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1855186

自動銀燒結晶片貼裝機市場報告:趨勢、預測及競爭分析(至2031年)

Automatic Silver Sintering Die Attach Machine Market Report: Trends, Forecast and Competitive Analysis to 2031

出版日期: | 出版商: Lucintel | 英文 150 Pages | 商品交期: 3個工作天內

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由於功率半導體裝置、射頻功率裝置和高性能LED市場的巨大機遇,全球自動銀燒結晶片貼裝機市場前景廣闊。預計2025年至2031年,該市場將以7.1%的複合年成長率成長。推動該市場成長的關鍵因素包括:對高功率元件的需求不斷成長、先進封裝技術的應用日益廣泛以及對溫度控管解決方案的需求不斷增加。

  • Lucintel 預測,按類型分類,全自動機器在預測期內將實現高速成長。
  • 從應用領域來看,功率半導體裝置、射頻功率元件和高效能LED預計將達到最高成長。
  • 從區域來看,預計亞太地區在預測期內將達到最高成長。

全自動銀燒結晶片黏接機的市場趨勢

由於先進電子封裝領域對更高效、更可靠的晶片貼裝解決方案的需求,自動化銀燒結晶片貼裝機市場正在快速發展。幾個關鍵趨勢正在推動這一發展進程。

  • 自動化和提高產量:開發能夠實現更高產量的全自動機器,以滿足大規模生產的需求,尤其是在汽車和消費性電子產業。這包括縮短生產週期和整合物料輸送系統。
  • 提高微型化精度:隨著電子設備變得越來越小、整合度越來越高,對晶片貼裝機的需求也越來越大,這些貼裝機能夠在微型零件的燒結過程中實現更高的貼裝精度和更精細的控制。
  • 整合先進製程控制:現代機器採用精密的感測器和軟體,即時監控和控制燒結過程中的壓力、溫度和時間,確保晶片連接始終如一的高品質。
  • 靈活支援各種基板:為了滿足功率模組、LED 和射頻裝置等應用的各種需求,對能夠處理更廣泛的物料輸送和尺寸的機器的需求日益成長。
  • 無壓燒結能力的發展:雖然壓力輔助燒結很常見,但人們對支援特定應用無壓燒結的機器越來越感興趣,並對其進行了開發,這可能會簡化工藝並減少對精密模具的壓力。

這些新興趨勢再形成自動化銀燒結晶片貼裝機市場,使其朝著更自動化、精確、靈活和可控的解決方案發展,從而在先進電子組件中實現更廣泛的應用和更高的品質。

自動銀燒結晶片黏接機市場的最新趨勢

近年來,自動銀燒結晶片貼裝機市場的發展趨勢主要集中在提高效率、可靠性以及擴大這些機器在半導體封裝領域的應用範圍。

  • 高功率燒結頭的開發:新的機器設計採用了一種燒結頭,可以施加更大的力並進行更精確的控制,從而提高燒結接頭的結合強度並減少空隙的形成。
  • 先進的視覺系統整合:實施增強型視覺系統,以實現更精確的模具放置和對準,這對於高精度應用和處理非常小的模具至關重要。
  • 引入多頭燒結機:為了提高產量,一些製造商正在開發允許多個燒結頭並行運作的設備,從而顯著提高生產能力。
  • 溫度控制均勻性得到改善:加熱系統的進步使得整個燒結區域的溫度分佈更加均勻,從而確保大晶粒和多晶粒封裝的黏合品質一致。
  • 即時製程監控和資料登錄:現代化的設備配備了先進的感測器和軟體,可即時監控關鍵過程參數並記錄數據,以實現可追溯性和品質保證。

這些發展正在影響自動化銀燒結晶片貼裝機市場,從而提高了產量、精度和品管,使銀燒結成為更可行、更有效率的晶片貼裝解決方案,適用於更廣泛的電子設備。

目錄

第1章執行摘要

第2章 市場概覽

  • 背景和分類
  • 供應鏈

第3章:市場趨勢與預測分析

  • 產業促進因素與挑戰
  • PESTLE分析
  • 專利分析
  • 法規環境

第4章 全球自動銀燒結晶片接合機市場(按類型分類)

  • 概述
  • 按類型進行吸引力分析
  • 完全自動化:趨勢與預測(2019-2031)
  • 半自治:趨勢與預測(2019-2031)

5. 全球自動銀燒結晶片黏接機市場(依應用領域分類)

  • 概述
  • 透過用途進行吸引力分析
  • 功率半導體裝置:趨勢與預測(2019-2031)
  • 射頻功率元件:趨勢與預測(2019-2031)
  • 高效能LED:趨勢與預測(2019-2031)
  • 其他:趨勢與預測(2019-2031 年)

第6章 區域分析

  • 概述
  • 全球自動銀燒結晶片黏接機市場(按地區分類)

7. 北美自動銀燒結晶片接合機市場

  • 概述
  • 北美自動銀燒結模具貼裝機市場(按類型分類)
  • 北美自動銀燒結晶片貼裝機市場(按應用領域分類)
  • 美國自動銀燒結模具組裝機市場
  • 墨西哥自動銀燒結模具貼裝機市場
  • 加拿大自動銀燒結模具組裝機市場

8. 歐洲自動銀燒結晶片接合機市場

  • 概述
  • 歐洲自動銀燒結模具貼裝機市場按類型分類
  • 歐洲自動銀燒結晶片貼裝機市場(按應用領域分類)
  • 德國自動銀燒結模具組裝機市場
  • 法國全自動銀燒結模具組裝機市場
  • 西班牙全自動銀燒結模具組裝機市場
  • 義大利全自動銀燒結模具組裝機市場
  • 英國自動銀燒結模具組裝機市場

9. 亞太地區自動銀燒結晶片接合機市場

  • 概述
  • 亞太地區自動銀燒結晶片貼裝機市場(按類型分類)
  • 亞太地區自動銀燒結晶片貼裝機市場(依應用領域分類)
  • 日本自動銀燒結模具貼裝機市場
  • 印度自動銀燒結模具組裝機市場
  • 中國全自動銀燒結晶片接合機市場
  • 韓國全自動銀燒結模具組裝機市場
  • 印尼自動銀燒結模具貼裝機市場

第10章 世界其他地區自動銀燒結晶片貼裝機市場

  • 概述
  • 世界其他地區自動銀燒結晶片貼裝機市場(按類型分類)
  • 世界其他地區自動銀燒結晶片貼裝機市場(按應用領域分類)
  • 中東自動銀燒結模焊機市場
  • 南美洲自動銀燒結模具組裝機市場
  • 非洲自動銀燒結模具組裝機市場

第11章 競爭分析

  • 產品系列分析
  • 營運整合
  • 波特五力分析
    • 競爭對手之間的競爭
    • 買方的議價能力
    • 供應商的議價能力
    • 替代品的威脅
    • 新進入者的威脅
  • 市佔率分析

第12章:機會與策略分析

  • 價值鏈分析
  • 成長機會分析
    • 按類型分類的成長機會
    • 透過申請獲得發展機會
  • 全球自動銀燒結晶片黏接機市場新興趨勢
  • 戰略分析
    • 新產品開發
    • 認證和許可
    • 合併、收購、協議、合作關係和合資企業

第13章 價值鏈主要企業的公司概況

  • Competitive Analysis
  • Boschman
  • ASMPT
  • AMX Automatrix
  • NIKKISO
  • PINK GmbH Thermosysteme
  • Zhuhai Silicon Cool Technology
  • Shenzhen Advanced Joining
  • Quick Intelligent Equipment
  • Chenglian Kaida Technology
  • JH Advanced Semiconductor

第14章附錄

  • 圖表清單
  • 表格列表
  • 調查方法
  • 免責聲明
  • 版權
  • 簡稱和技術單位
  • 關於 Lucintel
  • 詢問

The future of the global automatic silver sintering die attach machine market looks promising with opportunities in the power semiconductor device, rf power device, and high performance led markets. The global automatic silver sintering die attach machine market is expected to grow with a CAGR of 7.1% from 2025 to 2031. The major drivers for this market are the increasing demand for high power devices, the rising use in advanced packaging technologies, and the growing need for thermal management solutions.

  • Lucintel forecasts that, within the type category, fully automatic is expected to witness higher growth over the forecast period.
  • Within the application category, power semiconductor device, RF power device, and high performance LED is expected to witness the highest growth.
  • In terms of region, APAC is expected to witness the highest growth over the forecast period.

Emerging Trends in the Automatic Silver Sintering Die Attach Machine Market

The automatic silver sintering die attach machine market is evolving rapidly, driven by the need for more efficient and reliable die attachment solutions in advanced electronics packaging. Several key trends are shaping this evolution.

  • Increased Automation and Throughput: A primary trend is the development of fully automated machines capable of higher throughput to meet the demands of mass production, especially in automotive and consumer electronics. This involves faster cycle times and integrated material handling systems.
  • Enhanced Precision for Miniaturization: With the trend towards smaller and more integrated electronic devices, there's a growing need for die attach machines with higher placement accuracy and finer control over the sintering process for miniaturized components.
  • Integration of Advanced Process Control: Modern machines are incorporating sophisticated sensors and software for real-time monitoring and control of pressure, temperature, and time during the sintering process, ensuring consistent and high-quality die attachment.
  • Flexibility in Handling Diverse Substrates: There's an increasing demand for machines that can handle a wider variety of substrate materials and sizes, catering to the diverse requirements of applications like power modules, LEDs, and RF devices.
  • Development of Pressureless Sintering Capabilities: While pressure-assisted sintering is common, there's a growing interest in and development of machines supporting pressureless silver sintering for certain applications, simplifying the process and potentially reducing stress on delicate dies.

These emerging trends are reshaping the automatic silver sintering die attach machine market towards more automated, precise, flexible, and controlled solutions, enabling wider adoption and higher quality in advanced electronic assembly.

Recent Developments in the Automatic Silver Sintering Die Attach Machine Market

Recent developments in the automatic silver sintering die attach machine market are focused on improving efficiency, reliability, and the range of applications these machines can serve in semiconductor packaging.

  • Development of High-Force Sintering Heads: New machine designs incorporate sintering heads capable of applying higher and more precisely controlled forces, leading to improved bonding strength and reduced void formation in the sintered joint.
  • Integration of Advanced Vision Systems: Enhanced vision systems are being implemented for more accurate die placement and alignment, crucial for high-precision applications and handling of very small dies.
  • Introduction of Multi-Head Machines: To increase throughput, some manufacturers are developing machines with multiple sintering heads operating in parallel, significantly boosting production capacity.
  • Improved Temperature Control Uniformity: Advancements in heating systems ensure more uniform temperature distribution across the sintering area, resulting in consistent bonding quality for larger dies and multi-die packages.
  • Real-time Process Monitoring and Data Logging: Modern machines are equipped with sophisticated sensors and software that monitor key process parameters in real-time and log the data for traceability and quality assurance.

These developments are impacting the automatic silver sintering die attach machine market by enabling higher production volumes, greater precision, and improved quality control, making silver sintering a more viable and efficient die attach solution for a wider range of electronic devices.

Strategic Growth Opportunities in the Automatic Silver Sintering Die Attach Machine Market

The automatic silver sintering die attach machine market has significant strategic growth opportunities by targeting key applications where the benefits of silver sintering are particularly advantageous.

  • Electric Vehicle Power Modules: The increasing demand for high-performance and reliable power modules in EVs drives the need for advanced silver sintering die attach machines due to the superior thermal management required.
  • High-Power LED Packaging: Silver sintering provides excellent thermal dissipation for high-power LEDs, leading to growth opportunities for die attach machines in the manufacturing of efficient and long-lasting lighting solutions.
  • Silicon Carbide (SiC) and Gallium Nitride (GaN) Devices: These wide-bandgap semiconductors, used in power electronics and RF applications, benefit significantly from the high thermal conductivity of silver sintering, creating growth in their assembly.
  • Automotive Electronics (Non-EV): Applications like advanced driver-assistance systems (ADAS) and engine control units require robust die attachment, making silver sintering machines a strategic choice.
  • 5G Infrastructure Components: The high power and thermal management requirements of components used in 5G base stations and other communication equipment present growth opportunities for silver sintering die attach.

These strategic growth opportunities highlight the increasing importance of automatic silver sintering die attach machines in enabling the advancement and wider adoption of high-performance electronic devices across various rapidly growing sectors.

Automatic Silver Sintering Die Attach Machine Market Driver and Challenges

The automatic silver sintering die attach machine market is propelled by the performance advantages of silver sintering in demanding applications, but its growth is also shaped by certain economic and technological considerations.

The factors responsible for driving the automatic silver sintering die attach machine market include:

1. Superior Thermal and Electrical Conductivity: Silver sintering offers significantly better thermal and electrical performance compared to traditional solder, crucial for high-power and high-frequency devices.

2. Demand for High Reliability: Applications in automotive, aerospace, and power electronics require highly reliable die attachment, which silver sintering can provide.

3. Miniaturization and Higher Power Density: The trend towards smaller and more powerful electronic devices necessitates advanced die attach solutions like silver sintering.

4. Stringent Environmental Regulations: The move towards lead-free assembly processes favors alternatives like silver sintering.

5. Increasing Adoption of Wide-Bandgap Semiconductors: SiC and GaN devices, with their high operating temperatures, benefit greatly from silver sintering's thermal properties.

Challenges in the automatic silver sintering die attach machine market are:

1. Higher Initial Equipment Cost: Automatic silver sintering die attach machines typically have a higher upfront cost compared to traditional die bonders.

2. Material Costs of Silver Paste/Film: The cost of silver sintering materials can be higher than that of solder.

3. Process Optimization and Standardization: Optimizing the sintering process parameters for different applications and achieving industry-wide standardization can be complex.

The automatic silver sintering die attach machine market is driven by the performance and reliability advantages of silver sintering in advanced electronics. Overcoming the challenges related to initial costs, material expenses, and process optimization will be key to broader market adoption.

List of Automatic Silver Sintering Die Attach Machine Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies automatic silver sintering die attach machine companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the automatic silver sintering die attach machine companies profiled in this report include-

  • Boschman
  • ASMPT
  • AMX Automatrix
  • NIKKISO
  • PINK GmbH Thermosysteme
  • Zhuhai Silicon Cool Technology
  • Shenzhen Advanced Joining
  • Quick Intelligent Equipment
  • Chenglian Kaida Technology
  • JH Advanced Semiconductor

Automatic Silver Sintering Die Attach Machine Market by Segment

The study includes a forecast for the global automatic silver sintering die attach machine market by type, application, and region.

Automatic Silver Sintering Die Attach Machine Market by Type [Value from 2019 to 2031]:

  • Fully Automatic
  • Semi-Automatic

Automatic Silver Sintering Die Attach Machine Market by Application [Value from 2019 to 2031]:

  • Power Semiconductor Device
  • RF Power Device
  • High Performance LED
  • Others

Automatic Silver Sintering Die Attach Machine Market by Region [Value from 2019 to 2031]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

Country Wise Outlook for the Automatic Silver Sintering Die Attach Machine Market

The automatic silver sintering die attach machine market is witnessing increased adoption due to the superior thermal and electrical conductivity offered by silver sintering compared to traditional soldering. Recent developments focus on enhancing throughput, precision for smaller components, and the ability to handle diverse substrate materials to meet the growing demands of power electronics, automotive, and advanced packaging industries globally.

  • United States: The US market emphasizes advanced equipment for high-reliability applications in aerospace, defense, and electric vehicles. Recent developments include machines with enhanced force control and temperature profiling for consistent sintering quality, alongside integration with automation systems for higher production efficiency of complex power modules.
  • China: China's market is characterized by rapid expansion in semiconductor manufacturing and electric vehicle production, driving demand for high-volume, cost-effective silver sintering die attach machines. Recent developments include domestic manufacturers improving the speed and stability of their equipment and focusing on localization of key components.
  • Germany: Germany, with its strong automotive and industrial sectors, demands high-precision and robust silver sintering die attach machines. Recent advancements include machines with integrated quality control systems and the ability to handle large power modules with consistent sintering across the entire die area.
  • India: The Indian market is in a growth phase, driven by increasing electronics manufacturing and the adoption of EVs. Recent developments may include the introduction of more automated and versatile silver sintering machines, catering to a wider range of applications beyond basic semiconductor assembly.
  • Japan: Japan, a leader in precision manufacturing and advanced electronics, focuses on high-accuracy and reliable silver sintering die attach machines for miniaturized components and power devices. Recent developments include machines with finer placement accuracy and improved process control for complex multi-chip modules.

Features of the Global Automatic Silver Sintering Die Attach Machine Market

  • Market Size Estimates: Automatic silver sintering die attach machine market size estimation in terms of value ($B).
  • Trend and Forecast Analysis: Market trends (2019 to 2024) and forecast (2025 to 2031) by various segments and regions.
  • Segmentation Analysis: Automatic silver sintering die attach machine market size by type, application, and region in terms of value ($B).
  • Regional Analysis: Automatic silver sintering die attach machine market breakdown by North America, Europe, Asia Pacific, and Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the automatic silver sintering die attach machine market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape of the automatic silver sintering die attach machine market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the automatic silver sintering die attach machine market by type (fully automatic and semi-automatic), application (power semiconductor device, rf power device, high performance led, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Market Overview

  • 2.1 Background and Classifications
  • 2.2 Supply Chain

3. Market Trends & Forecast Analysis

  • 3.2 Industry Drivers and Challenges
  • 3.3 PESTLE Analysis
  • 3.4 Patent Analysis
  • 3.5 Regulatory Environment

4. Global Automatic Silver Sintering Die Attach Machine Market by Type

  • 4.1 Overview
  • 4.2 Attractiveness Analysis by Type
  • 4.3 Fully Automatic: Trends and Forecast (2019-2031)
  • 4.4 Semi-automatic: Trends and Forecast (2019-2031)

5. Global Automatic Silver Sintering Die Attach Machine Market by Application

  • 5.1 Overview
  • 5.2 Attractiveness Analysis by Application
  • 5.3 Power Semiconductor Device: Trends and Forecast (2019-2031)
  • 5.4 RF Power Device: Trends and Forecast (2019-2031)
  • 5.5 High Performance LED: Trends and Forecast (2019-2031)
  • 5.6 Others: Trends and Forecast (2019-2031)

6. Regional Analysis

  • 6.1 Overview
  • 6.2 Global Automatic Silver Sintering Die Attach Machine Market by Region

7. North American Automatic Silver Sintering Die Attach Machine Market

  • 7.1 Overview
  • 7.2 North American Automatic Silver Sintering Die Attach Machine Market by Type
  • 7.3 North American Automatic Silver Sintering Die Attach Machine Market by Application
  • 7.4 United States Automatic Silver Sintering Die Attach Machine Market
  • 7.5 Mexican Automatic Silver Sintering Die Attach Machine Market
  • 7.6 Canadian Automatic Silver Sintering Die Attach Machine Market

8. European Automatic Silver Sintering Die Attach Machine Market

  • 8.1 Overview
  • 8.2 European Automatic Silver Sintering Die Attach Machine Market by Type
  • 8.3 European Automatic Silver Sintering Die Attach Machine Market by Application
  • 8.4 German Automatic Silver Sintering Die Attach Machine Market
  • 8.5 French Automatic Silver Sintering Die Attach Machine Market
  • 8.6 Spanish Automatic Silver Sintering Die Attach Machine Market
  • 8.7 Italian Automatic Silver Sintering Die Attach Machine Market
  • 8.8 United Kingdom Automatic Silver Sintering Die Attach Machine Market

9. APAC Automatic Silver Sintering Die Attach Machine Market

  • 9.1 Overview
  • 9.2 APAC Automatic Silver Sintering Die Attach Machine Market by Type
  • 9.3 APAC Automatic Silver Sintering Die Attach Machine Market by Application
  • 9.4 Japanese Automatic Silver Sintering Die Attach Machine Market
  • 9.5 Indian Automatic Silver Sintering Die Attach Machine Market
  • 9.6 Chinese Automatic Silver Sintering Die Attach Machine Market
  • 9.7 South Korean Automatic Silver Sintering Die Attach Machine Market
  • 9.8 Indonesian Automatic Silver Sintering Die Attach Machine Market

10. ROW Automatic Silver Sintering Die Attach Machine Market

  • 10.1 Overview
  • 10.2 ROW Automatic Silver Sintering Die Attach Machine Market by Type
  • 10.3 ROW Automatic Silver Sintering Die Attach Machine Market by Application
  • 10.4 Middle Eastern Automatic Silver Sintering Die Attach Machine Market
  • 10.5 South American Automatic Silver Sintering Die Attach Machine Market
  • 10.6 African Automatic Silver Sintering Die Attach Machine Market

11. Competitor Analysis

  • 11.1 Product Portfolio Analysis
  • 11.2 Operational Integration
  • 11.3 Porter's Five Forces Analysis
    • Competitive Rivalry
    • Bargaining Power of Buyers
    • Bargaining Power of Suppliers
    • Threat of Substitutes
    • Threat of New Entrants
  • 11.4 Market Share Analysis

12. Opportunities & Strategic Analysis

  • 12.1 Value Chain Analysis
  • 12.2 Growth Opportunity Analysis
    • 12.2.1 Growth Opportunities by Type
    • 12.2.2 Growth Opportunities by Application
  • 12.3 Emerging Trends in the Global Automatic Silver Sintering Die Attach Machine Market
  • 12.4 Strategic Analysis
    • 12.4.1 New Product Development
    • 12.4.2 Certification and Licensing
    • 12.4.3 Mergers, Acquisitions, Agreements, Collaborations, and Joint Ventures

13. Company Profiles of the Leading Players Across the Value Chain

  • 13.1 Competitive Analysis
  • 13.2 Boschman
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.3 ASMPT
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.4 AMX Automatrix
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.5 NIKKISO
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.6 PINK GmbH Thermosysteme
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.7 Zhuhai Silicon Cool Technology
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.8 Shenzhen Advanced Joining
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.9 Quick Intelligent Equipment
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.10 Chenglian Kaida Technology
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing
  • 13.11 JH Advanced Semiconductor
    • Company Overview
    • Automatic Silver Sintering Die Attach Machine Business Overview
    • New Product Development
    • Merger, Acquisition, and Collaboration
    • Certification and Licensing

14. Appendix

  • 14.1 List of Figures
  • 14.2 List of Tables
  • 14.3 Research Methodology
  • 14.4 Disclaimer
  • 14.5 Copyright
  • 14.6 Abbreviations and Technical Units
  • 14.7 About Us
  • 14.8 Contact Us

List of Figures

  • Figure 1.1: Trends and Forecast for the Global Automatic Silver Sintering Die Attach Machine Market
  • Figure 2.1: Usage of Automatic Silver Sintering Die Attach Machine Market
  • Figure 2.2: Classification of the Global Automatic Silver Sintering Die Attach Machine Market
  • Figure 2.3: Supply Chain of the Global Automatic Silver Sintering Die Attach Machine Market
  • Figure 3.1: Driver and Challenges of the Automatic Silver Sintering Die Attach Machine Market
  • Figure 3.2: PESTLE Analysis
  • Figure 3.3: Patent Analysis
  • Figure 3.4: Regulatory Environment
  • Figure 4.1: Global Automatic Silver Sintering Die Attach Machine Market by Type in 2019, 2024, and 2031
  • Figure 4.2: Trends of the Global Automatic Silver Sintering Die Attach Machine Market ($B) by Type
  • Figure 4.3: Forecast for the Global Automatic Silver Sintering Die Attach Machine Market ($B) by Type
  • Figure 4.4: Trends and Forecast for Fully Automatic in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Figure 4.5: Trends and Forecast for Semi-automatic in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Figure 5.1: Global Automatic Silver Sintering Die Attach Machine Market by Application in 2019, 2024, and 2031
  • Figure 5.2: Trends of the Global Automatic Silver Sintering Die Attach Machine Market ($B) by Application
  • Figure 5.3: Forecast for the Global Automatic Silver Sintering Die Attach Machine Market ($B) by Application
  • Figure 5.4: Trends and Forecast for Power Semiconductor Device in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Figure 5.5: Trends and Forecast for RF Power Device in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Figure 5.6: Trends and Forecast for High Performance LED in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Figure 5.7: Trends and Forecast for Others in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Figure 6.1: Trends of the Global Automatic Silver Sintering Die Attach Machine Market ($B) by Region (2019-2024)
  • Figure 6.2: Forecast for the Global Automatic Silver Sintering Die Attach Machine Market ($B) by Region (2025-2031)
  • Figure 7.1: North American Automatic Silver Sintering Die Attach Machine Market by Type in 2019, 2024, and 2031
  • Figure 7.2: Trends of the North American Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2019-2024)
  • Figure 7.3: Forecast for the North American Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2025-2031)
  • Figure 7.4: North American Automatic Silver Sintering Die Attach Machine Market by Application in 2019, 2024, and 2031
  • Figure 7.5: Trends of the North American Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2019-2024)
  • Figure 7.6: Forecast for the North American Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2025-2031)
  • Figure 7.7: Trends and Forecast for the United States Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 7.8: Trends and Forecast for the Mexican Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 7.9: Trends and Forecast for the Canadian Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 8.1: European Automatic Silver Sintering Die Attach Machine Market by Type in 2019, 2024, and 2031
  • Figure 8.2: Trends of the European Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2019-2024)
  • Figure 8.3: Forecast for the European Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2025-2031)
  • Figure 8.4: European Automatic Silver Sintering Die Attach Machine Market by Application in 2019, 2024, and 2031
  • Figure 8.5: Trends of the European Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2019-2024)
  • Figure 8.6: Forecast for the European Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2025-2031)
  • Figure 8.7: Trends and Forecast for the German Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 8.8: Trends and Forecast for the French Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 8.9: Trends and Forecast for the Spanish Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 8.10: Trends and Forecast for the Italian Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 8.11: Trends and Forecast for the United Kingdom Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 9.1: APAC Automatic Silver Sintering Die Attach Machine Market by Type in 2019, 2024, and 2031
  • Figure 9.2: Trends of the APAC Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2019-2024)
  • Figure 9.3: Forecast for the APAC Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2025-2031)
  • Figure 9.4: APAC Automatic Silver Sintering Die Attach Machine Market by Application in 2019, 2024, and 2031
  • Figure 9.5: Trends of the APAC Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2019-2024)
  • Figure 9.6: Forecast for the APAC Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2025-2031)
  • Figure 9.7: Trends and Forecast for the Japanese Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 9.8: Trends and Forecast for the Indian Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 9.9: Trends and Forecast for the Chinese Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 9.10: Trends and Forecast for the South Korean Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 9.11: Trends and Forecast for the Indonesian Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 10.1: ROW Automatic Silver Sintering Die Attach Machine Market by Type in 2019, 2024, and 2031
  • Figure 10.2: Trends of the ROW Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2019-2024)
  • Figure 10.3: Forecast for the ROW Automatic Silver Sintering Die Attach Machine Market ($B) by Type (2025-2031)
  • Figure 10.4: ROW Automatic Silver Sintering Die Attach Machine Market by Application in 2019, 2024, and 2031
  • Figure 10.5: Trends of the ROW Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2019-2024)
  • Figure 10.6: Forecast for the ROW Automatic Silver Sintering Die Attach Machine Market ($B) by Application (2025-2031)
  • Figure 10.7: Trends and Forecast for the Middle Eastern Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 10.8: Trends and Forecast for the South American Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 10.9: Trends and Forecast for the African Automatic Silver Sintering Die Attach Machine Market ($B) (2019-2031)
  • Figure 11.1: Porter's Five Forces Analysis of the Global Automatic Silver Sintering Die Attach Machine Market
  • Figure 11.2: Market Share (%) of Top Players in the Global Automatic Silver Sintering Die Attach Machine Market (2024)
  • Figure 12.1: Growth Opportunities for the Global Automatic Silver Sintering Die Attach Machine Market by Type
  • Figure 12.2: Growth Opportunities for the Global Automatic Silver Sintering Die Attach Machine Market by Application
  • Figure 12.3: Growth Opportunities for the Global Automatic Silver Sintering Die Attach Machine Market by Region
  • Figure 12.4: Emerging Trends in the Global Automatic Silver Sintering Die Attach Machine Market

List of Tables

  • Table 1.1: Growth Rate (%, 2023-2024) and CAGR (%, 2025-2031) of the Automatic Silver Sintering Die Attach Machine Market by Type and Application
  • Table 1.2: Attractiveness Analysis for the Automatic Silver Sintering Die Attach Machine Market by Region
  • Table 1.3: Global Automatic Silver Sintering Die Attach Machine Market Parameters and Attributes
  • Table 3.1: Trends of the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 3.2: Forecast for the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 4.1: Attractiveness Analysis for the Global Automatic Silver Sintering Die Attach Machine Market by Type
  • Table 4.2: Market Size and CAGR of Various Type in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 4.3: Market Size and CAGR of Various Type in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 4.4: Trends of Fully Automatic in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 4.5: Forecast for Fully Automatic in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 4.6: Trends of Semi-automatic in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 4.7: Forecast for Semi-automatic in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 5.1: Attractiveness Analysis for the Global Automatic Silver Sintering Die Attach Machine Market by Application
  • Table 5.2: Market Size and CAGR of Various Application in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 5.3: Market Size and CAGR of Various Application in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 5.4: Trends of Power Semiconductor Device in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 5.5: Forecast for Power Semiconductor Device in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 5.6: Trends of RF Power Device in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 5.7: Forecast for RF Power Device in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 5.8: Trends of High Performance LED in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 5.9: Forecast for High Performance LED in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 5.10: Trends of Others in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 5.11: Forecast for Others in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 6.1: Market Size and CAGR of Various Regions in the Global Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 6.2: Market Size and CAGR of Various Regions in the Global Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 7.1: Trends of the North American Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 7.2: Forecast for the North American Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 7.3: Market Size and CAGR of Various Type in the North American Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 7.4: Market Size and CAGR of Various Type in the North American Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 7.5: Market Size and CAGR of Various Application in the North American Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 7.6: Market Size and CAGR of Various Application in the North American Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 7.7: Trends and Forecast for the United States Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 7.8: Trends and Forecast for the Mexican Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 7.9: Trends and Forecast for the Canadian Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 8.1: Trends of the European Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 8.2: Forecast for the European Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 8.3: Market Size and CAGR of Various Type in the European Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 8.4: Market Size and CAGR of Various Type in the European Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 8.5: Market Size and CAGR of Various Application in the European Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 8.6: Market Size and CAGR of Various Application in the European Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 8.7: Trends and Forecast for the German Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 8.8: Trends and Forecast for the French Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 8.9: Trends and Forecast for the Spanish Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 8.10: Trends and Forecast for the Italian Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 8.11: Trends and Forecast for the United Kingdom Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 9.1: Trends of the APAC Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 9.2: Forecast for the APAC Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 9.3: Market Size and CAGR of Various Type in the APAC Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 9.4: Market Size and CAGR of Various Type in the APAC Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 9.5: Market Size and CAGR of Various Application in the APAC Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 9.6: Market Size and CAGR of Various Application in the APAC Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 9.7: Trends and Forecast for the Japanese Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 9.8: Trends and Forecast for the Indian Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 9.9: Trends and Forecast for the Chinese Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 9.10: Trends and Forecast for the South Korean Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 9.11: Trends and Forecast for the Indonesian Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 10.1: Trends of the ROW Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 10.2: Forecast for the ROW Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 10.3: Market Size and CAGR of Various Type in the ROW Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 10.4: Market Size and CAGR of Various Type in the ROW Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 10.5: Market Size and CAGR of Various Application in the ROW Automatic Silver Sintering Die Attach Machine Market (2019-2024)
  • Table 10.6: Market Size and CAGR of Various Application in the ROW Automatic Silver Sintering Die Attach Machine Market (2025-2031)
  • Table 10.7: Trends and Forecast for the Middle Eastern Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 10.8: Trends and Forecast for the South American Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 10.9: Trends and Forecast for the African Automatic Silver Sintering Die Attach Machine Market (2019-2031)
  • Table 11.1: Product Mapping of Automatic Silver Sintering Die Attach Machine Suppliers Based on Segments
  • Table 11.2: Operational Integration of Automatic Silver Sintering Die Attach Machine Manufacturers
  • Table 11.3: Rankings of Suppliers Based on Automatic Silver Sintering Die Attach Machine Revenue
  • Table 12.1: New Product Launches by Major Automatic Silver Sintering Die Attach Machine Producers (2019-2024)
  • Table 12.2: Certification Acquired by Major Competitor in the Global Automatic Silver Sintering Die Attach Machine Market