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半導體生產設備

市場調查報告書

商品編碼

1698481

扇出型封裝市場：2025-2030 年預測

Fan-Out Packaging Market - Forecasts from 2025 to 2030

出版日期: 2025年03月18日 | 出版商:

Knowledge Sourcing Intelligence | 英文 148 Pages | 商品交期: 最快1-2個工作天內

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簡介目錄

在 2022-2030 年的預測期內，扇出型封裝市場將以 9.78% 的複合年成長率成長。

任何具有從晶片表面向外展開的連接以容納更多外部 I/O 的封裝都稱為扇出型封裝。在傳統的扇出型封裝中，晶粒完全浸入環氧模塑膠中，而不是放置在基板或內插器上。它們正在迅速取代更老、更成熟的封裝層（PoP）和邏輯記憶體系統。此外，人工智慧和機器學習在多個行業中的應用日益廣泛，推動了高效能運算的採用。

市場趨勢：

ECP 技術推動扇出型封裝：預計在整個預測期內，扇出型封裝解決方案市場將受到封裝晶片封裝 (ECP) 技術整合的推動。自從網路和多媒體出現以來，透過積體電路實現電子設備的小型化已經成為現代生活的必需品。
主要特點和應用：此技術依賴巨柱鍍層和線路重布(RDL) 金屬等關鍵元素。針對應用處理器 (AP) 等高腳位應用，該公司將把 inFO-Antenna-in-Package (AiP) 和 inFO-on-Substrate 創新融入扇出型晶圓級封裝 (FO-WLP) 產品中。這些解決方案廣泛應用於汽車、伺服器、智慧型手機等領域。
亞太地區：受中國、日本、印度和韓國等經濟強國的推動，亞太地區是該市場的主要參與者。台灣是全球最大半導體製造商的所在地，推動先進封裝解決方案（尤其是 PLP）的需求。據半導體行業協會（SIA）稱，該地區佔全球半導體銷售額的 50% 以上，使台灣製造商能夠滿足日益成長的半導體需求。許多台灣公司正在擴大扇出型封裝生產，以加強出口並支持區域市場的成長。

報告中介紹的主要企業包括台積電有限公司、力成科技股份有限公司、安靠科技股份有限公司、日月光股份有限公司、INTEVAC、Camtek、恩智浦半導體、Deca Technologies、長電科技等。

本報告的主要優點

深刻分析：獲得涵蓋主要和新興地區的深入市場洞察，重點關注客戶群、政府政策和社會經濟因素、消費者偏好、垂直行業和其他子區隔。
競爭格局：了解全球主要企業所採用的策略策略，並了解正確策略帶來的潛在市場滲透。
市場趨勢和促進因素：探索動態因素和關鍵市場趨勢以及它們將如何影響市場的未來發展。
可行的建議：利用洞察力進行策略決策，在動態環境中開闢新的業務流和收益。
受眾廣泛：對於新興企業、研究機構、顧問公司、中小企業和大型企業都有益且具有成本效益。

它有什麼用途？

產業和市場考量、商業機會評估、產品需求預測、打入市場策略、地理擴張、資本支出決策、法律規範與影響、新產品開發、競爭影響

研究範圍

2022 年至 2024 年的歷史數據和 2025 年至 2030 年的預測數據
成長機會、挑戰、供應鏈前景、法律規範與趨勢分析
競爭定位、策略和市場佔有率分析
收益成長和預測分析（包括國家在內的細分市場和地區）
公司概況（策略、產品、財務資訊、主要趨勢等）

Any package with connections fanning out from the chip surface to accommodate more external I/Os is referred to as fan-out packaging. The dies are completely submerged in an epoxy mold compound with conventional fan-out packaging rather than placed on a substrate or interposer. They are rapidly replacing the older, more established package-on-package (PoP), memory-on-logic systems. Additionally, the market's adoption of high-performance computing has expanded due to the growing use of artificial intelligence and machine learning in several industries.

Market Trends:

Boost from ECP Technology in Fan-Out Packaging: The Fan-Out Packaging Solutions market is set to experience growth spurred by the integration of Encapsulated Chip Package (ECP) technology throughout the forecast period. Since the advent of the Internet and multimedia, the miniaturization of electronics through integrated circuits has become integral to modern life.
Key Features and Applications: This technology relies on critical elements like mega pillar plating and redistribution layer (RDL) metal. It targets high-pin-count applications, such as application processors (AP), with companies planning to incorporate inFO-Antenna-in-Package (AiP) and inFO-on-Substrate innovations into their Fan-Out Wafer Level Packaging (FO-WLP) offerings. These solutions are widely used in automobiles, servers, and smartphones. Additionally, firms are refining fabrication techniques for High-Density Fan-Out Wafer Level Packaging (FOWLP) to meet rising demand.
Asia-Pacific: The Asia-Pacific region, led by economic powerhouses like China, Japan, India, and South Korea, is a key player in this market. Taiwan, home to some of the world's largest semiconductor producers, drives demand for advanced packaging solutions, particularly in PLPs. According to the Semiconductor Industry Association (SIA), the region accounts for over 50% of global semiconductor sales, enabling Taiwanese manufacturers to supply FOWLP for expanding semiconductor needs. Many companies in Taiwan are ramping up fan-out packaging production, enhancing exports and supporting regional market growth.

Some of the major players covered in this report include TSMC Limited, Powertech Technology Inc, Amkor Technology Inc, ASE Inc, INTEVAC, Camtek, NXP Semiconductor, Deca Technologies, and JCET Global, among others:

Key Benefits of this Report:

Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What do businesses use our reports for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence

Report Coverage:

Historical data from 2022 to 2024 & forecast data from 2025 to 2030
Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
Competitive Positioning, Strategies, and Market Share Analysis
Revenue Growth and Forecast Assessment of segments and regions including countries
Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

Fan-Out Packaging Market Segmentation:

By Type

Core Fan-out
High-density Fan-out
Ultra-high-density Fan-out

By Carrier Size

300mm
600mm
Others

By Material Type

Substrate Materials
Encapsulation Materials
Redistribution Layer (RDL) Materials
Others

By End-User

Foundries
Integrated Device Manufacturers (IDM)
Outsourced Semiconductor Assembly and Test (OSAT)

By Region

Americas
USA
Europe, Middle East, and Africa
Germany
Netherlandss
Others
Asia Pacific
China
Japan
Taiwan
South Korea
Others

1. EXECUTIVE SUMMARY

2. MARKET SNAPSHOT

2.1. Market Overview
2.2. Market Definition
2.3. Scope of the Study
2.4. Market Segmentation

3. BUSINESS LANDSCAPE

3.1. Market Drivers
3.2. Market Restraints
3.3. Market Opportunities
3.4. Porter's Five Forces Analysis
3.5. Industry Value Chain Analysis
3.6. Policies and Regulations
3.7. Strategic Recommendations

4. TECHNOLOGICAL OUTLOOK

5. FAN-OUT PACKAGING MARKET BY TYPE

5.1. Introduction
5.2. Core Fan-out
5.3. High-density Fan-out
5.4. Ultra-high-density Fan-out

6. FAN-OUT PACKAGING MARKET BY CARRIER SIZE

6.1. Introduction
6.2. 300mm
6.3. 600mm
6.4. Others

7. FAN-OUT PACKAGING MARKET BY MATERIAL TYPE

7.1. Introduction
7.2. Substrate Materials
7.3. Encapsulation Materials
7.4. Redistribution Layer (RDL) Materials
7.5. Others

8. FAN-OUT PACKAGING MARKET BY END-USER

8.1. Introduction
8.2. Foundries
8.3. Integrated Device Manufacturers (IDM)
8.4. Outsourced Semiconductor Assembly and Test (OSAT)

9. FAN-OUT PACKAGING MARKET BY GEOGRAPHY

9.1. Introduction
9.2. Americas
- 9.2.1. USA
9.3. Europe, Middle East, and Africa
- 9.3.1. Germany
- 9.3.2. Netherlandss
- 9.3.3. Others
9.4. Asia Pacific
- 9.4.1. China
- 9.4.2. Japan
- 9.4.3. Taiwan
- 9.4.4. South Korea
- 9.4.5. Others