-powered visual inspection to enhance throughput and defect detection. Sustainability is also becoming a core focus, with initiatives targeting halogen-free laminates, lead-free soldering, and waste minimization during etching and plating processes.

Which End-Use Industries and Regions Are Shaping Global Demand?

Consumer electronics remain the largest market for multilayer PCBs, primarily driven by the ever-evolving demand for thinner, faster, and more feature-rich devices like smartphones, tablets, laptops, smartwatches, and gaming consoles. Multilayer PCBs are critical in enabling compact system-on-chip (SoC) integration, high-speed memory interfaces, and complex signal routing within limited board real estate. The automotive sector is another significant adopter, where the proliferation of ADAS (Advanced Driver Assistance Systems), infotainment units, digital instrument clusters, and EV battery management systems is pushing demand for high-reliability multilayer designs.

The medical electronics market is experiencing rising adoption of multilayer PCBs in diagnostic imaging systems, implantable devices, portable monitors, and robotic surgery platforms. These applications demand ultra-reliable, biocompatible, and high-density PCBs with stringent compliance requirements. Meanwhile, industrial applications such as machine vision systems, process automation controllers, and smart meters are leveraging multilayer PCBs to handle complex sensor arrays and communication protocols.

Asia-Pacific dominates the global supply and demand scenario, led by China, Taiwan, South Korea, and Japan-housing the world’s most advanced PCB manufacturing clusters and electronics assembly lines. North America and Europe remain key innovation hubs, especially in aerospace, defense, and high-performance computing. Emerging nations like India and Vietnam are attracting investments in PCB fabrication due to favorable manufacturing policies, low labor costs, and growing domestic electronics consumption.

What Is Fueling Growth in the Global Multilayer PCB Market?

The growth in the global multilayer printed circuit boards market is driven by several factors, including the proliferation of advanced electronics, the miniaturization of devices, and increasing system complexity across end-use sectors. As consumers and industries demand faster processing, better connectivity, and smarter interfaces, multilayer PCBs are becoming foundational to hardware architecture. Their ability to support high-speed signal transmission, power integrity, and EMI shielding positions them as indispensable in next-generation electronics.

The rise of 5G infrastructure, automotive electrification, aerospace modernization, and medical device innovation is accelerating investments in high-layer count and HDI PCBs. Additionally, trends such as digital twins, autonomous systems, and smart factories are expanding the scope of PCB applications into new domains requiring robust, multilayer interconnects. Supply chain integration, collaborative design ecosystems, and advancements in material science are reducing design-to-deployment timelines and improving board functionality.

Global policy shifts around local semiconductor manufacturing, particularly in the U.S., EU, and India, are incentivizing domestic PCB production and boosting regional demand. Simultaneously, sustainability initiatives are pushing the development of recyclable boards and lead-free processes, expanding the appeal of multilayer PCBs in green electronics. As technology cycles shorten and innovation accelerates, the multilayer PCB market is expected to experience sustained and transformative growth.

SCOPE OF STUDY:

The report analyzes the Multilayer Printed Circuit Boards market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Product (Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates, Other Products); Substance (Rigid Substance, Flexible Substance, Rigid-Flex Substance)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 41 Featured) -

  • AT&S Austria Technologie & Systemtechnik
  • Chin Poon Industrial Co., Ltd.
  • CMK Corporation
  • Daeduck Electronics Co., Ltd.
  • DLPCB Co., Ltd.
  • Eltek Ltd.
  • HannStar Board Corporation
  • Ibiden Co., Ltd.
  • Jiangsu Suhan Circuit Co., Ltd.
  • Kingboard Holdings Limited
  • Meiko Electronics Co., Ltd.
  • Nippon Mektron, Ltd.
  • Olympic Circuit Technology Co., Ltd.
  • Shennan Circuits Co., Ltd.
  • Shinko Electric Industries Co., Ltd.
  • Simmtech Co., Ltd.
  • Tripod Technology Corporation
  • TTM Technologies, Inc.
  • Unimicron Technology Corporation
  • Zhen Ding Technology Holding Ltd.

AI INTEGRATIONS

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Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • Multilayer Printed Circuit Boards - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for High-Density Interconnects Spurs Growth in Multilayer PCB Adoption
    • Expansion of 5G Infrastructure Throws the Spotlight on Multilayer PCB Signal Integrity Requirements
    • Innovation in High-Speed Signal Routing Propels Demand for Advanced PCB Stacks
    • Proliferation of IoT Devices Drives Demand for Compact Multilayer PCB Architectures
    • Advancements in Thermal Management Materials Enhance PCB Reliability in High-Power Systems
    • Automotive Shift to ADAS and EV Architectures Expands Use of Multilayer PCBs in ECUs
    • Focus on Blind and Buried Vias Strengthens Market for High-Layer-Count PCB Designs
    • Surge in Semiconductor Packaging Integration Drives Need for Embedded Component PCBs
    • Investment in PCB Miniaturization and Flex-Rigid Hybrids Enhances Form Factor Versatility
    • Growth in Wearable Electronics Fuels Adoption of Thin Multilayer PCBs
    • Emphasis on Impedance Control Standards Enhances Quality of Signal Transmission
    • Medical Device Complexity Drives Demand for Multilayer PCBs in Compact Diagnostic Systems
    • Adoption of Lead-Free and RoHS-Compliant Materials Aligns With Regulatory Compliance
    • Rising Use of Multilayer PCBs in Aerospace and Defense Enhances Demand for High-Reliability Boards
    • Focus on AI-Driven Design Automation Accelerates PCB Layout and Fabrication Cycles
    • Emerging Cloud Hardware and Server Buildouts Expand Multilayer PCB Usage in Data Centers
    • Collaboration With Contract Manufacturers Improves Access to Advanced PCB Capabilities
    • Growth in AR/VR and Gaming Hardware Propels Demand for Multilayer PCB Subsystems
    • Drive Toward Design for Manufacturability Enhances Cost Efficiency of Complex PCB Stacks
    • Rising Penetration of Multilayer PCBs in Robotics and Industrial Automation Sustains Market Momentum
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Multilayer Printed Circuit Boards Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Multilayer Printed Circuit Boards by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 4: World 16-Year Perspective for Multilayer Printed Circuit Boards by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2014, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Rigid PCBs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Rigid PCBs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 7: World 16-Year Perspective for Rigid PCBs by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Standard Multilayer PCBs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Standard Multilayer PCBs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 10: World 16-Year Perspective for Standard Multilayer PCBs by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for HDI / Build-Up / Microvia PCBs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for HDI / Build-Up / Microvia PCBs by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 13: World 16-Year Perspective for HDI / Build-Up / Microvia PCBs by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Flexible Circuits by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Flexible Circuits by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 16: World 16-Year Perspective for Flexible Circuits by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for IC Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for IC Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 19: World 16-Year Perspective for IC Substrates by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Other Products by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Other Products by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 22: World 16-Year Perspective for Other Products by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Rigid Substance by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for Rigid Substance by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 25: World 16-Year Perspective for Rigid Substance by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for Flexible Substance by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 27: World Historic Review for Flexible Substance by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 28: World 16-Year Perspective for Flexible Substance by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for Rigid-Flex Substance by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 30: World Historic Review for Rigid-Flex Substance by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 31: World 16-Year Perspective for Rigid-Flex Substance by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Multilayer Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 32: USA Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 33: USA Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 34: USA 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 35: USA Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 36: USA Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 37: USA 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • CANADA
    • TABLE 38: Canada Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Canada Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 40: Canada 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 41: Canada Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 42: Canada Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 43: Canada 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • JAPAN
    • Multilayer Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 44: Japan Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: Japan Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 46: Japan 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 47: Japan Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 48: Japan Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 49: Japan 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • CHINA
    • Multilayer Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 50: China Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: China Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 52: China 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 53: China Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 54: China Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 55: China 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • EUROPE
    • Multilayer Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 56: Europe Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 57: Europe Historic Review for Multilayer Printed Circuit Boards by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 58: Europe 16-Year Perspective for Multilayer Printed Circuit Boards by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2014, 2025 & 2030
    • TABLE 59: Europe Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Europe Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 61: Europe 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 62: Europe Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Europe Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 64: Europe 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • FRANCE
    • Multilayer Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 65: France Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 66: France Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 67: France 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 68: France Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: France Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 70: France 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • GERMANY
    • Multilayer Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 71: Germany Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 72: Germany Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 73: Germany 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 74: Germany Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 75: Germany Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 76: Germany 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • ITALY
    • TABLE 77: Italy Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 78: Italy Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 79: Italy 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 80: Italy Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Italy Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 82: Italy 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • UNITED KINGDOM
    • Multilayer Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 83: UK Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 84: UK Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 85: UK 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 86: UK Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: UK Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 88: UK 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • SPAIN
    • TABLE 89: Spain Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 90: Spain Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 91: Spain 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 92: Spain Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Spain Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 94: Spain 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • RUSSIA
    • TABLE 95: Russia Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Russia Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 97: Russia 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 98: Russia Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Russia Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 100: Russia 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • REST OF EUROPE
    • TABLE 101: Rest of Europe Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 102: Rest of Europe Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 103: Rest of Europe 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 104: Rest of Europe Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Rest of Europe Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 106: Rest of Europe 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • ASIA-PACIFIC
    • Multilayer Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 107: Asia-Pacific Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 108: Asia-Pacific Historic Review for Multilayer Printed Circuit Boards by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 109: Asia-Pacific 16-Year Perspective for Multilayer Printed Circuit Boards by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2014, 2025 & 2030
    • TABLE 110: Asia-Pacific Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Asia-Pacific Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 112: Asia-Pacific 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 113: Asia-Pacific Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 114: Asia-Pacific Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 115: Asia-Pacific 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • AUSTRALIA
    • Multilayer Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 116: Australia Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 117: Australia Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 118: Australia 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 119: Australia Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 120: Australia Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 121: Australia 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • INDIA
    • Multilayer Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 122: India Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 123: India Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 124: India 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 125: India Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 126: India Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 127: India 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • SOUTH KOREA
    • TABLE 128: South Korea Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 129: South Korea Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 130: South Korea 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 131: South Korea Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 132: South Korea Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 133: South Korea 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 134: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Rest of Asia-Pacific Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 136: Rest of Asia-Pacific 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 137: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Rest of Asia-Pacific Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 139: Rest of Asia-Pacific 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • LATIN AMERICA
    • Multilayer Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 140: Latin America Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 141: Latin America Historic Review for Multilayer Printed Circuit Boards by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 142: Latin America 16-Year Perspective for Multilayer Printed Circuit Boards by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2014, 2025 & 2030
    • TABLE 143: Latin America Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 144: Latin America Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 145: Latin America 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 146: Latin America Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Latin America Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 148: Latin America 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • ARGENTINA
    • TABLE 149: Argentina Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 150: Argentina Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 151: Argentina 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 152: Argentina Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 153: Argentina Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 154: Argentina 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • BRAZIL
    • TABLE 155: Brazil Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 156: Brazil Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 157: Brazil 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 158: Brazil Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 159: Brazil Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 160: Brazil 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • MEXICO
    • TABLE 161: Mexico Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 162: Mexico Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 163: Mexico 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 164: Mexico Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 165: Mexico Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 166: Mexico 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • REST OF LATIN AMERICA
    • TABLE 167: Rest of Latin America Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 168: Rest of Latin America Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 169: Rest of Latin America 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 170: Rest of Latin America Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 171: Rest of Latin America Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 172: Rest of Latin America 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • MIDDLE EAST
    • Multilayer Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 173: Middle East Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 174: Middle East Historic Review for Multilayer Printed Circuit Boards by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 175: Middle East 16-Year Perspective for Multilayer Printed Circuit Boards by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2014, 2025 & 2030
    • TABLE 176: Middle East Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 177: Middle East Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 178: Middle East 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 179: Middle East Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 180: Middle East Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 181: Middle East 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • IRAN
    • TABLE 182: Iran Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 183: Iran Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 184: Iran 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 185: Iran Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 186: Iran Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 187: Iran 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • ISRAEL
    • TABLE 188: Israel Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 189: Israel Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 190: Israel 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 191: Israel Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 192: Israel Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 193: Israel 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • SAUDI ARABIA
    • TABLE 194: Saudi Arabia Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 195: Saudi Arabia Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 196: Saudi Arabia 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 197: Saudi Arabia Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 198: Saudi Arabia Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 199: Saudi Arabia 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 200: UAE Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 201: UAE Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 202: UAE 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 203: UAE Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 204: UAE Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 205: UAE 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • REST OF MIDDLE EAST
    • TABLE 206: Rest of Middle East Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 207: Rest of Middle East Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 208: Rest of Middle East 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 209: Rest of Middle East Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 210: Rest of Middle East Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 211: Rest of Middle East 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030
  • AFRICA
    • Multilayer Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 212: Africa Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 213: Africa Historic Review for Multilayer Printed Circuit Boards by Product - Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 214: Africa 16-Year Perspective for Multilayer Printed Circuit Boards by Product - Percentage Breakdown of Value Sales for Rigid PCBs, Standard Multilayer PCBs, HDI / Build-Up / Microvia PCBs, Flexible Circuits, IC Substrates and Other Products for the Years 2014, 2025 & 2030
    • TABLE 215: Africa Recent Past, Current & Future Analysis for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 216: Africa Historic Review for Multilayer Printed Circuit Boards by Substance - Rigid Substance, Flexible Substance and Rigid-Flex Substance Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
    • TABLE 217: Africa 16-Year Perspective for Multilayer Printed Circuit Boards by Substance - Percentage Breakdown of Value Sales for Rigid Substance, Flexible Substance and Rigid-Flex Substance for the Years 2014, 2025 & 2030

IV. COMPETITION