共封裝光學元件 (CPO) 市場報告：2031 年趨勢、預測與競爭分析

全球 CPO（共封裝光纖）市場的未來預計將在資料中心/HPC 和通訊/網路市場中看到機會。預計全球共封裝光學 (CPO) 市場從 2025 年到 2031 年的複合年成長率將達到 42.9%。該市場的主要促進因素是頻寬需求的增加、能源效率需求的增加以及 AI 工作負載的使用量的增加。

• 根據Lucintel的預測，1.6T以下類別預計在預測期內達到最高成長。
• 從應用類別來看，資料中心和HPC預計將出現強勁成長。
• 按地區分類，預計亞太地區將在預測期內實現最高成長。

CPO（共封裝光學元件）市場趨勢

由於技術創新和對節能解決方案的需求不斷增加，共封裝光學（CPO）市場正在快速變化。改變市場的主要趨勢是：

• 光學和電氣元件的整合最突出的趨勢是將光學和電氣元件整合到一個封裝中。這種整合最大限度地減少了延遲，最大限度地提高了頻寬效率，並降低了功耗，使其成為資料中心、雲端運算和通訊的理想解決方案。
• 越來越重視資料中心最佳化：資料中心對高速資料傳輸的需求正在推動共封裝光學（CPO）的發展。企業擴大採用共封裝光纖 (CPO) 技術來降低功耗並提高資料吞吐量。這是由人工智慧、機器學習和巨量資料分析的發展所推動的。
• 5G 和新一代網路擴展：全球 5G 網路的擴展為共封裝光學元件 (CPO) 的使用提供了巨大的推動力。這些網路需要共封裝光學元件 (CPO) 提供的高頻寬、低延遲技術。對高速網際網路連接的需求正在推動對通訊基礎設施中使用的光學技術的需求。
• 下一代封裝技術的演進：共封裝光學（CPO）與矽光電等新一代封裝技術的演變直接相關。這些技術促進了高速資料傳輸、高頻寬和低延遲，使其非常適合包括 5G 及更高版本的下一代通訊系統。
• 永續性和能源效率：日益成長的環境問題使得人們更加重視開發節能技術。共封裝光學元件 (CPO) 被認為是一種永續的選擇，因為它消耗更少的功率，並且可以處理高數據流量而不會產生過多的熱量。

這些趨勢反映出人們正朝著更整合、高效和高效的光學解決方案邁進，專注於滿足人工智慧、5G 和雲端運算等新興技術日益成長的資料傳輸需求。

CPO（共封裝光學元件）市場的最新趨勢

過去幾年，共封裝光學 (CPO) 市場取得了重大發展，促進了光學技術的快速發展。以下是五個主要趨勢：

• 光學整合技術的進步：各公司正在推進將光學元件整合到半導體封裝中。這項技術創新使得光學模組低耗電量，適合資料中心、高效能運算和通訊的應用。
• 5G基礎設施部署：5G正在全球部署，推動對高效能光互連的需求。共封裝光纖（CPO）是滿足5G高速、低延遲需求的完美解決方案，促進了全球對光學技術的投資和創新。
• 政府和產業支持：世界各國政府，尤其是美國和中國政府，正在投資共封裝光學元件 (CPO) 的開發。這項投資將用於資助依賴高速資料傳輸技術的 5G 和 AI 等下一代通訊基礎設施。
• 大型技術合作：英特爾、英特爾和 IBM 等產業巨頭正在合作推動共封裝光學 (CPO) 的發展。這些合作的重點是最大限度地減少能源使用和提高效能，加速這些技術在企業資料中心和雲端運算中的應用。
• 矽光電的出現：矽光電已成為共封裝光學（CPO）的關鍵推動因素。矽光電能夠在短時間內實現資料傳輸，同時消耗更少的功率，使其成為未來資料中心、IT 和通訊網路以及高效能運算的核心組成部分。

這些技術創新正在定義共封裝光纖 (CPO) 市場的未來，確保其成為下一代通訊和資料基礎設施的重要組成部分。

目錄

第1章執行摘要

第2章全球共封裝光學（CPO）市場：市場動態

• 簡介、背景和分類
• 供應鏈
• 產業驅動力與挑戰

第3章 2019-2031 年市場趨勢與預測分析

• 宏觀經濟趨勢（2019-2024）及預測（2025-2031）
• 全球共封裝光學（CPO）市場趨勢（2019-2024）及預測（2025-2031）
• 全球共封裝光學（CPO）市場類型
  • 小於1.6T
  • 1.6～3.2 T
  • 3.2噸或以上
• 全球共封裝光學（CPO）市場（按應用）
  • 資料中心和 HPC
  • 通訊和網路

第4章 2019 - 2031 年各地區市場趨勢及預測分析

• 全球共封裝光學（CPO）市場（按地區）
• 北美 CPO（共封裝光學元件）市場
• 歐洲CPO（共封裝光學）市場
• 亞太共同封裝光學（CPO）市場
• 其他地區的CPO（共封裝光學）市場

第5章 競爭分析

• 產品系列分析
• 營運整合
• 波特五力分析

第6章 成長機會與策略分析

• 成長機會分析
  • 全球共封裝光學（CPO）市場成長機會（按類型）
  • 全球共封裝光學（CPO）市場成長機會（按應用）
  • 全球共封裝光學（CPO）市場成長機會（按地區）
• 全球CPO（共封裝光學元件）市場的新趨勢
• 戰略分析
  • 新產品開發
  • 全球CPO（共封裝光學元件）市場產能擴張
  • 全球 CPO（共封裝光學）市場合併、收購及合資企業
  • 認證和許可

第7章主要企業簡介

• Broadcom
• NVIDIA
• Cisco
• Ranovus
• Intel

The future of the global co-packaged optic market looks promising with opportunities in the data center & HPC and telecommunication & networking markets. The global co-packaged optic market is expected to grow with a CAGR of 42.9% from 2025 to 2031. The major drivers for this market are the increasing demand for bandwidth, the rising need for energy efficiency, and the growing use of AI workloads.

• Lucintel forecasts that, within the type category, less than 1.6 T is expected to witness the highest growth over the forecast period.
• Within the application category, data center & HPC is expected to witness higher growth.
• In terms of region, APAC is expected to witness the highest growth over the forecast period.

Emerging Trends in the Co-Packaged Optic Market

The market for co-packaged optics is changing at a fast pace as a result of technological innovations and increasing needs for power-saving solutions. The following are the dominant trends changing the market:

• Optical and Electrical Component Integration: The most prominent trend is the increased emphasis on integrating optical and electrical components into a single package. Integration of this type minimizes latency, maximizes bandwidth efficiency, and reduces power consumption, making it the best solution for data centers, cloud computing, and telecommunications.
• Growing Emphasis on Data Center Optimization: The need for fast data transmission in data centers is driving the development of co-packaged optics. Organizations are increasingly using co-packaged optic technologies to save power and increase data throughput. This is being catalyzed by the growth in AI, machine learning, and big data analytics.
• Expansion of 5G and Next-Generation Networks: Expansion of 5G networks worldwide is a major push for the usage of co-packaged optics. These networks call for high-bandwidth, low-latency technology that is offered by co-packaged optics. The demand for high-speed internet connectivity is driving demand for optical technologies used in telecom infrastructure.
• Evolution of Next-Generation Packaging Technologies: Co-packaged optics is directly related to the evolution of novel and next-generation packaging technologies, like silicon photonics. These technologies facilitate high-speed data transmission, high bandwidth, and low latency and are well suited for next-generation communications systems, including 5G and beyond.
• Sustainability and Energy Efficiency: With greater concern for the environment, there is an increasing focus on developing energy-efficient technology. Co-packaged optics are perceived to be a sustainable option because they consume less power and can process high data traffic without producing excess heat.

These trends reflect the move towards more integrated, high-performance, and efficient optical solutions, with the focus on fulfilling the increasing needs for data transmission in emerging technologies such as AI, 5G, and cloud computing.

Recent Developments in the Co-Packaged Optic Market

The co-packaged optic market has witnessed great developments over the past few years, each making a contribution to the fast evolution of optical technologies. The following are five major developments:

• Optical Integration Technology Advancements: Optical components are increasingly being integrated in semiconductor packages by companies. The technological change has resulted in size, cost, and power reduction in optical modules, making them more fit for application in data centers, high-performance computing, as well as telecommunications.
• Rollout of 5G Infrastructure: With 5G deployments taking place across the globe, there is growing demand for optical interconnects with high performance. Co-packaged optics present a perfect solution to accommodate the high-speed and low-latency needs of 5G, fueling investment and innovation in optical technology around the world.
• Government and Industry Support: Governments from different countries, particularly the U.S. and China, are investing in co-packaged optics development. The investments are being made to fund next-generation communication infrastructures, including 5G and AI, which rely on high-speed data transmission technology.
• Tech Giants' Collaboration: Industry leaders such as Intel, Cisco, and IBM are coming together to propel the evolution of co-packaged optics. These collaborations are hastening the implementation of these technologies in data centers of enterprises and cloud computing with an emphasis on minimizing energy usage and improving performance.
• Silicon Photonics Emergence: Silicon photonics has become a central enabler for co-packaged optics. Silicon photonics enables transmitting data in a short time while consuming less power, making it a central building block of the future data centers, telecommunication networks, and high-performance computing.

These innovations are defining the future of the co-packaged optic market, ensuring that it becomes an essential element of next-generation communication and data infrastructure.

Strategic Growth Opportunities in the Co-Packaged Optic Market

The co-packaged optic industry offers several growth prospects in various applications. Five major prospects are as follows:

• Data Centers: As the need for cloud computing and big data analysis rises, data centers are emerging as a key application for co-packaged optics. Such technologies provide better performance and less power consumption, saving substantial costs for operators and providing accelerated data processing.
• Telecommunications: Co-packaged optics are ideal for the growth of 5G and future-generation telecom networks. They offer the high-speed, low-latency connections needed for 5G infrastructure, and therefore are essential for telecom operators looking to increase network capacity and efficiency.
• High-Performance Computing (HPC): In high-performance computing, the need for higher data throughput and lower power consumption is growing. Co-packaged optics address these requirements by providing faster, more efficient interconnect solutions, and thus they are a central element in supercomputing and AI-based research applications.
• Machine Learning and AI: The increasing requirement for machine learning and AI solutions fuels the demand for cutting-edge data processing technology. Co-packaged optics is important to make data transmission and processing faster, which is critical for AI-powered systems to perform optimally at scale.
• Automotive and IoT: Co-packaged optics find use in the automotive sector, particularly in autonomous vehicles that need high-speed data exchange between processors and sensors. In the same vein, IoT devices that must communicate across large networks can use the energy-efficient and high-bandwidth aspect of co-packaged optics.

These opportunities for growth bring to light the potential of co-packaged optics to revolutionize industries from telecommunications to AI and IoT, pushing technological development and market growth.

Co-Packaged Optic Market Driver and Challenges

The market for co-packaged optics is influenced by drivers and challenges. An understanding of these factors is essential for market stakeholders to play the market effectively.

The factors responsible for driving the co-packaged optic market include:

1. Technological Advancements: Technological developments like silicon photonics and integration technologies are principal forces behind the co-packaged optic market. They allow higher data rates, lower power requirements, and greater performance, all of which are crucial for data centers and telecommunications networks today.

2. 5G Deployment: The worldwide deployment of 5G networks necessitates high-end optical solutions that can fulfill the requirements of high-speed, low-latency 5G infrastructure. Co-packaged optics are vital to ensuring the efficiency and performance of future telecom networks.

3. Energy Efficiency: There is increasing recognition of energy use and environmental stewardship that is leading to the adoption of co-packaged optics, which minimize power usage as compared to traditional electrical interconnects. Such energy efficiency is particularly important for large data centers and telecom networks.

4. Cloud Computing Growth: The increasing adoption of cloud computing services demands faster and more efficient data transmission technologies. Co-packaged optics provide the high-performance and low-latency interconnects necessary for cloud services to scale.

5. AI and Big Data: Growth in AI and big data analytics is another significant reason for co-packaged optics since these technologies require greater bandwidth and quicker data processing. Co-packaged optics offer the required infrastructure to handle these data-hungry technologies.

Challenges in the co-packaged optic market are:

1. Significant Development Cost: Co-packaged optics require high R&D investment in development and integration. The cost of manufacturing these high-tech components can prove to be a limitation to adoption, especially for medium and small businesses.

2. Integration Challenges: Although co-packaged optics have several benefits, it is technically challenging to integrate optical devices with electronic systems and entails addressing compatibility, packaging, and scalability concerns.

3. Regulatory Barriers: The market for co-packaged optics is faced with several regulatory barriers, particularly intellectual property rights, global trade policies, and standards compliance. These barriers may hinder market growth and bring about uncertainties among manufacturers.

The market for co-packaged optics is fueled by advancements in technology, the need for energy-efficient solutions, and increasing demand for high-speed data transfer across all industries. The drivers are however still hindered by challenges including high development expenditure, integration difficulties, and compliance challenges that affect market growth. Careful consideration of these drivers and challenges must be taken in order to unlock the full value of co-packaged optics.

List of Co-Packaged Optic Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies co-packaged optic companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the co-packaged optic companies profiled in this report include-

• Broadcom
• NVIDIA
• Cisco
• Ranovus
• Intel

Co-Packaged Optic Market by Segment

The study includes a forecast for the global co-packaged optic market by type, application, and region.

Co-Packaged Optic Market by Type [Value from 2019 to 2031]:

• Less Than 1.6 T
• 1.6 To 3.2 T
• More Than 3.2 T

Co-Packaged Optic Market by Application [Value from 2019 to 2031]:

• Data Center & HPC
• Telecommunication & Networking

Co-Packaged Optic Market by Region [Value from 2019 to 2031]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

Country Wise Outlook for the Co-Packaged Optic Market

The co-packaged optic (CPO) industry is on a high growth trajectory, fueled by escalating demand for high-speed data transmission and power-efficient technologies. CPO is a technology of integrating the optical and electrical components into a single package, resulting in high power savings and enhanced performance for high-bandwidth applications. The United States, China, Germany, India, and Japan are the main contributors to this market, with numerous technological, economic, and regulatory forces driving the growth of this industry in each of these countries. This study identifies the current trends, advancements, and strategic growth prospects of the co-packaged optic market in these countries.

• United States: The United States is still the leader in innovation within the co-packaged optic market, with some of the major developments coming in data center technologies. Large firms like Intel and Cisco are heavily investing in co-packaged optics as a way to make data centers more efficient and conserve energy. The efforts by the U.S. government to accelerate technological innovation in 5G and AI also help in the growth of this industry.
• China: China has established a strong leap forward in the co-packaged optics, particularly in its communication infrastructure. Its intense focus on the rollout of 5G infrastructure and artificial intelligence technologies is pushing the call for high-speed and energy-saving data transmission. China's supportive government policies backing the development of semiconductor and fiber-optic technologies are essential in fueling the expansion.
• Germany: Germany's co-packaged optic market has expanded because of its industrial prowess in semiconductor production and focus on high-tech innovation. Companies like Siemens and Bosch are incorporating co-packaged optics into their high-speed computing and telecommunications equipment, in line with the European Union policies promoting technological independence.
• India: India is becoming a key player in the co-packaged optic industry, primarily fueled by rising demand for data infrastructure and 5G services. The government's Digital India push and investment in data centers are improving the country's skills in the optics and semiconductor segments.
• Japan: Japan has been making significant strides in co-packaged optics, particularly in automotive and telecommunications applications. Japan's global leadership in robotics and AI is shaping the demand for energy-saving, high-speed data solutions. NEC and Fujitsu are some of the companies venturing into co-packaged optic technologies to expand their product lines.

Features of the Global Co-Packaged Optic Market

Market Size Estimates: Co-packaged optic market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2019 to 2024) and forecast (2025 to 2031) by various segments and regions.

Segmentation Analysis: Co-packaged optic market size by type, application, and region in terms of value ($B).

Regional Analysis: Co-packaged optic market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the co-packaged optic market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the co-packaged optic market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the co-packaged optic market by type (less than 1.6 T, 1.6 to 3.2 T, and more than 3.2 T), application (data center & HPC and telecommunication & networking), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Co-Packaged Optic Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2019 to 2031

• 3.1. Macroeconomic Trends (2019-2024) and Forecast (2025-2031)
• 3.2. Global Co-Packaged Optic Market Trends (2019-2024) and Forecast (2025-2031)
• 3.3: Global Co-Packaged Optic Market by Type
  • 3.3.1: Less than 1.6 T
  • 3.3.2: 1.6 to 3.2 T
  • 3.3.3: More than 3.2 T
• 3.4: Global Co-Packaged Optic Market by Application
  • 3.4.1: Data Center & HPC
  • 3.4.2: Telecommunication & Networking

4. Market Trends and Forecast Analysis by Region from 2019 to 2031

• 4.1: Global Co-Packaged Optic Market by Region
• 4.2: North American Co-Packaged Optic Market
  • 4.2.1: North American Market by Type: Less than 1.6 T, 1.6 to 3.2 T, and More than 3.2 T
  • 4.2.2: North American Market by Application: Data Center & HPC and Telecommunication & Networking
• 4.3: European Co-Packaged Optic Market
  • 4.3.1: European Market by Type: Less than 1.6 T, 1.6 to 3.2 T, and More than 3.2 T
  • 4.3.2: European Market by Application: Data Center & HPC and Telecommunication & Networking
• 4.4: APAC Co-Packaged Optic Market
  • 4.4.1: APAC Market by Type: Less than 1.6 T, 1.6 to 3.2 T, and More than 3.2 T
  • 4.4.2: APAC Market by Application: Data Center & HPC and Telecommunication & Networking
• 4.5: ROW Co-Packaged Optic Market
  • 4.5.1: ROW Market by Type: Less than 1.6 T, 1.6 to 3.2 T, and More than 3.2 T
  • 4.5.2: ROW Market by Application: Data Center & HPC and Telecommunication & Networking

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Co-Packaged Optic Market by Type
  • 6.1.2: Growth Opportunities for the Global Co-Packaged Optic Market by Application
  • 6.1.3: Growth Opportunities for the Global Co-Packaged Optic Market by Region
• 6.2: Emerging Trends in the Global Co-Packaged Optic Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Co-Packaged Optic Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Co-Packaged Optic Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Broadcom
• 7.2: NVIDIA
• 7.3: Cisco
• 7.4: Ranovus
• 7.5: Intel