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熱固性模塑膠市場報告：趨勢、預測和競爭分析（至2035年）

Thermoset Molding Compound Market Report: Trends, Forecast and Competitive Analysis to 2035
出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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熱固性模塑膠市場

受汽車、航太以及電氣和電子市場機會的推動，全球熱固性模塑複合材料市場前景光明。預計到2035年，全球熱固性模塑複合材料市場規模將達到187億美元，高於2027年的132億美元，2027年至2035年的複合年成長率（CAGR）為6.0%。該市場的主要促進因素包括對重金屬需求的成長、飛機和運輸設備安全性的提高，以及對具有熱穩定性和耐腐蝕性的複合材料日益成長的需求。

  • 根據 Lucintel 的預測，由於酚醛樹脂在工業應用中的廣泛使用以及其優異的耐熱性，預計在整個預測期內，酚醛樹脂細分市場仍將是最大的細分市場。
  • 從應用領域來看，由於電動車和先進安全系統的日益普及，汽車產業預計將在整個預測期內呈現最高的成長率。
  • 從區域來看，亞太地區預計將在整個預測期內保持最大規模，這主要得益於印度和中國政府為建設智慧城市和現代化基礎設施所採取的措施。

熱固性模塑膠市場的新趨勢

2025年至2027年間，隨著車輛電氣化及其他電力電子產品、可再生能源和基礎設施建設等領域新要求的訂定，熱固性模塑膠預計將從通用型產品轉向高性能工程產品。根據Lucintel預測，這一市場將持續存在，高價值供應商將憑藉工廠位置、當地能源成本以及是否符合環境法規等因素，與價格競爭型製造商區分開來。

  • 永續性：預計從2025年起，歐洲製造商將擴大生物基樹脂的使用，並開始揭露其產品的碳足跡。熱固性樹脂廢棄物的回收也將加速推進。客戶的具體要求將與減少範圍3排放相關。我們需要展望未來三到五年。
  • 數位製造：透過將模擬和感測器數據與機器學習 (ML) 相結合來評估零件質量，減少複合材料和成型工藝的變異性，使製造商能夠在 2025 年前預測和控制工藝，並顯著減少廢品。
  • 電氣化：2024年，全球電動車銷量超過1700萬輛。電動車的持續成長將增加對用於電池和充電模組製造的熱固性模塑膠的需求。此外，到2030年，熱固性模塑膠將在與傳統引擎用化合物相同的應用領域受益於電動車的發展。
  • 輕量化材料：在汽車行業，使用玻璃纖維增強模塑複合材料替代金屬支架和蓋板以進一步減輕重量的趨勢預計將在2025年繼續保持。輕量化是一項至關重要的競爭優勢，尤其是在滿足日益嚴格的排放氣體法規方面。因此，模塑複合材料的使用量預計將會增加。
  • 區域供應鏈多元化：從 2025 年到 2027 年，東南亞、北美和歐洲電子製造業的擴張（加上半導體產業的成長）預計將增加對在地採購的模塑化合物的需求。

熱固性模塑膠廣泛應用於需要耐熱、電絕緣、尺寸穩定性和耐火性能的場合。專注於模塑製程自動化、配方改進和降低碳排放的供應商將擴大市場佔有率。而那些不具備特殊性能的模塑膠將面臨更大的價格壓力。

熱固性模塑膠市場的最新趨勢

預計到2025年，熱固性模塑膠市場將更加強勁，主要驅動力來自半導體封裝市場以及汽車和其他工業設備市場。在此期間，產業關注點預計將轉向低空隙率、熱性能和其他認證標準等方面的差異化因素。

  • 產能提升：據報道，住友貝利萊特公司計劃在2025年投資超過100億日元，用於建造新的半導體封裝生產線。在此期間，其他供應商預計也將獲得產品認證，以改善其區域供應鏈和供貨能力。
  • 電動車：汽車複合材料製造商正與電動車零件製造商合作，為其用於電力電子封裝的阻燃環氧樹脂和酚醛系統申請認證。許多此類項目針對的是800V或更高的封裝電壓，這就要求封裝具備電氣和熱絕緣能力。
  • 收購：2025 年，許多耐熱熱固性化合物和封裝的製造商繼續收購小規模的公司，以加強其研發和銷售能力。
  • 新產品發布：2025年，多種熱固性模塑膠系統問世，以便更好地滿足汽車和半導體產業的規格要求。這些體系中許多都含有改質劑減少翹曲和製程缺陷，並可在低於175°C的模具溫度下進行成型。
  • 區域生產：亞洲供應商正在擴大本地生產規模，以滿足區域內對半導體封裝的需求。與此同時，北美和歐洲的半導體客戶正在尋求雙重供應來源。近期公佈的產能擴張計畫（年產量超過1萬噸）將對供應鏈產生正面影響，並降低對單一國家的依賴。

半導體封裝市場仍將是具有優異熱穩定性和耐熱性的化合物的最大市場。電動車市場的蓬勃發展將進一步推動這個市場的發展。擁有穩定標準化配方的本土半導體封裝供應商將贏得市場。預計市場競爭將十分公平，但如果化合物能夠提升半導體封裝品質並減少成型缺陷，客戶將願意支付更高的價格。

目錄

第1章：摘要整理

第2章 市場概覽

  • 背景與分類
  • 供應鏈

第3章 市場趨勢與預測分析

  • 產業促進因素與挑戰
  • PESTLE分析
  • 專利分析
  • 法規環境

第4章 全球熱固性模塑膠市場：按類型分類

  • 吸引力分析：按類型
  • 酚醛樹脂
  • 環氧樹脂
  • 聚酯樹脂
  • 尿素甲醛
  • 三聚氰胺和甲醛
  • 其他

第5章 全球熱固性塑膠市場：依最終用途分類

  • 吸引力分析：按最終用途
  • 車
  • 航太
  • 電氣和電子設備
  • 其他

第6章 區域分析

第7章：北美熱固性塑膠市場

  • 北美熱固性模塑膠市場：按類型分類
  • 北美熱固性模塑膠市場：依最終用途分類
  • 美國熱固性模塑膠市場
  • 墨西哥熱固性模塑膠市場
  • 加拿大熱固性模塑膠市場

第8章：歐洲熱固性模塑膠市場

  • 歐洲熱固性模塑膠市場：按類型分類
  • 歐洲熱固性模塑膠市場：依最終用途分類
  • 德國熱固性模塑膠市場
  • 法國熱固性模塑膠市場
  • 西班牙熱固性模塑膠市場
  • 義大利熱固性模塑膠市場
  • 英國熱固性模塑膠市場

第9章：亞太地區熱固性模塑膠市場

  • 亞太地區熱固性模塑膠市場：按類型分類
  • 亞太地區熱固性模塑膠市場：依最終用途分類
  • 日本熱固性模塑膠市場
  • 印度熱固性模塑膠市場
  • 中國熱固性模塑膠市場
  • 韓國熱固性模塑膠市場
  • 印尼熱固性模塑膠市場

第10章：世界其他地區熱固性塑膠市場

  • 其他地區熱固性模塑膠市場：按類型分類
  • 其他地區熱固性模塑膠市場：依最終用途分類
  • 中東熱固性模塑膠市場
  • 南美洲熱固性模塑膠市場
  • 非洲熱固性模塑膠市場

第11章 競爭分析

  • 產品系列分析
  • 業務整合
  • 波特五力分析
  • 市佔率分析

第12章 機會與策略分析

  • 價值鏈分析
  • 成長機會分析
  • 新趨勢：全球熱固性模塑膠市場
  • 戰略分析

第13章：價值鏈中關鍵企業的公司概況

  • Competitive Analysis
  • Ashland Holding
  • BASF
  • Eastman chemical company
  • Evonik
  • Hexion
  • Huntsman
  • Kolon Industries
  • Kyocera chemical
  • Plastics engineering company
  • Rogers

第14章附錄

Thermoset Molding Compound Market

The future of the global thermoset molding compound market looks promising with opportunities in the automotive, aerospace, and electrical and electronics markets. The global thermoset molding compound market is expected to reach an estimated $18.7 billion by 2035 from $13.2 billion in 2027 with a CAGR of 6.0% from 2027 to 2035. The major drivers for this market are growing need for heavy metals, rising safety in aircraft and transportation, as well as increasing necessity for thermal stability and corrosive composites.

  • Lucintel forecasts that, within the type category, phenolic resin segment will remain the largest segment over the forecast period due to widespread industrial use and excellent heat resistance properties.
  • Within the application category, automotive is expected to witness the highest growth over the forecast period due to rising adoption of electric vehicles and advanced safety systems.
  • In terms of regions, APAC will remain the largest region over the forecast period due to government efforts in India and China to construct smart cities and contemporary infrastructure.

Emerging Trends in Thermoset Molding Compound Market

Thermoset molding compounds will shift from commodity to engineered performance between 2025 and 2027 with the introduction of new requirements for automotive electrification and other power electronics, renewable energy, and infrastructure equipment. According to Lucintel, a sustained market will exist, and higher-value suppliers will be differentiated from price-fighting producers by location of their facilities, local energy costs, and compliance with environmental regulations.

  • Sustainability: From 2025, European manufacturers will begin increasing the use of bio-based resins, and report product carbon footprints; thermoset waste recycling will also gain momentum. Customer specifications will relate to the reduction of Scope 3 emissions. Anticipate a look ahead of 3 to 5 years.
  • Digital Manufacturing: Simulation and sensor data, integrated with ML to evaluate part quality, reduced process variability in compounding and molding to a degree that 2025 manufacturers were able to predict and control their processes to significantly reduce scrap.
  • Electrification: Global sales of electric vehicles surpassed 17 million in 2024. The continued growth of electric vehicles will increase the demand for thermoset molding compounds to manufacture battery and charging modules. Thermoset molding compounds will also benefit from e-mobility for the same applications as traditional engine compounds, to 2030.
  • Lightweight Materials: Use of glass fiber-reinforced molding compounds to substitute metal brackets and covers in the auto industry in 2025, to further reduce weight, is a trend that is likely to continue. Weight reduction will be a critical competitive edge, and particularly so to meet ever increasing stringent emissions requirements. Hence, expect increase in use of molding compounds.
  • Regional Supply Chain Diversification: Increase in electronics manufacturing in Southeast Asia, North America and Europe (in combination with increase in the semiconductor industry) between 2025 to 2027, will increase demand for locally sourced molding compounds.

Thermoset molding compounds will be used where there is a need for heat resistance, electrical insulation, dimensional stability, and fire performance. Compound suppliers that automate their molding processes, improve their formulations and reduce their carbon footprint will increase their market share. Molding compounds without special features will be subjected to greater price pressures.

Recent Developments in the Thermoset Molding Compound Market

The thermoset molding compound market is expected to become more active by 2025, primarily for the semiconductor packaging market, and the automotive and other industries' equipment markets. During this time, we expect the industry focus will shift to low void content, thermal performance, and other qualification differentiators.

  • Capacity Additions: In 2025, Sumitomo Bakelite was reported to have invested more than 10 billion Japanese Yen to build a new semiconductor encapsulation capacity. Other suppliers are expected to qualify to improve regional supply and availability during this time.
  • Electric Vehicles: Automotive compounders have partnered with electric vehicle component manufacturers to qualify flame-retardant epoxy and phenolic systems for power electronics packages. Many of these programs are targeting package voltages of 800 V and above, requiring packages with electrical and thermal insulation.
  • Acquisitions: In 2025, many high-temperature thermoset compound and encapsulant companies continued to acquire smaller companies to strengthen their R&D and sales capabilities.
  • Product Launches: Several thermoset molding compound systems were introduced in 2025 to be more compliant to automotive and semiconductor specifications. Many of these systems contain modifiers to help reduce warpage and process scrap, and allow mold temperatures below 175 degrees Celsius.
  • Regional Production: Asian suppliers are increasing local production to meet regional semiconductor packaging demands. Meanwhile, North American and European semiconductor customers are looking for dual supply sources. The recently announced expansion (greater than 10,000 tons/year) would positively impact the supply chain and reduce dependence on a single country.

The semiconductor packaging market will continue to be the largest market for thermally stable and high-temperature compounds. The evolution of the electric vehicle market will additionally drive this market. Local semiconductor packaging suppliers with consistent and compliant formulations will win the market. Fair competition is expected, but customers will accept a premium if the compound improves the quality of the semiconductor packages and decreases molding defects.

Strategic Growth Opportunities in the Thermoset Molding Compound Market

The thermoset molding compound market is rapidly evolving with the ongoing trends of component electrification, lightweighting and stringent fire regulation. Between 2024 and 2026, the capacity additions and automotive cycle redesigns are expected to create a wider market beyond the traditional electrical hardware. Lucintel's perspective on this market also indicates that for suppliers, practical growth levers are likely to be material substitution and location-specific manufacturing.

  • Electric Vehicle Components: In January 2025, global EV sales exceeded 1.8 million units, according to Rho Motion. Thermoset molding compounds will gain from the increased demand to insulate, provide dimensional stability and flame resistance for busbar supports, battery housings and enclosures for power-electronics and charging. Furthermore, higher-voltage and more powerful architectures are likely to gain traction to replace metal and basic plastics.
  • Semiconductor Packaging: Epoxy molding compounds can address advanced packages with low moisture absorption and thermal expansion control. TSMC announced its 2024 revenue at NT$2.89 trillion in February 2025, attributable to the strong demand for chips. We expect packaging complexity and regional fab investment to create premium opportunities for materials in the next three to five years.
  • Renewable-energy Equipment: Sustainable growth is forecast in the electric and energy storage systems markets, and durable electric assemblies will continue to be in high demand. The International Energy Agency expects cumulative renewable capacity additions to reach 5,500 GW by 2030, with the majority being solar capacity additions. Longer-cycle infrastructure programs can benefit companies that qualify their compounds for outdoor, harsh environments.
  • Aerospace and Defense: High-temperature and flame-retardant molding compounds can enable replacement of machined parts in connectors and assemblies in the avionics system. Airbus delivered 793 commercial aircraft in 2025, thus sustaining demand for qualified, lightweight components. We expect certification to be a barrier to entry for the industry in the next five years.
  • Bio-based Formulations: Improved bio-derived phenolic and epoxy systems enable manufacturers to create more consistent processes for partial bio-derived formulations. In March 2025, the European Union's Packaging and Packaging Waste Regulation took effect and increased the need to decrease the fossil content in packaging. As embodied-carbon requirements are adopted by procurement, sustainable formulations will gain additional attention.

Market players that integrate formulation science and engineering will benefit the most. In the short-term, the largest volume opportunity will be in automotive. In the long-term, the best margin opportunities will be in aerospace and semiconductor packaging. The closest production to the customer will benefit the most because it will provide shorter qualification cycles. Companies will benefit the most by focusing on certified formulations, as well as recycle and bio-based feedstocks, and having a tech service team in the area of the largest manufacturing clusters.

Thermoset Molding Compound Market Drivers and Challenges

The thermoset molding compound market Will Experience Growth Due To The Following Factors: Technology, increased demand for electronics, economic investment, sustainability, and changes in regulations. Other factors include the goals and constraints of the industry. The interacting factors impact the future competition and growth of the industry.

Drivers for thermoset molding compound market Are: -

  • Miniaturization of Electronics: Demand for smaller and lighter electronics has led to use of epoxy molding compounds for semiconductor encapsulation. In January 2025, it was reported that the global semiconductor sales were approximately $57 billion, creating a need for advanced packaging materials. In next three to five years, artificial intelligence hardware, electric vehicles, and connected devices are expected to increase the demand for compounds that offer superior thermal management, electrical insulation, and dimensional stability.
  • Electric Vehicle Penetration: Electric vehicles utilize thermoset compounds for various components including power modules, battery components and charging systems and sensors, as well as for insulation. 2025 saw global sales of electric vehicles cross the 20 million unit mark, which increased the need for lightweight molding compounds. Next three to five years may see increased battery voltages and faster charging, as well as more sophisticated power-electronics systems. This may lead to increase in use of compounds with improved thermal, electrical, and mechanical properties.
  • Technology Advancements: Continuous advancements in molding compound formulations enable improved flow characteristics, and faster cure. In March 2025, manufacturers of semiconductors commenced mass production of devices with package sizes below 3 nanometers. Next three to five years, focus may be on development of materials that enable enhanced yield and reduced defects in molding, and improve design flexibility.
  • Sustainability and Regulatory Support: Various environmental regulations are promoting manufacturers to lower their carbon footprint and improve the safety of the materials they use. The EU further strengthened its requirements in February 2025 to regulate substances of concern (especially for controlling restrictions and expanding its end-of-life product consideration). There will be an increased focus on low-halogen, recyclable, bio-based, and lower-emission thermosets in the next three to five years.
  • Manufacturing Efficiency: There has been a greater focus on high-volume molding for consumer and automotive electronics. In 2025, many electronics manufacturers further automated molding and product inspection systems to further reduce the need for human labor. There will be continued improvements in processes, integration of stronger digital systems, control systems, and predictive maintenance, especially in curing systems.

The challenges facing this market include:

  • Price Volatility of Raw Materials: Those raw materials can be highly unpredictable (i.e. oil, petrochemicals, etc.). Prices could have a major effect on the profit margin of manufacturers in the thermoset molding industry. There will be greater demand for lower-weight formulations, especially in the next three to five years.
  • Recycling and End-of-Life Limitations: Thermoset materials form permanent cross-links, making them difficult to remelt and reshape. As such, they are nearly impossible to recycle using conventional techniques. In January 2025, several European initiatives continued to progress recovery and circularity goals. In the near future, lack of recyclability may hinder use in sustainable applications. There may also be growing interest in chemical recycling and sustainable designs that incorporate, for example, renewable raw materials or extended product life to reduce waste.
  • Strict Qualification and Supply-Chain Risks: The automotive, aerospace, and electronics industries require mat stone thermoset materials for components that must withstand thermal cycling, humidity, flammability, and other performance, reliability, and safety tests. Given the lengthy qualification tests and difficult approval processes, competing manufacturers may be able to take advantage of supply disruptions and fulfill the needs of the market. In the near future, suppliers offering global support, and reliable and flexible manufacturing capabilities will be able to gain a competitive edge.

Drivers, including the miniaturization of electronics, the electrification of automobiles, and the need for manufacturing processes and materials to be more sustainable, are expected to stimulate the thermoset molding compounds market during the forecast period. These trends and others are leading to increased demand for lightweight, thermally stable, and affordable insulating materials. Despite the growth potential, some limitations and risks may negatively impact the thermoset molding compound market. These include the high cost of raw materials, volatility in the price of raw materials, lack of recyclability, and the extended and rigid approval processes.

List of Thermoset Molding Compound Market Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. Through these strategies thermoset molding compound market companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the thermoset molding compound market companies profiled in this report include-

  • Ashland Holding
  • BASF
  • Eastman Chemical Company
  • Evonik
  • Hexion
  • Huntsman
  • Kolon Industries
  • Kyocera Chemical
  • Plastics Engineering Company
  • Rogers

Thermoset Molding Compound Market by Segment

The study includes a forecast for the global thermoset molding compound by type, end use, and region.

Thermoset Molding Compound Market by Type [Value ($B) from 2019 to 2035]:

  • Phenolic Resin
  • Epoxy Resin
  • Polyester Resin
  • Urea Formaldehyde
  • Melamine Formaldehyde
  • Others

Thermoset Molding Compound Market by End Use [Value ($B) from 2019 to 2035]:

  • Automotive
  • Aerospace
  • Electrical and Electronics
  • Others

Thermoset Molding Compound Market by Region [Value ($B) from 2019 to 2035]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

Country Wise Outlook for the Thermoset Molding Compound Market

The molding compound market is evolving as a result of the ongoing transformation in the electronics and automotive industries and corporate decisions at the industrial scale. Between 2025 and 2027, investment focus is likely to be on compression molding, epoxy encapsulation, and lower emission molding compounds. According to Lucintel's latest market analysis, the positioning of suppliers is related to the depth of their qualifications and the geographical location of their production sites.

  • United States: Investment in epoxy molding compounds for semiconductor packaging is on the rise. In January 2025, the U.S. Department of Commerce awarded up to $407 million of the CHIPS Program to Amkor Technology to build an advanced packaging facility in Arizona. This will strengthen U.S. packaging capacity and increase domestic qualification opportunities.
  • China: The government's March 2025 work report promised to continue advancement of the integrated circuit industry, with some domestic compound producers increasing their electronic materials production capacity. Domestic sourcing requirements and ramping chip production will broaden qualification volumes for molding compound producers.
  • Germany: Investments are flowing into the electrification and power electronics segments of the automotive and industrial end markets; in February 2025, Infineon opened its €5 billion Power Semiconductor and Analog device facility in Dresden. Higher European production of power semiconductors will create additional demand for thermoset encapsulation and molding materials.
  • India: After years of delays, the semiconductor manufacturing policy is being implemented; in February 2025, the Government approved Tata Electronics' ₹22,516 crore semiconductor assembly and test facility in Assam. Local semiconductor assembly will create a new customer base for epoxy molding compounds and transfer molding equipment.
  • Japan: Government funding is supporting Japanese advanced packaging; in April 2025, Rapidus reported ongoing work for 2-nanometer logic in Hokkaido. Latest generation packaging and chiplets initiatives are driving the development of more precise molding compounds.

Features of the Global Thermoset Molding Compound Market

  • Market Size Estimates: thermoset molding compound market size estimation in terms of value ($B).
  • Trend and Forecast Analysis: Market trends (2019 to 2026) and forecast (2027 to 2035) by various segments and regions.
  • Segmentation Analysis: thermoset molding compound market size by type, end use, and region in terms of value ($B).
  • Regional Analysis: thermoset molding compound market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different type, end use, and regions for the thermoset molding compound market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape of the thermoset molding compound market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

If you are looking to expand your business in this or adjacent markets, then contact us. We have done hundreds of strategic consulting projects in market entry, opportunity screening, due diligence, supply chain analysis, M & A, and more.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the thermoset molding compound market by type (phenolic resin, epoxy resin, polyester resin, urea formaldehyde, melamine formaldehyde, and others), end use (automotive, aerospace, electrical and electronics, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 8 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Market Overview

  • 2.1 Background and Classifications
  • 2.2 Supply Chain

3. Market Trends & Forecast Analysis

  • 3.2 Industry Drivers and Challenges
  • 3.3 PESTLE Analysis
  • 3.4 Patent Analysis
  • 3.5 Regulatory Environment

4. Global Thermoset Molding Compound Market by Type

  • 4.1 Overview
  • 4.2 Attractiveness Analysis by Type
  • 4.3 Phenolic Resin: Trends and Forecast (2019-2035)
  • 4.4 Epoxy Resin: Trends and Forecast (2019-2035)
  • 4.5 Polyester Resin: Trends and Forecast (2019-2035)
  • 4.6 Urea Formaldehyde: Trends and Forecast (2019-2035)
  • 4.7 Melamine Formaldehyde: Trends and Forecast (2019-2035)
  • 4.8 Others: Trends and Forecast (2019-2035)

5. Global Thermoset Molding Compound Market by End Use

  • 5.1 Overview
  • 5.2 Attractiveness Analysis by End Use
  • 5.3 Automotive: Trends and Forecast (2019-2035)
  • 5.4 Aerospace: Trends and Forecast (2019-2035)
  • 5.5 Electrical and Electronics: Trends and Forecast (2019-2035)
  • 5.6 Others: Trends and Forecast (2019-2035)

6. Regional Analysis

  • 6.1 Overview
  • 6.2 Global Thermoset Molding Compound Market by Region

7. North American Thermoset Molding Compound Market

  • 7.1 Overview
  • 7.2 North American Thermoset Molding Compound Market by Type
  • 7.3 North American Thermoset Molding Compound Market by End Use
  • 7.4 United States Thermoset Molding Compound Market
  • 7.5 Mexican Thermoset Molding Compound Market
  • 7.6 Canadian Thermoset Molding Compound Market

8. European Thermoset Molding Compound Market

  • 8.1 Overview
  • 8.2 European Thermoset Molding Compound Market by Type
  • 8.3 European Thermoset Molding Compound Market by End Use
  • 8.4 German Thermoset Molding Compound Market
  • 8.5 French Thermoset Molding Compound Market
  • 8.6 Spanish Thermoset Molding Compound Market
  • 8.7 Italian Thermoset Molding Compound Market
  • 8.8 United Kingdom Thermoset Molding Compound Market

9. APAC Thermoset Molding Compound Market

  • 9.1 Overview
  • 9.2 APAC Thermoset Molding Compound Market by Type
  • 9.3 APAC Thermoset Molding Compound Market by End Use
  • 9.4 Japanese Thermoset Molding Compound Market
  • 9.5 Indian Thermoset Molding Compound Market
  • 9.6 Chinese Thermoset Molding Compound Market
  • 9.7 South Korean Thermoset Molding Compound Market
  • 9.8 Indonesian Thermoset Molding Compound Market

10. ROW Thermoset Molding Compound Market

  • 10.1 Overview
  • 10.2 ROW Thermoset Molding Compound Market by Type
  • 10.3 ROW Thermoset Molding Compound Market by End Use
  • 10.4 Middle Eastern Thermoset Molding Compound Market
  • 10.5 South American Thermoset Molding Compound Market
  • 10.6 African Thermoset Molding Compound Market

11. Competitor Analysis

  • 11.1 Product Portfolio Analysis
  • 11.2 Operational Integration
  • 11.3 Porter's Five Forces Analysis
    • Competitive Rivalry
    • Bargaining Power of Buyers
    • Bargaining Power of Suppliers
    • Threat of Substitutes
    • Threat of New Entrants
  • 11.4 Market Share Analysis

12. Opportunities & Strategic Analysis

  • 12.1 Value Chain Analysis
  • 12.2 Growth Opportunity Analysis
    • 12.2.1 Growth Opportunities by Type
    • 12.2.2 Growth Opportunities by End Use
  • 12.3 Emerging Trends in the Global Thermoset Molding Compound Market
  • 12.4 Strategic Analysis
    • 12.4.1 New Product Development
    • 12.4.2 Certification and Licensing
    • 12.4.3 Mergers, Acquisitions, Agreements, Collaborations, and Joint Ventures

13. Company Profiles of the Leading Players Across the Value Chain

  • 13.1 Competitive Analysis
  • 13.2 Ashland Holding
    • Company Overview
    • Thermoset Molding Compound Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.3 BASF
    • Company Overview
    • Thermoset Molding Compound Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.4 Eastman chemical company
    • Company Overview
    • Thermoset Molding Compound Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.5 Evonik
    • Company Overview
    • Thermoset Molding Compound Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.6 Hexion
    • Company Overview
    • Thermoset Molding Compound Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.7 Huntsman
    • Company Overview
    • Thermoset Molding Compound Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.8 Kolon Industries
    • Company Overview
    • Thermoset Molding Compound Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.9 Kyocera chemical
    • Company Overview
    • Thermoset Molding Compound Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.10 Plastics engineering company
    • Company Overview
    • Thermoset Molding Compound Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.11 Rogers
    • Company Overview
    • Thermoset Molding Compound Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing

14. Appendix

  • 14.1 List of Figures
  • 14.2 List of Tables
  • 14.3 Research Methodology
  • 14.4 Disclaimer
  • 14.5 Copyright
  • 14.6 Abbreviations and Technical Units
  • 14.7 About Us
  • 14.8 Contact Us

List of Figures

  • Figure 1.1: Trends and Forecast for the Global Thermoset Molding Compound Market
  • Figure 2.1: Usage of Thermoset Molding Compound Market
  • Figure 2.2: Classification of the Global Thermoset Molding Compound Market
  • Figure 2.3: Supply Chain of the Global Thermoset Molding Compound Market
  • Figure 3.1: Driver and Challenges of the Thermoset Molding Compound Market
  • Figure 3.2: PESTLE Analysis
  • Figure 3.3: Patent Analysis
  • Figure 3.4: Regulatory Environment
  • Figure 4.1: Global Thermoset Molding Compound Market by Type in 2019, 2026, and 2035
  • Figure 4.2: Trends of the Global Thermoset Molding Compound Market ($B) by Type
  • Figure 4.3: Forecast for the Global Thermoset Molding Compound Market ($B) by Type
  • Figure 4.4: Trends and Forecast for Phenolic Resin in the Global Thermoset Molding Compound Market (2019-2035)
  • Figure 4.5: Trends and Forecast for Epoxy Resin in the Global Thermoset Molding Compound Market (2019-2035)
  • Figure 4.6: Trends and Forecast for Polyester Resin in the Global Thermoset Molding Compound Market (2019-2035)
  • Figure 4.7: Trends and Forecast for Urea Formaldehyde in the Global Thermoset Molding Compound Market (2019-2035)
  • Figure 4.8: Trends and Forecast for Melamine Formaldehyde in the Global Thermoset Molding Compound Market (2019-2035)
  • Figure 4.9: Trends and Forecast for Others in the Global Thermoset Molding Compound Market (2019-2035)
  • Figure 5.1: Global Thermoset Molding Compound Market by End Use in 2019, 2026, and 2035
  • Figure 5.2: Trends of the Global Thermoset Molding Compound Market ($B) by End Use
  • Figure 5.3: Forecast for the Global Thermoset Molding Compound Market ($B) by End Use
  • Figure 5.4: Trends and Forecast for Automotive in the Global Thermoset Molding Compound Market (2019-2035)
  • Figure 5.5: Trends and Forecast for Aerospace in the Global Thermoset Molding Compound Market (2019-2035)
  • Figure 5.6: Trends and Forecast for Electrical and Electronics in the Global Thermoset Molding Compound Market (2019-2035)
  • Figure 5.7: Trends and Forecast for Others in the Global Thermoset Molding Compound Market (2019-2035)
  • Figure 6.1: Trends of the Global Thermoset Molding Compound Market ($B) by Region (2019-2026)
  • Figure 6.2: Forecast for the Global Thermoset Molding Compound Market ($B) by Region (2027-2035)
  • Figure 7.1: North American Thermoset Molding Compound Market by Type in 2019, 2026, and 2035
  • Figure 7.2: Trends of the North American Thermoset Molding Compound Market ($B) by Type (2019-2026)
  • Figure 7.3: Forecast for the North American Thermoset Molding Compound Market ($B) by Type (2027-2035)
  • Figure 7.4: North American Thermoset Molding Compound Market by End Use in 2019, 2026, and 2035
  • Figure 7.5: Trends of the North American Thermoset Molding Compound Market ($B) by End Use (2019-2026)
  • Figure 7.6: Forecast for the North American Thermoset Molding Compound Market ($B) by End Use (2027-2035)
  • Figure 7.7: Trends and Forecast for the United States Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 7.8: Trends and Forecast for the Mexican Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 7.9: Trends and Forecast for the Canadian Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 8.1: European Thermoset Molding Compound Market by Type in 2019, 2026, and 2035
  • Figure 8.2: Trends of the European Thermoset Molding Compound Market ($B) by Type (2019-2026)
  • Figure 8.3: Forecast for the European Thermoset Molding Compound Market ($B) by Type (2027-2035)
  • Figure 8.4: European Thermoset Molding Compound Market by End Use in 2019, 2026, and 2035
  • Figure 8.5: Trends of the European Thermoset Molding Compound Market ($B) by End Use (2019-2026)
  • Figure 8.6: Forecast for the European Thermoset Molding Compound Market ($B) by End Use (2027-2035)
  • Figure 8.7: Trends and Forecast for the German Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 8.8: Trends and Forecast for the French Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 8.9: Trends and Forecast for the Spanish Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 8.10: Trends and Forecast for the Italian Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 8.11: Trends and Forecast for the United Kingdom Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 9.1: APAC Thermoset Molding Compound Market by Type in 2019, 2026, and 2035
  • Figure 9.2: Trends of the APAC Thermoset Molding Compound Market ($B) by Type (2019-2026)
  • Figure 9.3: Forecast for the APAC Thermoset Molding Compound Market ($B) by Type (2027-2035)
  • Figure 9.4: APAC Thermoset Molding Compound Market by End Use in 2019, 2026, and 2035
  • Figure 9.5: Trends of the APAC Thermoset Molding Compound Market ($B) by End Use (2019-2026)
  • Figure 9.6: Forecast for the APAC Thermoset Molding Compound Market ($B) by End Use (2027-2035)
  • Figure 9.7: Trends and Forecast for the Japanese Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 9.8: Trends and Forecast for the Indian Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 9.9: Trends and Forecast for the Chinese Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 9.10: Trends and Forecast for the South Korean Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 9.11: Trends and Forecast for the Indonesian Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 10.1: ROW Thermoset Molding Compound Market by Type in 2019, 2026, and 2035
  • Figure 10.2: Trends of the ROW Thermoset Molding Compound Market ($B) by Type (2019-2026)
  • Figure 10.3: Forecast for the ROW Thermoset Molding Compound Market ($B) by Type (2027-2035)
  • Figure 10.4: ROW Thermoset Molding Compound Market by End Use in 2019, 2026, and 2035
  • Figure 10.5: Trends of the ROW Thermoset Molding Compound Market ($B) by End Use (2019-2026)
  • Figure 10.6: Forecast for the ROW Thermoset Molding Compound Market ($B) by End Use (2027-2035)
  • Figure 10.7: Trends and Forecast for the Middle Eastern Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 10.8: Trends and Forecast for the South American Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 10.9: Trends and Forecast for the African Thermoset Molding Compound Market ($B) (2019-2035)
  • Figure 11.1: Porter's Five Forces Analysis of the Global Thermoset Molding Compound Market
  • Figure 11.2: Market Share (%) of Top Players in the Global Thermoset Molding Compound Market (2026)
  • Figure 12.1: Growth Opportunities for the Global Thermoset Molding Compound Market by Type
  • Figure 12.2: Growth Opportunities for the Global Thermoset Molding Compound Market by End Use
  • Figure 12.3: Growth Opportunities for the Global Thermoset Molding Compound Market by Region
  • Figure 12.4: Emerging Trends in the Global Thermoset Molding Compound Market

List of Tables

  • Table 1.1: Growth Rate (%, 2025-2026) and CAGR (%, 2027-2035) of the Thermoset Molding Compound Market by Type and End Use
  • Table 1.2: Attractiveness Analysis for the Thermoset Molding Compound Market by Region
  • Table 1.3: Global Thermoset Molding Compound Market Parameters and Attributes
  • Table 3.1: Trends of the Global Thermoset Molding Compound Market (2019-2026)
  • Table 3.2: Forecast for the Global Thermoset Molding Compound Market (2027-2035)
  • Table 4.1: Attractiveness Analysis for the Global Thermoset Molding Compound Market by Type
  • Table 4.2: Market Size and CAGR of Various Type in the Global Thermoset Molding Compound Market (2019-2026)
  • Table 4.3: Market Size and CAGR of Various Type in the Global Thermoset Molding Compound Market (2027-2035)
  • Table 4.4: Trends of Phenolic Resin in the Global Thermoset Molding Compound Market (2019-2026)
  • Table 4.5: Forecast for Phenolic Resin in the Global Thermoset Molding Compound Market (2027-2035)
  • Table 4.6: Trends of Epoxy Resin in the Global Thermoset Molding Compound Market (2019-2026)
  • Table 4.7: Forecast for Epoxy Resin in the Global Thermoset Molding Compound Market (2027-2035)
  • Table 4.8: Trends of Polyester Resin in the Global Thermoset Molding Compound Market (2019-2026)
  • Table 4.9: Forecast for Polyester Resin in the Global Thermoset Molding Compound Market (2027-2035)
  • Table 4.10: Trends of Urea Formaldehyde in the Global Thermoset Molding Compound Market (2019-2026)
  • Table 4.11: Forecast for Urea Formaldehyde in the Global Thermoset Molding Compound Market (2027-2035)
  • Table 4.12: Trends of Melamine Formaldehyde in the Global Thermoset Molding Compound Market (2019-2026)
  • Table 4.13: Forecast for Melamine Formaldehyde in the Global Thermoset Molding Compound Market (2027-2035)
  • Table 4.14: Trends of Others in the Global Thermoset Molding Compound Market (2019-2026)
  • Table 4.15: Forecast for Others in the Global Thermoset Molding Compound Market (2027-2035)
  • Table 5.1: Attractiveness Analysis for the Global Thermoset Molding Compound Market by End Use
  • Table 5.2: Market Size and CAGR of Various End Use in the Global Thermoset Molding Compound Market (2019-2026)
  • Table 5.3: Market Size and CAGR of Various End Use in the Global Thermoset Molding Compound Market (2027-2035)
  • Table 5.4: Trends of Automotive in the Global Thermoset Molding Compound Market (2019-2026)
  • Table 5.5: Forecast for Automotive in the Global Thermoset Molding Compound Market (2027-2035)
  • Table 5.6: Trends of Aerospace in the Global Thermoset Molding Compound Market (2019-2026)
  • Table 5.7: Forecast for Aerospace in the Global Thermoset Molding Compound Market (2027-2035)
  • Table 5.8: Trends of Electrical and Electronics in the Global Thermoset Molding Compound Market (2019-2026)
  • Table 5.9: Forecast for Electrical and Electronics in the Global Thermoset Molding Compound Market (2027-2035)
  • Table 5.10: Trends of Others in the Global Thermoset Molding Compound Market (2019-2026)
  • Table 5.11: Forecast for Others in the Global Thermoset Molding Compound Market (2027-2035)
  • Table 6.1: Market Size and CAGR of Various Regions in the Global Thermoset Molding Compound Market (2019-2026)
  • Table 6.2: Market Size and CAGR of Various Regions in the Global Thermoset Molding Compound Market (2027-2035)
  • Table 7.1: Trends of the North American Thermoset Molding Compound Market (2019-2026)
  • Table 7.2: Forecast for the North American Thermoset Molding Compound Market (2027-2035)
  • Table 7.3: Market Size and CAGR of Various Type in the North American Thermoset Molding Compound Market (2019-2026)
  • Table 7.4: Market Size and CAGR of Various Type in the North American Thermoset Molding Compound Market (2027-2035)
  • Table 7.5: Market Size and CAGR of Various End Use in the North American Thermoset Molding Compound Market (2019-2026)
  • Table 7.6: Market Size and CAGR of Various End Use in the North American Thermoset Molding Compound Market (2027-2035)
  • Table 7.7: Trends and Forecast for the United States Thermoset Molding Compound Market (2019-2035)
  • Table 7.8: Trends and Forecast for the Mexican Thermoset Molding Compound Market (2019-2035)
  • Table 7.9: Trends and Forecast for the Canadian Thermoset Molding Compound Market (2019-2035)
  • Table 8.1: Trends of the European Thermoset Molding Compound Market (2019-2026)
  • Table 8.2: Forecast for the European Thermoset Molding Compound Market (2027-2035)
  • Table 8.3: Market Size and CAGR of Various Type in the European Thermoset Molding Compound Market (2019-2026)
  • Table 8.4: Market Size and CAGR of Various Type in the European Thermoset Molding Compound Market (2027-2035)
  • Table 8.5: Market Size and CAGR of Various End Use in the European Thermoset Molding Compound Market (2019-2026)
  • Table 8.6: Market Size and CAGR of Various End Use in the European Thermoset Molding Compound Market (2027-2035)
  • Table 8.7: Trends and Forecast for the German Thermoset Molding Compound Market (2019-2035)
  • Table 8.8: Trends and Forecast for the French Thermoset Molding Compound Market (2019-2035)
  • Table 8.9: Trends and Forecast for the Spanish Thermoset Molding Compound Market (2019-2035)
  • Table 8.10: Trends and Forecast for the Italian Thermoset Molding Compound Market (2019-2035)
  • Table 8.11: Trends and Forecast for the United Kingdom Thermoset Molding Compound Market (2019-2035)
  • Table 9.1: Trends of the APAC Thermoset Molding Compound Market (2019-2026)
  • Table 9.2: Forecast for the APAC Thermoset Molding Compound Market (2027-2035)
  • Table 9.3: Market Size and CAGR of Various Type in the APAC Thermoset Molding Compound Market (2019-2026)
  • Table 9.4: Market Size and CAGR of Various Type in the APAC Thermoset Molding Compound Market (2027-2035)
  • Table 9.5: Market Size and CAGR of Various End Use in the APAC Thermoset Molding Compound Market (2019-2026)
  • Table 9.6: Market Size and CAGR of Various End Use in the APAC Thermoset Molding Compound Market (2027-2035)
  • Table 9.7: Trends and Forecast for the Japanese Thermoset Molding Compound Market (2019-2035)
  • Table 9.8: Trends and Forecast for the Indian Thermoset Molding Compound Market (2019-2035)
  • Table 9.9: Trends and Forecast for the Chinese Thermoset Molding Compound Market (2019-2035)
  • Table 9.10: Trends and Forecast for the South Korean Thermoset Molding Compound Market (2019-2035)
  • Table 9.11: Trends and Forecast for the Indonesian Thermoset Molding Compound Market (2019-2035)
  • Table 10.1: Trends of the ROW Thermoset Molding Compound Market (2019-2026)
  • Table 10.2: Forecast for the ROW Thermoset Molding Compound Market (2027-2035)
  • Table 10.3: Market Size and CAGR of Various Type in the ROW Thermoset Molding Compound Market (2019-2026)
  • Table 10.4: Market Size and CAGR of Various Type in the ROW Thermoset Molding Compound Market (2027-2035)
  • Table 10.5: Market Size and CAGR of Various End Use in the ROW Thermoset Molding Compound Market (2019-2026)
  • Table 10.6: Market Size and CAGR of Various End Use in the ROW Thermoset Molding Compound Market (2027-2035)
  • Table 10.7: Trends and Forecast for the Middle Eastern Thermoset Molding Compound Market (2019-2035)
  • Table 10.8: Trends and Forecast for the South American Thermoset Molding Compound Market (2019-2035)
  • Table 10.9: Trends and Forecast for the African Thermoset Molding Compound Market (2019-2035)
  • Table 11.1: Product Mapping of Thermoset Molding Compound Suppliers Based on Segments
  • Table 11.2: Operational Integration of Thermoset Molding Compound Manufacturers
  • Table 11.3: Rankings of Suppliers Based on Thermoset Molding Compound Revenue
  • Table 12.1: New Product Launches by Major Thermoset Molding Compound Producers (2019-2026)
  • Table 12.2: Certification Acquired by Major Competitor in the Global Thermoset Molding Compound Market