美國汽車感測器：市場佔有率分析、行業趨勢、統計數據和成長預測（2025-2030 年）

預計 2025 年美國汽車感測器市場規模為 57.3 億美元，到 2030 年將達到 81.4 億美元，市場估計和預測期（2025-2030 年）的複合年成長率為 7.32%。

汽車製造商正在每輛車上嵌入更多感測器，以滿足輪胎壓力、穩定性控制和自動煞車方面的要求。同時，車隊營運商正在採用富含感測器的遠端資訊處理系統來管理保險費和排放。雷達、LiDAR和基於MEMS的設備在成本和性能方面不斷取得突破，為傳統供應商和新興企業在美國汽車感測器市場開闢了新的差異化途徑。

美國汽車感測器市場趨勢與洞察

《CHIPS法案》鼓勵在岸MEMS晶圓廠建設

聯邦政府新撥款390億美元，正引導晶圓廠計劃在亞利桑那州、德克薩斯和紐約州北部落地，確保當地能夠提供用於支援引擎、電池和底盤控制的MEMS壓力、慣性和磁感測器。 Rogue Valley Microdevices公司已為其佛羅裡達工廠獲得670萬美元的融資，使其汽車MEMS產能幾乎翻了三倍。新增產能縮短了前置作業時間，降低了運輸風險，並支援準時交付到底特律及沿海地區的組裝廠。一所大學已獲得一項研究津貼，用於開發下一代微加工工藝，進一步推動美國汽車感測器市場的創新。這些舉措將增強市場韌性，並將未來的生產從海外工廠轉移回美國。

隨著電動車變得越來越普遍，每輛車安裝的感測器數量將會增加。

電動車整合的半導體數量是內燃機汽車的兩到三倍，到2030年，感測器的價值佔比將更大。僅電池管理系統就需要多個溫度、電流和電壓節點來防止熱失控。位置和磁感測器監控馬達轉速，高壓隔離裝置則保障安全。政府稅額扣抵和覆蓋全國的充電補貼正在加速交付，促使供應商擴大基於碳化矽的壓力和溫度晶片的規模，以應對更嚴苛的引擎蓋下環境。因此，即使整體汽車產量保持平穩，美國汽車感測器市場仍受益於平均售價的上漲。

缺水限制矽供應

亞利桑那州的下一代工廠每天可能要耗費數公升水，這將使本已飽受乾旱壓力的蓄水層雪上加霜。社區的反對和授權的延誤可能會限制當地晶圓的生產，並限制汽車晶粒感測器和慣性晶粒的輸送。為了降低風險，製造商正在實施封閉式回收，以回收超過70%的製程用水，但資本支出需要較長的投資回收期。如果更多工廠的建設未獲核准，缺水狀況可能會持續，從而限制美國汽車感測器市場的成長。

細分分析

到2024年，壓力設備將佔汽車收入的29.35%，支援燃油噴射、煞車輔助和胎壓監測等應用。美國汽車感知器壓力設備市場規模將隨著燃油效率和排放目標的實現而穩定成長。目前規模較小的雷達模組到2030年將以8.23%的複合年成長率成長，這得益於77GHz晶片組價格的下降以及新車安全評估計劃(NCAP)增加盲點、前方碰撞和交叉路口警報的壓力。一級製造商目前正在將四角4D雷達捆綁到主流SUV車型中，這表明感測器融合正在從高階市場轉向量產市場。

第二代毫米波架構將數位波束成形和AI物體分類整合到單一CMOS晶粒上。這減少了元件數量並簡化了熱設計，有助於雷達蠶食僅使用攝影機的ADAS市場佔有率。雷達和慣性參考單元組合供應商承諾即使在GPS受阻的情況下也能提供高精度里程計，這為美國汽車感測器產業創造了新的價值池。

2024年，動力傳動系統系統將佔總支出的36.56%，其中包括氣流感知器、爆震感知器、冷卻液溫度感知器和電池組感知器。符合Tier 3排放氣體法規將使動力傳動系統總成系統在汽車感測器中的佔比保持在高位。同時，到2030年，ADAS和自動駕駛功能的複合年成長率將達到8.71%，這將顯著提升其在美國汽車感測器市場的佔有率。超音波、攝影機、雷達和雷射雷達的組合將實現L2+等級的自動駕駛功能，而美國國家公路交通安全管理局（NHTSA）新頒布的自動緊急煞車規定將奠定其基準。

為了實現冗餘目標，OEM 指定了兩條獨立的感測路徑，用於橫向和縱向控制。到 2029 年，這將使每輛車的半導體總數超過 1,000 個，使 ADAS 成為成長最快的感測器預算線。持續的無線功能升級可以在車輛售出數年後，透過收益尚未開發的計算餘量來進一步延長生命週期收益。

其他福利：

• Excel 格式的市場預測 (ME) 表
• 3個月的分析師支持

目錄

第1章 引言

• 研究假設和市場定義
• 調查範圍

第2章調查方法

第3章執行摘要

第4章 市場狀況

• 市場概況
• 市場促進因素
  • 《CHIPS法案》鼓勵在岸MEMS晶圓廠建設
  • 隨著電動車變得越來越普遍，每輛車安裝的感測器數量將會增加。
  • Federal TPMS、ESC 和 NCAP 升級
  • 引入互聯保險遠端資訊處理
  • 軟體定義的汽車架構
  • 車隊脫碳目標（企業）
• 市場限制
  • 缺水限制矽供應
  • 成本和價格下降對一級供應商的利潤率帶來壓力
  • 惡劣環境下的可靠性和校準問題
  • 感測器級網路安全責任
• 價值/供應鏈分析
• 監管狀況
• 技術展望
• 永續性和能源足跡分析
• 五力分析
  • 新進入者的威脅
  • 買家/消費者的議價能力
  • 供應商的議價能力
  • 替代品的威脅
  • 競爭對手之間的競爭強度

第5章市場規模及成長預測

• 依感測器類型
  • 溫度感測器
  • 壓力感測器
  • 速度/速率感測器
  • 液位/位置感知器
  • 磁性感應器
  • 氣體/化學感測器
  • 慣性感測器（加速度計/陀螺儀）
  • LiDAR感測器
  • 雷達感測器
  • 超音波感測器
  • 影像/相機感光元件
  • 電流感測器
• 按用途
  • 動力傳動系統
  • 車身電子與舒適性
  • 安全保障
  • ADAS 與自動駕駛系統
  • 遠端資訊處理和連接
  • 電池管理（電動車）
• 按車輛類型
  • 摩托車
  • 搭乘用車
  • 輕型商用車
  • 大型商用車
• 按銷售管道
  • OEM
  • 售後市場
• 透過促銷
  • 內燃機汽車
  • 油電混合車
  • 純電動車
  • 燃料電池電動車
• 透過感測器技術
  • MEMS
  • 非MEMS/巨集感測器

第6章 競爭態勢

• 市場集中度
• 策略舉措
• 市佔率分析
• 公司簡介
  • Robert Bosch GmbH
  • DENSO Corporation
  • Continental AG
  • HELLA GmbH & Co. KGaA
  • Valeo SA
  • Texas Instruments Inc.
  • Infineon Technologies AG
  • NXP Semiconductors NV
  • Analog Devices Inc.
  • Hitachi Astemo Americas Inc.
  • Sensata Technologies
  • TE Connectivity
  • Aptiv PLC
  • STMicroelectronics NV
  • onsemi
  • BorgWarner Inc.
  • Renesas Electronics Corp.
  • Honeywell International Inc.
  • Allegro MicroSystems LLC
  • Microchip Technology Inc.

第7章 市場機會與未來展望

The US Automotive Sensors Market size is estimated at USD 5.73 billion in 2025, and is expected to reach USD 8.14 billion by 2030, at a CAGR of 7.32% during the forecast period (2025-2030).

Automakers are embedding more sensors per vehicle to comply with tire-pressure, stability-control, and automated-braking mandates. At the same time, fleet operators adopt sensor-rich telematics to control insurance costs and emissions. Radar, lidar, and MEMS-based devices continue to achieve cost and performance breakthroughs, giving legacy suppliers and start-ups new avenues for differentiation in the United States automotive sensors market.

US Automotive Sensors Market Trends and Insights

CHIPS Act Incentivises On-Shore MEMS Fabs

New federal grants worth USD 39 billion are steering wafer-fab projects to Arizona, Texas and upstate New York, ensuring a local pipeline of MEMS pressure, inertial and magnetic sensors that underpin engine, battery and chassis controls. Rogue Valley Microdevices has already secured USD 6.7 million for a Florida plant that will nearly triple its automotive MEMS capacity, illustrating how smaller foundries can scale under the program. The added capacity reduces lead-times, cuts shipping risk and supports just-in-time delivery for Detroit and coastal assembly plants. Universities gain research grants that seed next-gen micromachining processes, further anchoring innovation inside the United States automotive sensors market. Combined, these actions lift resilience and pull future production back from overseas fabs.

EV Adoption Pushes Sensor Content per Vehicle

Electric models integrate two to three times more semiconductors than ICE cars, pushing sensor value toward a greater share by 2030. Battery-management systems alone require multiple temperature, current and voltage nodes to prevent thermal runaway. Position and magnetic sensors monitor e-motor speed, while high-voltage isolation devices maintain safety. Government tax credits and coast-to-coast charging grants accelerate delivery volumes, so suppliers are scaling SiC-based pressure and temperature dies to meet harsher under-hood environments. As a result, the United States automotive sensors market is benefiting from higher average selling prices even when overall vehicle production remains flat.

Silicon-Supply Water-Stress Constraints

Next-generation fabs in Arizona may each draw significant liters of water daily, straining aquifers already under drought pressure. Community opposition or permitting delays could cap local wafer output, tightening the flow of automotive pressure and inertial dies. To mitigate risk, manufacturers are installing closed-loop recycling that recovers more than 70% of process water, yet capital outlays lengthen payback. Prolonged shortages could temper growth for the United States automotive sensors market if additional sites are not approved.

Other drivers and restraints analyzed in the detailed report include:

1. Connected-Insurance Telematics Retrofits
2. Software-Defined Vehicle Architectures
3. Cost & Price-Erosion Squeeze Tier-1 Margins

For complete list of drivers and restraints, kindly check the Table Of Contents.

Segment Analysis

Pressure devices delivered 29.35% of 2024 revenue, anchoring applications such as fuel injection, brake boost and mandated tire-pressure monitoring. The United States automotive sensors market size for pressure units is set to expand steadily in line with fuel-efficiency and emissions targets. Radar modules, although smaller today, will grow at a 8.23% CAGR through 2030 thanks to falling 77 GHz chipset prices and NCAP pressure to add blind-spot, front-collision and cross-traffic alerts. Tier-1s now bundle four-corner 4D radar into mainstream SUVs, signalling that sensor fusion is shifting from premium to volume segments.

Second-generation millimetre-wave architectures integrate digital beam-forming and AI-enhanced object classification on a single CMOS die. This reduces bill-of-materials and simplifies thermal design, helping radar to erode camera-only ADAS share. Suppliers that combine radar with inertial reference units promise high-accuracy odometry even when GPS is blocked, creating new value pools within the United States automotive sensors industry.

Powertrain systems accounted for 36.56% of 2024 spend, covering air-flow, knock, coolant-temperature and battery pack sensors. Compliance with Tier 3 emissions rules keeps powertrain allocations high. At the same time, ADAS and autonomous functions will expand at an 8.71% CAGR to 2030, raising their portion of the United States automotive sensors market size considerably. Ultrasonic, camera, radar and lidar combinations enable Level-2+ functions, while NHTSA's new automatic emergency-braking mandate locks in baseline volumes.

To meet redundancy targets, OEMs specify dual independent sensing paths for lateral and longitudinal control. This pushes total semiconductor count per vehicle past thousand mark by 2029, cementing ADAS as the fastest-growing budget line for sensors. Continuous over-the-air feature upgrades further stretch lifecycle revenue because dormant compute headroom can be monetised years after vehicle sale.

The United States Automotive Sensors Market Report is Segmented by Sensor Type (Temperature Sensors and More), Application (Powertrain and More), Vehicle Type (Motorcycles and More), Sales Channel (OEM and More), Propulsion (Internal Combustion Vehicles and More), and Sensor Technology (MEMS and More). The Market Forecasts are Provided in Terms of Value (USD) and Volume (Units).

List of Companies Covered in this Report:

1. Robert Bosch GmbH
2. DENSO Corporation
3. Continental AG
4. HELLA GmbH & Co. KGaA
5. Valeo SA
6. Texas Instruments Inc.
7. Infineon Technologies AG
8. NXP Semiconductors NV
9. Analog Devices Inc.
10. Hitachi Astemo Americas Inc.
11. Sensata Technologies
12. TE Connectivity
13. Aptiv PLC
14. STMicroelectronics NV
15. onsemi
16. BorgWarner Inc.
17. Renesas Electronics Corp.
18. Honeywell International Inc.
19. Allegro MicroSystems LLC
20. Microchip Technology Inc.

Additional Benefits:

• The market estimate (ME) sheet in Excel format
• 3 months of analyst support

TABLE OF CONTENTS

1 Introduction

• 1.1 Study Assumptions & Market Definition
• 1.2 Scope of the Study

2 Research Methodology

3 Executive Summary

4 Market Landscape

• 4.1 Market Overview
• 4.2 Market Drivers
  • 4.2.1 CHIPS Act Incentivizes On-Shore MEMS Fabs
  • 4.2.2 EV Adoption Pushes Sensor Content per Vehicle
  • 4.2.3 Federal TPMS, ESC & NCAP Upgrades
  • 4.2.4 Connected-Insurance Telematics Retrofits
  • 4.2.5 Software-Defined Vehicle Architectures
  • 4.2.6 Fleet Decarbonisation Targets (Corporate)
• 4.3 Market Restraints
  • 4.3.1 Silicon-Supply Water-Stress Constraints
  • 4.3.2 Cost & Price-Erosion Squeeze Tier-1 Margins
  • 4.3.3 Harsh-Duty Reliability & Calibration Issues
  • 4.3.4 Sensor-Level Cyber-Security Liabilities
• 4.4 Value / Supply-Chain Analysis
• 4.5 Regulatory Landscape
• 4.6 Technological Outlook
• 4.7 Sustainability & Energy-Footprint Analysis
• 4.8 Porter's Five Forces
  • 4.8.1 Threat of New Entrants
  • 4.8.2 Bargaining Power of Buyers/Consumers
  • 4.8.3 Bargaining Power of Suppliers
  • 4.8.4 Threat of Substitute Products
  • 4.8.5 Intensity of Competitive Rivalry

5 Market Size & Growth Forecasts (Value (USD) and Volume (Units))

• 5.1 By Sensor Type
  • 5.1.1 Temperature Sensors
  • 5.1.2 Pressure Sensors
  • 5.1.3 Speed / Velocity Sensors
  • 5.1.4 Level / Position Sensors
  • 5.1.5 Magnetic Sensors
  • 5.1.6 Gas / Chemical Sensors
  • 5.1.7 Inertial Sensors (Accel/Gyro)
  • 5.1.8 LiDAR Sensors
  • 5.1.9 Radar Sensors
  • 5.1.10 Ultrasonic Sensors
  • 5.1.11 Image / Camera Sensors
  • 5.1.12 Current Sensors
• 5.2 By Application
  • 5.2.1 Powertrain
  • 5.2.2 Body Electronics & Comfort
  • 5.2.3 Vehicle Security & Safety
  • 5.2.4 ADAS & Autonomous Systems
  • 5.2.5 Telematics & Connectivity
  • 5.2.6 Battery-Management (EV)
• 5.3 By Vehicle Type
  • 5.3.1 Motorcycles
  • 5.3.2 Passenger Cars
  • 5.3.3 Light Commercial Vehicles
  • 5.3.4 Heavy Commercial Vehicles
• 5.4 By Sales Channel
  • 5.4.1 OEM
  • 5.4.2 Aftermarket
• 5.5 By Propulsion
  • 5.5.1 Internal-Combustion Vehicles
  • 5.5.2 Hybrid Electric Vehicles
  • 5.5.3 Battery Electric Vehicles
  • 5.5.4 Fuel-Cell Electric Vehicles
• 5.6 By Sensor Technology
  • 5.6.1 MEMS
  • 5.6.2 Non-MEMS / Macro Sensors

6 Competitive Landscape

• 6.1 Market Concentration
• 6.2 Strategic Moves
• 6.3 Market Share Analysis
• 6.4 Company Profiles (Includes Global Level Overview, Market Level Overview, Core Segments, Financials as Available, Strategic Information, Market Rank/Share for Key Companies, Products and Services, SWOT Analysis, and Recent Developments)
  • 6.4.1 Robert Bosch GmbH
  • 6.4.2 DENSO Corporation
  • 6.4.3 Continental AG
  • 6.4.4 HELLA GmbH & Co. KGaA
  • 6.4.5 Valeo SA
  • 6.4.6 Texas Instruments Inc.
  • 6.4.7 Infineon Technologies AG
  • 6.4.8 NXP Semiconductors NV
  • 6.4.9 Analog Devices Inc.
  • 6.4.10 Hitachi Astemo Americas Inc.
  • 6.4.11 Sensata Technologies
  • 6.4.12 TE Connectivity
  • 6.4.13 Aptiv PLC
  • 6.4.14 STMicroelectronics NV
  • 6.4.15 onsemi
  • 6.4.16 BorgWarner Inc.
  • 6.4.17 Renesas Electronics Corp.
  • 6.4.18 Honeywell International Inc.
  • 6.4.19 Allegro MicroSystems LLC
  • 6.4.20 Microchip Technology Inc.

7 Market Opportunities & Future Outlook

• 7.1 White-space & Unmet-Need Assessment