多層印刷電路基板市場規模、佔有率、成長分析（按材料類型、基板、分銷管道、層數、應用、地區）- 產業預測，2025 年至 2032 年

2023 年全球多層印刷基板市場規模為 773 億美元，預計將從 2024 年的 812.4 億美元成長到 2032 年的 1,209.5 億美元，預測期（2025-2032 年）的複合年成長率為 5.1%。

多層印刷電路基板(PCB) 因其眾多技術優勢而日益普及，例如體積小、重量輕、耐用性高以及靈活性強。這些 PCB 是滿足智慧型手機和電腦等設備日益成長的小型化需求的關鍵，因此擴大應用於消費性電子、軍事裝備、醫療保健技術，尤其是智慧家庭自動化解決方案等各個領域。其設計將多層板整合在一塊基板中，以增強功能，從而在小空間內實現高容量和高速度。此外，製造商還可以享受到生產剛性和軟性 PCB 的多功能性優勢。然而，高昂的製造成本以及緊湊型設計帶來的複雜性等挑戰可能會阻礙該領域的市場成長。

目錄

介紹

• 調查目的
• 研究範圍
• 定義

調查方法

• 資訊採購
• 二次資料和一次資料方法
• 市場規模預測
• 市場假設與限制

執行摘要

• 全球市場展望
• 供需趨勢分析
• 細分機會分析

市場動態與展望

• 市場概覽
• 市場規模
• 市場動態
  • 促進因素和機會
  • 限制與挑戰
• 波特的分析

關鍵市場考察

• 關鍵成功因素
• 競爭程度
• 主要投資機會
• 市場生態系統
• 市場吸引力指數（2024年）
• PESTEL分析
• 總體經濟指標
• 價值鏈分析
• 定價分析
• 案例研究
• 顧客購買行為分析

多層印刷電路基板市場規模（依材料類型分類）及複合年成長率（2025-2032）

• 市場概覽
• 環氧樹脂
• 聚醯亞胺
• CFR環氧樹脂
• PTFE
• 熱塑性塑膠

多層印刷基板市場規模：依基板類型、複合年成長率（2025-2032）

• 市場概覽
• 死板的
• 靈活的
• 軟硬複合

多層印刷電路基板市場規模（依通路分類）及複合年成長率（2025-2032）

• 市場概覽
• 直銷
• 經銷商
• 網上銷售
• OEM

多層基板市場規模（以層數分類）及複合年成長率（2025-2032 年）

• 市場概覽
• 4層
• 6層
• 8層
• 10層
• 10層或更多層

多層印刷基板市場規模（按應用分類）及複合年成長率（2025-2032）

• 市場概覽
• 工業電子
• 衛生保健
• 航太/國防
• 車
• 資訊科技/通訊
• 家電
• 其他

多層印刷基板市場規模（按地區）及複合年成長率（2025-2032）

• 北美洲
  • 美國
  • 加拿大
• 歐洲
  • 德國
  • 西班牙
  • 法國
  • 英國
  • 義大利
  • 其他歐洲國家地區
• 亞太地區
  • 中國
  • 印度
  • 日本
  • 韓國
  • 其他亞太地區
• 拉丁美洲
  • 巴西
  • 其他拉丁美洲
• 中東和非洲
  • 海灣合作理事會國家
  • 南非
  • 其他中東和非洲地區

競爭資訊

• 前五大公司對比
• 主要企業市場定位（2024年）
• 主要市場參與者所採取的策略
• 近期市場趨勢
• 公司市場佔有率分析（2024年）
• 主要企業簡介
  • 公司詳情
  • 產品系列分析
  • 公司分部佔有率分析
  • 收益與前一年同期比較對比（2022-2024 年）

主要企業簡介

• Vector Electronics
• Compal Electronics
• Flex Ltd.
• Jabil Circuit
• Banda Electronics
• Zhen Ding Technology
• Taiwan Semiconductor Manufacturing Company
• Shenzhen Fastprint Electronics
• Sanmina Corporation
• Shenzhen Kaifa Technology
• Unimicron Technology
• Samsung Electronics
• Millennium Circuits Limited
• Nippon Mektron

結論和建議

Global Multilayer Printed Circuit Board Market size was valued at USD 77.3 billion in 2023 and is poised to grow from USD 81.24 billion in 2024 to USD 120.95 billion by 2032, growing at a CAGR of 5.1% during the forecast period (2025-2032).

Multilayer Printed Circuit Boards (PCBs) are gaining traction due to their numerous technical advantages, including compact size, lightweight design, exceptional durability, and improved flexibility. Essential for meeting the growing demand for miniaturization in devices like smartphones and computers, these PCBs are increasingly used across various sectors, such as consumer electronics, military equipment, and healthcare technologies, particularly in smart home automation solutions. Their design allows for increased functionality by combining multiple layers within a single board, delivering high capacity and speed in a reduced footprint. Moreover, manufacturers benefit from the versatility of producing both rigid and flexible PCBs. However, challenges such as high production costs and the complexity associated with compact designs may hinder market growth in this sector.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Multilayer Printed Circuit Board market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Multilayer Printed Circuit Board Market Segments Analysis

Global Multilayer Printed Circuit Board Market is segmented by Material Type, Substrate, Distribution Channel, Number of Layers, Application and region. Based on Material Type, the market is segmented into Epoxy Resin, Polyimide, CFR-epoxy, PTFE and Thermoplastic. Based on Substrate, the market is segmented into Rigid, Flexible and Rigid-Flex. Based on Distribution Channel, the market is segmented into Direct Sales, Distributors, Online Sales and OEMs. Based on Number of Layers, the market is segmented into 4 Layers, 6 Layers, 8 Layers, 10 Layers and More than 10 Layers. Based on Application, the market is segmented into Industrial Electronics, Healthcare, Aerospace and Defense, Automotive, IT and Telecom, Consumer Electronics and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Multilayer Printed Circuit Board Market

The global demand for electronic devices, including smartphones, laptops, and smart televisions, has significantly surged, driving the growth of the multilayer printed circuit board market. This upsurge is largely attributed to the increasing global population, which has heightened the need for advanced electronic gadgets. Additionally, the role of automated machinery and the prevalence of cellular towers in this tech-driven age cannot be overlooked. Furthermore, these electronic devices are not only essential for consumer use but also play a critical role in sectors such as aerospace, military, and various government institutions, all of which contribute to the expanding requirements for multilayer printed circuit boards.

Restraints in the Global Multilayer Printed Circuit Board Market

One of the key challenges facing the global multilayer printed circuit board market is the high cost associated with manufacturing, design, and depaneling processes. These expenses can significantly drive up the overall cost of multilayer boards. As a result, many leading electrical device manufacturers often turn to more affordable alternatives, which can be more economically viable. Additionally, the production timeline for multilayer printed circuit boards is considerably longer compared to that of traditional single or double-layer boards, further escalating costs and impacting the final product pricing. This combination of factors poses a significant restraint on market growth.

Market Trends of the Global Multilayer Printed Circuit Board Market

The Global Multilayer Printed Circuit Board (PCB) market is witnessing substantial growth, driven by the rapid adoption of technologies such as Artificial Intelligence (AI), the Internet of Things (IoT), and 5G. As we move further into a digitized era, the demand for efficient, high-capacity data transmission and processing solutions is accelerating. Multilayer PCBs are uniquely positioned to support these trends, offering enhanced capabilities for managing vast amounts of data with minimal latency. This synergy between multilayer PCBs and advanced technologies not only fuels market expansion but also aligns with the increasing need for innovative electronic applications across various industries.

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Drivers & Opportunities
  • Restraints & Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2024
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis
• Case Studies
• Customer Buying Behavior Analysis

Global Multilayer Printed Circuit Board Market Size by Material Type & CAGR (2025-2032)

• Market Overview
• Epoxy Resin
• Polyimide
• CFR-epoxy
• PTFE
• Thermoplastic

Global Multilayer Printed Circuit Board Market Size by Substrate & CAGR (2025-2032)

• Market Overview
• Rigid
• Flexible
• Rigid-Flex

Global Multilayer Printed Circuit Board Market Size by Distribution Channel & CAGR (2025-2032)

• Market Overview
• Direct Sales
• Distributors
• Online Sales
• OEMs

Global Multilayer Printed Circuit Board Market Size by Number of Layers & CAGR (2025-2032)

• Market Overview
• 4 Layers
• 6 Layers
• 8 Layers
• 10 Layers
• More than 10 Layers

Global Multilayer Printed Circuit Board Market Size by Application & CAGR (2025-2032)

• Market Overview
• Industrial Electronics
• Healthcare
• Aerospace and Defense
• Automotive
• IT and Telecom
• Consumer Electronics
• Others

Global Multilayer Printed Circuit Board Market Size & CAGR (2025-2032)

• North America (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • US
  • Canada
• Europe (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • Brazil
  • Rest of Latin America
• Middle East & Africa (Material Type, Substrate, Distribution Channel, Number of Layers, Application)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2024
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2024
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

• Vector Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Compal Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Flex Ltd.
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Jabil Circuit
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Banda Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Zhen Ding Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Taiwan Semiconductor Manufacturing Company
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shenzhen Fastprint Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Sanmina Corporation
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shenzhen Kaifa Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Unimicron Technology
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Samsung Electronics
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Millennium Circuits Limited
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Nippon Mektron
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendations