![]() |
市場調查報告書
商品編碼
1873663
獨立式ISP晶片:全球市場佔有率和排名、總收入和需求預測(2025-2031年)Independent ISP Chip - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031 |
||||||
※ 本網頁內容可能與最新版本有所差異。詳細情況請與我們聯繫。
2024 年全球獨立 ISP 晶片市場規模估計為 6.89 億美元,預計在預測期(2025-2031 年)內將以 5.8% 的複合年成長率成長,到 2031 年達到 10.22 億美元。
本報告對近期關稅調整和國際策略反制措施對獨立ISP晶片跨境產業佈局、資本配置模式、區域經濟相互依存關係和供應鏈重組的影響進行了全面評估。
影像訊號處理器 (ISP) 是處理前端影像感測器輸出訊號的單元。 ISP 晶片分為整合式和分離式兩種類型。目前,大多數智慧型手機使用整合式 ISP 晶片,該晶片整合在處理器中,並整合到設備的 SoC 處理器中。分立式 ISP 晶片獨立於處理器,雖然價格較高,但其優勢也相當顯著。
全球領先的獨立ISP晶片製造商包括意法半導體(STMicroelectronics)和安森美半導體(ON Semiconductor),這兩家公司佔了超過38%的市場佔有率。亞太地區是最大的市場,約佔55%的市場佔有率,其次是歐洲和北美,分別佔15%和18%的市場佔有率。依產品類型分類,支援HDR的晶片是最大的區隔市場,佔92%的市場佔有率;依應用領域分類,安防產業約佔40%的市場佔有率。
獨立ISP晶片市場的促進因素如下:
1. 技術突破:效能飛躍與人工智慧整合
徹底革新影像處理能力
低照度最佳化:憑藉 AI 降噪演算法和多頻譜融合技術,獨立的 ISP 晶片即使在極低照度環境下也能實現顯著提高的信噪比。
動態範圍增強:AI驅動的自適應HDR技術可即時最佳化明暗細節,減少過曝和欠曝。搭載高通驍龍8 Elite處理器的AI影像訊號處理器(ISP)支援4K解析度下的無限語意分割,從而實現對每個區域的差異化最佳化。
防手震與多模式融合:6自由度數位防手震、PDAF高速自動對焦和多感測器資料融合(雷達、紅外線等)提高了拍攝穩定性,滿足了運動場景的需求。
針對電源效率和運算能力進行了最佳化
AI模型壓縮:透過量化和剪枝演算法,AI ISP實現了終端端的低延遲處理。例如,DeepSeek-R1模型壓縮了生產規模所需的參數數量,並降低了儲存需求。
硬體協同設計:NPU 和 ISP 深度整合,提升處理效率。聯發科天璣 9400 的 NPU 890 支持自主感知和推理,顯著提升能效。
2. 市場需求:多樣化的應用場景
智慧安全監控
智慧城市和安城計劃正在推動對高清攝影機的需求,而獨立的ISP晶片支援人臉部辨識和車牌辨識等功能。
將 AI 處理器嵌入到 IPCSoC 中,可以實現從被動監控到主動感知的轉變,支援結構化資料處理和智慧分析。
汽車電子產業的爆炸性成長
自動駕駛等級的不斷提高(5 級自動駕駛需要 20 多個攝影機)正在推動對汽車 ISP 晶片的需求。
獨立 ISP 必須支援多通道 4K影像並行處理、HDR 和低照度最佳化,以滿足 ADAS(高級駕駛輔助系統)和 DMS(駕駛員監控系統)的需求。
高階消費性電子產品
隨著智慧型手機對影像品質的要求越來越高,傳統的整合式影像訊號處理器(ISP)已無法滿足這些需求,促使廠商開發獨立式ISP。例如,vivo的大螢幕藍心系列手機就配備了AI ISP,以支援多模態互動(語音、手勢和圖像)。
數位相機設備需求的不斷成長,以及電影製作等專業領域對更高解析度和穩定性的需求,正在推動ISP晶片的升級。
物聯網 (IoT) 和 5G 的興起
物聯網設備(例如智慧家庭攝影機)的普及和5G網路的發展正在加速資料傳輸,拓展ISP晶片的應用場景。例如,智慧汽車晶片支援Wi-Fi互聯和即時監控,滿足了車載物聯網(ISP)的需求。
3. 政策支持:國內替代和標準改進
由頂級設計團隊推動
政府已將積體電路產業納入「十四五」規劃,並透過稅收優惠、研發補貼等措施支持人工智慧晶片的發展。 「建構人工智慧產業國家綜合標準化體係指南(2024年版)」提出,到2026年要製定50多項與人工智慧晶片相關的國家標準。
地方政策(例如對北京和上海工業園區的支持)正在加速人工智慧晶片公司的叢集。
加速本地化進程
政策主導和技術突破正在推動國內人工智慧晶片產業鏈的發展,例如威瑞思的AI-ISP晶片實現了車規級量產,精嘉維的JM9系列GPU性能可與國際主流產品媲美。
預計到 2025 年,日本人工智慧晶片的自給率將達到 35%,但上游設備(如曝光設備)仍依賴進口,需要長期投資才能突破這一差距。
行業標準和規範
國際標準(例如 IEC 62805、ASTM F3287-18)規範製造過程和品管,而國家協會標準(例如 T/CAS 386-2019)則強調製造環境的清潔性和工藝穩定性,以確保產品一致性。
4. 產業鏈整合:上下游整合與生態系統建構
上游和下游技術合作
獨立的ISP晶片與CMOS感測器和SoC晶片協同最佳化,以提升整體效能。例如,OmniVision Technologies發布了一款整合ISP的CMOS感測器,而安森美半導體則提供CIS+ISP整合解決方案。
前端晶片和後端晶片(如IPCSoC和NVRSoC)的結合提供了端到端的智慧解決方案,降低了傳輸和儲存成本。
生態系中的合作與競爭
主要廠商正透過技術創新和產品升級來增強自身競爭力。例如,意法半導體和安森美半導體在ISP晶片領域擁有深厚的技術積累,並不斷推出新產品引領市場方向。
跨國合作,例如晶片製造商和演算法公司之間的聯合研發,正在加速技術實施,例如百度 PaddlePaddle 和 Cambrian MLU 的適配,並促進 AI ISP 在醫療和教育領域的應用。
5. 未來趨勢:科技融合與應用情境深化
人工智慧與量子運算的融合
量子運算有可能突破傳統ISP的物理限制,提高影像處理速度和能源效率,並成為智慧終端的核心推動力。
垂直場景加深
醫學(例如,即時增強手術影像)和教育(例如,用於遠端教育的高清影像傳輸)等領域對 ISP 晶片提出了新的要求,並推動了專用解決方案的發展。
終端雲端協作的標準化
2025 年巴黎人工智慧高峰會旨在促進人工智慧倫理和端到端部署規範,促進跨平台協作,並提高 ISP 晶片在端到雲端協作場景中的安全性和效率。
獨立ISP晶片市場的成長主要受技術突破、日益精細化的需求、政策支持以及產業鏈協同效應的驅動。隨著人工智慧技術的深度融合、應用場景的拓展以及國產晶片替代進程的加速,獨立ISP晶片市場將面臨更廣闊的發展機會。企業需要持續專注於技術創新、市場需求變化和政策指南,以增強自身競爭優勢並應對潛在挑戰。
本報告旨在透過依地區/國家、類型和應用進行分析,全面介紹全球獨立ISP晶片市場,重點關注總銷售量、收入、價格、市場佔有率和主要企業的排名。
本報告以銷售量(百萬片)和收入(百萬美元)為單位,對獨立ISP晶片市場規模、估算和預測進行了呈現,基準年為2024年,並包含了2020年至2031年的歷史數據和預測數據。定量和定性分析相結合,有助於讀者制定業務和成長策略,評估市場競爭,分析自身在當前市場中的地位,並就獨立ISP晶片做出明智的商業決策。
市場區隔
公司
依類型分類的區隔市場
應用領域
依地區
The global market for Independent ISP Chip was estimated to be worth US$ 689 million in 2024 and is forecast to a readjusted size of US$ 1022 million by 2031 with a CAGR of 5.8% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Independent ISP Chip cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
ISP, abbreviated as "Image Signal Processor", is a unit used to process the output signals of front-end image sensors. ISP chips are divided into two types: integrated and independent. Currently, most mobile phones use integrated ISP chips that come with processors, which are integrated into the phone's SOC processor. The independent ISP chip exists independently of the processor, and although it has a high cost, its advantages are also quite obvious.
Global key players of Independent ISP Chip include STMicroelectronics and Onsemi. The top two players hold a share over 38%. Asia-Pacific is the largest market, has a share about 55%, followed by Europe and North America, with share 15% and 18%, separately. In terms of product type, Supports HDR Chip is the largest segment, occupied for a share of 92%, and in terms of application, Security has a share about 40%.
The market drivers of independent ISP chips include:
1. Technological breakthroughs: performance leap and AI fusion
Image processing capability revolution
Low-light environment optimization: Through AI noise reduction algorithm and multi-spectral fusion technology, independent ISP chips can achieve a significant improvement in signal-to-noise ratio under extremely low illumination.
Dynamic range expansion: AI-driven adaptive HDR technology can optimize light and dark details in real time and reduce overexposure or underexposure. Qualcomm Snapdragon 8 Elite's AI ISP supports unlimited semantic segmentation at 4K resolution and implements differentiated optimization for different areas.
Anti-shake and multi-modal fusion: 6DOF digital anti-shake, PDAF fast focus and multi-sensor data fusion (such as radar, infrared) improve imaging stability and meet the needs of sports scenes.
Energy efficiency and computing power optimization
AI model compression: Through quantization and pruning algorithms, AI ISP achieves low-latency processing on the end side. For example, the DeepSeek-R1 model compresses the number of parameters to an operational scale, reducing storage requirements.
Hardware co-design: NPU and ISP are deeply integrated to improve processing efficiency. MediaTek Dimensity 9400's NPU 890 supports autonomous perception and reasoning, and its energy efficiency ratio is significantly improved.
2. Market demand: Diversified application scenarios
Intelligent security monitoring
Smart city and safe city projects drive the demand for high-definition cameras, and independent ISP chips support functions such as face recognition and license plate recognition.
After the IPCSoC is embedded with the AI processor, it realizes the transition from passive monitoring to active recognition, and supports structured data processing and intelligent analysis.
Explosive growth of automotive electronics
The level of autonomous driving has been improved (more than 20 cameras are required for L5 level), which has promoted the demand for on-board ISP chips.
Independent ISP needs to support multi-channel 4K video parallel processing, HDR and low-light optimization to meet the needs of ADAS (advanced driving assistance system) and DMS (driver monitoring system).
High-end consumer electronics
Smartphones have higher requirements for image quality, and traditional integrated ISPs are difficult to meet the needs, prompting manufacturers to develop independent ISPs. For example, the vivo Blue Heart large model is combined with the AI ISP to achieve "voice + gesture + image" multi-modal interaction.
The demand for digital camera equipment is growing, and the requirements for high resolution and high stability in professional fields (such as film production) drive the upgrade of ISP chips.
Internet of Things and 5G empowerment
The popularization of IoT devices (such as smart home cameras) and 5G networks accelerate data transmission and expand the application scenarios of ISP chips. For example, smart car chips support Wifi interconnection and real-time monitoring to meet the needs of the Internet of Vehicles.
3. Policy support: domestic substitution and standard improvement
Top-level design promotion
The country has included the integrated circuit industry in the "14th Five-Year Plan" and supported the development of AI chips through tax incentives, R&D subsidies and other measures. The "Guidelines for the Construction of the National Comprehensive Standardization System for the Artificial Intelligence Industry (2024 Edition)" requires the formulation of more than 50 national standards for AI chips by 2026.
Local policies (such as support for industrial parks in Beijing and Shanghai) accelerate the clustering development of AI chip companies.
Acceleration of the localization process
Policy-driven and technological breakthroughs promote the development of the domestic AI chip industry chain. For example, VeriSilicon's AI-ISP chips have achieved automotive-grade mass production, and Jingjiawei's JM9 series GPU performance is comparable to international mainstream products.
The self-sufficiency rate of domestic AI chips is expected to reach 35% in 2025, but upstream equipment (such as lithography machines) still relies on imports and requires long-term investment to break through.
Industry standards and specifications
International standards (such as IEC 62805, ASTM F3287-18) regulate production processes and quality control, and domestic group standards (such as T/CAS 386-2019) emphasize production cleanliness and process stability to ensure product consistency.
4. Industry chain collaboration: upstream and downstream linkage and ecological construction
Upstream and downstream technology collaboration
Independent ISP chips are coordinated and optimized with CMOS sensors and SoC chips to improve overall performance. For example, OmniVision Technologies launched a CMOS sensor with integrated ISP, and ON Semiconductor provides CIS+ISP integrated solutions.
The combination of front-end and back-end chips (such as IPCSoC and NVRSoC) provides end-to-end intelligent solutions to reduce transmission and storage costs.
Ecological cooperation and competition
Major manufacturers enhance their competitiveness through technological innovation and product upgrades. For example, STMicroelectronics and ON Semiconductor have deep technical accumulation in the field of ISP chips and continue to launch new products to lead the market direction.
Cross-border cooperation (such as joint research and development by chip manufacturers and algorithm companies) accelerates the implementation of technology, such as the adaptation of Baidu PaddlePaddle and Cambrian MLU, which promotes the application of AI ISP in medical and education fields.
5. Future trends: technology integration and scene deepening
AI and quantum computing integration
Quantum computing may break through the physical limitations of traditional ISPs, improve image processing speed and energy efficiency, and become the core driving force of smart terminals.
Vertical scene deepening
Medical (such as real-time enhancement of surgical images), education (such as high-definition video transmission of remote education) and other fields have put forward new requirements for ISP chips, promoting the development of dedicated solutions.
End-cloud collaboration standardization
The 2025 Paris AI Summit promotes AI ethics and end-side deployment specifications, promotes cross-platform collaboration, and improves the security and efficiency of ISP chips in end-cloud collaboration scenarios.
The growth of the independent ISP chip market is the result of technological breakthroughs, demand upgrades, policy support and industry chain synergy. In the future, with the in-depth integration of AI technology, the expansion of application scenarios and the acceleration of domestic substitution, the independent ISP chip market will usher in a broader development space. Enterprises need to continue to pay attention to technological innovation, changes in market demand and policy guidance to consolidate their competitive advantages and respond to potential challenges.
This report aims to provide a comprehensive presentation of the global market for Independent ISP Chip, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Independent ISP Chip by region & country, by Type, and by Application.
The Independent ISP Chip market size, estimations, and forecasts are provided in terms of sales volume (M Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Independent ISP Chip.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Independent ISP Chip manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Independent ISP Chip in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Independent ISP Chip in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.