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市場調查報告書
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1786527

全球互連和被動元件市場：產業分析、規模、佔有率、成長、趨勢和預測（2025-2032）

Interconnects and Passive Components Market: Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2025 - 2032
出版日期: | 出版商: Persistence Market Research | 英文 198 Pages | 商品交期: 2-5個工作天內

價格
簡介目錄

預計2025年全球互連和被動元件市場價值將達到 2.241億美元，到2032年將達到 3.392億美元，預測期內（2025-2032年）的年複合成長率為 6.1%。

互連和被動元件幾乎在所有電子設備中都不可或缺，包括家用電器、汽車系統、通訊、工業機械和醫療保健設備。連接器、電纜和插座等互連元件有助於訊號和電力傳輸，而電阻器、電容器和電感器等被動元件則可調節訊號流、抑制雜訊並穩定電路。快速數位化、汽車電子元件的不斷增加以及智慧連網型設備數量的不斷增加推動著市場的發展。此外，日益小型化的趨勢、5G基礎設施的成長以及物聯網（IoT）生態系統的不斷擴展也支持了這一需求。

市場促進因素：

全球互連和被動元件市場受多種關鍵因素驅動，包括家用電子電器、智慧型手機和穿戴式裝置日益成長的需求。電動車（EV）和高級駕駛輔助系統（ADAS）的日益普及，顯著增加了對高性能元件的需求。此外，5G 部署和工業自動化帶來的通訊基礎設施的擴展將進一步推動市場需求。更小、更有效率的元件的開發，加上節能電子系統日益成長的重要性，繼續推動製造商開發下一代產品以滿足不斷變化的需求。

市場限制：

儘管預計市場將強勁成長，但也面臨許多挑戰，包括供應鏈不穩定、原料價格波動以及影響全球貿易的地緣政治緊張局勢。設計可靠、小型化且成本具有競爭力的元件的複雜性構成了技術和經濟障礙。此外，日益嚴格的環境合規監管審查（例如 RoHS 和 REACH）也可能使生產和認證流程變得複雜。這些挑戰要求企業在永續材料、高效生產技術和全球供應鏈韌性方面加大投資。

市場機會：

智慧家庭、醫療用電子設備、穿戴式健康監測、航太系統和再生能源技術等新興應用蘊藏著巨大的機會。將人工智慧（AI）和邊緣運算整合到設備中的趨勢日益成長，這需要強大的互連和高度可靠的被動元件。此外，印刷和軟性電子產品的進步為醫療診斷和物聯網設備開闢了新的可能性。策略夥伴關係、併購以及向東南亞、拉丁美洲和非洲等新興市場的擴張，為市場參與企業提供了豐厚的成長機會。

本報告研究了全球互連和被動元件市場，提供了依產品類型、應用和地區分類的趨勢，以及參與市場的公司概況。

目錄

第1章 執行摘要

第2章 市場概述

  • 市場範圍和定義
  • 價值鏈分析
  • 宏觀經濟因素
  • 預測因子 - 相關性和影響力
  • COVID-19影響評估
  • PESTLE分析
  • 波特五力分析
  • 地緣政治緊張局勢：市場影響
  • 監管和技術格局

第3章 市場動態

  • 促進因素
  • 抑制因素
  • 機會
  • 趨勢

第4章 2019-2032年價格趨勢分析

  • 區域價格分析
  • 依細分市場定價
  • 價格影響因素

第5章 全球互連與被動元件市場展望：實績（2019-2024年）與預測（2025-2032年）

  • 主要亮點
  • 全球互連和被動元件市場展望：依產品類型
    • 簡介/主要調查結果
    • 2019-2024年市場規模趨勢分析（百萬美元）：依產品類型
    • 2025-2032年當前市場規模預測（百萬美元）：依產品類型
      • 互連
      • 被動元件
    • 市場吸引力分析：依產品類型
  • 全球互連與被動元件市場展望：依應用
    • 簡介/主要調查結果
    • 2019-2024年市場規模趨勢分析（百萬美元）：依應用
    • 2025-2032年當前市場規模預測（百萬美元）：依應用
      • 家電
      • 資料處理
      • 通訊
      • 軍事/航太
      • 車輛
      • 產業
      • 衛生保健
    • 市場吸引力分析：依應用

第6章 全球互連與被動元件市場展望：依地區

  • 主要亮點
  • 2019-2024年市場規模趨勢分析（百萬美元）：依地區
  • 2025-2032年目前市場規模預測（百萬美元）：依地區
    • 北美洲
    • 歐洲
    • 東亞
    • 南亞和大洋洲
    • 拉丁美洲
    • 中東和非洲
  • 市場吸引力分析：依地區

第7章 北美互連和被動元件市場展望：實績（2019-2024年）和預測（2025-2032年）

第8章 歐洲互連和被動元件市場展望：實績（2019-2024年）和預測（2025-2032年）

第9章 東亞互連和被動元件市場展望：實績（2019-2024年）和預測（2025-2032年）

第10章 南亞和大洋洲互連和被動元件市場展望：實績（2019-2024年）和預測（2025-2032年）

第11章 拉丁美洲互連和被動元件市場展望：實績（2019-2024年）和預測（2025-2032年）

第12章 中東和非洲互連和被動元件市場展望：實績（2019-2024年）和預測（2025-2032年）

第13章 競爭格局

  • 2025年市場佔有率分析
  • 市場結構
  • 公司簡介
    • TE Connectivity Limited
    • Amphenol Corporation
    • Molex Incorporated
    • Hirose Electric Co., Ltd.
    • Delphi Automotive LLP
    • Koch Industries
    • Japan Aviation Electronics Industry
    • AVX Corporation
    • Cisco
    • Panasonic Corporation

第14章 附錄

簡介目錄
Product Code: PMRREP33478

Persistence Market Research has recently released a comprehensive report on the worldwide market for interconnects and passive components. The report offers a thorough assessment of crucial market dynamics, including drivers, trends, opportunities, and challenges, providing detailed insights into the market structure.

Key Insights:

  • Interconnects and Passive Components Market Size (2025E): USD 224.1 Million
  • Projected Market Value (2032F): USD 339.2 Million
  • Global Market Growth Rate (CAGR 2025 to 2032): 6.1%

Interconnects and Passive Components Market - Report Scope:

Interconnects and passive components are essential in virtually all electronic devices, including consumer electronics, automotive systems, telecommunications, industrial machinery, and healthcare equipment. Interconnects such as connectors, cables, and sockets facilitate signal and power transmission, while passive components like resistors, capacitors, and inductors regulate signal flow, suppress noise, and stabilize circuits. The market is being driven by rapid digitization, increasing electronic content in vehicles, and the rise in smart and connected devices. Demand is further supported by advancements in miniaturization, growing 5G infrastructure, and expansion of the Internet of Things (IoT) ecosystem.

Market Growth Drivers:

The global interconnects and passive components market is propelled by several key factors, including growing demand for consumer electronics, smartphones, and wearable devices. The ongoing shift toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS) significantly increases the need for high-performance components. Additionally, the expansion of telecommunication infrastructure for 5G rollout and industrial automation fuels further market demand. Innovation in compact and high-efficiency components, coupled with the growing importance of energy-efficient electronic systems, continues to push manufacturers toward developing next-generation products to meet evolving needs.

Market Restraints:

Despite strong growth prospects, the market faces challenges such as supply chain volatility, raw material price fluctuations, and geopolitical tensions affecting global trade. The complexity of designing miniaturized components with high reliability at competitive costs poses technical and financial barriers. Moreover, increasing regulatory scrutiny related to environmental compliance (e.g., RoHS and REACH) can complicate the production and certification processes. These challenges necessitate investment in sustainable materials, efficient production technologies, and global supply chain resilience.

Market Opportunities:

Significant opportunities lie in emerging applications such as smart homes, medical electronics, wearable health monitoring, aerospace systems, and renewable energy technologies. The growing trend of integrating artificial intelligence (AI) and edge computing in devices requires robust interconnects and highly reliable passive components. Moreover, advancements in printed and flexible electronics open up new possibilities in medical diagnostics and IoT devices. Strategic partnerships, mergers, and expansions into developing markets such as Southeast Asia, Latin America, and Africa present lucrative growth opportunities for industry participants.

Key Questions Answered in the Report:

  • What are the primary factors driving the growth of the interconnects and passive components market globally?
  • Which component types and applications are most in demand across industries?
  • How are miniaturization and 5G technology reshaping the competitive landscape of the market?
  • Who are the key players, and what strategies are they employing to maintain market leadership?
  • What are the emerging trends and future prospects in the global interconnects and passive components market?

Competitive Intelligence and Business Strategy:

These companies are heavily investing in R\&D to develop compact, high-frequency, and durable components to meet the demands of next-gen applications. Strategic alliances with OEMs, investments in automation, and a focus on green manufacturing practices further help strengthen their market positioning. Emphasis on digital supply chain optimization and customer-centric design is becoming increasingly vital to stay competitive in this dynamic sector.

Key Companies Profiled:

  • TE Connectivity Limited
  • Amphenol Corporation
  • Molex Incorporated
  • Hirose Electric Co., Ltd.
  • Delphi Automotive LLP
  • Koch Industries
  • Japan Aviation Electronics Industry
  • AVX Corporation
  • Cisco
  • Panasonic Corporation

Interconnects and Passive Components Market Research Segmentation:

By Product Type:

  • Interconnects
  • Passive components

By Application:

  • Consumer Electronics
  • Data Processing
  • Telecommunication
  • Military & Aerospace
  • Automotive
  • Industrial
  • Healthcare

By Region:

  • North America
  • Latin America
  • Europe
  • Asia Pacific
  • Middle East and Africa

Table of Contents

1. Executive Summary

  • 1.1. Global Interconnects and Passive Components Market Snapshot 2025 and 2032
  • 1.2. Market Opportunity Assessment, 2025-2032, US$ Mn
  • 1.3. Key Market Trends
  • 1.4. Industry Developments and Key Market Events
  • 1.5. Demand Side and Supply Side Analysis
  • 1.6. PMR Analysis and Recommendations

2. Market Overview

  • 2.1. Market Scope and Definitions
  • 2.2. Value Chain Analysis
  • 2.3. Macro-Economic Factors
    • 2.3.1. Global GDP Outlook
    • 2.3.2. Global GDP Outlook
    • 2.3.3. Global economic Growth Forecast
    • 2.3.4. Global Urbanization Growth
    • 2.3.5. Other Macro-economic Factors
  • 2.4. Forecast Factors - Relevance and Impact
  • 2.5. COVID-19 Impact Assessment
  • 2.6. PESTLE Analysis
  • 2.7. Porter's Five Forces Analysis
  • 2.8. Geopolitical Tensions: Market Impact
  • 2.9. Regulatory and Technology Landscape

3. Market Dynamics

  • 3.1. Drivers
  • 3.2. Restraints
  • 3.3. Opportunities
  • 3.4. Trends

4. Price Trend Analysis, 2019-2032

  • 4.1. Region-wise Price Analysis
  • 4.2. Price by Segments
  • 4.3. Price Impact Factors

5. Global Interconnects and Passive Components Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 5.1. Key Highlights
  • 5.2. Global Interconnects and Passive Components Market Outlook: Product Type
    • 5.2.1. Introduction/Key Findings
    • 5.2.2. Historical Market Size (US$ Mn) Analysis by Product Type, 2019-2024
    • 5.2.3. Current Market Size (US$ Mn) Forecast, by Product Type, 2025-2032
      • 5.2.3.1. Interconnects
      • 5.2.3.2. Passive components
    • 5.2.4. Market Attractiveness Analysis: Product Type
  • 5.3. Global Interconnects and Passive Components Market Outlook: Application
    • 5.3.1. Introduction/Key Findings
    • 5.3.2. Historical Market Size (US$ Mn) Analysis by Application, 2019-2024
    • 5.3.3. Current Market Size (US$ Mn) Forecast, by Application, 2025-2032
      • 5.3.3.1. Consumer Electronics
      • 5.3.3.2. Data Processing
      • 5.3.3.3. Telecommunication
      • 5.3.3.4. Military & Aerospace
      • 5.3.3.5. Automotive
      • 5.3.3.6. Industrial
      • 5.3.3.7. Healthcare
    • 5.3.4. Market Attractiveness Analysis: Application

6. Global Interconnects and Passive Components Market Outlook: Region

  • 6.1. Key Highlights
  • 6.2. Historical Market Size (US$ Mn) Analysis by Region, 2019-2024
  • 6.3. Current Market Size (US$ Mn) Forecast, by Region, 2025-2032
    • 6.3.1. North America
    • 6.3.2. Europe
    • 6.3.3. East Asia
    • 6.3.4. South Asia & Oceania
    • 6.3.5. Latin America
    • 6.3.6. Middle East & Africa
  • 6.4. Market Attractiveness Analysis: Region

7. North America Interconnects and Passive Components Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 7.1. Key Highlights
  • 7.2. Pricing Analysis
  • 7.3. North America Market Size (US$ Mn) Forecast, by Country, 2025-2032
    • 7.3.1. U.S.
    • 7.3.2. Canada
  • 7.4. North America Market Size (US$ Mn) Forecast, by Product Type, 2025-2032
    • 7.4.1. Interconnects
    • 7.4.2. Passive components
  • 7.5. North America Market Size (US$ Mn) Forecast, by Application, 2025-2032
    • 7.5.1. Consumer Electronics
    • 7.5.2. Data Processing
    • 7.5.3. Telecommunication
    • 7.5.4. Military & Aerospace
    • 7.5.5. Automotive
    • 7.5.6. Industrial
    • 7.5.7. Healthcare

8. Europe Interconnects and Passive Components Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 8.1. Key Highlights
  • 8.2. Pricing Analysis
  • 8.3. Europe Market Size (US$ Mn) Forecast, by Country, 2025-2032
    • 8.3.1. Germany
    • 8.3.2. Italy
    • 8.3.3. France
    • 8.3.4. U.K.
    • 8.3.5. Spain
    • 8.3.6. Russia
    • 8.3.7. Rest of Europe
  • 8.4. Europe Market Size (US$ Mn) Forecast, by Product Type, 2025-2032
    • 8.4.1. Interconnects
    • 8.4.2. Passive components
  • 8.5. Europe Market Size (US$ Mn) Forecast, by Application, 2025-2032
    • 8.5.1. Consumer Electronics
    • 8.5.2. Data Processing
    • 8.5.3. Telecommunication
    • 8.5.4. Military & Aerospace
    • 8.5.5. Automotive
    • 8.5.6. Industrial
    • 8.5.7. Healthcare

9. East Asia Interconnects and Passive Components Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 9.1. Key Highlights
  • 9.2. Pricing Analysis
  • 9.3. East Asia Market Size (US$ Mn) Forecast, by Country, 2025-2032
    • 9.3.1. China
    • 9.3.2. Japan
    • 9.3.3. South Korea
  • 9.4. East Asia Market Size (US$ Mn) Forecast, by Product Type, 2025-2032
    • 9.4.1. Interconnects
    • 9.4.2. Passive components
  • 9.5. East Asia Market Size (US$ Mn) Forecast, by Application, 2025-2032
    • 9.5.1. Consumer Electronics
    • 9.5.2. Data Processing
    • 9.5.3. Telecommunication
    • 9.5.4. Military & Aerospace
    • 9.5.5. Automotive
    • 9.5.6. Industrial
    • 9.5.7. Healthcare

10. South Asia & Oceania Interconnects and Passive Components Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 10.1. Key Highlights
  • 10.2. Pricing Analysis
  • 10.3. South Asia & Oceania Market Size (US$ Mn) Forecast, by Country, 2025-2032
    • 10.3.1. India
    • 10.3.2. Southeast Asia
    • 10.3.3. ANZ
    • 10.3.4. Rest of SAO
  • 10.4. South Asia & Oceania Market Size (US$ Mn) Forecast, by Product Type, 2025-2032
    • 10.4.1. Interconnects
    • 10.4.2. Passive components
  • 10.5. South Asia & Oceania Market Size (US$ Mn) Forecast, by Application, 2025-2032
    • 10.5.1. Consumer Electronics
    • 10.5.2. Data Processing
    • 10.5.3. Telecommunication
    • 10.5.4. Military & Aerospace
    • 10.5.5. Automotive
    • 10.5.6. Industrial
    • 10.5.7. Healthcare

11. Latin America Interconnects and Passive Components Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 11.1. Key Highlights
  • 11.2. Pricing Analysis
  • 11.3. Latin America Market Size (US$ Mn) Forecast, by Country, 2025-2032
    • 11.3.1. Brazil
    • 11.3.2. Mexico
    • 11.3.3. Rest of LATAM
  • 11.4. Latin America Market Size (US$ Mn) Forecast, by Product Type, 2025-2032
    • 11.4.1. Interconnects
    • 11.4.2. Passive components
  • 11.5. Latin America Market Size (US$ Mn) Forecast, by Application, 2025-2032
    • 11.5.1. Consumer Electronics
    • 11.5.2. Data Processing
    • 11.5.3. Telecommunication
    • 11.5.4. Military & Aerospace
    • 11.5.5. Automotive
    • 11.5.6. Industrial
    • 11.5.7. Healthcare

12. Middle East & Africa Interconnects and Passive Components Market Outlook: Historical (2019-2024) and Forecast (2025-2032)

  • 12.1. Key Highlights
  • 12.2. Pricing Analysis
  • 12.3. Middle East & Africa Market Size (US$ Mn) Forecast, by Country, 2025-2032
    • 12.3.1. GCC Countries
    • 12.3.2. South Africa
    • 12.3.3. Northern Africa
    • 12.3.4. Rest of MEA
  • 12.4. Middle East & Africa Market Size (US$ Mn) Forecast, by Product Type, 2025-2032
    • 12.4.1. Interconnects
    • 12.4.2. Passive components
  • 12.5. Middle East & Africa Market Size (US$ Mn) Forecast, by Application, 2025-2032
    • 12.5.1. Consumer Electronics
    • 12.5.2. Data Processing
    • 12.5.3. Telecommunication
    • 12.5.4. Military & Aerospace
    • 12.5.5. Automotive
    • 12.5.6. Industrial
    • 12.5.7. Healthcare

13. Competition Landscape

  • 13.1. Market Share Analysis, 2025
  • 13.2. Market Structure
    • 13.2.1. Competition Intensity Mapping
    • 13.2.2. Competition Dashboard
  • 13.3. Company Profiles
    • 13.3.1. TE Connectivity Limited
      • 13.3.1.1. Company Overview
      • 13.3.1.2. Product Portfolio/Offerings
      • 13.3.1.3. Key Financials
      • 13.3.1.4. SWOT Analysis
      • 13.3.1.5. Company Strategy and Key Developments
    • 13.3.2. Amphenol Corporation
    • 13.3.3. Molex Incorporated
    • 13.3.4. Hirose Electric Co., Ltd.
    • 13.3.5. Delphi Automotive LLP
    • 13.3.6. Koch Industries
    • 13.3.7. Japan Aviation Electronics Industry
    • 13.3.8. AVX Corporation
    • 13.3.9. Cisco
    • 13.3.10. Panasonic Corporation

14. Appendix

  • 14.1. Research Methodology
  • 14.2. Research Assumptions
  • 14.3. Acronyms and Abbreviations