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1137998

SLP（類基板 PCB）市場 - COVID-19 的增長、趨勢、影響和預測（2022-2027 年）

Substrate-Like-PCB Market - Growth, Trends, and Forecasts (2022 - 2027)
出版日期: | 出版商: Mordor Intelligence | 英文 110 Pages | 商品交期: 2-3個工作天內

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簡介目錄

SLP（類基板 PCB）市場預計在預測期間（2022-2027 年）將以 12% 的複合年增長率增長。

OEM、智能電器和可穿戴設備越來越多地採用 SLP（類基板 PCB），見證了 SLP（類基板 PCB）市場的增長。對小型化和高效互連解決方案的需求也促進了 SLP（類基板 PCB）市場的增長。目前，市場嚴重依賴高端智能手機的增長。

主要亮點

  • PCB 基板用作 PCB 板和設備主體其餘部分之間的介質，不會導致設備斷電或發生故障。兩個單元之間的互連器用於有效地將信號傳輸到連接的組件，減少連接總數並導致整體功耗。
  • 隨著智能手機 OEM 轉向 5G，他們越來越多地採用這種 SLP 技術，這是市場增長的主要驅動力。 5G SoC 供應商聯發科宣布，其 2020 年出貨量翻了一番，佔全球智能手機 SoC 的近 40%。這標誌著對 5G 設備的需求增加，預計這將推動預測期內 SLP 的增長。
  • 汽車生產和銷售的增加以及高級安全功能（其中一些是政府機構強制要求的）安裝的增加需要便利和舒適的系統。對混合動力電動汽車 (HEV) 和電池電動汽車的需求不斷增長是可能在預測期內推動市場增長的主要因素。
  • 某些挑戰將阻礙整個市場的發展。熟練勞動力短缺、缺乏標準和協議等因素正在限制市場增長。此外，與 SLP 相關的複雜集成系統和高成本設置預計將在預測期內放緩增長。
  • 隨著物聯網、5G 和智能汽車等技術趨勢的興起，PCB 尺寸正在縮小，並且需要更強大的基板。因此，SLP 將被大規模用於支持這些技術趨勢。
  • 基板製造極大地限制了全球芯片供應鏈。由於該行業相對較新且利潤率較低，因此該行業在市場上的投資不足。此外，大流行給現有運營帶來了巨大壓力，全球芯片短缺限制了 PC 銷售，迫使工廠關閉，以及由於密封電子設備導致成本增加。

主要市場趨勢

汽車行業推動市場增長

  • 目前，汽車越來越依賴電子元件。過去，電子電路僅用於前照燈開關和雨刮器，但如今的汽車廣泛使用電子電路。
  • 通過將印刷電路板整合到新的應用中，現代汽車可以從不斷發展的電子電路技術中受益。處理射頻、微波和毫米波等高頻信號的 PCB 經常用於已安裝在汽車中的傳感器應用中。事實上，曾經為軍用車輛保留的雷達技術現在已廣泛用於現代汽車中，用於在巡航控制期間進行防撞、盲點監控和自適應交通狀況。
  • 剛柔結合基板目前是物聯網設備設計中高耐用性的有力候選者。剛柔結合板不是單一的實心板，而是一系列用柔性走線連接在一起的小板。汽車振動很大，這給傳統的剛性板帶來了沉重的負擔。因此，許多車載電子製造商正在用更抗振、更小和更輕的柔性基板代替剛性基板。
  • 汽車有很大的振動，這給傳統的剛性板帶來了很大的壓力。因此，許多車載電子製造商都在採用柔性基板，這種基板具有出色的抗振性，可以做得更小、更輕，而不是剛性基板。
  • 隨著汽車生產和銷售數量的增加以及政府機構強制要求安裝的高級安全功能的不斷推進，人們需要具有高度便利性和舒適性的系統。對混合動力電動汽車 (HEV) 和電池電動汽車的需求不斷增長是推動預測期內市場增長的主要因素。

預計亞太地區將成為增長最快的市場

  • 亞太地區已成為 SLP 的新興市場，因為它作為大規模投資和業務擴張的機會而受到全球關注。在全球範圍內，超過一半的手機用戶位於亞太地區，包括中國和印度。此外，該地區正在見證用戶從 3G 到 4G 和 5G 技術的範式轉變。
  • 推動亞太地區 SLP 市場增長的主要因素是智能手機普及率的提高、對連接解決方案的需求不斷增加、互聯網用戶數量的增加、帶寬密集型應用程序的擴展以及擴大該地區的電信基礎設施。大多數智能手機供應商都是亞太地區的公司。在預測期內，預計亞太地區對 SLP 的需求將很大。
  • 韓國、台灣和日本的 SLP 製造商主導著生產活動。例如，台灣的 ZD Tech 和日本的 Meiko 正在為多個智能手機客戶在越南和中國擴展新的 SLP（類基板 PCB）生產線。台灣已成為 SLP 技術發展的主要地點之一。在中國，來自台灣的技術轉移將逐漸積累SLP（基板類PCB）技術訣竅。
  • 截至 2021 年 4 月，已有 70 個國家和城市宣布了到 2050 年實現 100% 零排放汽車和逐步淘汰內燃機汽車的目標。例如，日本政府制定了到 2050 年在國內停止使用內燃機汽車的目標，並正在努力實現這一目標。該國已開始向電動汽車購買者提供臨時補貼。
  • 2021 年 6 月，AT&S 宣布已選擇馬來西亞作為其在東南亞的首個生產基地，用於製造高端印刷電路板 (PCB) 和集成電路 (IC) 基板。
  • 按地區劃分，台灣、日本和中國等亞太國家在全球 PCB 市場中佔有很大份額。根據台灣2021年10月公佈的全國統計數據，2020年PCB產量較2019年增加5740萬平方尺或9.083%。中國和印度預計將在未來與台灣競爭，因為大規模的努力和投資將繼續與中國和印度分別制定的環境和健康法規同時進行。

競爭格局

隨著行業領導者主導市場份額，SLP（類基板 PCB）市場正在整合。主要參與者包括 Kinsus Interconnect Technology Corp.、Ibiden、Compeq Manufacturing、Daeduck Electronics、Unimicron Technology Corporation、臻鼎科技、Meiko Electronics、TTM Technologies、AT&S 等。

  • 2022 年 5 月- 總部位於美國的 TTM Technologies Inc (TTM) 宣布計劃在馬來西亞檳城新建一座高度自動化的印刷電路板 (PCB) 製造廠，到 2025 年產量將達到 1.3 億美元。提出了美國的資本投資提案10,000 美元。馬來西亞的擴張解決了人們對先進技術、PCB 供應鏈彈性和區域多樣性日益增長的擔憂。

其他好處

  • Excel 格式的市場預測 (ME) 表
  • 三個月的分析師支持

內容

第1章介紹

  • 研究假設和市場定義
  • 調查範圍

第2章研究方法

第 3 章執行摘要

第 4 章市場洞察

  • 市場概覽
  • 工業吸引力 - 波特五力分析
    • 供應商的議價能力
    • 買家的議價能力
    • 新進入者的威脅
    • 替代品的威脅
    • 競爭公司之間的敵對關係
  • 工業價值鏈分析

第五章市場動態

  • 市場驅動力
    • 對家用電器和智能設備的需求不斷擴大
  • 市場製約因素
    • 與 SLP 相關的高昂設置成本

第 6 章市場細分

  • 應用
    • 消費品
    • 汽車
    • 通訊
    • 其他應用
  • 按地區
    • 北美
    • 歐洲
    • 亞太地區
    • 世界其他地區

第 7 章競爭格局

  • 公司簡介
    • Kinsus Interconnect Technology Corp.
    • Ibiden Co.Ltd.
    • Compeq Manufacturing Co. Ltd.
    • Daeduck Electronics Co. Ltd.
    • Unimicron Technology Corporation
    • Zhen Ding Technology
    • TTM Technologies
    • Meiko Electronics
    • Austria Technologie & Systemtechnik Aktiengesellschaft

（AT&S社）

    • 韓國巡迴賽
    • LG Innotek Co., Ltd.
    • 三星電子 - 機械

第八章投資分析

第 9 章市場潛力

簡介目錄
Product Code: 66813

The Substrate-Like-PCB Market is expected to grow at a CAGR of 12% during the forecast period (2022 - 2027). Owing to the rising adoption of substrate-like PCB in OEMs, smart consumer electronics, and wearable devices, there is a growth in the substrate-like PCB market. The need for miniaturization and efficient interconnect solutions is also contributing to substrate-like PCB market growth. At present market is heavily dependent on high-end smartphone growth.

Key Highlights

  • A PCB substrate is used as a medium between the PCB Board and the rest of the device body without the loss of any power or misfiring of the device. Interconnectors between both units are utilized to efficiently transfer signals to connected components, reducing the total number of connections and, consequently, the total power consumption.
  • Smartphone OEMs are increasingly using this SLP technology with a shift toward 5G, which is acting as the main driver for the growth of the market. MediaTek, which offers 5G SoCs, announced a doubled shipment in 2020, announcing that they manufactured nearly 40% of global smartphone SoCs. This indicates the growing demand for 5G devices, which is estimated to fuel the growth of substrate-like PCBs during the forecast period.
  • Increasing automobile production and sales and the increased incorporation of advanced safety features, some of which are mandated by government bodies, demand convenience and comfort systems. The growing demand for hybrid electric vehicles (HEV) and battery electric vehicles are the major factors that may drive the market growth during the forecast period.
  • Certain challenges will hinder the overall market growth. Factors such as a shortage of skilled labor and the absence of standards and protocols limit the market growth. Furthermore, complicated integrated systems and high-cost setups associated with substrate-like PCB are expected to slow growth during the forecast period.
  • With the rising trends in technologies such as IoT, 5G, and smart cars, it is required that the size of the PCB would be miniaturized and the substrates become much more powerful. Thus, substrate-like PCB will be used at a massive scale to support these technological trends.
  • Substrate manufacturing has been a massive restraint on the global chip supply chain. The sector's relatively newer origins paired with low margins have forced underinvestment in the market. Moreover, the pandemic forced a severe strain on the existing order of operations, enforced a global chip shortage that constricted personal computer sales, enforced idle plants, and raised costs for electronic devices under lockdown conditions.

Key Market Trends

Automotive Industry to Drive the Market Growth

  • Currently, automobiles increasingly rely on electronic components. Unlike in the past, when electronic circuits were solely used for headlight switches and windshield wipers, current automobiles make extensive use of electronics.
  • By incorporating PCBs into certain novel applications, the latest autos take the benefit of ever-advancing electronic circuit technology. Sensor applications, which are already popular in autos, frequently require PCBs that work with high-frequency signals, such as RF, microwave, or millimeter-wave frequencies. In fact, radar technology, which was formerly only used in military vehicles, is also widely used in modern automobiles to help drivers avoid collisions, monitor blind spots, and adjust to traffic conditions when on cruise control.
  • Currently, rigid-flex PCBs have been witnessing significant traction candidates for achieving high durability in IoT device design. Instead of one solid board, they feature various smaller ones joined with flexible wiring. The high-vibration environment of an automobile can put a conventional rigid PCB under a lot of stress. As a result, many automotive electronics manufacturers are employing flexible PCBs instead of rigid PCBs, which are more vibration resistant while being smaller and lighter.
  • The high-vibration environment of an automobile can put a conventional rigid PCB under a lot of stress. As a result, many automotive electronics manufacturers are employing flexible PCBs instead of rigid PCBs, which are more vibration resistant while being smaller and lighter.
  • Increasing automobile production and sales and the increased incorporation of advanced safety features, some of which are mandated by government bodies, demand convenience and comfort systems. The growing demand for hybrid electric vehicles (HEV) and battery electric vehicles are the major factors that will drive market growth during the forecast period.

Asia Pacific is Expected to be the Fastest Growing Market

  • Asia-Pacific is an emerging market for substrate-like PCBs as it has become a global focal point for significant investments and business expansion opportunities. Globally, more than half of the mobile subscribers are present in Asia-Pacific, such as in China and India. Moreover, there has been a paradigm shift of users from 3G to 4G and 5G technology in this region.
  • Key factors that are driving the substrate-like-PCB market growth in the Asia-Pacific region include the increasing adoption of smartphones, rising demand for connectivity solutions, a growing number of internet users, expanding bandwidth-intensive applications, and expansion of telecommunications infrastructure in the region. The majority of the smartphone providers are from the Asia-Pacific region; it is expected that there will be a significant demand for substrate-like-PCB in the Asia-Pacific region during the forecast period.
  • Substrate-like-PCB manufacturers from South Korea, Taiwan, and Japan are dominating production activities. For instance, players like Taiwan-headquartered ZD Tech and japan-headquartered Meiko are expanding new substrate-like-PCB production lines in Vietnam and China for more than one smartphone customer. Taiwan has become one of the major places for the development of substrate-like-PCB technology. Certainly, China will gain substrate-like-PCB technical know-how progressively with technology transfer from the major player.
  • As of April 2021, 70 subnational and city governments announced 100% zero-emission vehicle targets or the phaseout of internal combustion engine vehicles before 2050. For instance, Japan's government has set a goal of eliminating the use of internal combustion engine vehicles in the country by 2050 to help achieve this goal. The country has begun granting one-time subsidies to buyers of electric vehicles.
  • In June 2021, AT&S announced that it chose Malaysia as its first production plant in Southeast Asia for the manufacturing of high-end printed circuit boards (PCB) and integrated circuit (IC) substrates.
  • Geographically, Asia-Pacific countries, such as Taiwan, Japan, and China, occupy a significant share of the global PCB landscape. According to Taiwan National Statistics published in October 2021, PCB production in 2020 increased by 57.4 million square feet, or 9.083%, as compared to 2019. China and India are expected to match Taiwan in the future, as massive efforts and investments have been ongoing in parallel with environmental and health-based regulations placed by China and India, respectively.

Competitive Landscape

The Substrate-Like-PCB Market is consolidated because the majority of the market share is owned by top players in the industry. Some of the key players include Kinsus Interconnect Technology Corp., Ibiden Co.Ltd., Compeq Manufacturing Co. Ltd., Daeduck Electronics Co. Ltd., Unimicron Technology Corporation, Zhen Ding Technology, Meiko Electronics, TTM Technologies, AT&S, among others.

  • May 2022 - TTM Technologies Inc (TTM), located in the United States, announced a plan to establish a new, highly automated printed circuit board (PCB) manufacturing factory in Penang, Malaysia, with a proposed capital investment of USD 130 million by 2025. The Malaysian expansion addresses rising concerns about advanced technology, PCB supply chain resilience, and regional diversity.

Additional Benefits:

  • The market estimate (ME) sheet in Excel format
  • 3 months of analyst support

TABLE OF CONTENTS

1 INTRODUCTION

  • 1.1 Study Assumptions and Market Definition
  • 1.2 Scope of the Study

2 RESEARCH METHODOLOGY

3 EXECUTIVE SUMMARY

4 MARKET INSIGHTS

  • 4.1 Market Overview
  • 4.2 Industry Attractiveness - Porter's Five Forces Analysis
    • 4.2.1 Bargaining Power of Suppliers
    • 4.2.2 Bargaining Power of Buyers
    • 4.2.3 Threat of New Entrants
    • 4.2.4 Threat of Substitute Products
    • 4.2.5 Intensity of Competitive Rivalry
  • 4.3 Industry Value Chain Analysis

5 MARKET DYNAMICS

  • 5.1 Market Drivers
    • 5.1.1 Increasing Demand for Consumer Electronics and Smart Devices
  • 5.2 Market Restraints
    • 5.2.1 Higher Setup Cost Associated with Substrate-like-PCB

6 MARKET SEGMENTATION

  • 6.1 Application
    • 6.1.1 Consumer Electronics
    • 6.1.2 Automotives
    • 6.1.3 Communication
    • 6.1.4 Other Applications
  • 6.2 Geography
    • 6.2.1 North America
    • 6.2.2 Europe
    • 6.2.3 Asia Pacific
    • 6.2.4 Rest of the World

7 COMPETITIVE LANDSCAPE

  • 7.1 Company Profiles
    • 7.1.1 Kinsus Interconnect Technology Corp.
    • 7.1.2 Ibiden Co.Ltd.
    • 7.1.3 Compeq Manufacturing Co. Ltd.
    • 7.1.4 Daeduck Electronics Co. Ltd.
    • 7.1.5 Unimicron Technology Corporation
    • 7.1.6 Zhen Ding Technology
    • 7.1.7 TTM Technologies
    • 7.1.8 Meiko Electronics
    • 7.1.9 Austria Technologie & Systemtechnik Aktiengesellschaft

(AT&S)

    • 7.1.10 Korea Circuit
    • 7.1.11 LG Innotek Co.Ltd
    • 7.1.12 Samsung Electro - Mechanics

8 INVESTMENT ANALYSIS

9 FUTURE OF THE MARKET