熱熔膠黏劑的日本市場評估:各類型樹脂，各用途，各地區，機會，預測(2019年度～2033年度)

日本熱熔膠市場預計將從 2025 年的 6.0211 億美元成長到 2033 年的 8.5168 億美元，在 2026 年至 2033 年的預測期內，複合年增長率為 4.43%。這是由於包裝行業的擴張，受電子商務和永續發展計劃的推動，該行業嚴重依賴熱熔膠來實現安全密封和防篡改解決方案。此外，汽車產業也是一個主要貢獻者，黏合劑在黏合輕質材料和抗震方面發揮關鍵作用，這與提高燃油效率和生產電動車的動力相吻合。此外，電子業還依賴熱熔膠對複雜組件進行精確黏合，從而提高先進設備的可靠性。

汽車製造業的成長將推動對電動車組裝中使用的輕質材料、抗振黏合劑和膠黏劑的需求。根據國際汽車製造商組織（OICA）的調查，預計2023年日本汽車產量將達到899萬輛，較2021年成長15%。

本報告提供日本的熱熔膠黏劑市場相關調查分析，提供市場規模與預測，市場動態，主要企業形勢等資訊。

目錄

第1章 計劃的範圍和定義

第2章 調查手法

第3章 美國的關稅的影響

第4章 摘要整理

第5章 客戶的迴響

• 受訪者的人口統計
• 決定購買時應該考慮的要素
• 品牌認知度
• 未滿足需求

第6章 日本的熱熔膠黏劑市場預測(2019年度～2033年度)

• 市場規模分析與預測
  • 金額
  • 數量
• 市場佔有率的分析與預測
  • 各類型樹脂
    • 乙烯醋酸乙烯酯
    • 苯乙烯嵌段共聚物
    • 聚氨酯
    • 聚醯胺
    • 聚烯
    • 其他
  • 各用途
    • 包裝
    • 電子
    • 汽車
    • 建築·建設
    • 鞋子
    • 家具·床墊
    • 其他
  • 各地區
    • 北部(北海道·東北)
    • 中部(關東·中部)
    • 南部(關西，中國，四國，九州·沖繩)
  • 各企業的市場佔有率分析(前五名公司和其他 - 金額，2025年度)
• 市場地圖分析(2025年度)
  • 各類型樹脂
  • 各用途
  • 各地區

第7章 波特的五力分析

第8章 大環境分析

第9章 市場動態

• 推動市場要素
• 市場課題

第10章 市場趨勢與發展

第11章 案例研究

第12章 競爭情形

• 前五名市場領導公司的競爭矩陣
• 主要前十大企業的形勢
  • Bostik-Nitta Co., Ltd.
  • Henkel Japan Ltd.
  • Resonac Corporation
  • 3M Japan Limited
  • Akzo Nobel Coatings K.K.
  • Yasuhara Chemical Co., Ltd
  • Moresco Corporation
  • Oshika Corporation
  • Asahi Chemical Synthetic Co., Ltd.
  • Sekisui-Fuller Co., Ltd.

第13章 策略性建議

第14章 關於調查公司·免責聲明

Japan hot-melt adhesives market is projected to witness a CAGR of 4.43% during the forecast period FY2026-FY2033, growing from USD 602.11 million in FY2025 to USD 851.68 million in FY2033F, driven by expanding packaging industry, fueled by e-commerce and sustainability initiatives, heavily relies on hot melt adhesives for secure sealing and tamper-evident solutions. Additionally, the automotive sector is another major contributor, with adhesives playing a vital role in lightweight material bonding and vibration resistance, aligning with the push for fuel efficiency as well as electric vehicle production. Furthermore, the electronics industry also leverages hot melt adhesives for precise bonding of intricate components, enhancing reliability in advanced devices.

Increased automotive manufacturing drives demand for adhesives used in lightweight materials, vibration-resistant bonding, and electric vehicle assembly. According to the survey by the International Organization of Motor Vehicle Manufacturers (OICA), Japan's vehicle production reached 8.99 million units in 2023, reflecting a 15% growth since 2021.

Growth in Packaging Sector Supporting Market Expansion

The packaging industry in Japan is a major driver for the hot melt adhesives market, fueled by the rapid growth of e-commerce and sustainability initiatives. Hot melt adhesives are widely used in packaging applications for their fast-setting properties, cost-effectiveness, and ability to create tamper-evident seals. The rise of online shopping has increased demand for secure and durable packaging solutions, while sustainability efforts have driven the adoption of eco-friendly adhesives. Hot melt adhesives are particularly well suited to high-speed packaging lines and bring efficiency and consistency. Japan is prioritizing recyclable and reusable packaging material which continues to fuel the requirement for hot melt adhesives further, the flexibility of hot melt adhesives as a result of development in adhesive formulating has also made them workable with other packaging materials, thus increasing appeal across industries.

In March 2022, Toyo-Morton Ltd., Japan's leading laminating adhesives manufacturer updated its laminating adhesive portfolio with food-safe products, free of epoxy silanes and organic tin compounds. The renewed lineup includes solvent-based TOMOFLEX(TM) and solvent-free ECOAD(TM), suitable for multilayer flexible packaging applications such as dry food, liquid pouch, and high-performance retort. These products conform to global food contact regulations.

Automotive Industry Driving Adhesive Demand

Japan's automotive sector is a significant contributor to the hot melt adhesives market, driven by the shift toward lightweight materials and electric vehicles (EVs). Hot melt adhesives are essential for bonding lightweight components, providing vibration resistance, and enhancing vehicle durability. With the growing focus on fuel efficiency and EV production, the demand for advanced adhesive solutions has surged. These adhesives offer strong bonding capabilities without adding weight, making them ideal for modern automotive manufacturing. Additionally, technological advancements in adhesive formulations have improved their temperature resistance and performance, aligning with the stringent quality standards of Japan's automotive industry. The integration of hot melt adhesives in hybrid and electric vehicle assembly is particularly noteworthy, as they help in achieving the required structural integrity and safety standards.

In January 2025, the National Institute of Advanced Industrial Science and Technology (AIST) and Japanese chemical company Asahi Kasei have developed a stronger, reusable, and environmentally friendly adhesive from Euglena, a plankton. The adhesive, created by adding fatty acids to paramylon, is easy to remove with heat and could be used in automotive manufacturing, making lightweight vehicle parts easier to disassemble and reuse.

Electronics Sector Boosting Adhesive Applications

The expansion of electronics industry in Japan driving the growth of the hot melt adhesives market, as these adhesives are widely used for precise bonding of intricate components in advanced electronic devices, ensuring durability and reliability. Additionally, the development of high-performance and miniature electronics has raised the demand for specialty adhesives that can withstand heat stress and establish durable and long-lasting bonds. Hot melt adhesives also play a crucial role in assembling components such as circuit boards, displays, and housing. As Japan continues to lead in electronics innovation, the demand for versatile and high-performance adhesive solutions is expected to rise significantly. Furthermore, the development of new adhesive formulation technologies in the adhesive industry through ground-breaking collaborations within the prominent players to enhanced their thermal conductivity and electrical insulation properties is supporting the growth of advanced electronics applications, such as smartphones and automotive electronics.

In April 2024, Shin-Etsu Chemical acquired a dry adhesive technology developed by Setex Technologies, Inc., which uses biomimicry to provide strong friction and adhesion to materials. The company aims to develop a new market, focusing on the corporate market and the consumer market, by combining Setex's technology with Shin-Etsu Chemical's optimized materials.

Polyurethane (PU) Based Hot Melt Adhesives are Experiencing Significant Growth in Japan

The hot melt adhesives derived from polyurethane resins witnessing robust growth due to their versatile applications across industries such as automotive, packaging, electronics, and construction. In the automobile sector, PU adhesives are used for lightweight material joining and vibration-dampening assembly, which is suitable for Japan's focus on fuel economy and electric vehicle production. In the packaging market, PU adhesives are used for secure sealing and tamper-evident packaging, which is suitable for Japan's environmental regulations. Furthermore, technological advancements in bio-based PU adhesive products address growing consumer demand for sustainable materials. In electronic manufacturing, PU adhesives are used in precise bonding of intricate components with long-term insulation and thermal stress resistance. In building, PU adhesives are used in panel bonding and insulation.

In August 2023, Mitsui Chemicals announced that it was expanding its production capacity for polyurethane dispersions (PUDs) at Shimizu Factory to meet rising demand for mono-material food packaging due to sustainability concerns. The company plans to double its domestic production capacity, focusing on TAKELAC(TM) PUDs, water-based resins with excellent heat resistance and high-temperature gas barrier performance. These products aim to cater for the from end-user sectors, including paint, coatings, adhesives, binders, resin modifiers, and textile processing.

Future Market Scenario (FY2026-FY2023F)

The growth in e-commerce and the automotive industry's shift towards lightweight materials will continue to drive demand for hot melt adhesives. These adhesives are crucial for efficient packaging solutions and vibration-resistant bonding in vehicles, aligning with Japan's focus on fuel efficiency and electric vehicle production.

Further development of adhesive formulations will enhance performance attributes such as heat stability and strength of bonding, leading to wider applications across industries.

In addition, the shift towards low-VOC, environmentally friendly adhesives is also in accordance with the regulatory framework in Japan regarding the environment and consumers' desire for green products.

The electronics sector will continue to leverage hot melt adhesives for precise bonding of intricate components, enhancing durability and reliability in advanced devices.

Meanwhile, the construction industry's increasing use of hot melt adhesives for insulation and panel bonding will further drive market growth.

Key Players Landscape and Outlook

The Japan hot melt adhesives market is marked by the presence of both domestic and international players who are driving innovation and sustainability in the industry. These players are focusing on developing advanced adhesive formulations to meet the diverse needs of sectors such as packaging, automotive, electronics, and construction. The shift toward eco-friendly solutions is a key trend, with companies investing in bio-based and low-VOC adhesives to align with Japan's stringent environmental regulations and carbon neutrality goals. Additionally, technological innovations represent a primary focus as the prominent manufacturers working for enhancing performance of adhesives in terms of heat stability, flexibility, and bonding strength. Technological developments especially relate to applications of high reliability in the automobile and electronics industry, where accuracy and reliability are paramount. Moreover, the increase in demand for light-weight materials in electric cars and complex bonding solutions in high-end electronics is stimulating the manufacture of specialist adhesives.

In April 2023, Oshika Corporation, a leading manufacturer of wood adhesives and construction materials, expanded its business into non-housing industries and focuses on wood and wood-based technologies. The company believes in the regeneration of wood and its eco-friendly benefits, such as carbon storage in wood.

Table of Contents

1. Project Scope and Definitions

2. Research Methodology

3. Impact of U.S. Tariffs

4. Executive Summary

5. Voice of Customers

• 5.1. Respondent Demographics
• 5.2. Factors Consider in Purchase Decision
• 5.3. Brand Awareness
• 5.4. Unmet Needs

6. Japan Hot-melt Adhesives Market Outlook, FY2019-FY2033F

• 6.1. Market Size Analysis & Forecast
  • 6.1.1. By Value
  • 6.1.2. By Volume
• 6.2. Market Share Analysis & Forecast
  • 6.2.1. By Resin Type
    • 6.2.1.1. Ethylene Vinyl Acetate
    • 6.2.1.2. Styrene Block Copolymers
    • 6.2.1.3. Polyurethane
    • 6.2.1.4. Polyamide
    • 6.2.1.5. Polyolefins
    • 6.2.1.6. Others
  • 6.2.2. By Application
    • 6.2.2.1. Packaging
    • 6.2.2.2. Electronics
    • 6.2.2.3. Automotive
    • 6.2.2.4. Building and Construction
    • 6.2.2.5. Footwear
    • 6.2.2.6. Furniture and Mattress
    • 6.2.2.7. Others
  • 6.2.3. By Region
    • 6.2.3.1. North [Hokkaido and Tohoku]
    • 6.2.3.2. Central [Kanto and Chubu]
    • 6.2.3.3. South [Kansai, Chugoku, Shikoku, and Kyushu & Okinawa]
  • 6.2.4. By Company Market Share Analysis (Top 5 Companies and Others - By Value, FY2025)
• 6.3. Market Map Analysis, FY2025
  • 6.3.1. By Resin Type
  • 6.3.2. By Application
  • 6.3.3. By Region

All segments will be provided for all regions covered

7. Porter's Five Forces Analysis

8. PESTLE Analysis

9. Market Dynamics

• 9.1. Market Drivers
• 9.2. Market Challenges

10. Market Trends and Developments

11. Case Studies

12. Competitive Landscape

• 12.1. Competition Matrix of Top 5 Market Leaders
• 12.2. Key Players Landscape for Top 10 Market Players
  • 12.2.1. Bostik-Nitta Co., Ltd.
    • 12.2.1.1. Company Details
    • 12.2.1.2. Key Management Personnel
    • 12.2.1.3. Key Products Offered
    • 12.2.1.4. Key Financials (As Reported)
    • 12.2.1.5. Key Market Focus and Geographical Presence
    • 12.2.1.6. Recent Developments/Collaborations/Partnerships/Mergers and Acquisition
    • 12.2.1.7. SWOT Analysis for Top 5 Players
  • 12.2.2. Henkel Japan Ltd.
  • 12.2.3. Resonac Corporation
  • 12.2.4. 3M Japan Limited
  • 12.2.5. Akzo Nobel Coatings K.K.
  • 12.2.6. Yasuhara Chemical Co., Ltd
  • 12.2.7. Moresco Corporation
  • 12.2.8. Oshika Corporation
  • 12.2.9. Asahi Chemical Synthetic Co., Ltd.
  • 12.2.10. Sekisui-Fuller Co., Ltd.

Companies mentioned above DO NOT hold any order as per market share and can be changed as per information available during research work.

13. Strategic Recommendations

14. About Us and Disclaimer

List of Tables

• Table 1. Competition Matrix of Top 5 Market Leaders
• Table 2. Mergers & Acquisitions/ Joint Ventures (If Applicable)
• Table 3. About Us - Regions and Countries Where We Have Executed Client Projects

List of Figures

• Figure 1. Japan Hot-melt Adhesives Market, By Value, In USD Million, FY2019-FY2033F
• Figure 2. Japan Hot-melt Adhesives Market, By Volume, In Thousand Tons, FY2019-FY2033F
• Figure 3. Japan Hot-melt Adhesives Market Share (%), By Resin Type, FY2019-FY2033F
• Figure 4. Japan Hot-melt Adhesives Market Share (%), By Application, FY2019-FY2033F
• Figure 5. Japan Hot-melt Adhesives Market Share (%), By Region, FY2019-FY2033F
• Figure 6. By Resin Type Map-Market Size (USD Million) & Growth Rate (%), FY2025
• Figure 7. By Application Map-Market Size (USD Million) & Growth Rate (%), FY2025
• Figure 8. By Region Map-Market Size (USD Million) & Growth Rate (%), FY2025