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市場調查報告書
商品編碼
1917652
ABF(味之素積層膜)-全球市場佔有率和排名、總收入和需求預測(2026-2032 年)ABF (Ajinomoto Build-up Film) - Global Market Share and Ranking, Overall Sales and Demand Forecast 2026-2032 |
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味之素積層膜™(ABF)是一種薄膜型熱固性中階絕緣介質,用於建構高密度多層構裝基板(通常為 FC-BGA/「ABF基板」)。其核心產品形式包括:(i)用於疊層封裝的介質薄膜;(ii)支援大規模生產和轉換的配套產品和中間產品(例如,包括將清漆塗覆到載體薄膜上的清漆-薄膜製造鏈)。 ABF 的主要應用領域包括 PC 和工作站處理器、伺服器/資料中心、網路設備以及 AI/HPC 平台(在這些封裝中,訊號完整性、佈線密度和基板可靠性非常重要)。目前,該領域的競爭格局高度集中。味之素株式會社聲稱其在高性能半導體絕緣薄膜的全球市場佔有率超過 95%。味之素 FineTechno 的ABF 產品頁面顯示,其在主流 PC 市場的佔有率接近 100%,這使得 ABF 成為該生態系統中絕緣薄膜的現有標準。同時,市場正積極培育同功能類別(層壓介質薄膜)的認證替代品。例如,積水化學銷售一種用於FC-BGA的熱固性層壓介質薄膜,聲稱其與SAP生產線相容,並已被具有OSAT組裝經驗的主要基板供應商(日本和台灣)採用。這表明,即使現有技術仍保持其優勢,「第二來源」的開發在技術和商業性都在穩步推進。
產業趨勢和需求推動要素正日益受到人工智慧/高效能運算(AI/HPC)主導的基板複雜性和吞吐量的影響,而非傳統的以個人電腦為中心的成長。味之素的ICT簡報明確指出,ABF(增強型導電薄膜)的需求與通訊和資訊基礎設施(伺服器、資料中心和網路)的成長密切相關,並將每塊電路基板ABF用量的指數級成長量化為一個關鍵的結構性因素:例如,個人電腦基板使用6層ABF,而高效能運算電路基板使用18層,其基板表面積是前者的3.5倍,這意味著高效能CPU基板的ABF用量不到前者的10倍,具有「雙倍效應」。這意味著每塊電路板的產量更高,材料用量也更大。在技術方面,此藍圖的重點在於降低高速訊號傳輸的介電損耗(Df),以及控制翹曲、提高抗裂性,並改善SAP層壓中細線寬和間距的製造流程。積水化學的研發訊息明確提及降低損耗因子(Df)以滿足224Gb乙太網路切換器及更高規格交換器的需求,這反映了下一代電氣技術的發展方向。供應方面的因應措施主要集中在確保產能、提高認證流程效率以及透過多元化供應管道降低風險。現有企業正利用其事實上的標準地位(以及自產品商業化以來長期積累的認證經驗)來擴展和加強其供應鏈,而新參與企業則致力於研發與SAP兼容的低損耗層壓薄膜,以期通過FC-BGA及相關先進封裝節點的客戶認證計畫來獲取市場佔有率。
全球味之素積層膜(ABF)市場規模在2024年達到 5.1407億美元,到2032年達到 10.6909億美元,2026年至2032年的年複合成長率為 10.93%。
味之素積層膜(ABF)主要產自日本,約98.66%的產量產自日本。除日本外,台灣和中國當地也有小規模ABF生產,預計未來幾年中國大陸將扮演重要角色。
全球領先的味之素積層膜(ABF)生產商包括Ajinomoto Fine-Techno、Sekisui Chemical Co., Ltd.、WaferChem Technology Corporation、Taiyo Ink等。其中,Ajinomoto Fine-Techno佔據全球味之素積層膜(ABF)市場的主導地位,市場佔有率約96.42%。預計未來幾年將有更多公司進入味之素積層膜(ABF)市場。目前潛在的參與企業包括Zhuhai Hongchang Electronic Materials、Xi'an Tianhe Defense Technology、LOTUS HOLDINGS、Guangdong Hinnotech New Materials Technology。
台灣、日本、韓國、中國當地和東南亞是ABF薄膜銷售(消費)的主要市場,分別佔市場佔有率的41.88%、27.13%、10.99%、13.91%和5.71%。全球ABF基板主要產自這些地區,預計這些地區將繼續主導全球市場。全球領先的ABF基板製造商包括 Unimicron、Ibiden、Nan Ya PCB、Shinko Electric Industries、Kinsus Interconnect、AT&S、Semco、Kyocera、TOPPAN。截至2025年,以收入計算,全球排名前七的公司將佔據約91.86%的市場。主要終端用戶包括Intel、AMD、NVIDIA、蘋果和三星。截至2025年,主要終端用戶正與供應商展開激烈競爭,以確保其高效能運算(HPC)晶片製造所需的ABF基板供給能力,至少持續到2026年。幾乎所有ABF基板製造商都計劃在未來幾年擴大產能,並且有多家公司計劃進入市場。未來兩到五年,全球競爭環境將發生巨大變化,前景充滿不不確定性。
本報告目的是對全球味之素積層膜(ABF)市場依地區/國家、產品和應用進行全面分析,重點關注總銷售量、收入、價格、市場佔有率和主要企業的排名。
本報告以2025年為基準年,以味之素積層膜(ABF)市場規模、估算和預測資料,以銷售量(千平方公尺)和收入(百萬美元)為單位進行呈現,並涵蓋2020年至2031年的歷史資料和預測資料。定量和定性分析將幫助讀者制定用味之素積層膜(ABF)的業務和成長策略,評估競爭格局,分析自身在當前市場中的地位,並做出明智的商業決策。
市場區隔
依公司
依產品細分
依應用細分
依區域生產
依地區分類的銷售額和消費量
Ajinomoto Build-up Film(TM) (ABF) is a film-type thermosetting interlayer insulating dielectric used to build high-density multilayer package substrates (typically FC-BGA / "ABF substrates"); its core product forms in industry practice include (i) dielectric film supplied for lamination in build-up stacks and (ii) adjacent supply formats and intermediates such as varnish-to-film manufacturing chains (varnish applied on carrier film) that underpin volume production and conversion. ABF's dominant applications are PC and workstation processors, servers/data centers, network equipment, and increasingly AI/HPC platforms-i.e., packages where signal integrity, wiring density, and substrate reliability are critical. The current competitive landscape remains highly concentrated: Ajinomoto discloses >95% global share for insulating films used in high-performance semiconductors, while Ajinomoto Fine-Techno's ABF page claims near-100% share in major PCs and positions ABF as the incumbent insulation film standard in that ecosystem. At the same time, the market is actively cultivating qualified alternatives in the same functional category (build-up dielectric films); for example, Sekisui markets thermosetting build-up dielectric films for FC-BGA, asserting SAP-line compatibility and adoption by major substrate suppliers (Japan/Taiwan) with OSAT assembly experience-illustrating that "second-source" development is technically and commercially underway even if the incumbent remains dominant.
Industry trends and demand drivers are increasingly defined by AI/HPC-led substrate complexity and throughput rather than legacy PC-only growth. Ajinomoto's ICT briefing explicitly ties ABF demand to telecommunications and information infrastructure growth (servers, data centers, networks), and quantifies the key structural driver as ABF intensity per substrate rising sharply: a representative comparison shows PC substrates using 6 ABF layers versus HPC substrates using 18 ABF layers, with larger substrate surface area (index 3.5) and an implication of <10X ABF usage per high-performance CPU substrate-a "double effect" of more units plus higher material per unit. On the technology side, the roadmap focuses on lower dielectric loss (Df) for higher-speed signaling, alongside warpage control, crack resistance, and manufacturability for finer line/space in SAP build-up; Sekisui's development messaging explicitly references lowering Df to meet 224Gb Ethernet switch needs and beyond, reflecting where next-generation electrical requirements are headed. Supply-side responses therefore center on capacity assurance, qualification throughput, and multi-source risk mitigation: the incumbent leverages its de facto standard position (and long qualification history since first commercialization) while expanding and hardening supply chains, and challengers pursue SAP-compatible, low-loss build-up films to win incremental share through customer qualification programs in FC-BGA and adjacent advanced packaging nodes.
The global ABF (Ajinomoto Build-up Film) market size was US$ 514.07 million in 2024 and will reach US$ 1,069.09 million in 2032; it is expected to grow at a CAGR of 10.93% from 2026 to 2032.
The ABF (Ajinomoto Build-up Film) are mainly produced in Japan, about 98.66% ABF films are produced in Japan. In addition to Japan, China Taiwan and China mainland also produce small ABF films. Chiniese is expected to play an important role in the coming years.
Global key manufacturers of ABF (Ajinomoto Build-up Film) include Ajinomoto Fine-Techno, Sekisui Chemical Co., Ltd., WaferChem Technology Corporation, and Taiyo Ink, etc. Ajinomoto Fine-Techno is dominating the global ABF (Ajinomoto Build-up Film) market, with a share about 96.42 percent. In next few years, more companies are expected to enter ABF (Ajinomoto Build-up Film) market. Currently, potential entrants include Zhuhai Hongchang Electronic Materials, Xi'an Tianhe Defense Technology, LOTUS HOLDINGS, and Guangdong Hinnotech New Materials Technology.
In terms of ABF Film sales (consumption), China Taiwan, Japan, South Korea, China mainland and Southeast Asia are the key market, with market shares 41.88%, 27.13%, 10.99%, 13.91%, and 5.71% respectively. The global ABF substrates are mainly produced in these regions. In future, there regions will still dominate the global ABF substrates market. The global key manufacturers of ABF Substrate include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, and TOPPAN, etc. In 2025, the global top seven players had a share approximately 91.86% in terms of revenue. Key end users are Intel, AMD, Nvidia, Apple, and Samsung, etc. In 2025, the key end users are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2026. Almost all of ABF substrates manufacturers have plans to expand production capacity in next few years, and there also several companies have planned to enter to produce ABF substrates. The global competitive situation will be totally different after two or five years, filled with uncertainty.
This report aims to provide a comprehensive presentation of the global market for ABF (Ajinomoto Build-up Film), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of ABF (Ajinomoto Build-up Film) by region & country, by Product, and by Application.
The ABF (Ajinomoto Build-up Film) market size, estimations, and forecasts are provided in terms of sales volume (K square meters) and sales revenue ($ millions), considering 2025 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding ABF (Ajinomoto Build-up Film).
Market Segmentation
By Company
Segment by Product
Segment by Application
Production by Region
Sales/Consumption by Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of ABF (Ajinomoto Build-up Film) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Product, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of ABF (Ajinomoto Build-up Film) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of ABF (Ajinomoto Build-up Film) in country level. It provides sigmate data by Product, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.