市場調查報告書
商品編碼
1210908
SLP(類基板 PCB)全球市場規模調查和預測:按應用(消費電子、汽車、通信)、區域分析,2022-2029 年Global Substrate-Like-PCB Market Size study & Forecast, by Application (Consumer Electronics, Automotive, Communication) and Regional Analysis, 2022-2029 |
Substrate-Like-PCB用作PCB板和器件主體之間的介質。
通過高效地將信號傳輸到連接的組件,您可以減少連接數量並最大限度地降低整體功耗。 由於對智能設備和電子設備的需求增加,以及對類基板PCB應用意識的增強,類基板PCB市場正在擴大。
根據 2021 年印度手機和電子協會 (ICER) 的數據,印度的電子產品出口增長迅速,在過去五年中翻了一番。 2019年,電子產品出口收入達到約150億美元。 主要出口項目包括智能手機,在過去五年中增長了約 38 億美元。 越來越多地進入汽車行業和市場參與者增加研發活動正在為市場創造有利可圖的機會。 然而,高昂的設置成本阻礙了整個 2022-2029 年預測期內的市場增長。
全球類基板 PCB 市場研究中考慮的主要區域是亞太地區、北美、歐洲、拉丁美洲和世界其他地區。 由於智能手機的普及、對連接解決方案的採用和需求增加以及互聯網用戶普及率的提高,亞太地區在收入方面佔據主導地位。 另一方面,由於市場參與者和用戶在預測期內從 3G 遷移到 4G 和 5G 技術的增長活動增加等因素,預計亞太地區在預測期內將顯著增長。
這項研究的目的是定義近年來各個細分市場和國家的市場規模,並預測未來幾年的價值。 該報告旨在捕捉被調查國家工業的定性和定量方面的情況。
它還提供了關鍵方面的詳細信息,例如決定市場未來增長的驅動因素和挑戰。 此外,它還包含供利益相關者投資的微觀市場潛在機會,以及對主要參與者的競爭格局和產品供應的深入分析。
Global Substrate-Like-PCB Market is valued at approximately USD XX billion in 2021 and is anticipated to grow with a healthy growth rate of more than XX % over the forecast period 2022-2029. Substrate-Like-PCB is used as a medium between the PCB board and the device body. It reduces the number of connections and minimizes overall power consumption by efficiently transferring signals to connected components. The Substrate-Like-PCB market is expanding because of factors such as the rising demand for smart devices & electronic devices and growing awareness towards the application of Substrate-like-PCB.
According to INDIA CELLULAR AND ELECTRONICS ASSOCIATION (ICER) in 2021, India's electronics exports are rising rapidly and get doubled in the past five years. In 2019 the revenue generation reached to approximately USD 15 billion from the export of electronic devices. The source also states that major export items include smartphones with increased growth of about USD 3.8 billion in the last five years. Whereas rising advancement towards the automobile sector and growing R&D activities by market players create lucrative opportunities for the market. However higher set-up cost hampers the market growth throughout the forecast period of 2022-2029.
The key regions considered for the Global Substrate-Like-PCB Market study include Asia Pacific, North America, Europe, Latin America, and the Rest of the World. The Asia Pacific dominated the market in terms of revenue, owing to the increasing adoption of smartphones, growing adoption and demand for connectivity solutions, and rising penetration of internet users. Whereas the Asia Pacific is expected to grow significantly during the forecast period, owing to factors such as increasing rising growth activities by market players, and the shift of users from 3G to 4G & 5G technologies in the forecast period
Major market players included in this report are:
Kinsus Interconnect Technology Corp.
Ibiden Co.Ltd.
Compeq Manufacturing Co. Ltd.
Daeduck Electronics Co. Ltd.
Unimicron Technology Corporation
Zhen Ding Technology
TTM Technologies
Meiko Electronics
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
Korea Circuit
Recent Developments in the Market:
Global Substrate-Like-PCB Market Report Scope:
Historical Data: 2019-2020-2021
Base Year for Estimation: 2021
Forecast period: 2022-2029
Report Coverage: Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends
Segments Covered: Application, Region
Regional Scope: North America; Europe; Asia Pacific; Latin America; Rest of the World
Customization Scope: Free report customization (equivalent up to 8 analyst's working hours) with purchase. Addition or alteration to country, regional & segment scope*
The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.
The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:
By Application:
Consumer Electronics,
Automotive,
Communication
By Region:
North America
U.S.
Canada
Europe
UK
Germany
France
Spain
Italy
ROE
Asia Pacific
China
India
Japan
Australia
South Korea
RoAPAC
Latin America
Brazil
Mexico
Rest of the World
List of tables and figures and dummy in nature, final lists may vary in the final deliverable
List of figures
List of tables and figures and dummy in nature, final lists may vary in the final deliverable