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全球構裝基板市場研究報告，2025年
市場調查報告書
商品編碼
1895193

全球構裝基板市場研究報告，2025年

Global Package Substrates Market Research Report 2025
出版日期: | 出版商: QYResearch | 英文 292 Pages | 商品交期: 2-3個工作天內

價格

※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。

全球構裝基板（IC基板）市場預計到2024年將達到129億美元，到2031年將達到211.7億美元。

預計在2025年至2031年的預測期內，其年複合成長率將達到 8.01%。

目前，構裝基板主要由總部位於日本、韓國、台灣和中國當地的製造商生產。到2024年，台灣將成為最大的生產地，佔全球市場佔有率的28.03%，其次是韓國（27.4%）、中國當地（22%）和日本（17.17%）。

全球積體電路基板（構裝基板）市場結構上分為以下幾個區隔：ABF層壓基板（尤其是用於伺服器/AI CPU、GPU和網路ASIC等高引腳數、大尺寸封裝的FC-BGA基板）、BT樹脂基板（廣泛應用於行動/消費性電子應用以及眾多汽車/工業整合電路的主流BGA/CSP封裝基板）和模組/PRF構裝基板（例如SiPRF）。後者強調大規模生產、嚴格的尺寸控制和強大的可靠性。供應仍高度集中在東亞（日本、台灣、韓國和中國），歐洲則擁有部分高階產能。受資料中心運算需求和異質整合技術發展的驅動，市場需求正轉向更大尺寸、更高堆疊密度和更精細線寬/線間距的ABF基板。後疫情時代，該產業也正經歷「兩極週期」。儘管消費/PC相關基板的需求調整迅速，但伺服器/AI專用板（ABF）往往需要較長的認證週期和多年的平台藍圖來支撐。近期產能活動（例如，推出與資料中心處理器相關的新型大批量基板的產量）表明，即使整體電子產業週期有所放緩，主要供應商仍優先投資高階專用板。

2024年全球 ABF基板市場價值為 54億美元，預計到2031年將達到 105億美元，在2025-2031年預測期內的年複合成長率為 10.73%。

全球BT基板市場預計到2024年將達到74.1億美元，到2031年將達到103.8億美元，在2025-2031年的預測期內，年複合成長率將達到5.56%。

2024年全球 MIS基板市場價值為 9,600萬美元，預計到2031年將達到 2.55億美元，在2025-2031年預測期內的年複合成長率為 13.62%。

全球主要的構裝基板製造商包括Unimicron、Ibiden、Nan Ya PCB、Shinko Electric Industries、Kinsus Interconnect Technology、AT&S、Samsung Electro-Mechanics、Kyocera、Toppan等。截至2024年，全球前10大供應商約佔總營收的77.4%。

全球主要的ABF基板製造商包括Unimicron、Ibiden、Nan Ya PCB、Shinko Electric Industries、Kinsus Interconnect、AT&S、Semco、Kyocera、TOPPAN等。2024年，全球前七大公司以收益為準約佔市場佔有率的92.44%。

全球領先的MIS基板製造商包括台灣的PPt、中國的MiSpak Technology 和馬來西亞的QDOS。

先進封裝技術正日益影響技術和產品趨勢。基板不再是「被動載體」，而是晶片組、2.5D/3D整合以及高頻寬記憶體（HBM）生態系統的關鍵推動因素。這些技術要求更高的互連密度、更優異的翹曲控制以及在不斷提高的資料速率下更高的訊號完整性。這正推動著產業藍圖朝著更精細的線/空通孔（採用半積層製造流程（mSAP））、改進的雷射通孔形成、高精度抗蝕劑（LDI）、薄芯/無芯結構以及更高的堆疊密度發展，同時保持高產量產量比率和可靠性。在材料方面，由於基板性能越來越決定封裝的整體性能和可製造性，供應商不斷追求更低的損耗和更高的絕緣體（例如，ABF級層壓材料）的熱機械穩定性。同時，人們探索「下一代基板技術」（例如，玻璃芯基板），以提高未來運算封裝的互連密度、尺寸穩定性和供電供給能力，這表明基板藍圖進入向新材料和新製程過渡的階段，而不是簡單的增量擴展。

從價值鏈角度來看，上游工程的核心是介電/層壓材料（ABF型薄膜/樹脂）、BT環氧樹脂、銅箔、玻璃布/玻璃芯層壓板、阻焊層壓板/光阻劑、電鍍化學品以及專用設備（雷射鑽孔、成像/LDI、電鍍線、層壓/壓機、AOI/檢測、可靠性測試）。由於任何一種原料的供應限制，特別是先進層壓介電材料和高階製程設備的供應限制，都可能造成瓶頸，因此上游材料製造商不斷宣布與人工智慧/高效能運算（AI/HPC）成長預測相符的多年產能和技術擴張計畫。下游，基板流入與OSAT（外包組裝和測試）公司以及IDM/代工廠相關的高效能封裝生產線，這些生產線隨後供應給以伺服器/資料中心、HPC/AI加速器和網路/電信基礎設施為驅動的終端市場。此外，個人電腦、智慧型手機和汽車電子產品也存在週期性需求。展望未來，該產業的重點仍將位於亞洲，但政策和供應鏈韌性目標推動選擇性在地化。例如，美國很早就支持在國內生產先進封裝的玻璃基板，這顯示美國長期致力於關鍵基板技術的地理多元化。短期內，終端市場的需求和運轉率仍不均衡（人工智慧領域較為穩定，而消費領域則較易受週期性影響）。然而，從結構上看，前景依然樂觀，因為基板逐漸成為先進封裝規模化生產的阻礙因素，無論從技術、經濟或產能建設時間來看都是如此。

調查範圍

本報告全面介紹了全球構裝基板市場，結合定量和定性分析，目的是幫助讀者制定業務和成長策略，評估市場競爭，分析公司在當前市場中的地位，並就構裝基板做出明智的商業決策。

本報告以2020年至2031年的歷史資料和預測資料為基礎，以2024年為基準年，提供構裝基板市場規模、估算和預測，單位包括產量/出貨量（千平方公尺）和收入（百萬美元）。報告全面細分了全球構裝基板市場，包括依地區、產品類型、應用和主要企業分類的市場規模。

為了更深入了解市場，本報告提供了競爭格局、主要競爭對手及其市場地位的概況，並探討了技術趨勢和新產品開發。

本報告為構裝基板製造商、新參與企業以及與產業鏈相關企業提供整體市場和各個細分市場（依公司、類型、應用和地區）的收入、產量和平均價格資訊。

市場區隔

公司

  • Unimicron
  • Ibiden
  • Nan Ya PCB
  • Shinko Electric Industries
  • Kinsus Interconnect Technology
  • AT&S;
  • Samsung Electro-Mechanics
  • Kyocera
  • Toppan
  • Zhen Ding Technology
  • Daeduck Electronics
  • Zhuhai Access Semiconductor
  • LG InnoTek
  • Shennan Circuit
  • Shenzhen Fastprint Circuit Tech
  • Korea Circuit
  • FICT LIMITED
  • AKM Meadville
  • Shenzhen Hemei Jingyi Semiconductor Technology
  • Simmtech
  • HOREXS
  • ASE Material
  • PPt
  • MiSpak Technology
  • QDOS

依類型

  • FCBGA
  • FCCSP
  • 其他

依應用

  • PC
  • 伺服器和資料中心
  • 高效能運算/人工智慧晶片
  • 通訊
  • 智慧型手機
  • 穿戴式裝置和家用電子電器
  • 汽車電子
  • 其他

依材料類型

  • ABF基板
  • BT基板
  • MIS基板

依晶片類型

  • 非儲存積體電路基板
  • 記憶體基板

依地區

  • 日本
  • 韓國
  • 台灣
  • 中國
  • 東南亞

The global package substrates (IC substrates) market was valued at US$ 12.9 billion in 2024 and is anticipated to reach US$ 21.17 billion by 2031, witnessing a CAGR of 8.01% during the forecast period 2025-2031.

Currently the package substrates are mainly produced by manufactuers headquartered in Japan, South Korea, China Taiwan and China Mainland. China Taiwan is the largest producer of package substrates with global share 28.03% in 2024, followed by South Korea (27.4%), China Mainland (22%) and Japan (17.17%).

The global IC substrate (package substrate) market is structurally segmented by ABF build-up substrates (especially FC-BGA for high-pin-count, large-body packages used in server/AI CPUs, GPUs, networking ASICs), BT resin substrates (widely used in mainstream BGA/CSP for mobile/consumer and many automotive/industrial ICs), plus module/memory-oriented substrates (e.g., SiP/RF modules and memory package substrates) that emphasize high volume, tight dimensional control, and robust reliability. Supply remains highly concentrated in East Asia (Japan/Taiwan/Korea/China), while Europe has selective high-end capacity; the demand mix has been migrating toward larger, more layer-dense, tighter line/space ABF substrates driven by data center compute and heterogeneous integration. In the post-pandemic period, the industry has also shown a "split cycle": consumer/PC-related substrate demand can correct quickly, while server/AI-oriented ABF tends to be supported by long qualification cycles and multi-year platform roadmaps. Recent capacity moves (e.g., new high-volume substrate manufacturing ramps tied to data-center processors) underscore that leading suppliers still prioritize high-end ABF investment even when parts of the broader electronics cycle soften.

The global ABF substrates market was valued at US$ 5.4 billion in 2024 and is anticipated to reach US$ 10.5 billion by 2031, witnessing a CAGR of 10.73% during the forecast period 2025-2031.

The global BT substrates market was valued at US$ 7.41 billion in 2024 and is anticipated to reach US$ 10.38 billion by 2031, witnessing a CAGR of 5.56% during the forecast period 2025-2031.

The global MIS substrates market was valued at US$ 96 million in 2024 and is anticipated to reach US$ 255 million by 2031, witnessing a CAGR of 13.62% during the forecast period 2025-2031.

The key global manufacturers of package substrates include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect Technology, AT&S, Samsung Electro-Mechanics, Kyocera, and Toppan, etc. In 2024, the world's top ten vendors accounted for approximately 77.4% of the revenue.

The global key manufacturers of ABF Substrate include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, and TOPPAN, etc. In 2024, the global top seven players had a share approximately 92.44% in terms of revenue.

The global key manufacturers of MIS Substrate include China Taiwanese PPt, Chineses MiSpak Technology and Malaysian QDOS.

Technology and product trends are increasingly shaped by advanced packaging. The substrate is no longer a "passive carrier" but a key enabler for chiplets, 2.5D/3D integration, and high-bandwidth memory (HBM) ecosystems, which require more routing density, better warpage control, and higher signal integrity at rising data rates. Industry roadmaps therefore push finer L/S via semi-additive processes (mSAP), improved laser via formation, tighter registration (LDI), thinner cores/coreless structures, and higher layer counts-all while maintaining yield and reliability at scale. On the materials side, suppliers are continuously upgrading dielectrics (e.g., ABF-class build-up materials) for lower loss and better thermo-mechanical stability, because substrate performance increasingly gates overall package performance and manufacturability. Meanwhile, the "next substrate curve" (e.g., glass-core substrates) is being explored to extend wiring density, dimensional stability, and power delivery for future compute packages, signaling that the substrate roadmap is entering a new materials-and-process transition rather than simple incremental scaling.

From a value-chain perspective, the upstream is dominated by dielectric/build-up materials (ABF-type films/resins), BT epoxy systems, copper foil, glass cloth/core laminates, solder masks/photoresists, plating chemicals, and specialized equipment (laser drilling, imaging/LDI, plating lines, lamination/press, AOI/inspection, reliability test). Tightness in any one of these-particularly advanced build-up dielectrics and high-end process tools-can become a bottleneck, which is why upstream material makers continue to publicize multi-year capacity and technology expansion plans aligned with AI/HPC growth expectations. Downstream, substrates flow into OSATs and IDM/foundry-adjacent advanced packaging lines, then into end markets led by server & data center, HPC/AI accelerators, networking/communication infrastructure, plus cyclical volumes from PCs, smartphones, and automotive electronics. Looking forward, the industry's center of gravity remains in Asia, but policy and supply-chain resilience goals are catalyzing selective localization: the U.S., for example, has backed early-stage domestic manufacturing of glass substrates for advanced packaging, indicating a longer-term push to diversify critical substrate technologies geographically. Near term, demand and utilization will still be uneven by end market (AI strong; consumer more cyclical), but structurally the outlook remains favorable because substrates are increasingly the limiting factor for advanced packaging scaling-technically, economically, and in capacity build time.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Package Substrates, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Package Substrates.

The Package Substrates market size, estimations, and forecasts are provided in terms of output/shipments (Thousand Square Meters) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Package Substrates market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Package Substrates manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

By Company

  • Unimicron
  • Ibiden
  • Nan Ya PCB
  • Shinko Electric Industries
  • Kinsus Interconnect Technology
  • AT&S
  • Samsung Electro-Mechanics
  • Kyocera
  • Toppan
  • Zhen Ding Technology
  • Daeduck Electronics
  • Zhuhai Access Semiconductor
  • LG InnoTek
  • Shennan Circuit
  • Shenzhen Fastprint Circuit Tech
  • Korea Circuit
  • FICT LIMITED
  • AKM Meadville
  • Shenzhen Hemei Jingyi Semiconductor Technology
  • Simmtech
  • HOREXS
  • ASE Material
  • PPt
  • MiSpak Technology
  • QDOS

Segment by Type

  • FCBGA
  • FCCSP
  • Others

Segment by Application

  • PCs
  • Server & Data Center
  • HPC/AI Chips
  • Communication
  • Smart Phone
  • Wearable and Consumer Electronics
  • Automotive Electronics
  • Others

By Material Type

  • ABF Substrate
  • BT Substrate
  • MIS Substrate

By Chips Type

  • Non-memory IC Substrate
  • Memory Substrate

By Region

  • Japan
  • South Korea
  • China Taiwan
  • China Mainland
  • Southeast Asia

Chapter Outline:

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Detailed analysis of Package Substrates manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Production/output, value of Package Substrates by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.

Chapter 4: Consumption of Package Substrates in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.

Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 6: Provides the analysis of various market segments by Material Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 7: Provides the analysis of various market segments by Chips Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 8: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 9: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.

Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 11: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 12: The main points and conclusions of the report.

Table of Contents

1 Package Substrates Market Overview

  • 1.1 Product Definition
  • 1.2 Package Substrates by Type
    • 1.2.1 Global Package Substrates Market Value Growth Rate Analysis by Type: 2024 VS 2031
    • 1.2.2 FCBGA Substrates
    • 1.2.3 FCCSP Substrates
    • 1.2.4 Others (WB CSP, WB-BGA, SIP /RF Module Substrates, Memory Substrates, etc.)
  • 1.3 Package Substrates by Material Type
    • 1.3.1 Global Package Substrates Market Value Growth Rate Analysis by Material Type: 2024 VS 2031
    • 1.3.2 ABF Substrate
    • 1.3.3 BT Substrate
    • 1.3.4 MIS Substrate
      • 1.3.4.1 Single-layer MIS
      • 1.3.4.2 Multi-layer MIS
  • 1.4 Package Substrates by Chips Type
    • 1.4.1 Global Package Substrates Market Value Growth Rate Analysis by Chips Type: 2024 VS 2031
    • 1.4.2 Non-memory IC Substrate
    • 1.4.3 Memory Substrate
  • 1.5 Package Substrates by Application
    • 1.5.1 Global Package Substrates Market Value Growth Rate Analysis by Application: 2024 VS 2031
    • 1.5.2 PCs
    • 1.5.3 Server & Data Center
    • 1.5.4 HPC/AI Chips
    • 1.5.5 Communication
    • 1.5.6 Smart Phone
    • 1.5.7 Wearable and Consumer Electronics
    • 1.5.8 Automotive Electronics (Infotainment / ADAS)
    • 1.5.9 Others
  • 1.6 Global Market Growth Prospects
    • 1.6.1 Global Package Substrates Production Value Estimates and Forecasts (2020-2031)
    • 1.6.2 Global Package Substrates Production Capacity Estimates and Forecasts (2020-2031)
    • 1.6.3 Global Package Substrates Production Estimates and Forecasts (2020-2031)
    • 1.6.4 Global Package Substrates Market Average Price Estimates and Forecasts (2020-2031)
  • 1.7 Assumptions and Limitations

2 Market Competition by Manufacturers

  • 2.1 Global Package Substrates Production Market Share by Manufacturers (2020-2025)
  • 2.2 Global Package Substrates Production Value Market Share by Manufacturers (2020-2025)
  • 2.3 Global Package Substrates Company Type and Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
  • 2.4 Global Package Substrates Average Price by Manufacturers (2020-2025)
  • 2.5 Global Key Manufacturers of Package Substrates, Manufacturing Sites & Headquarters
  • 2.6 Global Key Manufacturers of Package Substrates, Product Type & Application
  • 2.7 Global Key Manufacturers of Package Substrates, Date of Enter into This Industry
  • 2.8 Global Package Substrates Market Competitive Situation and Trends
    • 2.8.1 Global Package Substrates Market Concentration Rate
    • 2.8.2 Global 5 and 10 Largest Package Substrates Players Market Share by Revenue
  • 2.9 Mergers & Acquisitions, Expansion

3 Package Substrates Production by Region

  • 3.1 Global Package Substrates Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
  • 3.2 Global Package Substrates Production Value by Region (2020-2031)
    • 3.2.1 Global Package Substrates Production Value Market Share by Region (2020-2025)
    • 3.2.2 Global Forecasted Production Value of Package Substrates by Region (2026-2031)
  • 3.3 Global Package Substrates Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
  • 3.4 Global Package Substrates Production by Region (2020-2031)
    • 3.4.1 Global Package Substrates Production Market Share by Region (2020-2025)
    • 3.4.2 Global Forecasted Production of Package Substrates by Region (2026-2031)
  • 3.5 Global Package Substrates Market Price Analysis by Region (2020-2025)
  • 3.6 Global Package Substrates Production and Value, Year-over-Year Growth
    • 3.6.1 Japan Package Substrates Production Value Estimates and Forecasts (2020-2031)
    • 3.6.2 South Korea Package Substrates Production Value Estimates and Forecasts (2020-2031)
    • 3.6.3 China Taiwan Package Substrates Production Value Estimates and Forecasts (2020-2031)
    • 3.6.4 China Mainland Package Substrates Production Value Estimates and Forecasts (2020-2031)
    • 3.6.5 Southeast Asia Package Substrates Production Value Estimates and Forecasts (2020-2031)

4 Package Substrates Consumption by Region

  • 4.1 Global Package Substrates Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
  • 4.2 Global Package Substrates Consumption by Region (2020-2031)
    • 4.2.1 Global Package Substrates Consumption by Region (2020-2031)
    • 4.2.2 Global Package Substrates Forecasted Consumption by Region (2026-2031)
  • 4.3 North America
  • 4.4 Europe
  • 4.5 China
  • 4.6 Japan
  • 4.7 South Korea
  • 4.8 China Taiwan
  • 4.9 Southeast Asia

5 Segment by Type

  • 5.1 Global Package Substrates Production by Type (2020-2031)
    • 5.1.1 Global Package Substrates Production by Type (2020-2025)
    • 5.1.2 Global Package Substrates Production by Type (2026-2031)
    • 5.1.3 Global Package Substrates Production Market Share by Type (2020-2031)
  • 5.2 Global Package Substrates Production Value by Type (2020-2031)
    • 5.2.1 Global Package Substrates Production Value by Type (2020-2025)
    • 5.2.2 Global Package Substrates Production Value by Type (2026-2031)
    • 5.2.3 Global Package Substrates Production Value Market Share by Type (2020-2031)
  • 5.3 Global Package Substrates Price by Type (2020-2031)

6 Segment by Material Type

  • 6.1 Global Package Substrates Production by Material Type (2020-2031)
    • 6.1.1 Global Package Substrates Production by Material Type (2020-2025)
    • 6.1.2 Global Package Substrates Production by Material Type (2026-2031)
    • 6.1.3 Global Package Substrates Production Market Share by Material Type (2020-2031)
  • 6.2 Global Package Substrates Production Value by Material Type (2020-2031)
    • 6.2.1 Global Package Substrates Production Value by Material Type (2020-2025)
    • 6.2.2 Global Package Substrates Production Value by Material Type (2026-2031)
    • 6.2.3 Global Package Substrates Production Value Market Share by Material Type (2020-2031)
  • 6.3 Global Package Substrates Price by Material Type (2020-2031)

7 Segment by Chips Type

  • 7.1 Global Package Substrates Production by Chips Type (2020-2031)
    • 7.1.1 Global Package Substrates Production by Chips Type (2020-2025)
    • 7.1.2 Global Package Substrates Production by Chips Type (2026-2031)
    • 7.1.3 Global Package Substrates Production Market Share by Chips Type (2020-2031)
  • 7.2 Global Package Substrates Production Value by Chips Type (2020-2031)
    • 7.2.1 Global Package Substrates Production Value by Chips Type (2020-2025)
    • 7.2.2 Global Package Substrates Production Value by Chips Type (2026-2031)
    • 7.2.3 Global Package Substrates Production Value Market Share by Chips Type (2020-2031)
  • 7.3 Global Package Substrates Price by Chips Type (2020-2031)

8 Segment by Application

  • 8.1 Global Package Substrates Production by Application (2020-2031)
    • 8.1.1 Global Package Substrates Production by Application (2020-2025)
    • 8.1.2 Global Package Substrates Production by Application (2026-2031)
    • 8.1.3 Global Package Substrates Production Market Share by Application (2020-2031)
  • 8.2 Global Package Substrates Production Value by Application (2020-2031)
    • 8.2.1 Global Package Substrates Production Value by Application (2020-2025)
    • 8.2.2 Global Package Substrates Production Value by Application (2026-2031)
    • 8.2.3 Global Package Substrates Production Value Market Share by Application (2020-2031)
  • 8.3 Global Package Substrates Price by Application (2020-2031)

9 Key Companies Profiled

  • 9.1 Unimicron
    • 9.1.1 Unimicron Package Substrates Company Information
    • 9.1.2 Unimicron Package Substrates Product Portfolio
    • 9.1.3 Unimicron Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.1.4 Unimicron Main Business and Markets Served
    • 9.1.5 Unimicron Recent Developments/Updates
  • 9.2 Ibiden
    • 9.2.1 Ibiden Package Substrates Company Information
    • 9.2.2 Ibiden Package Substrates Product Portfolio
    • 9.2.3 Ibiden Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.2.4 Ibiden Main Business and Markets Served
    • 9.2.5 Ibiden Recent Developments/Updates
  • 9.3 Nan Ya PCB
    • 9.3.1 Nan Ya PCB Package Substrates Company Information
    • 9.3.2 Nan Ya PCB Package Substrates Product Portfolio
    • 9.3.3 Nan Ya PCB Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.3.4 Nan Ya PCB Main Business and Markets Served
    • 9.3.5 Nan Ya PCB Recent Developments/Updates
  • 9.4 Shinko Electric Industries
    • 9.4.1 Shinko Electric Industries Package Substrates Company Information
    • 9.4.2 Shinko Electric Industries Package Substrates Product Portfolio
    • 9.4.3 Shinko Electric Industries Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.4.4 Shinko Electric Industries Main Business and Markets Served
    • 9.4.5 Shinko Electric Industries Recent Developments/Updates
  • 9.5 Kinsus Interconnect Technology
    • 9.5.1 Kinsus Interconnect Technology Package Substrates Company Information
    • 9.5.2 Kinsus Interconnect Technology Package Substrates Product Portfolio
    • 9.5.3 Kinsus Interconnect Technology Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.5.4 Kinsus Interconnect Technology Main Business and Markets Served
    • 9.5.5 Kinsus Interconnect Technology Recent Developments/Updates
  • 9.6 AT&S
    • 9.6.1 AT&S Package Substrates Company Information
    • 9.6.2 AT&S Package Substrates Product Portfolio
    • 9.6.3 AT&S Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.6.4 AT&S Main Business and Markets Served
    • 9.6.5 AT&S Recent Developments/Updates
  • 9.7 Samsung Electro-Mechanics
    • 9.7.1 Samsung Electro-Mechanics Package Substrates Company Information
    • 9.7.2 Samsung Electro-Mechanics Package Substrates Product Portfolio
    • 9.7.3 Samsung Electro-Mechanics Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.7.4 Samsung Electro-Mechanics Main Business and Markets Served
    • 9.7.5 Samsung Electro-Mechanics Recent Developments/Updates
  • 9.8 Kyocera
    • 9.8.1 Kyocera Package Substrates Company Information
    • 9.8.2 Kyocera Package Substrates Product Portfolio
    • 9.8.3 Kyocera Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.8.4 Kyocera Main Business and Markets Served
    • 9.8.5 Kyocera Recent Developments/Updates
  • 9.9 Toppan
    • 9.9.1 Toppan Package Substrates Company Information
    • 9.9.2 Toppan Package Substrates Product Portfolio
    • 9.9.3 Toppan Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.9.4 Toppan Main Business and Markets Served
    • 9.9.5 Toppan Recent Developments/Updates
  • 9.10 Zhen Ding Technology
    • 9.10.1 Zhen Ding Technology Package Substrates Company Information
    • 9.10.2 Zhen Ding Technology Package Substrates Product Portfolio
    • 9.10.3 Zhen Ding Technology Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.10.4 Zhen Ding Technology Main Business and Markets Served
    • 9.10.5 Zhen Ding Technology Recent Developments/Updates
  • 9.11 Daeduck Electronics
    • 9.11.1 Daeduck Electronics Package Substrates Company Information
    • 9.11.2 Daeduck Electronics Package Substrates Product Portfolio
    • 9.11.3 Daeduck Electronics Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.11.4 Daeduck Electronics Main Business and Markets Served
    • 9.11.5 Daeduck Electronics Recent Developments/Updates
  • 9.12 Zhuhai Access Semiconductor
    • 9.12.1 Zhuhai Access Semiconductor Package Substrates Company Information
    • 9.12.2 Zhuhai Access Semiconductor Package Substrates Product Portfolio
    • 9.12.3 Zhuhai Access Semiconductor Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.12.4 Zhuhai Access Semiconductor Main Business and Markets Served
    • 9.12.5 Zhuhai Access Semiconductor Recent Developments/Updates
  • 9.13 LG InnoTek
    • 9.13.1 LG InnoTek Package Substrates Company Information
    • 9.13.2 LG InnoTek Package Substrates Product Portfolio
    • 9.13.3 LG InnoTek Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.13.4 LG InnoTek Main Business and Markets Served
    • 9.13.5 LG InnoTek Recent Developments/Updates
  • 9.14 Shennan Circuit (GreaTech Substrates Co., Ltd. (GTS))
    • 9.14.1 Shennan Circuit Package Substrates Company Information
    • 9.14.2 Shennan Circuit Package Substrates Product Portfolio
    • 9.14.3 Shennan Circuit Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.14.4 Shennan Circuit Main Business and Markets Served
    • 9.14.5 Shennan Circuit Recent Developments/Updates
  • 9.15 Shenzhen Fastprint Circuit Tech
    • 9.15.1 Shenzhen Fastprint Circuit Tech Package Substrates Company Information
    • 9.15.2 Shenzhen Fastprint Circuit Tech Package Substrates Product Portfolio
    • 9.15.3 Shenzhen Fastprint Circuit Tech Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.15.4 Shenzhen Fastprint Circuit Tech Main Business and Markets Served
    • 9.15.5 Shenzhen Fastprint Circuit Tech Recent Developments/Updates
  • 9.16 Korea Circuit
    • 9.16.1 Korea Circuit Package Substrates Company Information
    • 9.16.2 Korea Circuit Package Substrates Product Portfolio
    • 9.16.3 Korea Circuit Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.16.4 Korea Circuit Main Business and Markets Served
    • 9.16.5 Korea Circuit Recent Developments/Updates
  • 9.17 FICT LIMITED
    • 9.17.1 FICT LIMITED Package Substrates Company Information
    • 9.17.2 FICT LIMITED Package Substrates Product Portfolio
    • 9.17.3 FICT LIMITED Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.17.4 FICT LIMITED Main Business and Markets Served
    • 9.17.5 FICT LIMITED Recent Developments/Updates
  • 9.18 AKM Meadville
    • 9.18.1 AKM Meadville Package Substrates Company Information
    • 9.18.2 AKM Meadville Package Substrates Product Portfolio
    • 9.18.3 AKM Meadville Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.18.4 AKM Meadville Main Business and Markets Served
    • 9.18.5 AKM Meadville Recent Developments/Updates
  • 9.19 Shenzhen Hemei Jingyi Semiconductor Technology
    • 9.19.1 Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Company Information
    • 9.19.2 Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Product Portfolio
    • 9.19.3 Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.19.4 Shenzhen Hemei Jingyi Semiconductor Technology Main Business and Markets Served
    • 9.19.5 Shenzhen Hemei Jingyi Semiconductor Technology Recent Developments/Updates
  • 9.20 Simmtech
    • 9.20.1 Simmtech Package Substrates Company Information
    • 9.20.2 Simmtech Package Substrates Product Portfolio
    • 9.20.3 Simmtech Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.20.4 Simmtech Main Business and Markets Served
    • 9.20.5 Simmtech Recent Developments/Updates
  • 9.21 HOREXS
    • 9.21.1 HOREXS Package Substrates Company Information
    • 9.21.2 HOREXS Package Substrates Product Portfolio
    • 9.21.3 HOREXS Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.21.4 HOREXS Main Business and Markets Served
  • 9.22 ASE Material
    • 9.22.1 ASE Material Package Substrates Company Information
    • 9.22.2 ASE Material Package Substrates Product Portfolio
    • 9.22.3 ASE Material Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.22.4 ASE Material Main Business and Markets Served
    • 9.22.5 ASE Material Recent Developments/Updates
  • 9.23 PPt
    • 9.23.1 PPt Package Substrates Company Information
    • 9.23.2 PPt Package Substrates Product Portfolio
    • 9.23.3 PPt Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.23.4 PPt Main Business and Markets Served
  • 9.24 MiSpak Technology
    • 9.24.1 MiSpak Technology Package Substrates Company Information
    • 9.24.2 MiSpak Technology Package Substrates Product Portfolio
    • 9.24.3 MiSpak Technology Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.24.4 MiSpak Technology Main Business and Markets Served
  • 9.25 QDOS
    • 9.25.1 QDOS Package Substrates Company Information
    • 9.25.2 QDOS Package Substrates Product Portfolio
    • 9.25.3 QDOS Package Substrates Production, Value, Price and Gross Margin (2020-2025)
    • 9.25.4 QDOS Main Business and Markets Served

10 Industry Chain and Sales Channels Analysis

  • 10.1 Package Substrates Industry Chain Analysis
  • 10.2 Package Substrates Raw Material Supply Analysis
    • 10.2.1 Key Raw Materials
    • 10.2.2 Raw Materials Key Suppliers
  • 10.3 Package Substrates Production Mode & Process Analysis
    • 10.3.1 ABF Substrates Technology Roadmap
    • 10.3.2 BT Substrates Technology Roadmap
    • 10.3.3 MIS Substrates Technology Roadmap
  • 10.4 Package Substrates Sales and Marketing
  • 10.5 Package Substrates Customer Analysis

11 Package Substrates Market Dynamics

  • 11.1 Package Substrates Industry Trends
  • 11.2 Package Substrates Market Drivers
  • 11.3 Package Substrates Market Challenges
  • 11.4 Package Substrates Market Restraints

12 Research Findings and Conclusion

13 Methodology and Data Source

  • 13.1 Methodology/Research Approach
    • 13.1.1 Research Programs/Design
    • 13.1.2 Market Size Estimation
    • 13.1.3 Market Breakdown and Data Triangulation
  • 13.2 Data Source
    • 13.2.1 Secondary Sources
    • 13.2.2 Primary Sources
  • 13.3 Author List
  • 13.4 Disclaimer
  • Table 1. Global Package Substrates Market Value by Type, (US$ Million) & (2024 VS 2031)
  • Table 2. Global Package Substrates Market Value by Material Type, (US$ Million) & (2024 VS 2031)
  • Table 3. Global Package Substrates Market Value by Chips Type, (US$ Million) & (2024 VS 2031)
  • Table 4. Global Package Substrates Market Value by Application, (US$ Million) & (2024 VS 2031)
  • Table 5. Global Package Substrates Production by Manufacturers (2020-2025) & (Thousand Square Meters)
  • Table 6. Global Package Substrates Production Market Share by Manufacturers (2020-2025)
  • Table 7. Global Package Substrates Production Value by Manufacturers (2020-2025) & (US$ Million)
  • Table 8. Global Package Substrates Production Value Share by Manufacturers (2020-2025)
  • Table 9. Global Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Production Value in Package Substrates as of 2024)
  • Table 10. Global Market Package Substrates Average Price by Manufacturers (USD/Square Meter) & (2020-2025)
  • Table 11. Global Key Manufacturers of Package Substrates, Manufacturing Sites & Headquarters
  • Table 12. Global Key Manufacturers of Package Substrates, Product Type & Application
  • Table 13. Global Key Manufacturers of Package Substrates, Date of Enter into This Industry
  • Table 14. Global Package Substrates Manufacturers Market Concentration Ratio (CR5 and HHI)
  • Table 15. Mergers & Acquisitions, Expansion Plans
  • Table 16. Global Package Substrates Production Value Growth Rate by Region: 2020 VS 2024 VS 2031 (US$ Million)
  • Table 17. Global Package Substrates Production Value (US$ Million) by Region (2020-2025)
  • Table 18. Global Package Substrates Production Value Market Share by Region (2020-2025)
  • Table 19. Global Package Substrates Production Value (US$ Million) Forecast by Region (2026-2031)
  • Table 20. Global Package Substrates Production Value Market Share Forecast by Region (2026-2031)
  • Table 21. Global Package Substrates Production Comparison by Region: 2020 VS 2024 VS 2031 (Thousand Square Meters)
  • Table 22. Global Package Substrates Production (Thousand Square Meters) by Region (2020-2025)
  • Table 23. Global Package Substrates Production Market Share by Region (2020-2025)
  • Table 24. Global Package Substrates Production (Thousand Square Meters) Forecast by Region (2026-2031)
  • Table 25. Global Package Substrates Production Market Share Forecast by Region (2026-2031)
  • Table 26. Global Package Substrates Market Average Price (USD/Square Meter) by Region (2020-2025)
  • Table 27. Global Package Substrates Market Average Price (USD/Square Meter) by Region (2026-2031)
  • Table 28. Global Package Substrates Consumption Growth Rate by Region: 2020 VS 2024 VS 2031 (Thousand Square Meters)
  • Table 29. Global Package Substrates Consumption by Region (2020-2025) & (Thousand Square Meters)
  • Table 30. Global Package Substrates Consumption Market Share by Region (2020-2025)
  • Table 31. Global Package Substrates Forecasted Consumption by Region (2026-2031) & (Thousand Square Meters)
  • Table 32. Global Package Substrates Forecasted Consumption Market Share by Region (2020-2025)
  • Table 33. Global Package Substrates Production (Thousand Square Meters) by Type (2020-2025)
  • Table 34. Global Package Substrates Production (Thousand Square Meters) by Type (2026-2031)
  • Table 35. Global Package Substrates Production Market Share by Type (2020-2025)
  • Table 36. Global Package Substrates Production Market Share by Type (2026-2031)
  • Table 37. Global Package Substrates Production Value (US$ Million) by Type (2020-2025)
  • Table 38. Global Package Substrates Production Value (US$ Million) by Type (2026-2031)
  • Table 39. Global Package Substrates Production Value Market Share by Type (2020-2025)
  • Table 40. Global Package Substrates Production Value Market Share by Type (2026-2031)
  • Table 41. Global Package Substrates Price (USD/Square Meter) by Type (2020-2025)
  • Table 42. Global Package Substrates Price (USD/Square Meter) by Type (2026-2031)
  • Table 43. Global Package Substrates Production (Thousand Square Meters) by Material Type (2020-2025)
  • Table 44. Global Package Substrates Production (Thousand Square Meters) by Material Type (2026-2031)
  • Table 45. Global Package Substrates Production Market Share by Material Type (2020-2025)
  • Table 46. Global Package Substrates Production Market Share by Material Type (2026-2031)
  • Table 47. Global Package Substrates Production Value (US$ Million) by Material Type (2020-2025)
  • Table 48. Global Package Substrates Production Value (US$ Million) by Material Type (2026-2031)
  • Table 49. Global Package Substrates Production Value Market Share by Material Type (2020-2025)
  • Table 50. Global Package Substrates Production Value Market Share by Material Type (2026-2031)
  • Table 51. Global Package Substrates Price (USD/Square Meter) by Material Type (2020-2025)
  • Table 52. Global Package Substrates Price (USD/Square Meter) by Material Type (2026-2031)
  • Table 53. Global Package Substrates Production (Thousand Square Meters) by Chips Type (2020-2025)
  • Table 54. Global Package Substrates Production (Thousand Square Meters) by Chips Type (2026-2031)
  • Table 55. Global Package Substrates Production Market Share by Chips Type (2020-2025)
  • Table 56. Global Package Substrates Production Market Share by Chips Type (2026-2031)
  • Table 57. Global Package Substrates Production Value (US$ Million) by Chips Type (2020-2025)
  • Table 58. Global Package Substrates Production Value (US$ Million) by Chips Type (2026-2031)
  • Table 59. Global Package Substrates Production Value Market Share by Chips Type (2020-2025)
  • Table 60. Global Package Substrates Production Value Market Share by Chips Type (2026-2031)
  • Table 61. Global Package Substrates Price (USD/Square Meter) by Chips Type (2020-2025)
  • Table 62. Global Package Substrates Price (USD/Square Meter) by Chips Type (2026-2031)
  • Table 63. Global Package Substrates Production (Thousand Square Meters) by Application (2020-2025)
  • Table 64. Global Package Substrates Production (Thousand Square Meters) by Application (2026-2031)
  • Table 65. Global Package Substrates Production Market Share by Application (2020-2025)
  • Table 66. Global Package Substrates Production Market Share by Application (2026-2031)
  • Table 67. Global Package Substrates Production Value (US$ Million) by Application (2020-2025)
  • Table 68. Global Package Substrates Production Value (US$ Million) by Application (2026-2031)
  • Table 69. Global Package Substrates Production Value Market Share by Application (2020-2025)
  • Table 70. Global Package Substrates Production Value Market Share by Application (2026-2031)
  • Table 71. Global Package Substrates Price (USD/Square Meter) by Application (2020-2025)
  • Table 72. Global Package Substrates Price (USD/Square Meter) by Application (2026-2031)
  • Table 73. Unimicron Package Substrates Company Information
  • Table 74. Unimicron Package Substrates Specification and Application
  • Table 75. Unimicron Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 76. Unimicron Main Business and Markets Served
  • Table 77. Unimicron Recent Developments/Updates
  • Table 78. Ibiden Package Substrates Company Information
  • Table 79. Ibiden Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 80. Ibiden Main Business and Markets Served
  • Table 81. Ibiden Recent Developments/Updates
  • Table 82. Nan Ya PCB Package Substrates Company Information
  • Table 83. Nan Ya PCB Package Substrates Specification and Application
  • Table 84. Nan Ya PCB Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 85. Nan Ya PCB Main Business and Markets Served
  • Table 86. Nan Ya PCB Recent Developments/Updates
  • Table 87. Shinko Electric Industries Package Substrates Company Information
  • Table 88. Shinko Electric Industries Package Substrates Specification and Application
  • Table 89. Shinko Electric Industries Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 90. Shinko Electric Industries Main Business and Markets Served
  • Table 91. Shinko Electric Industries Recent Developments/Updates
  • Table 92. Kinsus Interconnect Technology Package Substrates Company Information
  • Table 93. Kinsus Interconnect Technology Package Substrates Specification and Application
  • Table 94. Kinsus Interconnect Technology Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 95. Kinsus Interconnect Technology Main Business and Markets Served
  • Table 96. Kinsus Interconnect Technology Recent Developments/Updates
  • Table 97. AT&S Package Substrates Company Information
  • Table 98. AT&S Package Substrates Specification and Application
  • Table 99. AT&S Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 100. AT&S Main Business and Markets Served
  • Table 101. AT&S Recent Developments/Updates
  • Table 102. Samsung Electro-Mechanics Package Substrates Company Information
  • Table 103. Samsung Electro-Mechanics Package Substrates Specification and Application
  • Table 104. Samsung Electro-Mechanics Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 105. Samsung Electro-Mechanics Main Business and Markets Served
  • Table 106. Samsung Electro-Mechanics Recent Developments/Updates
  • Table 107. Kyocera Package Substrates Company Information
  • Table 108. Kyocera Package Substrates Specification and Application
  • Table 109. Kyocera Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 110. Kyocera Main Business and Markets Served
  • Table 111. Kyocera Recent Developments/Updates
  • Table 112. Toppan Package Substrates Company Information
  • Table 113. Toppan Package Substrates Specification and Application
  • Table 114. Toppan Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 115. Toppan Main Business and Markets Served
  • Table 116. Toppan Recent Developments/Updates
  • Table 117. Zhen Ding Technology Package Substrates Company Information
  • Table 118. Zhen Ding Technology Package Substrates Specification and Application
  • Table 119. Zhen Ding Technology Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 120. Zhen Ding Technology Main Business and Markets Served
  • Table 121. Zhen Ding Technology Recent Developments/Updates
  • Table 122. Daeduck Electronics Package Substrates Company Information
  • Table 123. Daeduck Electronics Package Substrates Specification and Application
  • Table 124. Daeduck Electronics Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 125. Daeduck Electronics Main Business and Markets Served
  • Table 126. Daeduck Electronics Recent Developments/Updates
  • Table 127. Zhuhai Access Semiconductor Package Substrates Company Information
  • Table 128. Zhuhai Access Semiconductor Package Substrates Specification and Application
  • Table 129. Zhuhai Access Semiconductor Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 130. Zhuhai Access Semiconductor Main Business and Markets Served
  • Table 131. Zhuhai Access Semiconductor Recent Developments/Updates
  • Table 132. LG InnoTek Package Substrates Company Information
  • Table 133. LG InnoTek Package Substrates Specification and Application
  • Table 134. LG InnoTek Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 135. LG InnoTek Main Business and Markets Served
  • Table 136. LG InnoTek Recent Developments/Updates
  • Table 137. Shennan Circuit Package Substrates Company Information
  • Table 138. Shennan Circuit Package Substrates Specification and Application
  • Table 139. Shennan Circuit Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 140. Shennan Circuit Main Business and Markets Served
  • Table 141. Shennan Circuit Recent Developments/Updates
  • Table 142. Shenzhen Fastprint Circuit Tech Package Substrates Company Information
  • Table 143. Shenzhen Fastprint Circuit Tech Package Substrates Specification and Application
  • Table 144. Shenzhen Fastprint Circuit Tech Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 145. Shenzhen Fastprint Circuit Tech Main Business and Markets Served
  • Table 146. Shenzhen Fastprint Circuit Tech Recent Developments/Updates
  • Table 147. Korea Circuit Package Substrates Company Information
  • Table 148. Korea Circuit Package Substrates Specification and Application
  • Table 149. Korea Circuit Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 150. Korea Circuit Main Business and Markets Served
  • Table 151. Korea Circuit Recent Developments/Updates
  • Table 152. FICT LIMITED Package Substrates Company Information
  • Table 153. FICT LIMITED Package Substrates Specification and Application
  • Table 154. FICT LIMITED Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 155. FICT LIMITED Main Business and Markets Served
  • Table 156. FICT LIMITED Recent Developments/Updates
  • Table 157. AKM Meadville Package Substrates Company Information
  • Table 158. AKM Meadville Package Substrates Specification and Application
  • Table 159. AKM Meadville Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 160. AKM Meadville Main Business and Markets Served
  • Table 161. AKM Meadville Recent Developments/Updates
  • Table 162. Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Company Information
  • Table 163. Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Specification and Application
  • Table 164. Shenzhen Hemei Jingyi Semiconductor Technology Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 165. Shenzhen Hemei Jingyi Semiconductor Technology Main Business and Markets Served
  • Table 166. Shenzhen Hemei Jingyi Semiconductor Technology Recent Developments/Updates
  • Table 167. Simmtech Package Substrates Company Information
  • Table 168. Simmtech Package Substrates Specification and Application
  • Table 169. Simmtech Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 170. Simmtech Main Business and Markets Served
  • Table 171. Simmtech Recent Developments/Updates
  • Table 172. HOREXS Package Substrates Company Information
  • Table 173. HOREXS Package Substrates Specification and Application
  • Table 174. HOREXS Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 175. HOREXS Main Business and Markets Served
  • Table 176. ASE Material Package Substrates Company Information
  • Table 177. ASE Material Package Substrates Specification and Application
  • Table 178. ASE Material Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 179. ASE Material Main Business and Markets Served
  • Table 180. ASE Material Recent Developments/Updates
  • Table 181. PPt Package Substrates Company Information
  • Table 182. PPt Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 183. PPt Main Business and Markets Served
  • Table 184. MiSpak Technology Package Substrates Company Information
  • Table 185. MiSpak Technology MIS Substrates Product Offerings
  • Table 186. MiSpak Technology Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 187. MiSpak Technology Main Business and Markets Served
  • Table 188. QDOS Package Substrates Company Information
  • Table 189. QDOS Package Substrates Specification and Application
  • Table 190. QDOS Package Substrates Production (Thousand Square Meters), Value (US$ Million), Price (USD/Square Meter) and Gross Margin (2020-2025)
  • Table 191. QDOS Main Business and Markets Served
  • Table 192. Key Raw Materials Lists
  • Table 193. Raw Materials Key Suppliers Lists
  • Table 194. ABF Substrates Technology Roadmap
  • Table 195. BT Substrates Technology Roadmap
  • Table 196. Package Substrates Customers List
  • Table 197. Package Substrates Market Trends
  • Table 198. Package Substrates Market Drivers
  • Table 199. Package Substrates Market Drivers
  • Table 200. Package Substrates Market Challenges
  • Table 201. Package Substrates Market Restraints
  • Table 202. Research Programs/Design for This Report
  • Table 203. Key Data Information from Secondary Sources
  • Table 204. Key Data Information from Primary Sources
  • Table 205. Authors List of This Report

List of Figures

  • Figure 1. Product Picture of Package Substrates
  • Figure 2. Global Package Substrates Market Value by Type, (US$ Million) & (2024 VS 2031)
  • Figure 3. Global Package Substrates Market Share by Type: 2024 VS 2031
  • Figure 4. FCBGA Product Picture
  • Figure 5. FCCSP Product Picture
  • Figure 6. WB-BGA Product Picture
  • Figure 7. WB CSP Product Picture
  • Figure 8. Plastic BGA Substrate
  • Figure 9. SiP (System In Package) Substrate
  • Figure 10. Global Package Substrates Market Value by Material Type, (US$ Million) & (2020-2031)
  • Figure 11. Global Package Substrates Market Share by Material Type: 2024 VS 2031
  • Figure 12. ABF Substrate Product Picture
  • Figure 13. FCCSP Product Picture
  • Figure 14. MIS Substrates Product Picture
  • Figure 15. Single-layer MIS Picture
  • Figure 16. Single-layer MIS Process
  • Figure 17. MiSpak 2-layer MIS Process
  • Figure 18. MiSpak Multi -layer MIS Process
  • Figure 19. PPt 1 & 2 layer MIS Process
  • Figure 20. Global Package Substrates Market Value by Chips Type, (US$ Million) & (2020-2031)
  • Figure 21. Global Package Substrates Market Share by Chips Type: 2024 VS 2031
  • Figure 22. Memory Substrate Product Picture
  • Figure 23. Global Package Substrates Market Value by Application, (US$ Million) & (2024 VS 2031)
  • Figure 24. Global Package Substrates Market Share by Application: 2024 VS 2031
  • Figure 25. PCs: ABF Substrates are widely used in PC's CPU/GPU/Chipset.
  • Figure 26. Server & Data Center
  • Figure 27. HPC/AI Chips
  • Figure 28. Communication
  • Figure 29. Smart Phone
  • Figure 30. Wearable and Consumer Electronics
  • Figure 31. Automotive Electronics
  • Figure 32. Global Package Substrates Production Value (US$ Million), 2020 VS 2024 VS 2031
  • Figure 33. Global Package Substrates Production Value (US$ Million) & (2020-2031)
  • Figure 34. Global Package Substrates Production Capacity (Thousand Square Meters) & (2020-2031)
  • Figure 35. Global Package Substrates Production (Thousand Square Meters) & (2020-2031)
  • Figure 36. Global Package Substrates Average Price (USD/Square Meter) & (2020-2031)
  • Figure 37. Package Substrates Report Years Considered
  • Figure 38. Package Substrates Production Share by Manufacturers in 2024
  • Figure 39. Package Substrates Production Value Share by Manufacturers in 2024
  • Figure 40. The Global 5 and 10 Largest Players: Market Share by Package Substrates Revenue in 2024
  • Figure 41. Global Package Substrates Production Value Comparison by Region: 2020 VS 2024 VS 2031 (US$ Million)
  • Figure 42. Global Package Substrates Production Value Market Share by Region: 2020 VS 2024 VS 2031
  • Figure 43. Global Package Substrates Production Comparison by Region: 2020 VS 2024 VS 2031 (Thousand Square Meters)
  • Figure 44. Global Package Substrates Production Market Share by Region: 2020 VS 2024 VS 2031
  • Figure 45. Japan Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
  • Figure 46. South Korea Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
  • Figure 47. China Taiwan Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
  • Figure 48. China Mainland Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
  • Figure 49. Southeast Asia Package Substrates Production Value (US$ Million) Growth Rate (2020-2031)
  • Figure 50. Global Package Substrates Consumption by Region: 2020 VS 2024 VS 2031 (Thousand Square Meters)
  • Figure 51. Global Package Substrates Consumption Market Share by Region: 2020 VS 2024 VS 2031
  • Figure 52. North America Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 53. Europe Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 54. China Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 55. Japan Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 56. South Korea Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 57. China Taiwan Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 58. Southeast Asia Package Substrates Consumption and Growth Rate (2020-2031) & (Thousand Square Meters)
  • Figure 59. Global Production Market Share of Package Substrates by Type (2020-2031)
  • Figure 60. Global Production Value Market Share of Package Substrates by Type (2020-2031)
  • Figure 61. Global Package Substrates Price (USD/Square Meter) by Type (2020-2031)
  • Figure 62. Global Production Market Share of Package Substrates by Material Type (2020-2031)
  • Figure 63. Global Production Value Market Share of Package Substrates by Material Type (2020-2031)
  • Figure 64. Global Package Substrates Price (USD/Square Meter) by Material Type (2020-2031)
  • Figure 65. Global Production Market Share of Package Substrates by Chips Type (2020-2031)
  • Figure 66. Global Production Value Market Share of Package Substrates by Chips Type (2020-2031)
  • Figure 67. Global Package Substrates Price (USD/Square Meter) by Chips Type (2020-2031)
  • Figure 68. Global Production Market Share of Package Substrates by Application (2020-2031)
  • Figure 69. Global Production Value Market Share of Package Substrates by Application (2020-2031)
  • Figure 70. Global Package Substrates Price (USD/Square Meter) by Application (2020-2031)
  • Figure 71. PPt C2iM Product Line Up
  • Figure 72. C2iM (xQFN) Advantages
  • Figure 73. PPt MIS Technology Roadmap
  • Figure 74. PPt MIS Material Roadmap
  • Figure 75. PPt MIS Surface Finish Solution
  • Figure 76. Package Substrates Value Chain
  • Figure 77. MiSpak Technology MIS Technology Roadmap
  • Figure 78. MIS Substrates Production Process
  • Figure 79. Bottom-up and Top-down Approaches for This Report
  • Figure 80. Data Triangulation