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市場調查報告書
商品編碼
1786537

全球中介層和扇出型晶圓級封裝 (WLP) 市場：產業分析、規模、佔有率、成長、趨勢和預測（2025-2032年）

Interposer and Fan-out WLP Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2025 - 2032
出版日期: | 出版商: Persistence Market Research | 英文 198 Pages | 商品交期: 2-5個工作天內

價格
簡介目錄

預計2025年全球中介層和扇出型 WLP 市場價值將達到 244億美元，到2032年將達到 1,016億美元，2025-2032年的年複合成長率為 22.6%。

中介層和扇出晶圓級構裝（WLP）技術革新半導體封裝，它們能夠實現高性能、高 I/O 密度和小尺寸。這些先進的封裝解決方案廣泛應用於行動裝置、高效能運算（HPC）、汽車電子產品和資料中心等高階應用。中介層技術作為矽晶片和基板之間的橋樑，促進了 2.5D 和 3D 整合，而扇出型 WLP 則完全消除了對基板的需求，提高了電氣性能並實現了微型化。該市場面向整合設備製造商（IDM）、外包半導體組裝和測試（OSAT）供應商以及代工廠，在成本效率和系統性能方面具有顯著優勢。

市場成長動力：

全球中介層和扇出型晶圓級封裝（WLP）市場受多種關鍵因素驅動，其中包括對小型、高速和節能電子設備日益成長的需求。人工智慧、物聯網和 5G 技術的發展需要能夠適應更高頻寬和散熱性能的先進封裝解決方案。此外，汽車和工業自動化系統中電子產品整合度的不斷提高，也推動了對堅固可靠的晶片封裝的需求。此外，克服莫耳定律限制的需求加速向異質整合的轉變，並推動中介層和扇出型封裝技術的採用。邊緣運算、穿戴式科技和消費性電子產品的擴張進一步增強了市場前景。

市場限制：

儘管成長條件良好，中介層和扇出型晶圓級封裝（WLP）市場仍面臨高額初始投資和複雜製造流程的挑戰。高密度中介層的製造和扇出型晶圓級封裝（WLP）的精確對準需要先進的製造基礎設施和熟練的勞動力，這限制了小型製造商的產量比率。此外，大批量生產的良率問題以及與舊有系統整合的困難也構成了重大障礙。封裝平台缺乏標準化以及供應鏈中斷也阻礙了不同應用程式和最終用戶細分市場之間的擴充性和一致性。

市場機會：

由於半導體元件架構的不斷進步、封裝研發投入的不斷增加以及對多晶片整合的需求不斷成長，中介層和扇出型晶圓級封裝（WLP）市場提供了巨大的成長機會。主動中介層、矽橋和扇出系統級封裝（SiP）解決方案的開發將為下一代晶片封裝創新鋪平道路。人工智慧、自動駕駛汽車和 6G通訊等新興應用預計將進一步加速其應用。 OSAT、代工廠和設計工作室之間的合作有望打造一個經濟高效且可擴展的封裝生態系統。在強大的電子製造能力的推動下，亞太地區的擴張為市場滲透和產生收入提供了良好的機會。

本報告研究了全球中介層和扇出型 WLP 市場，提供依封裝技術、應用、最終用戶行業和地理的趨勢，參與市場的公司概況。

目錄

第1章 執行摘要

第2章 市場概述

  • 市場範圍和定義
  • 價值鏈分析
  • 宏觀經濟因素
  • 預測因子 - 相關性和影響力
  • COVID-19影響評估
  • PESTLE分析
  • 波特五力分析
  • 地緣政治緊張局勢：市場影響
  • 監管和技術格局

第3章 市場動態

  • 促進因素
  • 抑制因素
  • 機會
  • 趨勢

第4章 2019-2032年價格趨勢分析

  • 區域價格分析
  • 依細分市場定價
  • 價格影響因素

第5章 全球中介層與扇出型 WLP 市場展望：實績（2019-2024年）與預測（2025-2032年）

  • 主要亮點
  • 全球中介層與扇出型晶圓級封裝（WLP）市場展望（依封裝技術）
    • 簡介/主要調查結果
    • 2019-2024年市場規模趨勢分析（十億美元）（依封裝技術）
    • 2025-2032年市場預測（十億美元）（依封裝技術）
      • 穿透矽通孔
      • 中介層
      • 扇出型晶圓級封裝
    • 包裝技術市場吸引力分析
  • 全球中介層與扇出型晶圓級封裝（WLP）市場展望（依應用）
  • 簡介/主要調查結果
  • 2019-2024年市場規模趨勢分析（十億美元）（依應用）
  • 2025-2032年當前市場規模預測（十億美元）（依應用）
    • 邏輯
    • 成像與光電子
    • 記憶
    • MEMS/感測器
    • LED
    • 電源類比和混合訊號、射頻、光電
  • 市場吸引力分析：依應用
  • 全球中介層與扇出型晶圓級封裝（WLP）市場前景（依最終用戶產業）
    • 簡介/主要調查結果
    • 2019-2024年市場規模趨勢分析（十億美元）（依最終用戶產業）
    • 2025-2032年當前市場規模預測（十億美元）（依最終用戶產業）
      • 家電
      • 通訊
      • 工業部門
      • 車輛
      • 軍事/航太
      • 智慧科技
      • 醫療設備
    • 市場吸引力分析（依最終用戶產業）

    第6章 全球中介層與扇出型晶圓級封裝（WLP）市場展望：依地區

    • 主要亮點
    • 2019-2024年市場規模趨勢分析（十億美元）：依地區
    • 2025-2032年市場規模預測（十億美元）：依地區
      • 北美洲
      • 歐洲
      • 東亞
      • 南亞和大洋洲
      • 拉丁美洲
      • 中東和非洲
    • 市場吸引力分析：依地區

    第7章 北美中介層和扇出型晶圓級封裝（WLP）市場展望：實績（2019-2024年）和預測（2025-2032年）

    第8章 歐洲中介層與扇出型WLP市場展望：實績（2019-2024年）與預測（2025-2032年）

    第9章 東亞中介層和扇出型 WLP 市場展望：實績（2019-2024年）和預測（2025-2032年）

    第10章 南亞和大洋洲中介層和扇出型 WLP 市場展望：實績（2019-2024年）和預測（2025-2032年）

    第11章 拉丁美洲中介層和扇出型 WLP 市場展望：實績（2019-2024年）和預測（2025-2032年）

    第12章 中東和非洲中介層和扇出型 WLP 市場展望：實績（2019-2024年）和預測（2025-2032年）

    第13章 競爭格局

    • 2025年市場佔有率分析
    • 市場結構
    • 公司簡介
      • Taiwan Semiconductor Manufacturing
      • Samsung Electronics
      • Toshiba Corp.
      • ASE
      • Qualcomm Incorporated
      • Texas Instruments
      • Amkor Technology
      • United Microelectronics
      • STMicroelectronics
      • Broadcom Ltd.
      • Intel Corporation
      • Infineon Technologies AG

    第14章 附錄

    • 簡介目錄
    Product Code: PMRREP33480

    Persistence Market Research has recently released a comprehensive report on the worldwide market for Interposer and Fan-out WLP. The report offers a thorough assessment of crucial market dynamics, including drivers, trends, opportunities, and challenges, providing detailed insights into the market structure.

    Key Insights:

    • Interposer and Fan-out WLP Market Size (2025E): USD 24.4 Billion
    • Projected Market Value (2032F): USD 101.6 Billion
    • Global Market Growth Rate (CAGR 2025 to 2032): 22.6%

    Interposer and Fan-out WLP Market - Report Scope:

    Interposer and Fan-out Wafer-Level Packaging (WLP) technologies are revolutionizing semiconductor packaging by enabling higher performance, greater I/O density, and reduced form factors. These advanced packaging solutions are widely adopted in high-end applications such as mobile devices, high-performance computing (HPC), automotive electronics, and data centers. Interposer technology facilitates 2.5D and 3D integration by acting as a bridge between silicon chips and substrates, while fan-out WLP eliminates the need for a substrate altogether, enhancing electrical performance and miniaturization. This market caters to integrated device manufacturers (IDMs), outsourced semiconductor assembly and test (OSAT) providers, and foundries, offering critical advantages in cost efficiency and system performance.

    Market Growth Drivers:

    The global Interposer and Fan-out WLP market is propelled by several key factors, including the rising demand for compact, high-speed, and energy-efficient electronic devices. The growth in AI, IoT, and 5G technologies requires advanced packaging solutions capable of handling higher bandwidths and thermal performance. Moreover, the increasing integration of electronics in automotive and industrial automation systems drives demand for robust and reliable chip packaging. Additionally, the need to overcome the limitations of Moore's Law has accelerated the shift toward heterogeneous integration, boosting adoption of interposer and fan-out packaging methods. The expansion of edge computing, wearable technologies, and consumer electronics further strengthens the market outlook.

    Market Restraints:

    Despite favorable growth conditions, the Interposer and Fan-out WLP market faces challenges related to high initial investment and complex manufacturing processes. The production of high-density interposers and the precise alignment in fan-out WLP require advanced fabrication infrastructure and skilled labor, limiting accessibility for small-scale manufacturers. Additionally, yield concerns in high-volume production and the difficulty of integration with legacy systems pose significant barriers. The lack of standardization across packaging platforms and supply chain disruptions also hinder scalability and consistency across different applications and end-user sectors.

    Market Opportunities:

    The Interposer and Fan-out WLP market presents significant growth opportunities driven by continued advancements in semiconductor device architecture, increased investment in packaging R\&D, and rising demand for multi-die integration. The development of active interposers, silicon bridges, and fan-out system-in-package (SiP) solutions opens new avenues for innovation in next-generation chip packaging. Emerging applications in artificial intelligence, autonomous vehicles, and 6G communications will further accelerate adoption. Collaborations among OSATs, foundries, and design houses are expected to result in cost-efficient, scalable packaging ecosystems. Expansion in the Asia Pacific region, driven by strong electronics manufacturing capabilities, offers promising opportunities for market penetration and revenue generation.

    Key Questions Answered in the Report:

    • What are the primary factors driving the growth of the Interposer and Fan-out WLP market globally?
    • Which applications and end-user sectors are leading the adoption of advanced packaging technologies?
    • How are innovations in wafer-level packaging reshaping the semiconductor value chain?
    • Who are the major players in the market and what strategic moves are shaping the competitive landscape?
    • What future trends and technological developments will influence the Interposer and Fan-out WLP market?

    Competitive Intelligence and Business Strategy:

    These companies invest in cutting-edge packaging solutions such as InFO (Integrated Fan-Out), CoWoS (Chip-on-Wafer-on-Substrate), and SiP for enhanced performance and integration. Collaborations with major fabless semiconductor firms and system OEMs facilitate early design adoption and ecosystem alignment. Moreover, investment in advanced packaging fabs and AI-driven process control technologies helps improve yield and production efficiency, supporting long-term market scalability.

    Key Companies Profiled:

    • Taiwan Semiconductor Manufacturing
    • Samsung Electronics
    • Toshiba Corp
    • ASE
    • Qualcomm Incorporated
    • Texas Instruments
    • Amkor Technology
    • Value (US$ Billion) Microelectronics
    • STMicroelectronics
    • Broadcom Ltd.
    • Intel Corporation
    • Infenion Technologies AG

    Interposer and Fan-out WLP Market Research Segmentation:

    By Packaging Technology:

    • Through-silicon Vias
    • Interposers
    • Fan-out Wafer-level Packaging

    By Application:

    • Logic
    • Imaging & Optoelectronics
    • Memory
    • MEMS/sensors
    • LED
    • Power Analog & Mixed Signal, RF, Photonics

    By End-User Industry:

    • Consumer Electronics
    • Telecommunication
    • Industrial Sector
    • Automotive
    • Military & Aerospace
    • Smart Technologies
    • Medical Devices

    By Region:

    • North America
    • Latin America
    • Europe
    • Asia Pacific
    • Middle East and Africa

    Table of Contents

    1. Executive Summary

    • 1.1. Global Interposer and Fan-out WLP Market Snapshot 2025 and 2032
    • 1.2. Market Opportunity Assessment, 2025-2032, US$ Bn
    • 1.3. Key Market Trends
    • 1.4. Industry Developments and Key Market Events
    • 1.5. Demand Side and Supply Side Analysis
    • 1.6. PMR Analysis and Recommendations

    2. Market Overview

    • 2.1. Market Scope and Definitions
    • 2.2. Value Chain Analysis
    • 2.3. Macro-Economic Factors
      • 2.3.1. Global GDP Outlook
      • 2.3.2. Global GDP Outlook
      • 2.3.3. Global economic Growth Forecast
      • 2.3.4. Global Urbanization Growth
      • 2.3.5. Other Macro-economic Factors
    • 2.4. Forecast Factors - Relevance and Impact
    • 2.5. COVID-19 Impact Assessment
    • 2.6. PESTLE Analysis
    • 2.7. Porter's Five Forces Analysis
    • 2.8. Geopolitical Tensions: Market Impact
    • 2.9. Regulatory and Technology Landscape

    3. Market Dynamics

    • 3.1. Drivers
    • 3.2. Restraints
    • 3.3. Opportunities
    • 3.4. Trends

    4. Price Trend Analysis, 2019-2032

    • 4.1. Region-wise Price Analysis
    • 4.2. Price by Segments
    • 4.3. Price Impact Factors

    5. Global Interposer and Fan-out WLP Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

    • 5.1. Key Highlights
    • 5.2. Global Interposer and Fan-out WLP Market Outlook: Packaging Technology
      • 5.2.1. Introduction/Key Findings
      • 5.2.2. Historical Market Size (US$ Bn) Analysis by Packaging Technology, 2019-2024
      • 5.2.3. Current Market Size (US$ Bn) Forecast, by Packaging Technology, 2025-2032
        • 5.2.3.1. Through-silicon Vias
        • 5.2.3.2. Interposers
        • 5.2.3.3. Fan-out Wafer-level Packaging
      • 5.2.4. Market Attractiveness Analysis: Packaging Technology
    • 5.3. Global Interposer and Fan-out WLP Market Outlook: Application
      • 5.3.1. Introduction/Key Findings
      • 5.3.2. Historical Market Size (US$ Bn) Analysis by Application, 2019-2024
      • 5.3.3. Current Market Size (US$ Bn) Forecast, by Application, 2025-2032
        • 5.3.3.1. Logic
        • 5.3.3.2. Imaging & Optoelectronics
        • 5.3.3.3. Memory
        • 5.3.3.4. MEMS/sensors
        • 5.3.3.5. LED
        • 5.3.3.6. Power Analog & Mixed Signal, RF, Photonics
      • 5.3.4. Market Attractiveness Analysis: Application
    • 5.4. Global Interposer and Fan-out WLP Market Outlook: End-User Industry
      • 5.4.1. Introduction/Key Findings
      • 5.4.2. Historical Market Size (US$ Bn) Analysis by End-User Industry, 2019-2024
      • 5.4.3. Current Market Size (US$ Bn) Forecast, by End-User Industry, 2025-2032
        • 5.4.3.1. Consumer Electronics
        • 5.4.3.2. Telecommunication
        • 5.4.3.3. Industrial Sector
        • 5.4.3.4. Automotive
        • 5.4.3.5. Military & Aerospace
        • 5.4.3.6. Smart Technologies
        • 5.4.3.7. Medical Devices
      • 5.4.4. Market Attractiveness Analysis: End-User Industry

    6. Global Interposer and Fan-out WLP Market Outlook: Region

    • 6.1. Key Highlights
    • 6.2. Historical Market Size (US$ Bn) Analysis by Region, 2019-2024
    • 6.3. Current Market Size (US$ Bn) Forecast, by Region, 2025-2032
      • 6.3.1. North America
      • 6.3.2. Europe
      • 6.3.3. East Asia
      • 6.3.4. South Asia & Oceania
      • 6.3.5. Latin America
      • 6.3.6. Middle East & Africa
    • 6.4. Market Attractiveness Analysis: Region

    7. North America Interposer and Fan-out WLP Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

    • 7.1. Key Highlights
    • 7.2. Pricing Analysis
    • 7.3. North America Market Size (US$ Bn) Forecast, by Country, 2025-2032
      • 7.3.1. U.S.
      • 7.3.2. Canada
    • 7.4. North America Market Size (US$ Bn) Forecast, by Packaging Technology, 2025-2032
      • 7.4.1. Through-silicon Vias
      • 7.4.2. Interposers
      • 7.4.3. Fan-out Wafer-level Packaging
    • 7.5. North America Market Size (US$ Bn) Forecast, by Application, 2025-2032
      • 7.5.1. Logic
      • 7.5.2. Imaging & Optoelectronics
      • 7.5.3. Memory
      • 7.5.4. MEMS/sensors
      • 7.5.5. LED
      • 7.5.6. Power Analog & Mixed Signal, RF, Photonics
    • 7.6. North America Market Size (US$ Bn) Forecast, by End-User Industry, 2025-2032
      • 7.6.1. Consumer Electronics
      • 7.6.2. Telecommunication
      • 7.6.3. Industrial Sector
      • 7.6.4. Automotive
      • 7.6.5. Military & Aerospace
      • 7.6.6. Smart Technologies
      • 7.6.7. Medical Devices

    8. Europe Interposer and Fan-out WLP Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

    • 8.1. Key Highlights
    • 8.2. Pricing Analysis
    • 8.3. Europe Market Size (US$ Bn) Forecast, by Country, 2025-2032
      • 8.3.1. Germany
      • 8.3.2. Italy
      • 8.3.3. France
      • 8.3.4. U.K.
      • 8.3.5. Spain
      • 8.3.6. Russia
      • 8.3.7. Rest of Europe
    • 8.4. Europe Market Size (US$ Bn) Forecast, by Packaging Technology, 2025-2032
      • 8.4.1. Through-silicon Vias
      • 8.4.2. Interposers
      • 8.4.3. Fan-out Wafer-level Packaging
    • 8.5. Europe Market Size (US$ Bn) Forecast, by Application, 2025-2032
      • 8.5.1. Logic
      • 8.5.2. Imaging & Optoelectronics
      • 8.5.3. Memory
      • 8.5.4. MEMS/sensors
      • 8.5.5. LED
      • 8.5.6. Power Analog & Mixed Signal, RF, Photonics
    • 8.6. Europe Market Size (US$ Bn) Forecast, by End-User Industry, 2025-2032
      • 8.6.1. Consumer Electronics
      • 8.6.2. Telecommunication
      • 8.6.3. Industrial Sector
      • 8.6.4. Automotive
      • 8.6.5. Military & Aerospace
      • 8.6.6. Smart Technologies
      • 8.6.7. Medical Devices

    9. East Asia Interposer and Fan-out WLP Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

    • 9.1. Key Highlights
    • 9.2. Pricing Analysis
    • 9.3. East Asia Market Size (US$ Bn) Forecast, by Country, 2025-2032
      • 9.3.1. China
      • 9.3.2. Japan
      • 9.3.3. South Korea
    • 9.4. East Asia Market Size (US$ Bn) Forecast, by Packaging Technology, 2025-2032
      • 9.4.1. Through-silicon Vias
      • 9.4.2. Interposers
      • 9.4.3. Fan-out Wafer-level Packaging
    • 9.5. East Asia Market Size (US$ Bn) Forecast, by Application, 2025-2032
      • 9.5.1. Logic
      • 9.5.2. Imaging & Optoelectronics
      • 9.5.3. Memory
      • 9.5.4. MEMS/sensors
      • 9.5.5. LED
      • 9.5.6. Power Analog & Mixed Signal, RF, Photonics
    • 9.6. East Asia Market Size (US$ Bn) Forecast, by End-User Industry, 2025-2032
      • 9.6.1. Consumer Electronics
      • 9.6.2. Telecommunication
      • 9.6.3. Industrial Sector
      • 9.6.4. Automotive
      • 9.6.5. Military & Aerospace
      • 9.6.6. Smart Technologies
      • 9.6.7. Medical Devices

    10. South Asia & Oceania Interposer and Fan-out WLP Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

    • 10.1. Key Highlights
    • 10.2. Pricing Analysis
    • 10.3. South Asia & Oceania Market Size (US$ Bn) Forecast, by Country, 2025-2032
      • 10.3.1. India
      • 10.3.2. Southeast Asia
      • 10.3.3. ANZ
      • 10.3.4. Rest of SAO
    • 10.4. South Asia & Oceania Market Size (US$ Bn) Forecast, by Packaging Technology, 2025-2032
      • 10.4.1. Through-silicon Vias
      • 10.4.2. Interposers
      • 10.4.3. Fan-out Wafer-level Packaging
    • 10.5. South Asia & Oceania Market Size (US$ Bn) Forecast, by Application, 2025-2032
      • 10.5.1. Logic
      • 10.5.2. Imaging & Optoelectronics
      • 10.5.3. Memory
      • 10.5.4. MEMS/sensors
      • 10.5.5. LED
      • 10.5.6. Power Analog & Mixed Signal, RF, Photonics
    • 10.6. South Asia & Oceania Market Size (US$ Bn) Forecast, by End-User Industry, 2025-2032
      • 10.6.1. Consumer Electronics
      • 10.6.2. Telecommunication
      • 10.6.3. Industrial Sector
      • 10.6.4. Automotive
      • 10.6.5. Military & Aerospace
      • 10.6.6. Smart Technologies
      • 10.6.7. Medical Devices

    11. Latin America Interposer and Fan-out WLP Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

    • 11.1. Key Highlights
    • 11.2. Pricing Analysis
    • 11.3. Latin America Market Size (US$ Bn) Forecast, by Country, 2025-2032
      • 11.3.1. Brazil
      • 11.3.2. Mexico
      • 11.3.3. Rest of LATAM
    • 11.4. Latin America Market Size (US$ Bn) Forecast, by Packaging Technology, 2025-2032
      • 11.4.1. Through-silicon Vias
      • 11.4.2. Interposers
      • 11.4.3. Fan-out Wafer-level Packaging
    • 11.5. Latin America Market Size (US$ Bn) Forecast, by Application, 2025-2032
      • 11.5.1. Logic
      • 11.5.2. Imaging & Optoelectronics
      • 11.5.3. Memory
      • 11.5.4. MEMS/sensors
      • 11.5.5. LED
      • 11.5.6. Power Analog & Mixed Signal, RF, Photonics
    • 11.6. Latin America Market Size (US$ Bn) Forecast, by End-User Industry, 2025-2032
      • 11.6.1. Consumer Electronics
      • 11.6.2. Telecommunication
      • 11.6.3. Industrial Sector
      • 11.6.4. Automotive
      • 11.6.5. Military & Aerospace
      • 11.6.6. Smart Technologies
      • 11.6.7. Medical Devices

    12. Middle East & Africa Interposer and Fan-out WLP Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

    • 12.1. Key Highlights
    • 12.2. Pricing Analysis
    • 12.3. Middle East & Africa Market Size (US$ Bn) Forecast, by Country, 2025-2032
      • 12.3.1. GCC Countries
      • 12.3.2. South Africa
      • 12.3.3. Northern Africa
      • 12.3.4. Rest of MEA
    • 12.4. Middle East & Africa Market Size (US$ Bn) Forecast, by Packaging Technology, 2025-2032
      • 12.4.1. Through-silicon Vias
      • 12.4.2. Interposers
      • 12.4.3. Fan-out Wafer-level Packaging
    • 12.5. Middle East & Africa Market Size (US$ Bn) Forecast, by Application, 2025-2032
      • 12.5.1. Logic
      • 12.5.2. Imaging & Optoelectronics
      • 12.5.3. Memory
      • 12.5.4. MEMS/sensors
      • 12.5.5. LED
      • 12.5.6. Power Analog & Mixed Signal, RF, Photonics
    • 12.6. Middle East & Africa Market Size (US$ Bn) Forecast, by End-User Industry, 2025-2032
      • 12.6.1. Consumer Electronics
      • 12.6.2. Telecommunication
      • 12.6.3. Industrial Sector
      • 12.6.4. Automotive
      • 12.6.5. Military & Aerospace
      • 12.6.6. Smart Technologies
      • 12.6.7. Medical Devices

    13. Competition Landscape

    • 13.1. Market Share Analysis, 2025
    • 13.2. Market Structure
      • 13.2.1. Competition Intensity Mapping
      • 13.2.2. Competition Dashboard
    • 13.3. Company Profiles
      • 13.3.1. Taiwan Semiconductor Manufacturing
        • 13.3.1.1. Company Overview
        • 13.3.1.2. Product Portfolio/Offerings
        • 13.3.1.3. Key Financials
        • 13.3.1.4. SWOT Analysis
        • 13.3.1.5. Company Strategy and Key Developments
      • 13.3.2. Samsung Electronics
      • 13.3.3. Toshiba Corp.
      • 13.3.4. ASE
      • 13.3.5. Qualcomm Incorporated
      • 13.3.6. Texas Instruments
      • 13.3.7. Amkor Technology
      • 13.3.8. United Microelectronics
      • 13.3.9. STMicroelectronics
      • 13.3.10. Broadcom Ltd.
      • 13.3.11. Intel Corporation
      • 13.3.12. Infineon Technologies AG

    14. Appendix

    • 14.1. Research Methodology
    • 14.2. Research Assumptions
    • 14.3. Acronyms and Abbreviations