通孔被動元件市場－全球產業規模、佔有率、趨勢、機會和預測，按元件、引腳模式、應用、地區和競爭格局分類，2021-2031年預測

全球通孔被動元件市場規模將從2025年的372.9億美元成長到2031年的621.3億美元，複合年成長率為8.88%。通孔被動元件是指電阻器、電容器和電感器等電子元件，其引腳設計用於穿過印刷電路板上的鑽孔並焊接以建立連接。

主要市場促進因素

對高可靠性汽車電子產品和電動車動力總成日益成長的需求，是推動通孔被動元件應用的主要催化劑。隨著製造商向電氣化轉型，對能夠承受熱循環和高壓負載的元件的要求變得至關重要。

主要市場挑戰

整個產業向表面貼裝技術的快速轉型是全球通孔被動元件市場擴張的主要障礙。這項轉變的根本驅動力在於對小型化和最佳化印刷電路板元件密度的持續需求。

主要市場趨勢

自動化機器人插件和人工智慧驅動製造技術的進步正在從根本上重塑通孔被動元件的生產模式。製造商正擴大部署先進的插件機，從而擺脫對人工的依賴，進而消除通孔組裝和表面貼裝組裝之間的成本差異。

目錄

第1章：產品概述

第2章：研究方法

第3章：執行概要

第4章：顧客之聲

第5章：全球通孔被動元件市場展望

• 市場規模及預測
  • 按價值
• 市佔率及預測
  • 依元件分類（電阻器、電容器、電感器、二極體、變送器、感測器及其他）
  • 依導線類型（軸嚮導線和徑向導線）
  • 依應用領域（消費性電子、IT及電信、汽車、工業、航太及國防、醫療保健及其他）
  • 按地區
  • 按公司（2025 年）
• 市場地圖

第6章：北美通孔被動元件市場展望

• 市場規模及預測
• 市佔率及預測
• 北美洲：國家分析
  • 美國
  • 加拿大
  • 墨西哥

第7章：歐洲通孔被動元件市場展望

• 市場規模及預測
• 市佔率及預測
• 歐洲：國家分析
  • 德國
  • 法國
  • 英國
  • 義大利
  • 西班牙

第8章：亞太地區通孔被動元件市場展望

• 市場規模及預測
• 市佔率及預測
• 亞太地區：國家分析
  • 中國
  • 印度
  • 日本
  • 韓國
  • 澳洲

第9章：中東和非洲通孔被動元件市場展望

• 市場規模及預測
• 市佔率及預測
• 中東和非洲：國家分析
  • 沙烏地阿拉伯
  • 阿拉伯聯合大公國
  • 南非

第10章：南美通孔被動元件市場展望

• 市場規模及預測
• 市佔率及預測
• 南美洲：國家分析
  • 巴西
  • 哥倫比亞
  • 阿根廷

第11章：市場動態

• 促進要素
• 挑戰

第12章：市場趨勢與發展

• 併購
• 產品發布
• 最新進展

第13章：全球通孔被動元件市場：SWOT分析

第14章：波特五力分析

• 產業競爭
• 新進入者的潛力
• 供應商議價能力
• 顧客的力量
• 替代產品的威脅

第15章：競爭格局

• Murata Manufacturing Co., Ltd.
• TDK Corporation
• Vishay Intertechnology, Inc.
• Panasonic Corporation
• AVX Corporation
• KEMET Corporation
• Taiyo Yuden Co., Ltd.
• Wurth Elektronik GmbH & Co. KG
• Yageo Corporation
• Samsung Electro-Mechanics Co., Ltd.

第16章：策略建議

第17章調查會社について,免責事項

The Global Through Hole Passive Components Market will grow from USD 37.29 Billion in 2025 to USD 62.13 Billion by 2031 at a 8.88% CAGR. Through-hole passive components are electronic elements such as resistors, capacitors, and inductors that feature leads designed to be inserted through drilled holes in a printed circuit board and soldered to establish a connection.

Key Market Drivers

The rising demand for high-reliability automotive electronics and EV powertrains acts as a primary catalyst for the adoption of through-hole passive components. As manufacturers transition toward electrification, the requirement for components enduring thermal cycling and high-voltage loads becomes critical. Through-hole resistors and capacitors are integrated into inverters because their leaded architecture provides robust mechanical anchorage against vibrations.

Key Market Challenges

The rapid industry-wide transition toward Surface Mount Technology represents the primary impediment to the expansion of the Global Through Hole Passive Components Market. This shift is fundamentally driven by the relentless demand for miniaturization and the necessity to optimize component density on printed circuit boards. Surface mount counterparts offer superior compatibility with high-speed automated assembly systems, significantly reducing manufacturing costs compared to the manual or semi-automated insertion processes required for through-hole leads.

Key Market Trends

The advancement of automated robotic insertion and AI-driven manufacturing is fundamentally reshaping the production landscape for through-hole passive components. Manufacturers are increasingly deploying advanced insertion machines that eliminate the traditional reliance on manual labor, thereby neutralizing the cost disparities between through-hole and surface mount assembly. This transition is critical for maintaining the viability of leaded resistors and capacitors in mass-production environments where precision and speed are paramount.

Key Market Players

• Murata Manufacturing Co., Ltd.
• TDK Corporation
• Vishay Intertechnology, Inc.
• Panasonic Corporation
• AVX Corporation
• KEMET Corporation
• Taiyo Yuden Co., Ltd.
• Wurth Elektronik GmbH & Co. KG
• Yageo Corporation
• Samsung Electro-Mechanics Co., Ltd.

Report Scope:

In this report, the Global Through Hole Passive Components Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Through Hole Passive Components Market, By Component:

• Resistors
• Capacitors
• Inductors
• Diodes
• Transducers
• Sensors
• and Others

Through Hole Passive Components Market, By Leads Model:

• Axial Leads and Radial Leads

Through Hole Passive Components Market, By Application:

• Consumer Electronics
• IT & Telecommunication
• Automotive
• Industrial
• Aerospace & Defense
• Healthcare
• and Others

Through Hole Passive Components Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Through Hole Passive Components Market.

Available Customizations:

Global Through Hole Passive Components Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, Trends

4. Voice of Customer

5. Global Through Hole Passive Components Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Component (Resistors, Capacitors, Inductors, Diodes, Transducers, Sensors, and Others)
  • 5.2.2. By Leads Model (Axial Leads and Radial Leads)
  • 5.2.3. By Application (Consumer Electronics, IT & Telecommunication, Automotive, Industrial, Aerospace & Defense, Healthcare, and Others)
  • 5.2.4. By Region
  • 5.2.5. By Company (2025)
• 5.3. Market Map

6. North America Through Hole Passive Components Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Component
  • 6.2.2. By Leads Model
  • 6.2.3. By Application
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Through Hole Passive Components Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Component
      • 6.3.1.2.2. By Leads Model
      • 6.3.1.2.3. By Application
  • 6.3.2. Canada Through Hole Passive Components Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Component
      • 6.3.2.2.2. By Leads Model
      • 6.3.2.2.3. By Application
  • 6.3.3. Mexico Through Hole Passive Components Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Component
      • 6.3.3.2.2. By Leads Model
      • 6.3.3.2.3. By Application

7. Europe Through Hole Passive Components Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Component
  • 7.2.2. By Leads Model
  • 7.2.3. By Application
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Through Hole Passive Components Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Component
      • 7.3.1.2.2. By Leads Model
      • 7.3.1.2.3. By Application
  • 7.3.2. France Through Hole Passive Components Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Component
      • 7.3.2.2.2. By Leads Model
      • 7.3.2.2.3. By Application
  • 7.3.3. United Kingdom Through Hole Passive Components Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Component
      • 7.3.3.2.2. By Leads Model
      • 7.3.3.2.3. By Application
  • 7.3.4. Italy Through Hole Passive Components Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Component
      • 7.3.4.2.2. By Leads Model
      • 7.3.4.2.3. By Application
  • 7.3.5. Spain Through Hole Passive Components Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Component
      • 7.3.5.2.2. By Leads Model
      • 7.3.5.2.3. By Application

8. Asia Pacific Through Hole Passive Components Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Component
  • 8.2.2. By Leads Model
  • 8.2.3. By Application
  • 8.2.4. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Through Hole Passive Components Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Component
      • 8.3.1.2.2. By Leads Model
      • 8.3.1.2.3. By Application
  • 8.3.2. India Through Hole Passive Components Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Component
      • 8.3.2.2.2. By Leads Model
      • 8.3.2.2.3. By Application
  • 8.3.3. Japan Through Hole Passive Components Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Component
      • 8.3.3.2.2. By Leads Model
      • 8.3.3.2.3. By Application
  • 8.3.4. South Korea Through Hole Passive Components Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Component
      • 8.3.4.2.2. By Leads Model
      • 8.3.4.2.3. By Application
  • 8.3.5. Australia Through Hole Passive Components Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Component
      • 8.3.5.2.2. By Leads Model
      • 8.3.5.2.3. By Application

9. Middle East & Africa Through Hole Passive Components Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Component
  • 9.2.2. By Leads Model
  • 9.2.3. By Application
  • 9.2.4. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Through Hole Passive Components Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Component
      • 9.3.1.2.2. By Leads Model
      • 9.3.1.2.3. By Application
  • 9.3.2. UAE Through Hole Passive Components Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Component
      • 9.3.2.2.2. By Leads Model
      • 9.3.2.2.3. By Application
  • 9.3.3. South Africa Through Hole Passive Components Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Component
      • 9.3.3.2.2. By Leads Model
      • 9.3.3.2.3. By Application

10. South America Through Hole Passive Components Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Component
  • 10.2.2. By Leads Model
  • 10.2.3. By Application
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Through Hole Passive Components Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Component
      • 10.3.1.2.2. By Leads Model
      • 10.3.1.2.3. By Application
  • 10.3.2. Colombia Through Hole Passive Components Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Component
      • 10.3.2.2.2. By Leads Model
      • 10.3.2.2.3. By Application
  • 10.3.3. Argentina Through Hole Passive Components Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Component
      • 10.3.3.2.2. By Leads Model
      • 10.3.3.2.3. By Application

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Global Through Hole Passive Components Market: SWOT Analysis

14. Porter's Five Forces Analysis

• 14.1. Competition in the Industry
• 14.2. Potential of New Entrants
• 14.3. Power of Suppliers
• 14.4. Power of Customers
• 14.5. Threat of Substitute Products

15. Competitive Landscape

• 15.1. Murata Manufacturing Co., Ltd.
  • 15.1.1. Business Overview
  • 15.1.2. Products & Services
  • 15.1.3. Recent Developments
  • 15.1.4. Key Personnel
  • 15.1.5. SWOT Analysis
• 15.2. TDK Corporation
• 15.3. Vishay Intertechnology, Inc.
• 15.4. Panasonic Corporation
• 15.5. AVX Corporation
• 15.6. KEMET Corporation
• 15.7. Taiyo Yuden Co., Ltd.
• 15.8. Wurth Elektronik GmbH & Co. KG
• 15.9. Yageo Corporation
• 15.10. Samsung Electro-Mechanics Co., Ltd.

16. Strategic Recommendations

17. About Us & Disclaimer