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市場調查報告書
商品編碼
1873409
EEPROM晶片-全球市場佔有率和排名、總收入和需求預測(2025-2031年)EEPROM Chips - Global Market Share and Ranking, Overall Sales and Demand Forecast 2025-2031 |
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2024年全球EEPROM晶片市場規模預計為10.16億美元,預計到2031年將成長至17.72億美元,2025年至2031年的複合年成長率為8.5%。
本報告從跨境產業佈局、資本配置模式、區域經濟相互依存以及供應鏈重組等方面,對近期針對 EEPROM 晶片的關稅調整和國際戰略反制措施進行了全面評估。
EEPROM(電可擦可程式唯讀記憶體)是一種使用者可修改的唯讀記憶體(ROM),可以透過施加高於正常電壓的方式重複擦除和重新編程(寫入)。 EEPROM晶片必須完全擦除和重新編程,不能選擇性擦除和重新編程,且其使用壽命有限,通常只有數萬到數十萬次的可程式設計循環。由於EEPROM在電腦使用過程中經常需要重新編程,因此其使用壽命是設計中的重要考慮因素。
EEPROM 是 Electrically 可程式設計)的縮寫,它是一種可重寫的存儲晶片或存儲組件,即使斷電也能保留存儲的資訊,被稱為非揮發性記憶體。
由於其低功耗、非揮發性儲存和高可靠性等優勢,EEPROM晶片已成為眾多產業不可或缺的核心元件。其應用範圍將持續擴展,涵蓋消費性電子、汽車、工業、物聯網、醫療、家電和通訊等眾多領域。隨著技術的進步,尤其是在整合和安全方面的提升,市場前景預計將保持穩定成長。隨著汽車智慧化和電氣化進程的加速、ADAS應用的廣泛普及以及車載攝影機數量的不斷增加,EEPROM在汽車領域的應用顯著成長,其應用範圍進一步擴展至ADAS、智慧駕駛座、智慧連網、3E系統、開關微型馬達、底盤和變速箱等領域。這推動了每輛車EEPROM需求的快速成長。預計到2024年,EEPROM在汽車產業的營收佔有率將達到約14%,未來幾年的複合年成長率約為17.02%。
就消費而言,中國目前是全球最大的消費市場,預計到2024年將佔52.4%的銷售市場佔有率,其次是北美和歐洲,分別佔10.5%和8.2%。未來幾年,在物聯網、智慧家庭、新能源汽車、5G通訊、工業4.0和智慧製造等產業的推動下,中國有望成為成長最快的市場,2025年至2031年的複合年成長率約為14.62%。
就產量而言,中國和東南亞是主要的生產地區,2024年分別佔市場佔有率的47.5%和35.5%。預計中國在未來幾年將維持最高的成長率,到2031年將達到市佔率的61.8%。
從製造商的角度來看,全球領先的EEPROM晶片製造商包括意法半導體(STMicroelectronics)、微芯科技(Microchip Technology)、巨科半導體(Giantec Semiconductor)、安森美半導體(ON Semiconductor)、艾博瑞克(Abric)、普旦亞半導體(PouzFuya S藥)複音半導體(A藥葉) Microelectronics)、瑞薩電子(Renesas Electronics)、羅姆半導體(ROHM Semiconductor)、上海百靈半導體(Shanghai Belling)、華虹半導體(Huahong Semiconductor)、弗里蒙特微裝置(FMD)、亞德諾半導體(Ananalogces)、H圳nanalogces(FMD)。 Chip)和武漢鑫源半導體(Wuhan Xinyuan Semiconductor)。截至2024年,全球頂級製造商主要是意法半導體和微芯科技,約佔51%的市場佔有率。第二梯隊製造商包括巨辰半導體(Juchen Semiconductor)、安森美半導體(ON Semiconductor)、艾博瑞克(Abric)、普蘭半導體(Praan Semiconductor)、復旦微電子(Fudan Microelectronics)、瑞薩電子(Renesas Electronics)、百靈半導體(上海)導體半導體(上海)導體半導體(上海)導體半導體(Shangul)。 Belling)與華虹半導體(Huahong Semiconductor),總合佔41%的市佔率。預計未來幾年,該行業的競爭將更加激烈,尤其是在中國市場。
未來EEPROM晶片市場的主要發展趨勢與成長點:
1. 物聯網 (IoT) 和智慧型裝置的快速發展是推動 EEPROM 晶片需求成長的關鍵因素。隨著智慧家庭、智慧城市和穿戴式裝置等物聯網產品的普及,對小型化、低功耗和高可靠性儲存晶片的需求持續成長,尤其是在感測器資料儲存和裝置配置領域。
2. 汽車電子產業的擴張,特別是自動駕駛技術、車載資訊娛樂系統和電動車(EV)的發展,顯示未來對EEPROM晶片的需求將持續成長。汽車對低功耗和大容量資料儲存的需求將成為市場成長的關鍵推動力。
3. 高密度和低耗電量
隨著積體電路技術的進步,EEPROM晶片的儲存密度不斷提高,而功耗卻持續降低。未來,為了滿足日益成長的資料儲存需求,EEPROM將實現更高的儲存容量和更低的功耗。低功耗和小尺寸將成為重要的設計因素,尤其是在嵌入式應用中。
4. 整合和多功能性
多功能整合將是EEPROM未來發展的關鍵趨勢。越來越多的EEPROM晶片將整合更多功能,例如更高的讀寫速度、內建加密功能、耐高溫性能以及更寬的工作電壓範圍。整合度的提高不僅有助於降低成本,還能減少基板面積佔用並提高產品可靠性。
5. 3D儲存技術的應用
先進的儲存技術,例如3D NAND,正在逐步佔領市場。這些技術目前已應用於傳統儲存設備(例如快閃記憶體和固態硬碟),但它們也可能對EEPROM晶片的設計和製造產生影響。 3D堆疊技術有望實現更高的儲存密度和更低的功耗。
6. 加強安全和加密要求
隨著網路安全和資料隱私問題日益嚴峻,EEPROM未來將更加重視資料保護和加密功能。例如,在金融支付、智慧卡和物聯網等應用中,整合硬體加密模組的EEPROM晶片有望湧現,以確保資料安全。
7. 與替代技術的競爭
隨著快閃記憶體和磁阻隨機存取記憶體(MRAM)等新型儲存技術的發展,EEPROM晶片可能會面臨一定的市場競爭。特別是MRAM和閃存,在速度和儲存密度方面具有優勢。然而,由於其較長的擦寫壽命和小型化特性,EEPROM在許多特定應用中仍然佔著不可替代的地位。
本報告旨在依地區/國家、類型和應用對全球 EEPROM 晶片市場進行全面分析,重點關注總銷售量、收入、價格、市場佔有率和主要企業的排名。
本報告以銷售量(百萬片)和收入(百萬美元)為單位,對EEPROM晶片市場規模、估算和預測進行了呈現,以2024年為基準年,並涵蓋了2020年至2031年的歷史數據和預測數據。透過定量和定性分析,我們幫助讀者制定業務/成長策略、評估市場競爭、分析自身在當前市場中的地位,並就EEPROM晶片做出明智的商業決策。
市場區隔
公司
依類型分類的細分市場
應用領域
依地區
The global market for EEPROM Chips was estimated to be worth US$ 1016 million in 2024 and is forecast to a readjusted size of US$ 1772 million by 2031 with a CAGR of 8.5% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on EEPROM Chips cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
EEPROM (electrically erasable programmable read-only memory) is user-modifiable read-only memory (ROM) that can be erased and reprogrammed (written to) repeatedly through the application of higher than normal electrical voltage. An EEPROM chip has to be erased and reprogrammed in its entirety, not selectively. It also has a limited life - that is, the number of times it can be reprogrammed is limited to tens or hundreds of thousands of times. In an EEPROM that is frequently reprogrammed while the computer is in use, the life of the EEPROM can be an important design consideration.
EEPROM is the abbreviation of Electrically Erasable Programmable Read-Only Memory. It is a rewritable memory chip or memory component that can still retain the stored information in the absence of power. This is called non-volatile memory.
Due to its advantages such as low power consumption, non-volatile storage, and high reliability, EEPROM chips have become an indispensable core component in many industries. In many fields such as consumer electronics, automobiles, industry, the Internet of Things, medical care, home appliances, and communications, the application of EEPROM chips will continue to expand. With the advancement of technology, especially the improvement of integration and safety, its market prospects will continue to maintain strong growth. With the acceleration of the process of automobile intelligence and electrification, the more popularization of ADAS applications, and the increase in the number of on-board cameras, the use of automotive EEPROM is increasing significantly, and the application scope of automotive EEPROM has also been further expanded to ADAS, smart cockpits, smart networking, three-electric systems, switch micromotors, chassis transmission, etc., driving the rapid increase in the demand for EEPROM per vehicle. The automotive industry will have a sales share of approximately 14% in 2024, and a CAGR of approximately 17.02% in the next few years.
In terms of consumption, China is currently the world's largest consumer market, accounting for 52.4% of the sales market share in 2024, followed by North America and Europe, accounting for 10.5% and 8.2% respectively. In the next few years, driven by industries such as the Internet of Things (IoT), smart homes, new energy vehicles, 5G communications, Industry 4.0 and smart manufacturing, China is expected to grow the fastest, with a CAGR of approximately 14.62% during 2025-2031.
From the production side, China and Southeast Asia are two important production regions, accounting for 47.5% and 35.5% of the market share in 2024 respectively. It is expected that China will maintain the fastest growth rate in the next few years, and its share is expected to reach 61.8% in 2031.
From the perspective of manufacturers, the core EEPROM chip manufacturers worldwide mainly include STMicroelectronics, Microchip Technology, Giantec Semiconductor, onsemi, ABLIC, Puya Semiconductor, Fudan Microelectronics, Renesas Electronics, ROHM Semiconductor, Shanghai Belling, Hua Hong Semiconductor, Fremont Micro Devices (FMD), Analog Devices, NXP, Shenzhen Hangshun Chip, Wuhan Xinyuan Semiconductor, etc. In 2024, the world's first-tier manufacturers mainly include STMicroelectronics and Microchip Technology, and the first-tier manufacturers account for about 51% of the market share; the second-tier manufacturers include Juchen Semiconductor, ON Semiconductor, ABLIC, Puran Semiconductor, Fudan Microelectronics, Renesas Electronics, Rohm Semiconductor, Shanghai Belling, Huahong Semiconductor, etc., with a total share of 41%. It is expected that industry competition will become more intense in the next few years, especially in the Chinese market.
The main development trends and growth points of the future market of EEPROM chips:
1. The rapid development of the Internet of Things (IoT) and smart devices is an important factor driving the growth of EEPROM chip demand. With the popularity of IoT products such as smart homes, smart cities, and wearable devices, the demand for small, low-power, and highly reliable memory chips continues to rise, especially in the fields of sensor data storage and device configuration.
2. The expansion of the automotive electronics field, especially the development of autonomous driving, in-vehicle infotainment systems, and electric vehicles (EVs), indicates that the demand for EEPROM chips will continue to rise. The demand for low power consumption and high data storage in automobiles will become an important driving force for market growth.
3. Higher density and lower power consumption
With the advancement of integrated circuit technology, the storage density of EEPROM chips continues to increase, and power consumption continues to decrease. In the future, EEPROM will achieve higher storage capacity and lower current consumption to meet the growing demand for data storage. Especially in embedded applications, low power consumption and small size will become important design considerations.
4. Integration and multifunctionality
Multifunctional integration will be an important trend in the future development of EEPROM. More and more EEPROM chips will integrate more functions, such as enhanced read and write speeds, built-in encryption, high temperature resistance, and a wide voltage operating range. The increase in integration not only helps to reduce costs, but also reduces circuit board area and improves product reliability.
5. Application of 3D storage technology
3D NAND and other advanced storage technologies are gradually entering the market. Although these technologies have been applied in traditional storage fields (such as Flash and SSD), they may also affect the design and manufacture of EEPROM chips. Through 3D stacking technology, higher storage density and lower power consumption can be achieved.
6. Increased security and encryption requirements
With the increasing severity of network security and data privacy issues, EEPROM will place more emphasis on data protection and encryption functions in the future. For example, some EEPROM chips will integrate hardware encryption modules to ensure data security, especially in applications such as financial payments, smart cards, and the Internet of Things.
7. Competition from alternative technologies
With the development of new storage technologies such as Flash storage and MRAM (magnetoresistive random access memory), EEPROM chips may face certain market competition. In particular, MRAM and Flash storage have certain advantages in terms of high speed and higher storage density. However, EEPROM still occupies an irreplaceable position in many specific applications due to its stronger erase and write life and miniaturization characteristics.
This report aims to provide a comprehensive presentation of the global market for EEPROM Chips, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of EEPROM Chips by region & country, by Type, and by Application.
The EEPROM Chips market size, estimations, and forecasts are provided in terms of sales volume (Million Pcs) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding EEPROM Chips.
Market Segmentation
By Company
Segment by Type
Segment by Application
By Region
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of EEPROM Chips manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of EEPROM Chips in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of EEPROM Chips in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.