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市場調查報告書
商品編碼
1153886

半導體用粘膠、薄膜的全球市場:趨勢，機會，競爭分析

Semiconductor Adhesive Paste and Film Market: Trends, Opportunities and Competitive Analysis
出版日期: | 出版商: Lucintel | 英文 211 Pages | 商品交期: 3個工作天內

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簡介目錄

全球半導體用粘膠、薄膜的市場規模，預計從2021年到2027年以5.1％的年複合成長率擴大，2027年成為787億美元。牽引市場的主要原因，是家電產品的成長與汽車的電子內容的增加造成半導體需求增加等。

本報告提供半導體用粘膠、薄膜的世界市場調查，市場規模和預測，市場促進因素及課題，市場趨勢，各市場區隔的市場分析，競爭情形，成長機會分析等系統性資訊。

目錄

第1章 摘要整理

第2章 市場背景與分類法

  • 簡介，背景，分類法
  • 供應鏈
  • 產業的推動因素與課題

第3章 市場趨勢與預測分析(2016年～2027年)

  • 宏觀經濟趨勢(2016年～2021年)與預測(2022年～2027年)
  • 全球市場趨勢(2016年～2021年)與預測(2022年～2027年)
  • 各產品類型
    • 環氧樹脂系黏劑
    • 矽膠系黏劑
    • 丙烯系黏劑
    • 聚氨酯系黏劑
    • 其他
  • 各用途
    • 汽車
    • 家電
    • 航太與防衛
    • 生物科學
    • 其他

第4章 市場趨勢與預測分析:各地區(2016年～2027年)

  • 各地區
  • 北美
    • 各產品類型
    • 各用途
    • 美國
    • 加拿大
    • 墨西哥
  • 歐洲
    • 各產品類型
    • 各用途
    • 德國
    • 法國
    • 義大利
    • 英國
  • 亞太地區
    • 各產品類型
    • 各用途
    • 中國
    • 印度
    • 日本
  • 其他地區
    • 各產品類型
    • 各用途

第5章 競爭分析

  • 產品系列分析
  • 地理有效半徑
  • 波特的五力分析

第6章 成長機會及策略分析

  • 成長機會分析
    • 各產品類型
    • 各用途
    • 各地區
  • 全球市場的新的趨勢
  • 策略分析
    • 新產品的開發
    • 生產能力的擴大
    • 合併，收購，合資企業

第7章 主要企業的簡介

  • H.B. Fuller
  • Henkel
  • Master Bond
  • Panacol-Elosol
  • 3M
簡介目錄

Semiconductor Adhesive Paste and Film Market Trends and Forecast

The future of the semiconductor adhesive paste and film market looks promising with opportunities in the automotive, consumer electronics, aerospace and defense, and bioscience industries. The semiconductor adhesive paste and film market is expected to reach an estimated $78.7 billion by 2027 with a CAGR of 5.1% from 2021 to 2027. The major drivers for this market are increasing demand for semiconductors due to growth in consumer electronics and increasing electronic content in vehicles.

A total of 93 figures / charts and 93 tables are provided in this 211-page report to help in your business decisions. Learn the scope of benefits, companies researched, and other details of the semiconductor adhesive paste and film market report.

Semiconductor Adhesive Paste and Film Market by Segment

The study includes a forecast for the global semiconductor adhesive paste and film market by product type, application, and region as follows:

Semiconductor Adhesive Paste and Film Market by Product Type [Value ($M) shipment analysis for 2016 - 2027]:

  • Epoxy Based Adhesives
  • Silicone Based Adhesives
  • Acrylic Based Adhesives
  • Polyurethane Based Adhesives
  • Others

Semiconductor Adhesive Paste and Film Market by Application [Value ($M) shipment analysis for 2016 - 2027]:

  • Automotive
  • Consumer Electronics
  • Aerospace and Defense
  • Biosciences
  • Others

Semiconductor Adhesive Paste and Film Market by Region [Value ($M) analysis for 2016 - 2027]:

  • North America

USA

Mexico

Canada

  • Europe

Germany

Spain

UK

Italy

France

  • Asia Pacific

China

India

Japan

  • The Rest of the World

List of Semiconductor Adhesive Paste and Film Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies semiconductor adhesive paste and film companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the semiconductor adhesive paste and film companies profiled in this report includes.

  • H.B. Fuller
  • Henkel
  • Master Bond
  • Panacol-Elosol
  • 3M

Semiconductor Adhesive Paste and Film Market Insight

  • Epoxy based adhesives will remain the largest segment and it is expected to witness the highest growth over the forecast period due to its superior properties, such as excellent adhesion, versatility, good electrical properties, compatibility, resistance to weathering, and ease of application that can readily be tailored according to the demand of manufacturer
  • Asia Pacific is expected to remain the largest region over the forecast period due to the large manufacturing base for semiconductors.

Features of Semiconductor Adhesive Paste and Film Market

  • Market Size Estimates: Semiconductor adhesive paste and film market size estimation in terms of value ($M)
  • Trend and Forecast Analysis: Market trends (2016-2021) and forecast (2022-2027) by various segments and regions.
  • Segmentation Analysis: Market size by product type and application
  • Regional Analysis: Semiconductor adhesive paste and film market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis of growth opportunities in different product type, application, and regions for the semiconductor adhesive paste and film market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the semiconductor adhesive paste and film market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the semiconductor adhesive paste and film market size?

Answer: The global semiconductor adhesive paste and film market is expected to reach an estimated $78.7 billion by 2027

Q2. What is the growth forecast for semiconductor adhesive paste and film market?

Answer: The semiconductor adhesive paste and film market is expected to grow at a CAGR of 5.1% from 2021 to 2027.

Q3. What are the major drivers influencing the growth of the semiconductor adhesive paste and film market?

Answer: The major drivers for this market are increasing demand for electronic devices including smartphones, laptops, and others

Q4. Who are the key semiconductor adhesive paste and film companies?

Answer: Some of the key semiconductor adhesive paste and film companies are as follows:

  • H.B. Fuller
  • Henkel
  • Master Bond
  • Panacol-Elosol
  • 3M

Q5. In semiconductor adhesive paste and film market, which region is expected to be the largest in next 5 years?

Answer: Asia Pacific is expected to remain the largest region and witness the highest growth over next 5 years

Q6. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

  • Q.1 What are some of the most promising potential, high growth opportunities for the global semiconductor adhesive paste and film market by product type (epoxy based adhesives, silicone based adhesives, acrylic based adhesives, polyurethane based adhesives, and others), application (automotive, consumer electronics, aerospace and defense, biosciences, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2 Which segments will grow at a faster pace and why?
  • Q.3 Which regions will grow at a faster pace and why?
  • Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
  • Q.5 What are the business risks and threats to the market?
  • Q.6 What are the emerging trends in this market and the reasons behind them?
  • Q.7 What are the changing demands of customers in the market?
  • Q.8 What are the new developments in the market? Which companies are leading these developments?
  • Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
  • Q.1 0 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?
  • Q.1 1 What M & A activities have taken place in the last 5 years in this market?

Table of Contents

1. Executive Summary

2. Market Background and Classifications

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2016 to 2027

  • 3.1: Macroeconomic Trends (2016-2021) and Forecast (2022-2027)
  • 3.2: Global Semiconductor Adhesive Paste and Film Market Trends (2016-2021) and Forecast (2022-2027)
  • 3.3: Global Semiconductor Adhesive Paste and Film Market by Product Type
    • 3.3.1: Epoxy Based Adhesives
    • 3.3.2: Silicone Based Adhesives
    • 3.3.3: Acrylic Based Adhesives
    • 3.3.4: Polyurethane Based Adhesives
    • 3.3.5: Others
  • 3.4: Global Semiconductor Adhesive Paste and Film Market by Application
    • 3.4.1: Automotive
    • 3.4.2: Consumer Electronics
    • 3.4.3: Aerospace and Defense
    • 3.4.4: Biosciences
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2016 to 2027

  • 4.1: Global Semiconductor Adhesive Paste and Film Market by Region
  • 4.2: North American Semiconductor Adhesive Paste and Film Market
    • 4.2.1: Market by Product Type: Epoxy Based Adhesives, Silicone Based Adhesives, Acrylic Based Adhesives, Polyurethane Based Adhesives, and Others
    • 4.2.2: Market by Application: Automotive, Consumer Electronics, Aerospace and Defense, Biosciences, and Others
    • 4.2.3: United States Semiconductor Adhesive Paste and Film Market
    • 4.2.4: Canadian Semiconductor Adhesive Paste and Film Market
    • 4.2.5: Mexican Semiconductor Adhesive Paste and Film Market
  • 4.3: European Semiconductor Adhesive Paste and Film Market
    • 4.3.1: Market by Product Type: Epoxy Based Adhesives, Silicone Based Adhesives, Acrylic Based Adhesives, Polyurethane Based Adhesives, and Others
    • 4.3.2: Market by Application: Automotive, Consumer Electronics, Aerospace and Defense, Biosciences, and Others
    • 4.3.3: German Semiconductor Adhesive Paste and Film Market
    • 4.3.4: French Semiconductor Adhesive Paste and Film Market
    • 4.3.5: Italian Semiconductor Adhesive Paste and Film Market
    • 4.3.6: United Kingdom Semiconductor Adhesive Paste and Film Market
  • 4.4: APAC Semiconductor Adhesive Paste and Film Market
    • 4.4.1: Market by Product Type: Epoxy Based Adhesives, Silicone Based Adhesives, Acrylic Based Adhesives, Polyurethane Based Adhesives, and Others
    • 4.4.2: Market by Application: Automotive, Consumer Electronics, Aerospace and Defense, Biosciences, and Others
    • 4.4.3: Chinese Semiconductor Adhesive Paste and Film Market
    • 4.4.4: Indian Semiconductor Adhesive Paste and Film Market
    • 4.4.5: Japanese Semiconductor Adhesive Paste and Film Market
  • 4.5: ROW Semiconductor Adhesive Paste and Film Market
    • 4.5.1: Market by Product Type: Epoxy Based Adhesives, Silicone Based Adhesives, Acrylic Based Adhesives, Polyurethane Based Adhesives, and Others
    • 4.5.2: Market by Application: Automotive, Consumer Electronics, Aerospace and Defense, Biosciences, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Geographical Reach
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Semiconductor Adhesive Paste and Film Market by Product Type
    • 6.1.2: Growth Opportunities for the Global Semiconductor Adhesive Paste and Film Market by Application
    • 6.1.3: Growth Opportunities for the Global Semiconductor Adhesive Paste and Film Market by Region
  • 6.2: Emerging Trends in the Global Semiconductor Adhesive Paste and Film Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Semiconductor Adhesive Paste and Film Market
    • 6.3.3: Mergers and Acquisitions, and Joint Ventures in the Global Semiconductor Adhesive Paste and Film Industry

7. Company Profiles of Leading Players

  • 7.1: H.B. Fuller
  • 7.2: Henkel
  • 7.3: Master Bond
  • 7.4: Panacol-Elosol
  • 7.5: 3M